Monday, June 14, 2021

Open Optical Momentum at #OFC21

Openness was a big theme at this year's virtual #OFC21 event, with big announcements concerning XR optics, OSFP modules, 800G, disaggregated platforms based on Telecom Infra Project (TIP) designs, and market-ready 400ZR solutions.

Marvell announced sampling on an ultra low-power, 400G DSP chipset and a 50Gbps PAM4 DSP chipset which integrates transimpedance amplifiers (TIAs) and laser drivers in the CMOS package -- both targeting disaggregated optical platforms.

In this video, Jim Carroll and Roy Chua discuss the new Marvell, and whether "Open" can be a strategic differentiator for the company.

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Dark Fiber & Infrastructure links to Sabey Data Centers in Ashburn

Sabey Data Centers' Ashburn campus will serve as a terminus for a high-capacity dark fiber connectivity conduit linking Northern Virginia’s “Data Center Alley” to major Northeast U.S. telecom corridors. The conduit is owned and operated by Dark Fiber & Infrastructure.

DF&I’s unique Potomac River Crossing bypasses Washington, DC, thereby providing its customers with a diverse, all underground, lowest-latency option within the largest U.S. data center market. The installation is complete and the system is currently operational.

Robert Rockwood, President of Sabey Data Centers, said, “This development is a milestone for Sabey’s East Coast expansion. In a region experiencing unbridled bandwidth growth, especially with hyperscale customers who demand for leased dark fiber and new conduits, we are pleased to be a solution provider in partnership with DF&I.”

DF&I's Co-founder John Schmitt said, “Our infrastructure hub at Intergate.Ashburn reinforces our position as the largest open access network currently available for lease in the region. It provides diversity, latency improvement, and scale that is required but until now, had not been available in the market today."

Skorpios 100G CWDM4 chipset passes Telcordia

Skorpios Technologies announced Telcordia qualification for its 100G CWDM4 chipset, as well as its 100G CWDM4 optical transceiver, both of which are shipping in limited quantities. The chipset is based on Skorpios' Heterogeneous Photonic Integrated Circuit (HPIC) technology platform, which seamlessly integrates III-V material into a standard CMOS process flow.

At the device level, extensive testing demonstrated full compliance to GR-468. Testing beyond Telcordia requirements resulted in demonstrating >10,000 hours high temperature operating life (HTOL) against a requirement of 2,000 hours, and extensive accelerated aging testing demonstrated a 50+ year lifetime for the four-channel devices.

At the optical transceiver level, full compliance was demonstrated to GR-468, GR-326 and GR-1217 standards. Testing beyond Telcordia requirements resulted in demonstration of 2,000 hours of unbiased damp heat against a 1,000-hour requirement.

"With a technology platform passed full Telcordia qualification with no issues and demonstrated industry-leading lifetimes, Skorpios secures a commanding position in current and future applications requiring high levels of photonic integration with many lasers and modulators on a single die" said Glenn Li, CTO for Skorpios Technologies.

Dell'Oro: Sales of data center switches surged in Q1

Global Data Center Switch market revenue were up 14 percent year-over-year in 1Q21, the strongest growth rate recorded since 1Q18, according to a new report from Dell'Oro Group. Growth was healthy across all major customer segments (Cloud Service Providers, Telco Service Providers, and Large Enterprises) and all regions, except Latin America.

“In line with our predictions, the recovery in the data center switch market, which started in the second half of last year, continued to accelerate in 1Q21,” said Sameh Boujelbene, Senior Research Director at Dell’Oro Group. “Although this strong performance was in part due to an easy year-over-year comparison, it was more reflective of an improvement in the demand environment. Additionally, impact from supply chain challenges on revenue and pricing environment during the quarter was minimal but may become more pronounced in the remainder of the year,” added Boujelbene.

Additional highlights from the 1Q21 Ethernet Switch – Data Center Report:

  • Major vendors with revenue share gain in the first quarter period are Arista, H3C, and Huawei.
  • 25 Gbps, 100 Gbps, and 400 Gbps comprised more than 60 percent of the data center switch port shipments in 1Q21 as the pandemic has accelerated the adoption of new generation speeds and the decline of legacy speeds.

