Monday, March 11, 2019

Linux Foundation backs CHIPS Alliance project

The Linux Foundation will host the CHIPS Alliance project. which curates high-quality open source code relevant to the design of silicon devices for mobile, computing, consumer electronics, and Internet of Things (IoT) applications.

CHIPS Alliance backers include Esperanto Technologies, Google, SiFive and Western Digital, all of which are committed to both open source hardware and continued momentum behind the free and open RISC-V architecture.

"Open collaboration has repeatedly proven to help industries accelerate time to market, achieve long-term maintainability, and create de facto standards," said Mike Dolan, vice president of strategic programs, the Linux Foundation.  "The same collaboration model applies to the hardware in a system, just as it does to software components. We are eager to host the CHIPS Alliance and invite more organizations to join the initiative to help propel collaborative innovation within the CPU and SoC markets."

"As new workloads surface every day, we need new silicon designs in order to optimize processing requirements," said Martin Fink, interim CEO of RISC-V Foundation and executive vice president and CTO of Western Digital. "Today's legacy general purpose architectures are, in some cases, decades old.  With the creation of the CHIPS Alliance, we are expecting to fast-track silicon innovation through the open source community."

The CHIPS Alliance also announced a few planned contributions:

Google -- planning to contribute a Universal Verification Methodology (UVM)-based instruction stream generator environment for RISC-V cores. The environment provides configurable, highly stressful instruction sequences that can verify architectural and micro-architectural corner-cases of designs.

Western Digital -- planning to contribute their high performance, 9-stage, dual issue, 32-bit SweRV Core, together with a test bench, and high performance SweRV Instruction set simulator. Additional contribution will be specification and early implementations of OmniXtend cache coherence protocol.

SiFive -- was founded by the inventors of the free and open RISC-V Instruction Set Architecture, who, together with their colleagues at UC Berkeley, developed the first opensource RISC-V microprocessors and a new opensource hardware description language Chisel. This initial work at UC Berkeley also developed the RocketChip SoC generator, including the initial version of the TileLink coherent interconnect fabric.

http://www.chipsalliance.org

Seaborn interconnects Seabras-1 cable with DE-CIX New York

Seaborn Networks has established an interconnection to DE-CIX New York from its Seabras-1 subsea cable.

Seabras-1 is a fully operational 6-fiber pair, 72Tbps submarine cable system between Brazil and the U.S. offering the lowest latency path between São Paulo and the NY metro area.

Seaborn’s interconnection to DE-CIX New York provides Seabras-1 customers in South America with the ability to reach over 200 networks within the U.S. without incurring long provisioning intervals and additional costs such as cross connect fees.

Customers will also have Direct access to DE-CIX Frankfurt and Marseille via GlobePEER Remote. There is no additional cross connect fees to reach any DE-CIX customer globally.

“I am thrilled that DE-CIX’s unique solution is now available to South American networks over Seabras-1’s lowest latency network to New York,” comments Ed d'Agostino, General Manager, DE-CIX North America. “Through Seaborn, DE-CIX is readily accessible throughout Brazil bringing world-class connectivity between North America and South America and Europe.”

“This partnership with DE-CIX provides Brazil’s IP networks with one-stop-shop, remote IPX access to DE-CIX’s most compelling interconnect locations, leveraging the scale and agility of Seaborn’s Seabras-1 system,” adds Larry Schwartz, Seaborn’s CEO. “In this new arrangement, Seaborn is pleased to continue supporting the global expansion initiatives of Brazil’s ISP community.”

http://www.seabornnetworks.com
http://www.de-cix.net

Molex and Innovium to show optimized 12.8T

At OCP Summit 2019 later this week in San Jose, California, Molex and Innovium will host a joint demonstration combining Molex’s BiPass I/O technology with Innovium’s 12.8Tbps TERALYNX Switch ASIC.

The companies say the new switch system design offers better signal integrity, thermal management and simple manufacturability, providing the end customer a highly robust and resilient system.

Molex's low-insertion-loss, BiPass I/O technology serves as a PCB alternative to enable efficient and reliable implementation of 56 and 112 Gbps PAM-4 protocols. The BiPass cable assembly routes signals directly from an ASIC chip in a switch to the server front-panel I/O without having to go through the printed circuit board between them. Because the ASIC can be positioned farther back in the box, the BiPass solution allows for vertical orientation, providing greater port density. For further cost benefits, the BiPass solution reduces the number of board layers and eliminate the power cost and consumption of re-timers. From a thermal management perspective, the BiPass solution uses dual heatsinks, on the top and bottom of module, making cooling of 20W modules possible.

