Sunday, December 6, 2020

AirHop integrates eSON with Azure

AirHop Communications has integrated its eSON platform with Microsoft Azure (cloud, Edge Zones and Azure Private Edge Zones), enabling near real-time Radio Access Networks (RAN) automation and optimization applications to accelerate 4G and 5G deployments for operator and private enterprise networks.

AirHop's eSON platform enables RAN intelligence via real-time coordinated performance optimization for 4G and 5G Open RAN architectures, delivering applications for automated configuration optimization, interference management, mobility optimization and is extensible for new customer driven optimization applications. The cloud-native eSON system is deployable as a stand alone VNF and as xApps in an O-RAN compliant near real-time Radio Intelligent Controller (RIC).

AirHop said it will be working with Microsoft to ensure seamless integration and operation of eSON as a Cloud Native Function (CNF) in the Azure platforms. The addition of eSON extends Azure 4G/5G solutions with commercially hardened real-time autonomous optimization applications delivering better spectral efficiency, faster data rates, improved end-user quality of experience and operational cost savings through network self-healing.

“We are pleased to collaborate with Microsoft on cloud-based next generation network platforms,” stated Yan Hui, CEO and co-founder at AirHop. “Real-time autonomous network optimization is essential for 5G and our eSON software is field proven in large scale deployments globally including Rakuten Mobile and Reliance Jio. Microsoft Azure platforms and eSON network optimization applications will be used across various businesses to simplify private 5G deployment, optimization and maintenance. Our solution also brings an O-RAN compliant platform roadmap to Azure 4G/5G solutions.”

http://www.airhopcomm.com




Luna Innovations acquires OptaSense for fiber monitoring

Luna Innovations has acquired OptaSense Holdings, a QinetiQ company, for £29 million in cash.

OptaSense specializes in fiber optic distributed monitoring solutions for pipelines, oilfield services, security, highways and railways, as well as power and utilities monitoring systems. The combination is expected to create the world’s largest fiber optic sensing company.

Luna said the acquisition brings important distributed acoustic sensing (DAS) intellectual property and products, which strongly complement its existing portfolio, and provides algorithm-development expertise, critical for AI and machine learning. OptaSense’s research and development talent and highly skilled salesforce, combined with more than 150 active and pending patents, will also enhance Luna’s existing experienced team and broaden its intellectual property portfolio.

"The acquisition of OptaSense marks an incredibly important milestone in Luna’s history and will further support our growth trajectory," said Scott Graeff, President and Chief Executive Officer of Luna. "With the combination of Luna and OptaSense, we are bringing together businesses with strong adjacencies and a large, combined opportunity. This transaction allows Luna to acquire a leader in fiber optic sensing solutions and distributed acoustic sensing systems of a global size and scale that will truly be transformative to our company. In addition, OptaSense’s success has been driven by a world class, industry-leading technology base and a very talented team of employees. We are very excited about welcoming them to the Luna team.”


Renesas showcases optical interconnects at virtual ECOC

Renesas Electronics will showcase its portfolio of optical communication products at this week's virtual European Conference on Optical Communication (ECOC) 2020:

Optical Communications for Datacom

PAM4-based solutions for datacom - featuring the industry’s first CMOS-based PAM4 CDR solution, the new HXT14450 CDR with integrated VCSEL driver and the HXR14450 CDR with integrated TIA are designed for 200G and 400G links and are also ideally suited for short range (SR) and Active Optical Cable operation for data centers. The series features significantly lower power and smaller size compared with traditional DSP solutions, as well as higher integration – including an integrated MCU – to further simplify system design. The series is certified for the -40°C to 85°C temperature range, making it ideal for optical communications links in 5G mid- and back-haul infrastructure. The standalone HXC44400 CDR is also available, and customers can combine it with Renesas DML drivers and TIAs to enable 200G long range links.

The lineup of high performance optical signal chain products also includes the HXT45411 family of EML drivers, HXT45430 Silicon-Photonics drivers, HXT44420 family of DML drivers and HXR45400 series TIAs for PAM4 deployments.

Optical Communications for Telecom

Renesas’ 64 GBaud GX76474 driver family and GX36420 series Coherent TIAs combine exceptional analog performance, low power, and high reliability with high bandwidth and configurability to support the telecom industry’s fastest growing segment – coherent optical communications. These new drivers and TIAs support all the key requirements to support the increased demands of longer range communication including:

  • Up to 400 Gbps of data speeds using industry-standard 64 GBaud modulation
  • Scalable solutions for 32G, 45G, and 64G, enabling customers to optimize either for speed or for power and cost, and to adjust key parameters via Serial Peripheral Interface (SPI)
  • The GX76474 and GX36420 series also cover all the optical modulator technologies currently on the market, including Lithium Niobate, Indium Phosphide, and Silicon Photonics, as well as both the industry-standard Integrated Coherent Receiver (ICR) and Transmitter Receiver Optical Sub-Assembly (TROSA) configurations.

