Thursday, September 26, 2019

FCC outlines 3.5 GHz auction plan for 2020

The FCC is proposing to auction seven Priority Access Licenses (PALs) in the 3550-3650 MHz portion of the 3.5 GHz Band for each county-based license area in the country, for a total of 22,631 PALs nationwide.  Each PAL will consist of a 10-megahertz unpaired channel assigned by automated frequency coordinators, known as Spectrum Access Systems.  Consistent with the Commission’s rules, Priority Access Licensees would be permitted to aggregate up to four PALs in any license area.

The 3.5 GHz band holds the potential to be prime spectrum for 5G services.

The FCC is now seeking comment on the following proposals:

Using an ascending clock auction format (similar to the format used for Auction 102 and to be used for Auction 103), in which bidders indicate their demand for generic license blocks in specific counties;
Offering bidders the option to bid at a Cellular Market Area (CMA) level in the 172 CMAs that are classified as Metropolitan Statistical Areas and comprise multiple counties; and
Incorporating an “activity upper limit” that would allow bidders to submit bids that exceed their current bidding eligibility, to help mitigate the possibility of losing bidding eligibility under certain circumstances.

The FCC's Public Notice also proposes rules for bidding credit caps, upfront payments, bidding eligibility, minimum opening bids, bid removal and withdrawal, and other auction procedures for Auction 105, which is set to begin on June 25, 2020.



IDC: Cloud IT Infrastructure Revenues Decline in Q2

Vendor revenue from sales of IT infrastructure products (server, enterprise storage, and Ethernet switch) for cloud environments, including public and private cloud, declined 10.2% year over year in the second quarter of 2019 (2Q19), reaching $14.1 billion, according to the International Data Corporation (IDC) Worldwide Quarterly Cloud IT Infrastructure Tracker.

IDC also lowered its forecast for total spending on cloud IT infrastructure in 2019 to $63.6 billion, down 4.9% from last quarter's forecast and changing from expected growth to a year-over-year decline of 2.1%.




Some highlights from IDC:

  • Vendor revenue from hardware infrastructure sales to public cloud environments in 2Q19 was down 0.9% compared to the previous quarter (1Q19) and down 15.1% year over year to $9.4 billion. This segment of the market continues to be highly impacted by demand from a handful of hyperscale service providers, whose spending on IT infrastructure tends to have visible up and down swings. 
  • After a strong performance in 2018, IDC expects the public cloud IT infrastructure segment to cool down in 2019 with spend dropping to $42.0 billion, a 6.7% decrease from 2018. 
  • Spending on private cloud IT infrastructure has showed more stable growth since IDC started tracking sales of IT infrastructure products in various deployment environments. In the second quarter of 2019, vendor revenues from private cloud environments increased 1.5% year over year reaching $4.6 billion. IDC expects spending in this segment to grow 8.4% year over year in 2019.
  • Overall, the IT infrastructure industry is at crossing point in terms of product sales to cloud vs. traditional IT environments. In 3Q18, vendor revenues from cloud IT environments climbed over the 50% mark for the first time but fell below this important tipping point since then. In 2Q19, cloud IT environments accounted for 48.4% of vendor revenues. For the full year 2019, spending on cloud IT infrastructure will remain just below the 50% mark at 49.0%. Longer-term, however, IDC expects that spending on cloud IT infrastructure will grow steadily and will sustainably exceed the level of spending on traditional IT infrastructure in 2020 and beyond.
  • Spending on the three technology segments in cloud IT environments is forecast to deliver growth for Ethernet switches while compute platforms and storage platforms are expected to decline in 2019. Ethernet switches are expected to grow at 13.1%, while spending on storage platforms will decline at 6.8% and compute platforms will decline by 2.4%. Compute will remain the largest category of spending on cloud IT infrastructure at $33.8 billion.
  • Sales of IT infrastructure products into traditional (non-cloud) IT environments declined 6.6% from a year ago in Q219. For the full year 2019, worldwide spending on traditional non-cloud IT infrastructure is expected to decline by 5.8%, as the technology refresh cycle driving market growth in 2018 is winding down this year. By 2023, IDC expects that traditional non-cloud IT infrastructure will only represent 41.8% of total worldwide IT infrastructure spending (down from 52.0% in 2018). This share loss and the growing share of cloud environments in overall spending on IT infrastructure is common across all regions.
  • Most regions grew their cloud IT Infrastructure revenues in 2Q19. Middle East & Africa was fastest growing at 29.3% year over year, followed by Canada at 15.6% year-over-year growth. Other growing regions in 2Q19 included Central & Eastern Europe (6.5%), Japan (5.9%), and Western Europe (3.1%). Cloud IT Infrastructure revenues were down slightly year over year in Asia/Pacific (excluding Japan) (APeJ) by 7.7%, Latin America by 14.2%, China by 6.9%, and the USA by 16.3%.