Dell'Oro: XGS-PON OLT spending takes off

Total global revenue for the Broadband Access equipment market increased to $3.3 B in 1Q 2021, up 18 percent year-over-year (Y/Y), according to Dell'Oro Group. Growth came from spending on PON OLT ports, particularly 10 Gbps PON technologies.

"The shift to 10 Gbps PON technologies is happening quickly and on a global basis," noted Jeff Heynen, Vice President, Broadband Access and Home Networking at Dell'Oro Group. "The only thing preventing further expansions are supply chain constraints and increased costs," explained Heynen.

  • Additional highlights from the 1Q 2021 Broadband Access and Home Networking quarterly report:
  • Total broadband access equipment revenue was down 6 percent from the record revenue of 4Q 2020.
  • Total cable access concentrator revenue increased 15 percent Y/Y to $243 M. Though DOCSIS license purchases were down, new hardware purchases in the form of CCAP chassis, line cards, and DAA nodes and modules helped push revenue higher.
  • Total DSL Access Concentrator revenue was down 30 percent Y/Y, driven by slower port shipments worldwide as more operators shift their spending to fiber.
  • Total PON ONT revenue was down quarter over quarter, but unit shipments remained above 30 M globally for the second straight quarter.

AWS to open data center in Tel Aviv

Amazon Web Services will open a data center region in Tel Aviv, Israel in the first half of 2023.

The AWS Israel (Tel Aviv) Region will have three Availability Zones, each fully isolated with its own infrastructure. As is the case with other AWS Regions, the AZs in the region and will be connected together with dedicated, fully-redundant metro fiber. 

AWS currently has 81 Availability Zones within 25 AWS Regions in operation today, with 21 more Availability Zones and seven announced regions (including this one) underway.

Defense Info Systems Agency awards $1.8 billion contract to Cisco

The U.S. Defense Information Systems Agency awarded a contract valued at $1.8 billion to Cisco for Cisco Smart Net Total Care and Software Support Services for users across the Department of Defense.  

The period of performance is a one-year base period and two one-year option periods, for a total contract life cycle of three years.

DISA awards $84 million contract to Comcast for Ethernet Gateway Region 4

The U.S. Defense Information Systems Agency awarded a contract valued at $84.2 million to Comcast Government Services for the Commercial Ethernet Gateway Region 4 to provide mission partner access, via Ethernet connections, to the Department of Defense Information Network and to enable the replacement of legacy, time division multiplexing-based circuits.

Primary performance will be at the contractor’s above-identified facility in Reston, Virginia.

North Carolina's AccessOn Networks picks Ciena

AccessOn Networks, a North Carolina-based provider of advanced fiber-based communication services, has chosen Ciena to expand its network across rural locations.

AccessOn Networks will deploy Ciena’s 6500 Flexible Grid ROADM to offer new high-speed 100GbE services and extend access to new PoP locations with long distance 600 Gbps wavelengths. The upgraded network will also leverage Ciena’s 5170 Platform, helping scale lower-speed 10GbE service demands, and its Manage, Control and Plan (MCP) domain controller for increased network visibility and monitoring.

“Our mission is to provide connections to small, rural communities throughout North Carolina and put them on equal footing with even the largest cities,” said Steve Ledford, CEO, AccessOn Networks. “Ciena’s solutions will allow us to achieve that goal by transforming the network with greater capacity and efficiency to accommodate the increasing digital needs of our partners and their customers.”

“As the home network becomes increasingly important, AccessOn Networks can serve as the missing link, giving the local community greater connectivity. With Ciena’s solutions, these communities will have improved Internet services, boosting digital opportunities for all,” said Bruce Hembree, Vice President & General Manager of Sales in the Americas, Ciena.

Sunday, June 13, 2021

Hengtong Rockley demos 800G QSFP-DD800 DR8 pluggable

Hengtong Rockley Technology Co. announced an 800G QSFP-DD800 DR8 optical module based on EML technology.