“By leveraging the combined capabilities of Innovium’s TERALYNX 12.8Tbps switch ASIC and Molex’s BiPass I/O technology, we are highlighting better performance and more operational efficiencies for our customer’s evolving data center needs,” said Chris Kapuscinski, global product manager, Molex. “The BiPass and Innovium demo shows that even at 112 Gbps, copper is still a viable and more economical option.”

Avi Networks cites customer momentum

Avi Networks has more than doubled its revenue and number of customers each year for the past three years.

The company says large enterprises are replacing their legacy ADCs (application delivery controllers) with the Avi software platform for both data center and cloud use cases. Avi claims hundreds of global enterprises, including the world’s largest financial services, media, and technology companies, are now using its platform. Instead of managing hundreds of physical or virtual appliances, Avi customers can dispatch services like load balancing and web application firewall to any application using one centralized interface. Avi’s technology effortlessly spans bare-metal servers and private and public clouds, making it a natural choice for hybrid and multi-cloud environments.

“There’s a reason we take so many customers from legacy vendors,” said Avi Networks CEO Amit Pandey. “We remain the only enterprise-grade solution that deploys consistently across all environments. In response, legacy vendors are developing siloed solutions for each environment or attempting to modernize through acquisitions. Meanwhile our architecture and controller technology are years ahead and getting better all the time. It’s no wonder that enterprises are choosing Avi Networks for their business-critical applications.”

Avi Networks also noted that it has also updated its platform with over 250 new features, including advanced controller and process analytics, client log streaming, and the release of Avi SaaS — the world’s first cloud-managed load balancing solution.

Avi pulls in $60 million including an investment from Cisco

Avi Networks, a start-up based in Santa Clara, California, announced $60 million in new funding including investments from Cisco Investments along with DAG Ventures, Greylock Partners, Lightspeed Venture Partners, and Menlo Ventures.

Cisco resells the Avi Vantage Platform in markets around the world, and Avi closely integrates with Cisco ACI, Cisco’s intent-based networking and automation solution for the data center.

Avi Networks offers an application delivery controller (ADC) with a Software Load Balancer, an Intelligent Web Application Firewall, and an Elastic Service Mesh for container-based applications. The company says that as businesses shift their operations to clouds such as Azure and AWS, its intent-based software offers easier management, faster performance, greater elasticity, deeper analytics, and more powerful automation than legacy ADC vendors.

Avi also reports that it has tripled its bookings over the past year, with significant adoption by the Global 2000 and 20% of the Fortune 50.

This latest round brings Avi’s total funding to $115 million.

“Modern applications are driving a new urgency with which enterprises are automating their networks and application delivery systems,” said Amit Pandey, CEO of Avi Networks. “Cisco software and infrastructure are a cornerstone in this transformation. I am thrilled about this strategic investment from Cisco and our continued joint efforts to deliver the elasticity, intelligence, and multi-cloud capabilities that enterprises need.”


  • Avi Networks is headed by Amit Pandey, who joined the company as CEO in 2015. Previously, Pandey spent nearly a decade at NetApp in a wide range of executive positions, and followed that with two successful stints at startups - first as CEO of TerraCotta that was acquired by the European software giant, Software AG and next as CEO of Zenprise that was acquired by Citrix.
  • Avi Networks was co-founded in November 2012 by Umesh Mahajan, who previously was VP/GM of Data Center Switching at Cisco; Murali Basavaiah, who previously was VP Engineering at Cisco for NX-OS Software and Nexus 7000/MDS product; and Ranga Rajagopalan, who previously was Sr. Director of Engineering at Cisco and responsible for NX-OS systems/platform software for the Cisco Nexus 7000.

International bank picks Zayo for wavelength service

Zayo announced that a major international bank has selected it to provide wavelength connectivity for a network expansion project in the U.S. and need for future capacity requirements.

The dedicated wavelength solution will connect approximately 10 locations for the customer primarily on the East Coast.

“The sale is an excellent illustration of our vertical segment approach deepening a relationship with an existing customer,” said Jack Waters, president of Zayo Networks and COO. “They worked closely with the customer to develop this unique solution, which will enable the bank to continue to scale their network across a strategic geography.”