“Over the last several months, data center, network, and telecom infrastructures have navigated significant increases in the demands and requirements placed on their systems, driven by increasing volumes of high-bandwidth data such as live and on-demand streamed content, the deployment of more AI-based systems, and a worldwide shift to the cloud as more consumers depend on connected systems for their work and daily life,” said Diwakar Vishakhadatta, Vice President of Optical Communication Products at Renesas. “

Broadband Forum cites 2020 progress as Robin Mersh steps down

Despite the challenges of COVID-19, the Broadband Forum said 2020 was a record year for the development of industry-wide standardized solutions and technical specifications and open source projects. In 2020 the Forum published 25 technical reports, 14 application notes, test plans, marketing reports and market updates and had 24 new members and observers in attendance. It also held five vBASe events virtually covering all corners of the globe, and in addition over 20 separate virtual sessions in its educational webinar series, which addressed hot topics including PON, USP, 5G and convergence. 

The Broadband Forum also expressed its gratitude to Robin Mersh who, after 14 successful years in office, has stepped down from his role as Chief Executive Officer to pursue a new challenge outside of the industry. Long-term Broadband Forum contributor and previous board member, Ken Ko re-joins the Forum as Managing Director and Craig Thomas moves into a new position of Vice President of Strategic Marketing and Business Development.

“It has been an honor serving the broadband community through some very exciting times. It has always been interesting and rewarding, but I am happy to leave the organization in good hands,” said Mersh. “The work is cutting edge and continues to be groundbreaking for convergence, cloud services, service management, Wi-Fi, testing, certification and software. The future is bright, and I’ll continue to follow the Broadband Forum with great interest and pride.”

“I would like to extend my thanks and express the appreciation of the Forum’s membership to Robin Mersh who has played a pivotal role and provided an incredible service in shaping the Broadband Forum to be the well-regarded force in the industry it is today,” said John Blackford, Broadband Forum Chairman.

https://www.broadband-forum.org

Chinese professor pleads guilty in U.S. case involving CNEX, Huawei

 Bo Mao, a visiting professor at the University of Texas, pled guilty to a single charge of making a false statement to the FBI. The case relates to the theft of a high-performance storage chip developed by CNEX Labs. Prosectutors alleged that the theft was carried out on behalf of Huawei.  

Mr. Mao, a Chinese national, is expected to be allowed to return to China after the sentencing later this month.


Thursday, December 3, 2020

Intel shows micro-ring modulators, all-silicon photodetectors, multi-lambda lasers

Intel showcased a number of advancements in the field of optical interconnects, advancing its long-term ambition to bring optical I/O directly into silicon packages. During a virtual Intel Labs day presentatio, the company demonstrated advances in key technology building blocks, including with light generation, amplification, detection, modulation, complementary metal-oxide semiconductor (CMOS) interface circuits and package integration. 

Key technology building blocks showcased:

  • Micro-ring modulators: Conventional silicon modulators take up too much area and are costly to place on IC packages. By developing micro-ring modulators, Intel has miniaturized the modulator by a factor of more than 1,000, thereby eliminating a key barrier to integrating silicon photonics onto a compute package.
  • All-silicon photodetector: For decades, the industry has believed silicon has virtually no light detection capability in the 1.3-1.6um wavelength range. Intel showcased research that proves otherwise. Lower cost is one of the main benefits of this breakthrough.
  • Integrated semiconductor optical amplifier: As the focus turns to reducing total power consumption, integrated semiconductor optical amplifiers are an indispensable technology, made possible with the same material used for the integrated laser.
  • Integrated multi-wavelength lasers: Using a technique called wavelength division multiplexing, separate wavelengths can be used from the same laser to convey more data in the same beam of light. This enables additional data to be transmitted over a single fiber, increasing bandwidth density.
  • Integration: By tightly integrating silicon photonics and CMOS silicon through advanced packaging techniques, we can gain three benefits: lower power, higher bandwidth and reduced pin count. Intel is the only company that has demonstrated integrated multi-wavelength lasers and semiconductor optical amplifiers, all-silicon photodetectors, and micro-ring modulators on a single technology platform tightly integrated with CMOS silicon. This research breakthrough paves the path for scaling integrated photonics.

Intel said these advancements will enable future architectures that are more disaggregated, with multiple functional blocks such as compute, memory, accelerators and peripherals spread throughout the entire network and interconnected via optical and software in high-speed and low-latency links.