Initial Specs for Common NFV Infrastructure published

The Common NFVI Telco Taskforce (CNTT), which is an open industry taskforce hosted by Linux Foundation and GSMA, has published its initial common Reference Model and first Reference Architecture with the goal of building of operationally-efficient, open source, SDN and NFV infrastructures.

“This initial release represents the first tangible output of CNTT,” said Heather Kirksey, vice president, Community and Ecosystem Development, the Linux Foundation. “In the short time since ONS North America, the community has already reached milestones around creation of the Reference Model and first Reference Architecture. We have also initiated significant discussion around Reference Implementation along with commencement of enhancements to OVP within OPNFV.  I am very pleased to see the focused delivery of this group and our ability to align the industry and accelerate innovation, especially in the advance of 5G. It’s incredible to witness such deep collaboration and integration among operators and vendors from across the globe.”



“The speed with which this group has been established and produced its first tangible results are testament to the close cooperation and collaboration of its industry members,” said Alex Sinclair, Chief Technology Officer, GSMA. “A common framework and approach will accelerate adoption and deployment in the 5G era and we look forward to aligning further with our partners on this important project.”

Initially organized early in 2019, CNTT held its first community-wide, face-to-face gathering in Paris this July, with more than 80 operator and vendor participants in attendance; the successful three-day event enabled collaborative discussion on next steps.

Following that initial meeting, the CNTT is working closely with taskforce members to refine the  NFVI Reference Model, define a limited number of Reference Architectures, develop testing and verification requirements, and work with the OPNFV Verification Program (OVP) to define a global VNF compliance and validation lifecycle. This work will shorten the on-boarding effort for VNFs, accelerate time to revenue, and reduce costs for both VNF vendors and operators. Relying on a ground breaking collaborative model between the GSMA, the Linux Foundation, and the telecommunications vendor ecosystem, the group is creating a suite of tangible specifications to be hosted by the GSMA, and code to be created and hosted within OPNFV. 

Preliminary documentation — including the first Reference Model — are available in CNTT GitHub repository 

“Since its formation earlier this year, the CNTT community has made tremendous progress in building out the foundational elements of a NFVI and VFN lifecycle framework, as well as creating alignment on a discrete, compliant and verified set of NFV infrastructures for the telco ecosystem,” said Mark Cottrell, assistant vice president, Network Cloud, AT&T Labs.

https://cntt-n.github.io/CNTT/doc/ref_model/chapters/chapter01.html#1.3

LF Edge takes on two new projects: Baetyl and Fledge

by Benedict Chua, Assistant Editor
LF Edge, which is part of the Linux Foundation, is taking on two new projects.

Baetyl, an existing project contributed by Baidu and previously known as “OpenEdge,” extends cloud computing, data and services seamlessly to edge devices.

“In the era of 5G and IoT, edge computing will have tremendous opportunities to play a role in all fields and industries,” said Watson Yin, Vice President of Baidu and the General Manager of the Intelligent Cloud business group. “As a founding member of LF Edge, Baidu Intelligent Cloud decided to donate Baetyl, the intelligent edge computing framework, to the community, hoping to reciprocate the open-source community while continuously contributing cutting-edge technologies to the global technology ecosystem.  The leading edge-computing technology and framework will further accelerate the implementation of cloud + AI in a wider range of industries with a bigger scale and lead the global AI industry into a new chapter of industrialized production.”

Fledge, an existing project contributed by Dianomic and previously known as “Fog Lamp,”  is an open source framework and community for the industrial edge focused on critical operations. Baetyl and Fledge join the organization’s founding projects: Akraino Edge Stack, EdgeX Foundry, Home Edge, Open Glossary of Edge Computing, and Project EVE. Concurrently,  IOTA Foundation, SAIC Foundation (TESRA), Thunder Software, and Zenlayer join as General members.

Fledge is an open source framework and community for the industrial edge focused on critical operations, predictive maintenance, situational awareness and Fledge works closely with both Project EVE and Akraino. Project EVE provides system and orchestration services and a container runtime for Fledge applications and services. Fledge’s verticals (manufacturing, energy, etc.) are starting to roll out 5G and private LTE networks; using Akraino blueprints, Fledge applications and services can be consistently managed as they utilize 5G and private LTE networks.