Marvell posts quarterly revenue of $745 million, eyes 5G

Marvell Technology Group reported revenue of $745 million for its fourth quarter of fiscal 2019  (ended 02-Feb-2109).

GAAP net loss from continuing operations for the fourth quarter of fiscal 2019 was $(261) million, or $(0.40) per diluted share. Non-GAAP net income from continuing operations for the fourth quarter of fiscal 2019 was $168 million, or $0.25 per diluted share. Cash flow from operations for the fourth quarter was $107 million.

Revenue for fiscal 2019 was $2.9 billion. GAAP net loss from continuing operations for fiscal 2019 was $(179) million, or $(0.30) per diluted share. Non-GAAP net income from continuing operations for fiscal 2019 was $716 million, or $1.19 per diluted share. Cash flow from operations for fiscal 2019 was $597 million

"Marvell continued to improve its financial performance in fiscal 2019, while also increasing scale and diversifying its business through the acquisition of Cavium. While macroeconomic conditions are currently impacting our first quarter outlook, we expect growth to resume in the second quarter," said Matt Murphy, Marvell's President and Chief Executive Officer. "Looking ahead, we are excited about our expanding position in the 5G market, including our recently announced partnership with Samsung, which includes multiple generations of baseband and control plane processors for both LTE and 5G base stations."

Marvell intros silicon for 5G infrastructure

Marvell, whose 3G and 4G solutions are widely deployed in 3G and 4G networks worldwide, announced an end-to-end silicon platform for 5G infrastructure.

Whereas initial deployments of 5G NR have been dominated by FPGA-based solutions, Marvell said its 5G solution encompasses baseband DSPs, Arm multi-core SoCs, purpose-built hardware accelerators, Ethernet connectivity engines and system-level security solutions.

Marvell's 5G NR Platform includes:

  • Radio Access SoCs: The OCTEON Fusion-M product line is optimized for cost/power and programmable with a 3GPP protocol stack split and massive MIMO capabilities. Marvell's SoCs set the performance benchmark for both LTE-A and 5G NR, with multiple deployments through key industry partners.
  • Transport/EPC Core Processors: Multi-core OCTEON processors that are optimized to address the most demanding use cases of 5G NR. Marvell's scalable data-plane acceleration makes its embedded processors ideal for 5G Core/EPC applications at the heart of the network as well. Marvell uniquely offers a single unified architecture for both transport and EPC core.
  • Ethernet Networking: switches and PHYs for carrier infrastructure. Marvell Prestera switches contain hierarchical traffic management for mobile infrastructure. In addition, Marvell's differentiated switching solutions allow advanced flow identification and access control to enable user-level security.
  • Wi-Fi Connectivity: Marvell is ramping high volume production of 8x8 and 4x4 Wi-Fi 6 solutions. The 802.11ax engines include full MU-MIMO and OFDMA uplink and downlink, multi-gigabit peak speeds, precision location, cloud management, best-in-class beamforming and integrated Bluetooth 5 technology. 
  • ThunderX2 Arm-based Server: Marvell has introduced workload optimized ThunderX2 server processors to augment and enhance its 5G portfolio. 

Aquantia intros 10 Gigabit Ethernet MAC Controller

Aquantia introduced a 10G Ethernet Controller that enables SFP+ port or backplane connectivity.

Features of the AQtion AQC100 include:

  • PCI Express 3.0 modes with x4/x2/x1 lane operation
  • SFP+ for Direct Attach Copper (DAC) and optical SFP modules
  • Board-level or backplane connectivity between chips
  • Support for Windows, macOS, Linux, Data Plane Development Kit and other operating systems
  • Less than 1W power consumption

“The introduction of AQC100 shows Aquantia’s continued commitment to bring high-speed connectivity to networks everywhere by delivering efficient interconnect solutions,” said LK Bhupathi, Vice President of Marketing, Aquantia. “By supporting SFP+ and backplane applications, the AQtion AQC100 complements our previously announced Multi-Gig controllers, like the AQC107, and will allow customers to enjoy high-speed connectivity irrespective of cabling or connectivity used.”

Sunday, March 10, 2019

Germany's updated security requirements avoid ban on Huawei

The Bundesnetzagentur, which is the German regulatory office in charge of telecommunications, published additional security requirements for telecommunications networks and services without banning Huawei or other Chinese vendors.