“We are approaching an I/O power wall and an I/O bandwidth gap that will dramatically hinder performance scaling. The rapid progress Intel is making in integrated photonics will enable the industry to fully re-imagine data center networks and architectures that are connected by light. We have now demonstrated all of the critical optical technology building blocks on one silicon platform, tightly integrated with CMOS silicon. Our research on tightly integrating photonics with CMOS silicon can systematically eliminate barriers across cost, power and size constraints to bring the transformative power of optical interconnects to server packages,” stated James Jaussi, senior principal engineer and director of PHY Lab, Intel Labs.

Without such advancements, Intel warns the industry will soon reach the practical limits of electrical I/O performance - what it calls an "I/O power wall".



ONF's Aether Edge Cloud selected for DARPA's Pronto Project

The Open Networking Foundation's Aether 5G Connected Edge Cloud platform is being used as the software platform for Pronto, a project backed by $30 million in DARPA funding to develop secure 5G network infrastructure. Specifically, DARPA is funding ONF to build, deploy and operate the network to support research by Cornell, Princeton and Stanford universities in the areas of network verification and closed-loop control. 

Aether (pronounced ‘ee-ther’) provides mobile connectivity and edge cloud services for distributed enterprise networks, all provisioned and managed from a centralized cloud. ONF will enhance and deploy its open source Aether software platform as the foundation for the Pronto research work, and in turn the research results will be open sourced back into Aether to help advance Aether as a platform for future secure 5G network infrastructure.

One of Pronto's goals is "to leverage network programmability to enable deep and wide network visibility, verification, and closed-loop control, giving programmers tools to build and dynamically deploy customized network functionality in a secure and reliable manner."


ONF also confirmed that it is now running a beta production deployment of Aether.  This deployment is a single unified cloud managed network interconnecting the project’s commercial partners AT&T, Ciena, Intel, Google, NTT, ONF and Telefonica. This initial deployment supports CBRS and/or 4G/LTE radio access at all sites, and is cloud managed from a shared core running in the Google public cloud.

The University campuses are being added to this Aether deployment in support of Pronto. Campus sites will be used by Pronto researchers to advance the Pronto research, serving as both a development platform and a testbed for use case experimentation. The Aether footprint is expected to grow on the university campuses as Aether’s 5G Connected Edge Cloud capabilities are leveraged both for research on additional use cases as well as for select campus operations.

“At Google Cloud, we are working closely with the telecom ecosystem to help enable 5G transformation, accelerated by the power of cloud computing. We are pleased to support the Open Networking Foundation's work to extend the availability of 5G and edge capabilities via an open source platform,” stated Shailesh Shukla, VP and GM, Networking, Google Cloud.

“Cornell is deploying Aether on campus to bring private 5G/LTE connectivity services with edge cloud capabilities into our research facilities.  We expect private 5G/LTE with connected edge cloud to become an important and integral part of our research infrastructure for many research and operational groups on the campus.  We also see the value of interconnecting a nation-wide leading infrastructure with Stanford, Princeton and ONF for collaborative research among university researchers across the country,” said David Lifka, Vice President for Information Technologies and CIO, Cornell University.

https://prontoproject.org/

https://opennetworking.org/

ONF's Aether targets Enterprise 5G/LTE-Edge-Cloud-as-a-Service

The Open Networking Foundation (ONF) announced Aether – the first open-source platform for delivering Enterprise 5G/LTE-Edge-Cloud-as-a-Service.

Aether (pronounced ‘ee-ther’) provides mobile connectivity and edge cloud services for distributed enterprise networks, all provisioned and managed from a centralized cloud.


Aether leverages existing work from ONF including the CORD and ONOS platforms. It can be run in a Kubernetes environment, and it simultaneously supports deployment on licensed (4G/5G) and unlicensed (CBRS) spectrum.

“Aether opens the door for enterprises to rapidly deploy 5G and edge cloud services to help power their digital transformations. This can be done with a variety of flexible business models including in collaboration with telco operators, cloud operators, and third party providers. It offers the flexibility to utilize a wide range of bands including 5G, licensed bands, and CBRS. This cloud-enabled platform turns mobile connectivity and enterprise mobile edge cloud capabilities into a cloud-managed service, simplifying deployment and operations while delivering scalable and cost-effective services,” states Guru Parulkar, Executive Director, ONF & Executive Director, Stanford Platform Lab.


Broadcom samples 7nm 8x100G PAM4 PHYs

Broadcom announced first sampling of a new family of 7nm 800G PAM-4 PHY devices. The portfolio includes 800G optical PHY devices (BCM8780X) optimized for QSFP-DD800 and OSFP transceiver module applications and an 800G 8:8 retimer PHY device (BCM87360) designed for line card applications. 