“It’s incredible to witness such strong industry support for collaborative innovation to create an open source framework at the edge,” said Arpit Joshipura, general manager, Networking, Automation, Edge & IoT, the Linux Foundation. “In just nine months, LF Edge has seen tremendous growth across the board. We couldn’t be more pleased to welcome our newest members and projects.  Added expertise in industrial edge, manufacturing, energy, and more brings the community and ecosystem closer to a more comprehensive edge stack, delivering shared innovation across technology sectors at the edge.”

http://www.lfedge.org

LF Edge announces Project EVE Seed Code

LF Edge, an umbrella organization within the Linux Foundation that aims to establish an open, interoperable framework for edge computing independent of hardware, silicon, cloud, or operating system, announced Project Edge Virtualization Engine (EVE) seed code contributed by LF Edge founding member ZEDEDA.

With Project EVE, edge gateways and devices run a variety of edge workloads simultaneously, decoupling application management from the underlying hardware. Applications can be deployed in standard virtual machines (VM) or container environments and be managed through a standard set of APIs.

“With Project EVE, the goal is to create a single virtualization standard for edge devices for the industry to build around so that we can enjoy the benefits of cloud-native applications sooner rather than later,” said Said Ouissal, co-founder and CEO of ZEDEDA. “Imagine how much more impact we can achieve now that edge applications can be reliably managed and secured.”

Additionally, LF Edge welcomes new Associate and Liaison member organizations Industrial Internet Consortium (IIC), the LIONS Center at the Pennsylvania State University, OTAinfo, and University of New Hampshire’s Interoperability Lab (UNH-IOL).

"We are excited to see the LF community continue to collaborate on building unified edge solutions,” said Arpit Joshipura, general manager,  Networking, IoT and Edge Computing, the Linux Foundation. “We appreciate ZEDEDA’s leadership in helping us advance On-Prem Edge IoT with initiatives like Project EVE, and are eager to showcase the broad capabilities of LF Edge onsite in Santa Clara while welcoming our newest members."

Linux Foundation targets Unified Open Source Framework for the Edge

The Linux Foundation is unifying a number of its projects into a new umbrella organization to establish an open, interoperable framework for edge computing independent of hardware, silicon, cloud, or operating system. The goal is the formation of a software stack that brings the best of telecom, cloud, and enterprise (representing location, latency and mobility differentiation).

LF Edge is initially comprised of five projects: Akraino Edge Stack, EdgeX Foundry, and Open Glossary of Edge Computing, formerly stand-alone projects at The Linux Foundation. The initiative also includes a new project contributed by Samsung Electronics, which will create a hub for real-time data collected through smart home devices, and another project from ZEDEDA, which is contributing a new agnostic standard edge architecture.

“The market opportunity for LF Edge spans industrial, enterprise and consumer use cases in complex environments that cut across multiple edges and domains. We’re thrilled with the level of support backing us at launch, with 60 global organizations as founding members and new project contributions,” said Arpit Joshipura, general manager, the Linux Foundation. “This massive endorsement, combined with existing code and project contributions like Akraino from AT&T and EdgeX Foundry from Dell EMC, means LF Edge is well-positioned to transform edge and IoT application development.”

LF Edge is already supported by the following founding members: (Premier) Arm, AT&T, Baidu, Dell EMC, Dianomic Inc., Ericsson, HP Inc., HPE, Huawei, IBM, Intel, inwinStack, Juniper Networks, MobiledgeX, Netsia, Nokia Solutions, NTT, OSIsoft, Qualcomm Technologies, Radisys, Red Hat, Samsung Electronics, Seagate Technology, Tencent, WindRiver, Wipro, ZEDEDA; and (General) Advantech Co., Alleantia srl,  Beechwoods Software Inc., Canonical Group Limited, CertusNet, CloudPlugs Inc., Concept Reply, DATA AHEAD AG, Enigmedia, EpiSensor, Foghorn Systems Inc., ForgeRock US Inc., Foundries.io, Hangzhou EMQ Technologies Co. Ltd., IOTech Systems Ltd., IoTium, KMC, Linaro, Mainflux, Mocana, NetFoundry, Packet, Pluribus Networks, RackN, Redis Labs, VaporIO, Vitro Technology Corp., Volterra Inc., Wanxiang Group; and (Associate) Automotive Edge Computing Consortium (AECC), Beijing University of Posts and Telecommunications (BUPT), Electronics and Telecommunications Research Institute (ETRI), Infrastructure Masons, Inc., and Project Haystack.