The key elements of the new security policy are:

  • Systems may only be sourced from trustworthy suppliers whose compliance with national security regulations and provisions for the secrecy of telecommunications and for data protection is assured.
  • Network traffic must be regularly and constantly monitored for any abnormality and, if there is any cause for concern, appropriate protection measures must be taken.
  • Security-related network and system components (critical key components) may only be used if they have have been certified by the Federal Office for Information Security (BSI) and undergone IT security checks by a BSI-approved testing body. Critical key components may only be sourced from trustworthy suppliers/manufacturers, ie those that can provide assurance of their trustworthiness.
  • Security-related network and system components (critical key components) may only be used following an appropriate acceptance test upon supply and must be subjected to regular and ongoing security tests. The components that are security-related (critical key components) will be defined by the BSI and Bundesnetzagentur by mutual agreement.
  • Only trained professionals may be employed in security-related areas.
  • Proof must be provided that the hardware tested for the selected, security-related components and the source code at the end of the supply chain are actually deployed in the products used.
  • When planning and building the network, "monocultures" must be avoided by using network and system components from different manufacturers.
  • Where system-related processes are outsourced, only professionally competent, reliable and trustworthy contractors may be selected.
  • Adequate redundancy must be available for critical, security-related network and system components (critical key components). 

"We revise the security requirements on a regular basis in light of the current security situation and technological developments," explained Jochen Homann, Bundesnetzagentur President. "Security requirements apply to all network operators and service providers, irrespective of the technology they deploy. All networks, not just individual standards like 5G, are included."

https://www.bundesnetzagentur.de/SharedDocs/Pressemitteilungen/EN/2019/20190307_SL.html?nn=404530

Thursday, March 7, 2019

Austria completes 5G auction in 3.4 - 3.8 GHz band

Austria concluded an auction of 5G spectrum in the 3.4-3.8 GHz band. Licenses were acquired by the three leading operators (A1, Hutchinson, T-Mobile) as well as some smaller players. In total, 438 out of a total of 468 frequency packages (39 packages of 10 MHz each, in twelve regions) were auctioned for a total price of around EUR 188 million. The auction lasted over three weeks.

T-Mobile Austria acquired 110 MHz of spectrum throughout the country (11 packages of 10 MHz each in 12 regions), for a total price of €57 million.


Huawei announces 50G PON prototype

Huawei announced a single-wavelength 50G passive optical network (PON) prototype.

The new unit provides 50 Gbps downstream transmission rates and 25 Gbps/50 Gbps upstream transmission rates over a single wavelength.

Huawei's design is based on mature 25G optical components. It achieves 50 Gbps transmission rates over a single wavelength through fiber dispersion compensation and transmitter/receiver bandwidth compensation technologies on the physical PON links. Under the 1:64 split ratio, the prototype supports transmissions over 20 km, and enables customers to smoothly transition to 50G PON networks without needing to change the ODN of the live network. The prototype is also fully compatible with XG(S)-PON and 10G-EPON in the 50G PON wavelength planning. To protect operators' investment, 50G PON boards are designed so that they can be inserted and run in the Huawei new-generation smart distributed OLT MA5800.

In February 2018, the ITU-T officially initiated the 50G PON standards project and began developing technical solutions and standards. The standards are expected to be finalized in 2020 and put into commercial use in 2023.

Huawei notes that is a contributing member of the ITU-T and IEEE in 50G PON technology.

Sicoya to build silicon photonics packaging factory in China

Sicoya GmbH, which specializes in monolithically integrated Silicon Photonics, announces the build of a new factory in Tianjin, China focusing on assembly and test of optical transceivers and engines.

The factory installation includes anti-vibration foundations and clean room facilities that will allow the factory to perform CMOS wafer level post-processing steps and downstream packaging processes.

Sicoya says the facility will serve the Chinese market and will manufacture transceivers and engines for the 5G wireless fronthaul and 100G/400G Ethernet-based datacenter application utilizing Sicoya's monolithically integrated Silicon Photonics chips.

"The Chinese Market is very important for Sicoya and customers require local manufacturing and services at scale," said Dr. Sven Otte, CEO of Sicoya.

International customers in the US or Europe will be served out of both the factory in Tianjin and complementary out of the factory in Berlin, Germany.