Highlights:

BCM87800/BCM87802 – Ultra-low power 7nm 800G optical PHYs for transceiver modules

  • Monolithic integrated 112Gbps laser driver with direct-drive PAM-4 output capability for EML and Silicon Photonics
  • Industry-leading DSP performance and power efficiency 

BCM87360 – Industry’s first 7nm 800G 8:8 retimer PHY for line cards

  • High-performance PAM-4 SerDes @ host and line side with link training and auto-negotiation
  • Interoperable with Broadcom switch merchant silicon and ASIC
  • Compliant to IEEE and OIF standards

“Continuing Broadcom’s strategy of building best-in-class PHYs, the two new 8x100G PHY families being sampled today expands our industry-leading 7nm PAM4 product line,” said Lorenzo Longo, senior vice president and general manager of the Physical Layer Products Division at Broadcom. “Broadcom provides optimized solutions for a wide range of optical and line card applications at both 50G and 100G. No other company offers the same portfolio breadth with an equivalent level of investment and IP availability to enable the next level of network expansion.” 



DARPA backs Lasers for Universal Microscale Optical Systems program

DARPA is backing a new Lasers for Universal Microscale Optical Systems (LUMOS) program, which aims to bring high-performance lasers to advanced photonics platforms. 

Three LUMOS Technical Areas are cited:

  • bringing high-performance lasers and optical amplifiers into advanced domestic photonics manufacturing foundries. Tower Semiconductor and SUNY Polytechnic Institute were selected to demonstrate flexible, efficient on-chip optical gain in their photonics processes to enable next-generation optical microsystems for communications, computing, and sensing. LUMOS technologies will be made available to future design teams through DARPA-sponsored multi-project wafer runs.
  • developing high power lasers and amplifiers on fast photonics platforms for microwave applications. Research teams include Ultra-Low Loss Technologies, Quintessent, Harvard University, and Sandia National Laboratories.
  • creating precise lasers and integrated photonic circuits for visible spectrum applications with an ambitious goal of “wavelength by design” across an unprecedented spectral range. The teams will seek to develop lasers at many challenging wavelengths throughout the program to enable compact atomic sensors for navigation, precise timing solutions, and emerging quantum information hardware. Selected research teams include Nexus Photonics, Yale University, California Institute of Technology, Sandia National Laboratories, and the University of Colorado at Boulder.

"LUMOS is part of the third phase of DARPA’s Electronics Resurgence Initiative (ERI) – a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems,” said Gordon Keeler, program manager in DARPA’s Microsystems Technology Office. “As an ERI program, LUMOS aims to create unique, differentiated domestic manufacturing capabilities that are accessible to the DoD through the enhanced capabilities of existing foundries and through DoD-relevant demonstration systems created by the program performers."

https://www.darpa.mil/news-events/2020-12-01

Hawaiki augments its trans-Pacific cable with capacity on SEA-US

Hawaiki Submarine Cable signed an agreement with Hawaiian Telcom Inc., securing significant international capacity on the Southeast Asia – United States (SEA-US) trans-Pacific fiber cable system from Guam to Los Angeles.

The deal, along with recently-acquired capacity on JGA-South cable from Sydney to Guam, enables Hawaiki to expand its subsea network with a new route linking Sydney, Guam, Hawai‘i and Los Angeles. This adds greater connectivity and route diversity between Australia and the U.S.

Hawaiki owns and operates the 15,000km Hawaiki Transpacific Cable, which was launched in July 2018,  with a design capacity of 67 Tbps. It links New Zealand, Australia, Hawai‘i and mainland U.S. 

The SEA-US Cable, which went into service in August 2017, runs a similar length to connect Indonesia, the Philippines, Guam, Hawai‘i and California, and is owned and operated by a consortium of regional telcos, including Hawaiian Telcom. JGA-South Cable came into service in March 2020, spanning 7,000 km from Sydney to Guam.

https://www.hawaiki.co.nz/news-and-updates/hawaiki-and-hawaiian-telcom-activate-milestone-sydney-guam-hawaii-la-route/

IEEE forms 802.3 Beyond 400Gb/s Ethernet Study Group


IEEE has formed a study group within the IEEE 802.3 Ethernet Working Group with an aim to standardize capabilities exceeding today’s maximum data rate of 400 Gbps.

The first meeting of the newly launched IEEE 802.3 Beyond 400 Gb/s Ethernet Study Group is scheduled for the IEEE 802.3 Ethernet Working Group’s interim session the week of 18 January 2021.