More about LF Edge projects:

  • Akraino Edge Stack -- creating an open source software stack that supports high-availability cloud services optimized for edge computing systems and applications;
  • EdgeX Foundry -- focused on building a common open framework for IoT edge computing.
  • Home Edge Project -- seed code contributed by Samsung Electronics, is a new project that concentrates on driving and enabling a robust, reliable, and intelligent home edge computing framework, platform and ecosystem running on a variety of devices in our daily lives.
  • Open Glossary of Edge Computing -- provides a concise collection of terms related to the field of edge computing.
  • Project EVE (Edge Virtualization Engine) -- contributed by ZEDEDA, will create an open and agnostic standard edge architecture that accommodates complex and diverse on- and off-prem hardware, network and application selections.

DE-CIX upgrades at EdgeConneX Munich

DE-CIX is upgrading its current equipment within the EdgeConneX facility in Munich, Germany, to a capacity of more than 1 terabyte.

DE-CIX has maintained network and peering infrastructure at Landsberger Strasse 155 – now the EdgeConneX Munich facility -- for the past ten years. Thanks to a growing number of customers with 100 Gigabit Ethernet connections serving over 140 Autonomous System Numbers, peak traffic now exceeds 36 Gbps. 

“Expanding our capacity with EdgeConneX was a natural choice in a competitive market known for tight data center real estate,” adds Dr. Thomas King, CTO at DE-CIX. “For businesses of all sizes and industries, the ability to interconnect to networks locally and access cloud onramps is more important than ever. This is a trend we see not just in Munich but in our other German markets as well. With our infrastructure upgrade in the EdgeConneX Munich facility, we are further driving our customers’ abilities to peer regionally while remotely accessing our other locations including Frankfurt, Hamburg, Dusseldorf, New York, Madrid, Marseille, Lisbon, Palermo and Istanbul.”

Keysight and Qualcomm eye Dynamic Spectrum Sharing

Keysight Technologies announced an extended collaboration with Qualcomm to accelerate commercialization of Dynamic Spectrum Sharing (DSS) technology.

DSS enables a mobile operator to flexibly use existing spectrum allocations across low-, mid- and high- frequency bands by dynamically switching between LTE and 5G NR coverage based on traffic demand. Mobile operators can leverage DSS to deliver the best possible performance and coverage for a mix of 4G and 5G devices.

The collaboration utilizes Keysight’s 5G network emulation solutions to accelerate the development of Qualcomm Snapdragon 5G Modem-RF System to support DSS, an emerging technology that is part of the 3GPP Release 15. By 2020, mobile operators are expected to start implementing DSS on existing 4G LTE base stations, speeding nationwide deployments of 5G services. DSS allows mobile operators to transform LTE base stations via a software upgrade to create hybrid 4G/5G base stations. As a result, users of DSS-capable 5G NR devices can access 5G services in urban and rural environments.

“Our continued collaboration with Keysight on 5G technology, which was initiated in 2015, has enabled Qualcomm Technologies to accelerate the implementation of DSS, a critical feature that will help mobile operators quickly transition to 5G,” said Jon Detra, vice president, engineering, Qualcomm Technologies, Inc. “Keysight helps us develop and validate our Snapdragon 5G Modem-RF System designs at a pace that will help accelerate 5G commercialization.”

http://www.keysight.com/find/5G

Wednesday, September 25, 2019

COBO demos packet transmission between On-Board and MSA modules

At this week's ECOC 2019 in Dublin, the Consortium for On-Board Optics (COBO) showcased compliance boards built to its recently completed Module Compliance Board (MCB) and Host Compliance Board (HCB) specification. Members also demonstrated the latest developments of optical connectivity solutions for faceplate, backplane, module and co-packaged optics.

Of note, a COBO proof-of-concept switch was demonstrating error-free packet transmission between COBO modules, OSFP modules and QSFP-DD modules. The 400GBASE-SR8 connections were between all module form factors. The OSFP and QSFP-DD modules operated at 10W; whereas, the COBO module had a 30% power savings by operating at under 7W. The ability to place the COBO module closer to the switch ASIC greatly improved the signal integrity performance of the connection permitting the COBO module to use a clock and data recovery (CDR) chip instead of a digital signal processing (DSP) chip.

“Member collaboration has enabled COBO to offer the industry’s first live traffic demonstration of an on-board optics switch based upon COBO’s specification and demonstrating the improved power efficiency of on-board optics,” said Brad Booth, President of COBO.  “COBO members have worked diligently to develop an industry-first specification for on-board optical modules and compliance boards to lower the barrier to entry for implementing on-board optics.”

http://onboardoptics.org






Broadcom delivers dual 400G MACSec PHY

Broadcom is now shipping a dual 400G MACSec PHY with AES-256 designed to address security requirements for high speed interconnects in modern network infrastructure including hyper-scale, cloud, service provider and enterprise networks.