There are two main form factors for 800G MSA: OSFP and QSFP-DD800. Because of the tight space, QSFP-DD800 module design has been considered as the most challenging, in term of layout, signal integrity and thermal management. 

Hengtong Rockley is adapting 7nm DSP with built-in drivers, and COB structure to achieve this 800G QSFP-DD800 DR8 design, the total module power consumption is around 16W. Sampling is expected later hits year and commercial production is expected in the second half of 2022. Hengtong Rockley also plans to have 800G optical module based on Silicon Photonics technology in 2022.

Hengtong Rockley Technology a joint venture established by Hengtong Optic-Electric Co., Ltd., China and Rockley Photonics Limited, UK. Hengtong Rockley is based in Suzhou, China.

Furukawa develops light sources for SUPER C-band and SUPER L-band

Furukawa Electric Co., Ltd. announced new laser light source products for SUPER C-band and SUPER L-band optical transmission, including a new wide tuning range micro-ITLA (Integrable Tunable Laser Assembly) and pump laser diode modules for Raman amplifiers with the expanded wavelength range.

Furukawa Electric developed the micro-ITLAs and Raman pump laser diode modules for wider wavelength range using its lower loss waveguide technology by optimizing designs based on its crystal growth and precision semiconductor processing expertise.

The wavelength range of the new micro-ITLA has been expanded from 96 to 120 channels for 50 GHz spacing. The available bandwidth has expanded from the conventional C-band: 191.300 - 196.100 THz (4.8 THz width) to Super C-band: 190.675 - 196.675 THz (6 THz width). In the same way it will also be possible to expand bandwidth from the conventional L-band: 186.350 - 190.700 THz (4.35 THz width) to Super L-band: 184.350 - 190.500 THz (6.15 THz width).

For the new pump laser diode modules, the wavelength range has been expanded for 400/500/600 mW products from 1420 - 1510 nm to 1330 - 1520 nm.

Sumitomo announces Expanded Beam multi-fiber connector

Sumitomo Electric Industries unveiled its new "AirEB", a multi-fiber connector with an expanded beam that has optical performance tolerant to the contamination on the connector mating faces.

The new AirEB connector has a lens structure at the end face of the connector, which expands the optical beam to be tolerant of foreign dust particles and keeps optical performance good with less frequent cleaning, or even without cleaning.

The company cites the following advantages of its AirEB connector:

  • No need of the frequent cleaning, cleaning with ease.
  • An expanded beam can be tolerant of the contaminations on the end face.
  • A small gap between mated lenses prevent the particles from sticking to the end face.
  • Mass production friendly with no special equipment required for production.
  • The polishing process required for a conventional MPO is not needed.
  • All optics in a straight path can make the alignment easy.

Silicon Photonics integration of Indium phosphide distributed feedback lasers

Sivers Photonics, imec, and ASM AMICRA successfully completed a wafer-scale integration of indium phosphide (InP) distributed feedback (DFB) lasers from Sivers’ InP100 platform onto imec’s silicon photonics platform (iSiPP). 

Using ASM AMICRA’s latest NANO flip-chip bonder tool, the InP DFB laser diodes were bonded onto a 300mm silicon photonics wafer with an alignment precision within 500nm, enabling reproducible coupling of more than 10mW of laser power into the silicon nitride waveguides on the silicon photonics wafer. Supported by its partners, imec will offer this technology later in 2021 as a prototyping service, thereby accelerating the adoption of silicon photonics in a wide range of applications from optical interconnects, over LiDAR, to biomedical sensing.

Sivers says many silicon photonic systems today still rely on external light sources, owing to the lack of efficient on‐chip light sources. Silicon itself does not emit light efficiently and, therefore, light sources made of III-V semiconductors, such as indium phosphide (InP) or gallium arsenide (GaAs), are typically implemented as separately packaged components. These off‐chip lasers often suffer from higher coupling losses, a large physical footprint and a high packaging cost.