“The path to beyond 400 Gb/s Ethernet exists, but there are a host of options and physical challenges that will need to be considered to take the next leap in speed rate for Ethernet,” said John D’Ambrosia, Distinguished Engineer, Futurewei Technologies, who led the call for interest in forming the IEEE 802.3 Beyond 400 Gb/s Ethernet Study Group. “Both the historical trend lines for Ethernet bandwidth demand and everything the industry understands today about its future needs and technology growth curves indicate that the time to take the next step is now, in order to satisfy humanity’s needs and desires for connectivity. It will be the responsibility of the study group to examine the problem and develop the project authorization documentation necessary to launch a new standard-development project.”



WSJ: U.S. considers a possible deal for Huawei's Meng Wanzhou

The U.S. Department of Justice is in talks with Meng Wanzhou, the chief financial officer and deputy chairwoman of Huawei and daughter of founder Ren Zhengfei, about a possible deal that could lead to her return to China, according to Reuters, The Wall Street Journal and other media sources. Ms. Meng, who was arrested in Vancouver, Canada in December 2018, is wanted by the U.S. authorities for alleged bank fraud regarding the re-export of restricted U.S. technology to Iran. Her extradition to the United States has been tied up in the Canadian courts.  

https://www.reuters.com/article/usa-huawei-tech-canada/update-1-us-in-talks-with-huawei-cfo-meng-on-resolving-criminal-charges-source-idUSL1N2IJ32H

Canadian court rules extradition process can continue for Huawei exec

A Canadian court has ruled that the extradition process of Huawei CFO Meng Wanzhou to the United States to face fraud charges may continue. The question at hand was whether the case should be dismissed for failing to meet the criteria of "double criminality" -- whether the alleged activity also violates Canadian law.

In a press statement, Huawei expressed its disappointment and said it hoped Canada's judicial system would ultimately "prove Ms. Meng's innocence."

 Huawei's CFO is arrested in Canada, U.S. seeks extradition

Meng Wanzhou, the chief financial officer and deputy chairwoman of Huawei, was arrested in Vancouver, Canada on December 1st at the request of the U.S. government, which is seeking her extradition, according to multiple news sources. U.S. authorities reportedly are investigating violations of economic sanctions on Iran.

Meng Wanzhou (Sabrina Weng) is the daughter of Huawei founder Ren Zhengfei.


  • A biography on Huawei's website says Meng Wanzhou joined the company in 1993 and has previously held the positions of Director of the International Accounting Dept, CFO of Huawei Hong Kong, and President of the Accounting Mgmt Dept. She is credited with the founding of five shared service centers around the world, the completion of Huawei's Global Payment Center in Shenzhen, leading an eight-year partnership with IBM focused on Integrated Financial Services.

NTT Ltd.'s Jason Goodall to retire in mid 2021

Jason Goodall, Global Chief Executive Officer of NTT Ltd., announced plans to retire at the end of June 2021 after 23 years in many senior leadership roles across the NTT family, including Global CEO of Dimension Data.

Following his retirement, Jason will remain as a Board Director for NTT Ltd. and Dimension Data, as well as act as a strategic advisor for our NTT Venture Capital business.

NTT said it will announce a successor in the coming weeks.



 

Wednesday, December 2, 2020

OIF's 2020 Transport SDN API Interoperability Demo

OIF completed a multi-vendor 2020 Transport SDN Application Programming Interface (API) interoperability demonstration aimed at validating the benefits of transport SDN for the 5G era.

The ten-week long interoperability testing exercise, which was held in Telefonica’s Madrid lab, focused on SDN-based programmability, control and automation — testing Layer 1 and Layer 0 OTN control using ONF T-API 2.1.3, with additional testing of OpenConfig device APIs for transport equipment in network-operator-defined use cases.

Participating vendors included ADVA, Ciena, Cisco Systems, Infinera and Nokia. Network operator Telefonica hosted the demo. China Telecom, Telia and TELUS participated as consulting network operators.

“Operators have demanded more open optical networks to enable flexibility, lower costs, and best-of-breed options,” said Scott Wilkinson, Lead Analyst at Cignal AI. “Standard management interfaces and multi-vendor interoperability are critical to open optical networks. The interoperability demonstration recently performed under the guidance of the OIF is a major step towards achieving those operator goals.”

“The successful completion of the OIF 2020 Transport SDN API interoperability demonstration is a significant milestone toward widespread SDN deployment in production networks,” said Arturo Mayoral, Telefónica Transport Global CTIO Unit – Technology Expert and Lead of Optical SDN strategy. “By aligning vendors for a shared purpose – interoperability – and testing multiple use cases, we’re fostering manageability and flexibility in the network to allow deployment of cloud-based services, meet dynamic bandwidth demands and accelerate transport network transformation for the 5G era.”