Broadcom's BCM81343 quadruples the switch bandwidth capability of the previous generation duall 100G MACSec PHY by offering dual 400G ports. The device supports the IEEE 1588 precision time protocol (PTP) providing accurate clock timing for time-sensitive transactions and mission-critical tasks.

BCM81343 Product Highlights

  • Dual 400GbE PHY supporting CDAUI8, CDAUI4 electrical interfaces for QSFP-DD & OSFP optical modules
  • Supports MACSec in applications from 10G to 400G
  • Support MACSec in both 400G retiming & 400G<->100G (reverse gearbox) applications
  • IEEE 802.1AE 256-bit MACSec supporting data rates from 10G to 400G
  • IEEE 1588 supporting up to Class-C to meet stringent 5G timing requirements
  • Proven interoperability with Broadcom switch ASICs and ASSPs using 28-Gbaud PAM-4 and NRZ SerDes
  • Pin-compatible to Broadcom’s standard 400G reverse gearbox and retimer devices for easy upgrade
  • Low power 16nm CMOS technology 


“Data privacy and security have become critical in the data center and cloud infrastructure given the increasing number of security breaches. As cloud and service providers transition their networks to 400G Ethernet to support the growing demand for higher bandwidth and emerging 5G services, it’s imperative that their 400G networks be equipped with 400G MACSec to protect against intrusion attacks, wiretapping and other threats,” said Lorenzo Longo, senior vice president and general manager of the Physical Layer Products Division at Broadcom. “Expanding upon Broadcom’s industry-leading 400G PAM-4 PHY portfolio, the BCM81343 is the first commercial 400G MACSec PHY that delivers up to 800G of switch bandwidth with PTP time-stamping for 5G applications.”

Mellanox adds SONiC to its Spectrum switches

Mellanox Technologies announced ASIC-to-Protocol (A2P) customer support solutions for the SONiC Network Operating System (NOS) on Mellanox Spectrum switches.

SONiC (Software for Open Networking in the Cloud) is a fully open-sourced NOS for Ethernet switches, first created by Microsoft to run Microsoft Azure and now a community project under the Open Compute Project (OCP). SONiC is built on the Switch Abstraction Interface API (SAI) and breaks down traditional monolithic switch software into agile, microservices-based containerized components. This model accelerates innovation within the NOS and the data center by breaking vendor lock-in and simplifying switch programmability, allowing network operators to choose the best-of-breed switching platforms. SONiC offers a full suite of network functionality—like BGP, ECMP, VXLAN, IPv6, and RDMA—that has been deployed and production-hardened in some of the largest data centers in the world.

Mellanox has been a major contributor to SONiC. Mellanox is now adding SONiC support for customers running large deployments of the SONiC NOS on Mellanox SN2000 and SN3000 switches.

“SONiC is an amazingly versatile and scalable NOS for the data center, and Open Ethernet is an incredibly powerful concept,” said Amit Katz, Vice President of Ethernet Switches, Mellanox Technologies. “Every week we hear from more customers who want to combine the power of SONiC with the best-in-class switch silicon in Mellanox Spectrum. Our unique support offering and vast SONiC experience make this easy for new and existing SONiC customers.”

Yousef Kahlidi, Corporate Vice President, Azure Networking at Microsoft Corp. said, “SONiC delivers scalable and efficient cloud networking that offers one optimized NOS that runs on a variety of best-of-breed switches. Offering support for SONiC on their switches allows Mellanox to bring the benefits of SONiC to a larger customer segment.”



Michael Kagan, CTO and co-founder of Mellanox Technologies, talks about the next step for SmartNICs and the company's newly released ConnectX-6 Dx product driven by its own silicon.

Rambus tapes out its 112G XSR SerDes PHY

Rambus taped out its 112G XSR SerDes PHY on a leading-edge 7nm process node optimized for PPA to support data center, networking, HPC, AI and ML applications.

Rambus said its 112G XSR SerDes PHY represents the latest advancement in high-speed signaling technology for die-to-die (D2D) and die-to-optical engine (D2OE) connections.

"As semiconductor markets turn towards chiplets to enable their high-performance products, chip-to-chip interconnects will be critical for maintaining high speed and signal integrity across variable physical distances," said Shane Rau, research vice president, computing semiconductors at IDC. "SerDes PHYs at advanced process nodes, like the 7nm 112G XSR, enable that speed and signal integrity."

“Our 112G XSR SerDes PHY is implemented in the leading-edge 7nm process technology, providing chip and system architects the most advanced platform for their designs,” said Hemant Dhulla, vice president and general manager of IP cores at Rambus. “We are excited to continue our tradition of delivering leading-edge IP solutions that address the systems design challenges of the most demanding applications in networking, HPC and AI.”