"We need to stay flexible with respect to the installed capacity of the two factories," said Peter Neumann VP of Operations at Sicoya. "In the past the industry tended to consolidate operations in one place to gain scale and utilization of overhead cost but today staying flexible and being able to react quickly to changes in the political environment becomes a key asset that customers appreciate," he continuous.

http://www.sicoya.com

Source Photonics expands data center and routing portfolio

Source Photonics has expanded its portfolio of single-mode products for datacenter and routing applications. The new products leverage the company’s multi-year investment in 28Gbaud and 53Gbaud PAM4 developments and support applications such as the 400G DR4, FR4 and LR8, 100G DR/FR, and 50G LR and ER.

In addition, Source Photonics also announces the availability of its second-generation 100G QSFP28 CWDM4.

“Source Photonics led the market deployment of small form-factor 10 km products for several generations,” says Ed Ulrichs, Director of PLM at Source Photonics. “The performance of our advanced 50G, 100G and 400G PAM4 based products prove our technical and production capabilities to lead scale of the entire 500m to 40 km portfolio.”

Source Photonics’ portfolio of Datacenter and Routing products include:

  • 400G LR8 supporting 400GE links up to 10 km; the platform is expandable to support 400G-ER8 for 400G links up to 40 km by 2020
  • 400G DR4 supporting 400GE links for 500m as well as enhanced reach of up to 2 km; the platform supports breakout into 100G-DR/FR as well as high-density 100GE links
  • 400G FR4 supporting 400GE links up to 2 km over duplex single-mode fiber
  • 400G SR8 supporting 400GE links up to 100m (OM4) over multi-mode fiber
  • 100G DR/FR supporting single-channel 100G connectivity and supporting breakout from 400G DR4
  • 100G LR4 supporting 100GE links up to 10 km with support for Ethernet only and OTU4 as well as enhanced performance for E-temp and I-temp applications
  • 100G 4WDM-40 supporting 100GE links up to 40 km with Ethernet only and OTU4 support
  • 100G CWDM4 supporting 100GE links up to 2 km over duplex single-mode fiber
  • 100G SR4 supporting 100GE links up to 100m (OM4) over multi-mode fiber

http://sourcephotonics.com

Spirent showcases 400/200/100/50 GigETes Test System

At OFC, Spirent Communications showcased its 8-port 1U-rack-mountable 400/200/100/50 Gigabit Ethernet (GbE) test system. The system claims to be the world’s highest density QSFP-DD test solution. It is designed to validate the forwarding performance and Quality of Service (QoS) of high-scale, next-generation-enabled, multi-terabit routers and switches, all contained in a single rack space.

Spirent is also showing the world’s highest-density native QSFP28 quint-speed series of test modules, supporting 100/50/40/25/10GbE from a single interface as part of the joint display, delivering the robust connectivity demanded by emerging markets and applications.

“It’s an exciting time as Ethernet speeds continue to evolve, and customers continue to design and develop solutions to meet future network requirements,” said Abhitesh Kastuar, general manager of Spirent’s Cloud and IP Business Unit. “Our innovation and test capabilities make Spirent the right partner for companies that are racing to bring their leading-edge network technologies to market first. We have been working with all the major network equipment vendors to deliver new chipsets so they can design and develop next-generation 400G products, enabling networking and services vendors to deploy faster and more reliably.”

https://www.spirent.com/HSE

Semtech expands its EPON portfolio

Semtech introduced a combo chip and a multi-rate burst mode Transimpedance Amplifier (TIA) for 10G EPON Optical Line Terminals (OLTs).

“The upsurge in the 10G EPON market is expected to continue and we believe these products will help drive this growth,” said Dr. Timothy Vang, Vice President of Marketing and Applications for Semtech’s Signal Integrity Products Group. “Our engineering team has produced another unique chipset that delivers higher performance and enables lower manufacturing costs through further integration.”

The combo chip is a fully bidirectional device that supports both 1G and 10G EPON. The transmit data path features Semtech’s 10G EML driver with ClearEdge CDR referenceless technology to effectively reset the path jitter budget. Tx path optimization can be accomplished via an I2C programmable PLL loop bandwidth control and a variety of jitter filter modes. The EML driver includes eye-shaping features and an automatic power control loop to deliver best-in-class transmit eye quality. The burst mode receive data path includes two separate limiting amplifiers, one for 1G EPON and the other for 10G EPON with a fast Burst Mode Signal Detect function. The Rx path outputs 10G data at CML levels, while the 1G Rx output is available at CML or LVPECL levels depending on the device version.