“We’re excited to work with imec and ASM AMICRA on the development of advanced integrated photonic components. The availability of tailored InP laser sources, designed and fabricated on our InP100 manufacturing platform, will boost the adoption of silicon photonic circuits for a wide variety of commercial applications ”, says Billy McLaughlin, Sivers Photonics Managing Director.

Joris van Campenhout, Optical I/O Program Director at imec: “We are very pleased to be working with Sivers Photonics and ASM AMICRA to extend our silicon photonics platform with hybrid integrated laser sources and amplifiers. This additional functionality will enable our joint customers to develop and prototype advanced photonic integrated circuits (PICs) with capabilities well beyond what we can offer today, in key areas such as datacom, telecom and sensing.”

Dr. Johann Weinhändler, ASM AMICRA Managing Director: “Our strength in high-precision placement seamlessly complements the expertise of all partners. With automated and ultra-precise flip-chip bonding, the way to high-volume manufacturing of these hybrid assemblies is open.”

DT expands its Open Telekom Cloud with Amsterdam data center

Deutsche Telekom is expanding the reach of its Open Telekom Cloud with the opening of a huge data center campus in Amsterdam.  The facility covers a total area of 21,000 square meters.  DT said its servers and storage will operate under the highest security standards, with electricity exclusively from renewable energy sources. The two facilities in Amsterdam target PUE (Power Usage Effectiveness) values of 1.32 and 1.25, which is approximately 30 percent lower consumption than conventional data centers.

"The opening of our cloud data center in Amsterdam strengthens Europe’s data sovereignty," said Adel al Saleh, member of the Telekom Board of Management and CEO T-Systems. "And companies improve their security, because European data protection rules apply.“ 

The new Amsterdam site "mirrors" the two core data centers of the Open Telekom Cloud in Biere and Magdeburg. The distance of around 500 kilometers is well above the critical infrastructure (KRITIS) recommendation of the German Federal Office for Information Security (BSI). Computing and storage power are still available even if there are outages - due to natural disasters, for example - at the various sites.

Capgemini and Orange to build "Cloud de Confiance" in France

Capgemini and Orange will establish a joint venture company called “Bleu” to provide a "Cloud de Confiance" to address the security requirements of the French State, public administrations and critical infrastructure companies across France. The idea is to build a French hyperscale cloud, fully under French and European jurisdictions.Bleu will provide its customers with an independent, trusted cloud platform with a broad catalog of digital solutions...

Planning begins for a European quantum communication network

The European Commission has selected Airbus to lead a consortium of companies and research institutes to study the design of the future European quantum communication network, EuroQCI, to enable ultra-secure communication between critical infrastructures and government institutions across the European Union. The 15-month study will set out the details of the end-to-end system and design. The European Commission's ambition is to run a EuroQCI demonstrator...

GLOBALFOUNDRIES and GlobalWafers increase 300mm wafer supply

GLOBALFOUNDRIES announced an $800 million agreement with GlobalWafers to add 300mm silicon-on-insulator (SOI) wafer manufacturing and expand existing 200mm SOI wafer production at GWC’s MEMC facility in O’Fallon, Missouri. The 300mm pilot line is on track to be completed in Q4 this year.

In particular, the 300mm wafers made at GWC’s MEMC site in Missouri will be used at GF’s most advanced manufacturing facility, Fab 8 in Malta, New York, and the 200mm wafers made at the Missouri site will be used at GF’s Fab 9 in Essex Junction, Vermont. 

GLOBALFOUNDRIES said these wafers will be used across a range of applications including 5G smartphones, wireless connectivity, automotive radar, and aerospace.

Credo announces 3.2Tbps retimer chiplet with 112Gbps lane rates

Credo announced the production availability of a low-power 3.2Tbps retimer XSR-enabled high-speed connectivity chiplet with 112Gbps lane rates. 

Credo's new Nutcracker new device, which is optimized for multi-chip-modules (MCM) ASICs,  has 32 low-power lanes of 112G XSR SerDes on the host side, which communicate with the in-module system-on-chip (SOC) core ASIC. The chiplet has 32 lanes of low-power 112G MR+ reach-optimized DSP to provide the off-module interface on the line side.