The results of the multi-vendor demonstration will be revealed during a public read-out webinar event being held in partnership with Lightwave, Tuesday 12 January 2021, 6:00-7:30am PST. Register for free here

A private read-out event for demo participants and invited Network Operators is scheduled for Tuesday 19 January 2021.

OIF representatives will give presentations on the current status of the 2020 OIF Transport SDN API Interoperability Demonstration during the below events:

  • NGON & DCI World Digital Symposium – Friday 04 December 2020 – 20:00-20:15pm CET, OIF Speaker: Arturo Mayoral López de Lerma, Telefonica S.A
  • ECOC – Monday 07 December 2020 – 17:20-17:40pm CET, OIF Speaker: Arturo Mayoral López de Lerma, Telefonica S.A

https://www.oiforum.com/technical-work/2020-oif-transport-sdn-api-interoperability-demo/


2020 Transport SDN Application Programming Interface (API) Interoperability Demonstration PR Boilerplate:

Inphi debuts its next-gen 400G DR4 silicon photonics platform

Inphi has begun sampling its next-generation 400G DR4 silicon photonics platform solution, which includes a silicon photonics integrated circuit (PIC), a flip chip transimpedance amplifier (TIA), and an analog controller.

The new 400G DR silicon photonics platform is designed to work seamlessly with Inphi’s Porrima PAM4 Digital Signal Processor (DSP).

400G DR silicon photonics platform highlights:

  • Analog controller IC which replaces multiple discrete components for laser bias, configuration and monitoring of silicon photonics, and TIA control 
  • Inphi’s complete silicon photonics transceiver with four low-loss, transmit Mach-Zehnder modulators and four high-responsivity, receive photodiodes
  • Low-power, flip chip TIA with excellent sensitivity, overload, and error floor
  • Inphi’s Porrima Gen3 low-power, PAM4 DSP with integrated 56Gbaud laser driver 

Inphi said it is bringing its high volume silicon wafer scale manufacturing by offering the option to purchase Inphi-designed high-performance 400G DR4 PICs in full 200-mm wafer form. Customers receive silicon PIC wafers direct from an Inphi fab partner and will be able to continue with high-volume wafer scale manufacturing and 3-D heterogenous integration in their own factories. 


“Inphi has been the leading force to define and create a PAM4 ecosystem of optical modules for cloud and data center networks,” said Dr. Loi Nguyen, Founder and SVP, Optical Interconnect at Inphi. “I believe today’s announcement will mark the beginning of a new era of the ‘fabless optics’ industry. Optical transceiver manufacturers can leverage silicon high volume wafer scale in the manufacturing of transceivers without owning a fab.”

http://www.inphi.com

Ayar Labs hits key milestone for chip-to-chip optical connectivity

 Ayar Labs demonstrated its patented monolithic electronic/photonic solution on Globalfoundries' next-gen photonics solution based on its 45nm platform. 

The companies said this industry-first demonstration is a key milestone in providing chip-to-chip optical connectivity at scale. The two companies began working together in 2015 with a commitment to collaborate and commercialize differentiated silicon photonics solutions for greenfield applications that would require extreme bandwidth density (high data throughput in a small physical package) at low latency and high energy efficiency.

“Ayar Labs has been perfecting our micro-ring based monolithic electronic/photonic solution for nearly a decade. But the true commercial potential is realized when coupled with a 300mm semiconductor fabrication process that delivers the performance, reliability, and cost advantages that we and our customers require,” says Charles Wuischpard, CEO, Ayar Labs. “This is yet another industry-first result that solidifies our leadership for this market opportunity.”

“Ayar Labs is an important partner of GLOBALFOUNDRIES,” says Anthony Yu, Vice President of Silicon Photonics at GF. “As collaborators, we’ve incorporated their requirements for PDK and process optimizations while providing early access to our next-generation process. Together, we will unlock a larger market opportunity and realize chip-to-chip optical I/O solutions that will enable higher bandwidth and faster connection for high performance compute applications.”

Over the last 18 months, Ayar Labs has been working with select semiconductor manufacturers, systems builders, and end users on co-design partnerships. The company is now announcing an expanded sampling program of its next-generation chiplet developed on GF’s latest silicon photonics manufacturing process that will be available to a broader group by request at ayarlabs.com/starterkit/

Dr. Mark Wade, President and CTO of Ayar Labs, will be sharing details of this industry first demonstration at ECOC 2020 as part of his presentation on ‘Silicon photonic chiplets for chip-to-chip communications’ on Tuesday, December 8, from 16:20 – 16:40 (CET). A video of the demonstration will also be made available at this time.

http://www.ayarlabs.com

Lockheed Martin Ventures invests in Ayar Labs

Lockheed Martin Ventures has made a strategic investment in Ayar Labs, a start-up that is developing  monolithic in-package optical I/O (MIPO) solution for applications that require high bandwidth, low latency and power efficient short reach interconnects. Financial terms were not disclosed.