The Rambus 112G XSR SerDes PHY includes:

  • High-bandwidth connectivity greater than 800 Gbps per millimeter of beachfront making it ideal for D2D and D2OE interconnects in networking and HPC applications
  • Designed to provide a low-power, high-speed interface that supports chip disaggregation
  • Best-in-class architecture for power, performance, area (PPA) with approximately 1 pJ/bit or 1mW/Gbps power
  • Compliance with Open Interface Forum Common Electrical I/O Consortium (OIF-CEI) standard


Broadband Forum updates Connect Home specs

Broadband Forum has released the latest version of its Connected Home standard User Services Platform (USP) alongside new Wi-Fi data models as part of TR-181.

USP 1.1 enables new deployments to implement quickly into existing infrastructure via support of MQTT, a commonly used protocol in many different aspects of the Connected Home.

The Broadband Forum said its new release also provides northbound REST APIs, which define a standard way of communicating with USP controllers to efficiently manage USP Agents and connected devices integrated with USP. The first version of the Compliance Test Plan is also given in USP 1.1, paving the way for more interoperable solutions in the future by ensuring quality USP implementations.

At the same time, Broadband Forum has published the TR-181 2.13 device data models which defines data models for all types of TR-069 and USP-enabled devices, including end-user devices, Wi-Fi access points, residential gateways, and other network infrastructure devices. This standard incorporates the Wi-Fi Alliance’s Data Elements specification to provide standards-compliant means to periodically retrieve data from USP devices via USP controllers and provide support for real-time control of Internet of Things (IoT) devices through a standardized model of controls and sensors.

The TR-181 data models also provide support for home networks with Multi-AP deployments and the latest Wi-Fi standards, 802.11ax and WPA3. This avoids the need for proprietary data models to be developed by different vendors, unifying Wi-Fi management for all types of deployments.

“The number of connected smart home devices is expected to overtake smartphones by 2021 and this represents a lucrative opportunity for operators,” said Geoff Burke, Chief Marketing Officer at Broadband Forum. “For this opportunity to be realized, standards, which were incredibly important in the mass deployment of broadband networks, are vital for creating a stable ecosystem for Connected Home implementations at scale. These latest updates aim to bring exactly that, positioning USP as the standardized, open, and interoperable platform for smart home and Wi-Fi management.”

https://www.broadband-forum.org/

Broadband Forum kicks off BNG Disaggregation project

The Broadband Forum is launching a new Broadband Network Gateway (BNG) project to define the architecture and requirements for a disaggregated BNG control plane and user plane which separates the control plane and data plane.

BNG disaggregation is expected to bring benefits such as centralized locations for configuration and IP address management, leading to faster delivery of new services. The work will also ensure the control plane and user plane can be easily scaled according to customer demand.

Intel outlines “Barlow Pass” - 2nd gen Optane DC persistent memory

Intel outlined a series of milestones in advancing memory and storage for cloud, artificial intelligence and network edge applications.

Developments include:

  • Intel plans to operate a new Optane technology development line at its facilities in Rio Rancho, New Mexico; 
  • The second-generation of Intel Optane DC Persistent Memory, code-named “Barlow Pass,” scheduled for release in 2020 with Intel’s next-generation Intel Xeon® Scalable processor 
  • Intel’s industry-first demonstration of 144-layer QLC (Quad Level Cell) NAND for data center SSDs (solid-state drives), which are also expected in 2020.


Intel said the combination of its Optane technology with QLC 3D NAND technology on a single M.2 module enables Intel Optane memory expansion into thin and light notebooks and certain space-constrained desktop form factors – such as all-in-one PCs and mini PCs. The new product also offers a higher level of performance not met by traditional Triple Level Cell (TLC) 3D NAND SSDs today and eliminates the need for a secondary storage device.

Aryaka extends SD-WAN with HybridWAN capability

Aryaka has extended its Global Managed SD-WAN with a HybridWAN capability, where a combination of Aryaka’s Layer 2 core connectivity and Aryaka-managed internet connectivity will provide a more flexible experience.

The Aryaka core option offers guaranteed performance for business-critical traffic, while the Internet option offers cost-effective transport for non-priority traffic, an ‘Internet-first’ paradigm for enterprise connectivity that tracks the ‘cloud-first’ paradigm for applications. This also helps enterprises consolidate their branch appliances resulting in a lower TCO.

Aryaka said its HybridWAN is combined with two additional innovations to help secure SD-WAN adoption; zone-based firewall capabilities and micro-segmentation in support of multi-tenancy.