The company says its unique DSP technology allowed the development of the low-power 32x112Gbps XSR to 32x112Gbps MR+ retimer die in TSMC's 12nm process. In contrast, alternative solutions will require the usage of more costly 7nm or 5nm nodes.

"We developed and commercialized Nutcracker in a strategic collaboration with a large, Fortune 200 customer," said Jeff Twombly, Vice President of Business Development at Credo. "Nutcracker is now the leading solution for next-generation ASIC deployments requiring heterogeneous MCM approaches to achieve the performance scale demanded across all technology industries, including emerging co-packaged optics in the data center," Twombly continued.

Sivers Photonics lands SEK 14 million optical sensing order

Sivers Photonics announced a new order worth approximately SEK 14m for design, development and supply of semiconductor laser devices for use in advanced optical sensing applications. The order comes from one of the company's established Fortune 100 customers and will be delivered and billed during 2021.

“This is the second order from this customer in 2021, at total value of some SEK 25m, which is already on the same level as during the full year 2020. Over the last 12 months the total order value now stands at some SEK 50m. I am very pleased to see that we are accelerating the number of orders and for each order the chance increases that we will be part of the future volume production for the sensors,” said Anders Storm, Group CEO of Sivers Semiconductors.

Saturday, June 12, 2021

SANWA acquires Fiberon for passive and active connectors

SANWA Denki Kogyo Co., Ltd. completed its acquisition of Fiberon Technologies, another provider of fiber optic network solutions. Financial terms were not disclosed.

FIBERON, founded in 1998, specializes in advanced passive and active connectivity products for the optical fiber communications market.

“FIBERON has continuously delivered quality products with excellent service and speed as a trusted supply partner to its customers,” said Yasuo Ishii, President and CEO of SANWA. “Joining FIBERON’s advanced product lines and strategic geographical presence together with SANWA’s unparalleled engineering, manufacturing, and quality management will significantly expand the available product range and service reach for current customers and offer a powerful supplier partnership for optical communications industry worldwide.”

In addition to the expanded product offerings by both companies, SANWA’s in-house design, engineering and manufacturing capabilities will now provide custom engineering and OEM sourcing options to FIBERON’s existing and new customers.

Nokia awarded optical contracts in Nepal

Subisu, a leading service provider in Nepal, has selected Nokia to modernize the 1500 kilometers long backbone network spread across East and West Nepal. Nokia has deployed its 400G single fiber solution to provide ultra-high-speed broadband to Subisu’s retail and enterprise subscribers.  The Nokia 1830 Photonic Service Switch (PSS) platform offering Photonic Service Engine (PSE) enabled 400G single fiber, bidirectional Dense Wavelength Division Multiplexing (DWDM) solution is now deployed across the country. This is the first operation of such a solution anywhere.

Separately, Nokia announced that CG NET will deploy its GPON solution as part of an extensive Fiber-to-the-Home (FTTH) roll-out across the Kathmandu Valley. Nokia’s solution will enable CG NET to offer the fastest broadband speeds in the market and competitive service offering for IPTV, gaming, remote work and remote education. 

Nokia notes that it now has more than 300 GPON deployments worldwide.

Friday, June 11, 2021

Vapor IO debuts Kinetic Grid -- edge-to-edge with national backbone

Vapor IO introduced its Kinetic Grid platform, an intelligent infrastructure service with an edge-to-edge national backbone.

The service combines colocation, networking and interconnection infrastructure into a nationwide platform for modern applications. Vapor IO has entered into strategic partnerships with Zayo and VMware.

Vapor IO said its service will offer  real time telemetry for contextualizing resources, responding to actual and predicted failure conditions, as well as hypercomposing resource flows for implementing the Open Grid.

Vapor IO also operates its Kinetic Edge Exchange, a high-speed, software-defined interconnection services platform at the edge. Customers can cross-connect, via software, to other networks on Vapor IO’s platform.