Ayar Labs publicly demonstrated its monolithic electronic photonic TeraPHY chiplet at the Supercomputing 2019 conference and is now working with select semiconductor manufacturers, OEM systems builders, and end users on sampling and co-design partnerships in 2020. The company is based in Santa Clara, California.

“We are excited to welcome Lockheed Martin Ventures as a strategic investor,” said Charles Wuischpard, CEO of Ayar Labs. “Working with key system integrators like Lockheed Martin, who really understand the value of our solution and how to design it into future complex systems, is incredibly important. In that sense, we view this relationship as more than funding alone, but as an important long-term working relationship as well.”

Ayar Labs selected for Intel’s DARPA PIPES Project

Ayar Labs has been selected as Intel’s optical I/O solution partner for their recently awarded DARPA PIPES (Photonics in Package for Extreme Scalability) project.

The PIPES project aims to develop integrated optical I/O solutions co-packaged with next generation FPGA/CPU/GPU and accelerators in Multi-Chip Packages (MCP) to provide extreme data rates (input/output) at ultra-low power over much longer distances than supported by current technology. In the first phase of the project, the Ayar Labs TeraPHY chiplet will be co-packaged with an Intel FPGA using the AIB (Advanced Interconnect Bus) interface and Intel’s EMIB silicon-bridge packaging. “We’re seeing an explosion of Datacenter workloads that have an insatiable demand for bandwidth and the need to connect devices at rack-scale distances,” said Vince Hu, VP of Strategy and Innovation for Intel’s FPGA products. “The best way to do that is with optical interconnect and by using an Ayar Labs chiplet(s), we can achieve very high bandwidth at low latency and low power consumption.”

“Bringing optical connectivity all the way into the CPU/SOC package has long been one of the ‘Holy Grail’ projects in High Performance and Hyperscale Computing, as it unleashes the performance of ever more powerful computing and network processors and removes a major bottleneck and set of constraints in systems architecture and design,” said Charles Wuischpard, CEO of Ayar Labs, “Moreover, the energy consumed in moving data through a system is now very significant and growing, and the best way to manage that is to move the data optically from end to end. We are pleased to be selected by Intel as the optical solution for their DARPA PIPES project and look forward to a multi-year collaboration.”

The TeraPHY chiplet is manufactured on GLOBALFOUNDRIES' 45nm platform, which enabled Ayar Labs to build a monolithic, single-die solution that integrates both electrical and optical photonic circuits and devices on a single chip.

“We have worked in close collaboration with Ayar Labs to deliver a new class of integrated electronic, photonics solutions,” said Anthony Yu, vice president of Computing and Wired Infrastructure at GF. “Going forward, we’re excited to work with the pioneers at Ayar Labs to continue disrupting the market by combining our next generation 45nm platform, targeted to future CMOS-based photonics solutions, with their differentiated technology that will push the limits of chip communication bandwidth for high-performance computing, cloud and AI applications.”

NeoPhotonics' Class 60 coherent modulators/receivers for 100+ Gbaud

 NeoPhotonics announced the addition of Class 60 versions of its Coherent Driver-Modulator (CDM) and Intradyne Coherent Receiver (Micro-ICR) to its suite of High Bandwidth Coherent components, addressing the next generation of 100+ Gbaud systems to meet the ongoing growth in demand for bandwidth, especially between cloud data centers. 

These new Class 60 Coherent components extend the highest speed over distance performance of NeoPhotonics' existing Class 50 products by increasing the 3 dB bandwidth from 50 GHz to 60 GHz. The Class 60 suite improves on the currently shipping Class 40 components, and allows increasing symbol rates from the current 64+ Gbaud rate to the higher 100+ Gbaud rates. These NeoPhotonics components work together to enable customers to implement single wavelength data transmission near one Terabit per second over datacenter interconnect (DCI) distances, and long-haul 400~500Gbps transmission.

Higher symbol rates increase data capacity while maintaining superior optical signal to noise ratio (OSNR) and reach performance, thereby enabling the highest speed over distance use. These new components are available in compact form factor packages suitable for use in pluggable modules and compact daughter cards. NeoPhotonics Class 60 CDM and Micro-ICR are mechanically compatible to their Class 40 counterparts, and are a natural upgrade path for achieving the higher symbol rates (100+ Gbaud) in order to support 800Gbps and above data rates per wavelength applications.