The Aryaka service integrates edge intelligence, security, application optimization and visibility. Zones extend Aryaka’s existing north-south access firewall to east-west, such as separating employee, DMZ and external LANs. Micro-segmentation then extends this partitioning, either within a single enterprise or as part of a multi-tenant branch, across the SD-WAN.

“Aryaka has been at the forefront of these two trends, offering the first truly global managed SD-WAN Service,” said Shashi Kiran, CMO of Aryaka. “We’re now enhancing this even further with additional flexibility and choice, but not at the expense of added complexity, such as when an enterprise must manage different WAN providers and technologies or a traditional MPLS service where direct cloud connectivity takes extra effort.”

https://www.aryaka.com/

Bigleaf raises $21 million for its SD-WAN

Bigleaf Networks, a start-up based in Beaverton, Oregon, announced $21 million in Series B funding for its cloud-first SD-WAN.

Bigleaf says that while current networking technologies have been built for the large enterprise use-case of site-to-site networking, there is a gap for SMB and mid-sized companies seeking SD-WAN solutions.

Bigleaf is exclusively focused on partner-led channels, including telecom operators.

The funding round was led by Updata Partners with participation from the Oregon Venture Fund, SeaChange Fund, and other existing investors.

https://www.bigleaf.net

Ericsson makes US$1.23 billion provision for U.S. investigation

Ericsson made a provision of SEK 12 billion (US$1.23 billion) to resolve the ongoing investigation by U.S. authorities. The process to find a resolution is still ongoing, but Ericsson reckons it may face a monetary sanction of US$1 billion.

As previously disclosed, Ericsson has been co-operating voluntarily since 2013 with an investigation by the United States Securities and Exchange Commission (SEC) and, since 2015, with an investigation by the United States Department of Justice (DOJ) into Ericsson’s compliance with the U.S. Foreign Corrupt Practices Act (FCPA) and the process is still ongoing. The investigation covers a period ending Q1 2017 and revealed breaches of the Company’s Code of Business Ethics and the FCPA in six countries: China, Djibouti, Indonesia, Kuwait, Saudi Arabia and Vietnam.

The company previously communicated that the resolution of the investigations will result in material financial and other measures. While Ericsson cannot comment in detail on the ongoing process with the U.S. authorities, the Company can with current visibility now estimate the cost and thus make a provision, which will impact the third quarter 2019 results by SEK 12 b. The provision constitutes the Company’s current estimate of expenditure related to resolving the U.S. investigations, of which the combined monetary sanctions from SEC and DOJ is estimated at USD 1 b., and the remainder pertains to other costs related to resolving the investigation. The provision will be booked as Other Operating Expenses in the income statement of Segment Emerging Business and Other.

Börje Ekholm, President and CEO, says: ”Over the last two years we have operationally turned around our company and established a strong portfolio and competitive cost structure. With today’s announcement we confront another legacy issue and take the next step in resolving it. We have to recognize that the Company has failed in the past and I can assure you that we work hard every day to build a stronger Ericsson, where ethics and compliance are cornerstones in how we conduct business. Over the past two years, we have made significant investments in our ethics and compliance program including our investigative capabilities and have taken actions against employees who have transgressed our values and standards.”

HPE completes acquisition of Cray

Hewlett Packard Enterprise completed its previously announced acquisition of Cray Inc., the legendary supercomputer developer. The deal, which was first announced in May, was valued at approximately $1.3 billion, net of cash.

“Bringing together Cray and HPE establishes the most comprehensive end-to-end portfolio across compute, storage, software and services in the fast-growing high performance computing and artificial intelligence market segments,” said Phil Davis, president, Hybrid IT, Hewlett Packard Enterprise. “But, the real value is what we can accomplish together as one team. We are united in our vision to be a global leader in high performance computing. By combining the teams’ deep expertise and R&D engines, we are better positioned to help our customers solve their most data-intensive challenges both today and well into the future.”


Cray traces its origin back to 1972 and the founding of Cray Research. The company is currently based in Seattle, with US-based manufacturing, and approximately 1,300 employees worldwide. The company delivered revenue of $456 million in its most recent fiscal year, up 16 percent year over year.

Cray recently announced an Exascale supercomputer contract for over $600 million for the U.S. Department of Energy’s Oak Ridge National Laboratory. The system, which is targeted to be the world’s fastest system, uses Cray’s new Shasta system architecture and Slingshot interconnect. The company was also part of an award with Intel for the first U.S. Exascale contract from the U.S. Department of Energy’s Argonne National Laboratory, with Cray’s portion of the contract valued at over $100 million.