Semtech’s high sensitivity Burst Mode TIA is designed for 10G EPON OLT applications. The device features a fast automatic gain control loop to enable high dynamic range in burst mode applications. The GN7056 is offered in die form, supports industrial temperature range and uses a single 3.3V power supply.

MaxLinear cites momentum with its PAM4 DSP for 400G modules

Delta, a global supplier of power and thermal management solutions, has selected MaxLinear’s Telluride PAM4 DSP to develop its next-generation 400G-DR4 optical module. Delta’s proprietary single mode TOSA/ROSA design and package technology can be extended to DR4 single lambda optical modules.

MaxLinear’s MxL935xx Telluride family of SoCs are key components in the development of high-speed mega-scale data centers based on 100Gbps single lambda optical interconnects. The MxL935xx Telluride family of chips are the world’s first DSP SoCs with integrated electro-absorption modulated laser (EA-EML) drivers for 100/400Gbps optical interconnects and breakout mode clocking support for 400Gbps DR4 optical modules. The MxL93542 400G PAM4 DSP allows companies like Delta to develop a 400Gbps optical interconnect module in a compact form factor for intra-datacenter applications with a transmission distance up to 2 kilometers.

Molex has demonstrated MaxLinear’s “Telluride” (MxL935xx) pulse-amplitude-modulation (PAM4) digital signal processing (DSP) systems-on-chip (SoCs) for next generation 400G-DR4 and 100G-DR optical modules. Molex’s data center connectivity products include QSFP-DD, QSFP28, SFP-DD and 100G Lambda. Molex support for the Open19 Initiative with the Molex Impel Customized Data Cable solution aims to establish a new open standard for data center servers by delivering a flexible, scalable and secure platform.

ColorChip, a global leader in photonic integrated transceivers, has selected MaxLinear’s Telluride (MxL935xx) pulse-amplitude-modulation (PAM4) digital signal processing (DSP) systems-on-chip (SoCs) for their next generation 400G-DR4 and 100G-DR1 optical modules. The new optical modules join ColorChip’s multi-generational optical engine platforms, based on proprietary SystemOnGlass™ technology. ColorChip’s multi-generational optical engine platform has been refined over several generations of transceivers. Its PAM4 100G and 400G optical interconnects based on MaxLinear’s Telluride family are expected to be commercially available later this year.

MaxLinear demos QSFP-DD Optical Interoperability for 400G

At OFC 2019, MaxLinear privately showcased optical interoperability using 400Gbps QSFP-DD modules from early access customers.

The demonstration highlighted the capabilities of MaxLinear’s Telluride PAM4 DSP, the MxL93542, by enabling an end-to-end 400Gbps FR4 link between QSFP-DD modules from multiple vendors. In addition, optical interop will be demonstrated between a 400Gbps DR4 optical module and a 100Gbps DR1 optical module in breakout mode.

“We sampled our Telluride PAM4 DSP one year ago and in that time have enabled numerous customers to design and sample 100G DR1 and 400G DR4 & FR4 modules,” said Will Torgerson, Vice President and General Manager of MaxLinear’s High-Speed Interconnect Group. “We are very excited to be demonstrating some of those modules at OFC and sharing our plans to remain at the forefront of this major industry transition towards 400Gbps based on 100G per optical wavelength PAM4 technology.”

The Telluride family of chips includes the MxL93542 PAM4 DSP with integrated EA-EML driver and the MxL9154 quad linear PAM4 TIA.

Dell'Oro: Wireless Packet Core revenues up 7% in 4Q18

Wireless Packet Core (WPC) market revenues grew 7 percent Y/Y in 4Q 2018, according to a new report from Dell'Oro Group. For the full-year 2018, Huawei was the top-ranked vendor, achieving this annual designation for the first time ever.