The Class 60 suite comprises:

  • Class 60 CDM: NeoPhotonics Class 60, polarization multiplexed, coherent driver modulator (CDM) features a co-packaged InP modulator with four linear, high bandwidth, differential drivers, and is designed for low V-Pi, low insertion loss and a high extinction ratio. The compact package is designed to be compliant with the form factor of the OIF Implementation Agreement #OIF-HB-CDM-01.0.
  • Class 60 Micro-ICR: NeoPhotonics Class 60 High Bandwidth Micro-Intradyne Coherent Receiver (Micro-ICR) is designed for 100+ Gbaud symbol rates, more than tripling the rate of standard 100G ICRs. The compact package is designed to be compliant with the OIF Implementation Agreement OIF-DPC-MRX-02.0.

These components are designed to work together with NeoPhotonics “Nano” ultra-narrow linewidth external cavity tunable laser, which cuts the size approximately in half compared to current Micro-ITLAs, while featuring industry leading linewidth and low phase noise with low electrical power consumption.

“NeoPhotonics has supported our customers by being first to volume production of our products at each new speed node. We are pleased to now offer Class 60 coherent modulators and receivers, which along with our ultra-narrow linewidth external cavity “nano” tunable laser, provide a complete suite of components enabling customers to increase the data rate per wavelength to one Terabit and beyond,” said Tim Jenks, Chairman and CEO of NeoPhotonics. “We are continuing to extend the bandwidth of our Indium Phosphide coherent integration platform to serve the highest speed over distance applications,” concluded Mr. Jenks.

https://www.neophotonics.com/press-releases/?newsId=12071

Advanced Material Solutions for Co-Packaged Optics - replay

The thermal properties of optical components become key considerations as power, processing, and utilization increase with faster data rates. For future optical components, several advanced materials are being considered. 

Our guests for this webinar are:

Dr. Peter Johnson, Staff Scientist at SABIC, who discusses thermoplastic optical integration in co-packaged applications. Dr. Johnson obtained his Ph.D in Chemistry at the University of Colorado, Boulder.

Dr. Jake Joo , who leads the  Optoelectronics group at Dupont. His presentation covers the high-speed data challenges for co-packaged optics, and the critical materials needed for next-gen data centers, including polymer waveguides, low-loss dialectic materials, index management materials, thermal management materials, etc. Dr. Joo obtained his PhD.D. in Materials Science and Engineering from MIT.

This is the third in a series of webinars sponsored by Dupont’s Silicon Valley Tech Center and the Consortium for On-board Optics (COBO).

https://youtu.be/f2-y6qnMbRA

Viavi introduces test tool for last mile fiber deployment

Viavi Solutions introduced a new type of network test tool to speed and simplify last mile optical fiber activation and maintenance. 

The versatile VIAVI Optimeter combines the functionality of a broadband or GPON/XG(S)-PON power meter with fiber certification and connector inspection in a simple, all-in-one solution for effortless FTTx certification and troubleshooting — regardless of field technicians' experience level. The Optimeter was designed to reduce truck rolls and trouble tickets by proving successful fiber install passes, or providing clear fault ownership information to stop unnecessary handoffs.

"Pressure to meet demand for new PON/FTTH service often leads to minimal testing or even no testing. As a result, technicians are not able to complete install and activation on the first visit between 20 to 50% of the time, leading to poor customer experiences and lost revenue," said Kevin Oliver, Vice President and General Manager, Converged Instruments and Virtual Test, VIAVI. "As service activation failure rates and maintenance costs continue to rise, the VIAVI Optimeter is a critical tool for premise and home techs to make sure that last mile fiber installation is done right the first time, improving deployment success rates and reducing the need for return visits."

Vodafone Business announces AWS Wavelength edge service in London

Vodafone Business is the first company in Europe to enable an AWS Wavelength service for distributed Multi-access Edge Computing (MEC).

In collaboration with AWS, Vodafone Business’ distributed MEC service will be rolled out from the spring of 2021, starting with the first commercial centre in London, and with other locations in the UK and Germany to follow. 

The commercial MEC centre in London will provide an ultra-low latency zone over a wide area and make use of Vodafone’s 5G network in the capital. In addition to areas within and around London, the low latency zone will extend to Cambridge, Oxford, Birmingham, Bristol, and Cardiff, as well as many towns home to tech firms along the M4 motorway corridor and parts of Wales and Cornwall.

Vodafone Chief Technology Officer, Johan Wibergh, said: “Every millisecond matters in digitalising manufacturing, safeguarding citizens and workers, transporting medical supplies by drone or eliminating motion sickness when wearing a VR headset. Putting these services much closer to the customer with Vodafone’s Edge Computing service will significantly reduce any delay in transmitting critical services. By opening up new innovation hubs within our 5G network, which currently spans 127 cities and nine markets in Europe, we can help turn new business ideas into commercial successes.”