Tuesday, September 24, 2019

Verizon and Calix hit 34 Gbps over fiber using bonded NG-PON2

Verizon and Calix achieved 34 Gbps speeds over fiber using a bonded NG-PON2 (Next-Generation Passive Optical Network 2) ONT (Optical Network Terminal) prototype on Verizon’s simplified, increasingly automated fiber network. The demonstration was conducted at the Verizon Innovation Center in Waltham, Massachusetts.

To reach 34 Gbps, Verizon and Calix bonded all four available wavelength channels.

Verizon said it expects NG-PON2 technology will provide faster speeds, lower latency, simplification of operations and increased automation in the fiber network.  To achieve those benefits, NG-PON2 technology must be deployed throughout the entire fiber network.  Last year, Verizon and Calix successfully trialed NG-PON2 on the OLT (Optical Line Terminal).

“We know how important connectivity is to small and mid-size businesses,” said T.J. Fox, Senior Vice President and President of Verizon Business Markets. “These advances will deliver the promise of the cloud for our customers and bring them technology at parity to what previously was only in reach for large enterprises.”

“The AXOS Intelligent Access Edge simplifies the network, dramatically increases service velocity, and creates the foundation to unify both business and residential services into a single access transport,” said Michel Langlois, chief development officer for Calix. “The latest test results demonstrate how this approach enables CSPs to extend the benefits of AXOS all the way to the subscriber edge. With new services becoming increasingly bandwidth-intensive, our work with Verizon has demonstrated that AXOS systems leveraging NG-PON2 will provide the future-proof connectivity needed to meet these demands.”

Verizon goes all in with One Fiber program, NG-PON2


We are big believers in taking fiber all the way to the customer, said Lee Hicks, Verizon, speaking at ADTRAN's Broadband Business Solutions event in Huntsville, Alabama. Verizon's One Fiber program is its multiyear strategy to build a common fiber plant for all services, including consumer, business and mobile backhaul. The carrier starts with a deep base fiber, having invested in its FiOS FTTH network for years. In April 2017, Verizon awarded...


Verizon has selected Calix's AXOS E9-2 Intelligent Edge System to begin large-scale NG-PON2 deployments this quarter. These deployments will include the AXOS RPm (Routing Protocol module for Layer 3) and the AXOS SMm (Subscriber Management module for disaggregated Broadband Network Gateway). Financial terms were not disclosed. Calix said its NG-PON2 converged services platform enables Verizon to deploy a single access network for residential, business,...


ADVA leads PEARLS project to integrate quantum-dot lasers onto ePICs

ADVA is leading a three-year initiative funded by Germany’s Federal Ministry for Education and Research (BMBF) to create advanced optical transceiver chiplets for data center interconnect (DCI) applications.

The project entitled “Photonic Embedding of Active Region Laser chips in Silicon (PEARLS)” aims to integrate quantum-dot lasers onto silicon-based electro-photonic integrated circuits (ePICs). By combining silicon photonics, BiCMOS electronics and lasers on a single chip, the size and cost of optical transceivers can be dramatically reduced. The three-year project involves a consortium comprising ADVA, FormFactor, Fraunhofer IZM, IHP, IHP Solutions, Sicoya, Technion and the University of Kassel.

“With this project we’re taking integration and compact design to new levels. By squeezing more technology onto a single chip than ever before, we’re creating a platform for miniaturized optical transceivers able to deliver the space and bandwidth density needed for tomorrow’s DCI networks,” said Jörg-Peter Elbers, SVP, advanced technology, ADVA. “PEARLS not only paves the way for a new generation of intra-data center transceivers, but also facilitates more compact and cost-effective integrated coherent transmitter-receiver optical sub-assemblies (IC-TROSAs) for inter-data center applications.”

ADVA also noted that the PEARLS project is aiming to take a silicon-based electro-photonic chip platform – which offers monolithic integration of electronics and photonics as already proven in the ADVA-led SPEED project – and extend it to incorporate a third key element: Nanotechnology lasers will be added to the chip, saving space and reducing energy consumption compared to off-chip approaches. This will be achieved with quantum dots just a few nanometers in size. Able to withstand extreme temperatures, they facilitate wafer-scale integration without the need for a thermo-electric cooler or a hermetic package.

“Within this very exciting project, IHP will develop the technology platform. Together we’re breaking new ground and laying the foundations for the next generation of low-energy, space-efficient optical transceivers,” commented Bernd Tillack, managing director, IHP GmbH. “The PEARLS project will pave the way for optical transceiver chiplets – modular transceiver chips with an unprecedented level of optical and electronic integration. Built on top of a standard BiCMOS process flow, the new technology will also be a major step forward for sustainable DCI networking.”

https://www.adva.com/en/newsroom/press-releases/20190924-adva-leads-project-to-create-markets-most-advanced-optical-transceiver-chiplets

See also