Other findings in the report for the top-three Core vendor rankings for the full-year revenues in 2018 were as follows:

  • Wireless Packet Core (2G/3G/4G): Huawei, Ericsson, Nokia
  • Traditional Packet Core (2G/3G): Huawei, Ericsson, Nokia
  • Evolved Packet Core (4G): Ericsson, Huawei, Nokia

"The modest growth of the WPC market in 4Q 2018 was due to the 4G Evolved Packet Core (EPC) technologies that service providers are using for 4G networks, but also for EPC use in upcoming 5G network deployments," said Dave Bolan, senior analyst at Dell'Oro Group. "For 2018 WPC market shares, Huawei was the number on vendor based on revenues; however, Ericsson, retained its first-place ranking for the EPC market that was the largest sub-segment of the wireless packet core market," Bolan added.

http://www.delloro.com

IDT launches 80G linear drivers for next-gen coherent

Integrated Device Technology (IDT) introduced its new GX7847x 80G linear driver series, in die form, for next generation coherent optical integrated modules.

IDT said its GX7847x series 80G linear drivers are 4-channel integrated single die solutions that cover all optical modulator technologies in the market. The GX78471, GX78472 and GX78474 are optimized to provide the best performance for Lithium Niobate, Indium Phosphide, and Silicon Photonics modulators, respectively.

The drivers are designed for 400G ZR, Metro, and Data Center Interconnect (DCI) applications, are compliant with the Optical Interconnect Forum (OIF) standard, and are used in highly integrated optical sub-assembly modules such as the High Bandwidth Coherent Driver Modulator (HB-CDM) and Integrated Coherent Transmitter-Receiver Optical Sub-Assembly (IC-TROSA).  The HB-CDM and IC-TORSA using the GX7847x series have higher bandwidth without any degradations in terms of output voltage swing, linearity, power consumption and die size. 

http://www.idt.com

Renesas to acquire Integrated Device Technology for $6.7 billion

Renesas Electronics Corporation of Japan has agreed to acquire Integrated Device Technology (IDT, NASDAQ: IDTI) for approximately US$6.7 billion (approximately 733.0 billion yen at an exchange rate of 110 yen to the dollar), combing two recognized leaders in embedded processors and analog mixed-signal semiconductors. IDT shares are to be acquired at a price of US$49.00 per share.

IDT, which is based in San Jose, California, is a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power. Renesas is the leading global supplier of microcontrollers, and a leader in analog & power and SoC products. The acquisition will provide Renesas with analog mixed-signal capabilities in embedded systems, including RF, advanced timing, memory interface & power management, optical interconnect, wireless power, and smart sensors.

The combination of these product lines with Renesas’ advanced MCUs and SoCs and power management ICs enables Renesas to offer comprehensive solutions that support the increasing demand of high data processing performance.

Luna Innovations acquires General Photonics

Luna Innovations has acquired General Photonics Corporation, a Chino, California-based supplier of optical components, modules and test equipment. General Photonics is focused on the generation, measurement and control of polarized light critical in fiber optic-based applications. The purchase price was $20 million, which includes a potential $1 million earnout payment.

Luna said General Photonics’ component and module product lines are an ideal addition to its own product portfolio. Its polarization measurement instruments are highly complementary to Luna’s line of optical measurement tools.

“We are excited to announce the acquisition of General Photonics, another step in the execution of our core strategy. This acquisition brings a highly complementary product portfolio to the capabilities of Luna’s communications test products,” said Scott Graeff, President and Chief Executive Officer of Luna. “We intend to drive a quick and smooth integration as both company’s products are built on similar electronics, optics and software platforms for high-precision measurement and control of light. This deal further demonstrates our commitment to use capital prudently for transactions that are quickly accretive to our earnings, and it is consistent with our previously stated goal to drive long-term value.”

CREDO highlights electrical and optical 100G PAM4

At this week's OFC 2019, CREDO conducted multiple live demonstrations of its low power, high-performance 112Gbps (G) PAM4 Serializer-Deserializer (SerDes) technologies.

“New high demand workloads such as artificial intelligence are moving to the cloud and are driving the need to deliver dramatic increases in throughput overall for data center, enterprise and high-performance computing environments,” said Rajan Pai, vice president of system applications at Credo. “Our 112G PAM4 demonstrations with industry leading standards bodies are laying the groundwork for providing ubiquitous 112G lane-rate connectivity at the performance and scale required.”

“Credo’s 112G single lane rate electrical and optical connectivity technologies are being well received,” said Jeff Twombly, vice president of business development at Credo. “End customers continue to push for significant increases in network bandwidth and the industry as a whole will benefit greatly by a rapid move to single lane rate, end-to-end 112G deployments.”

http://www.credosemi.com