Sunday, March 10, 2019

Germany's updated security requirements avoid ban on Huawei

The Bundesnetzagentur, which is the German regulatory office in charge of telecommunications, published additional security requirements for telecommunications networks and services without banning Huawei or other Chinese vendors.

The key elements of the new security policy are:

  • Systems may only be sourced from trustworthy suppliers whose compliance with national security regulations and provisions for the secrecy of telecommunications and for data protection is assured.
  • Network traffic must be regularly and constantly monitored for any abnormality and, if there is any cause for concern, appropriate protection measures must be taken.
  • Security-related network and system components (critical key components) may only be used if they have have been certified by the Federal Office for Information Security (BSI) and undergone IT security checks by a BSI-approved testing body. Critical key components may only be sourced from trustworthy suppliers/manufacturers, ie those that can provide assurance of their trustworthiness.
  • Security-related network and system components (critical key components) may only be used following an appropriate acceptance test upon supply and must be subjected to regular and ongoing security tests. The components that are security-related (critical key components) will be defined by the BSI and Bundesnetzagentur by mutual agreement.
  • Only trained professionals may be employed in security-related areas.
  • Proof must be provided that the hardware tested for the selected, security-related components and the source code at the end of the supply chain are actually deployed in the products used.
  • When planning and building the network, "monocultures" must be avoided by using network and system components from different manufacturers.
  • Where system-related processes are outsourced, only professionally competent, reliable and trustworthy contractors may be selected.
  • Adequate redundancy must be available for critical, security-related network and system components (critical key components). 

"We revise the security requirements on a regular basis in light of the current security situation and technological developments," explained Jochen Homann, Bundesnetzagentur President. "Security requirements apply to all network operators and service providers, irrespective of the technology they deploy. All networks, not just individual standards like 5G, are included."

https://www.bundesnetzagentur.de/SharedDocs/Pressemitteilungen/EN/2019/20190307_SL.html?nn=404530

Thursday, March 7, 2019

Austria completes 5G auction in 3.4 - 3.8 GHz band

Austria concluded an auction of 5G spectrum in the 3.4-3.8 GHz band. Licenses were acquired by the three leading operators (A1, Hutchinson, T-Mobile) as well as some smaller players. In total, 438 out of a total of 468 frequency packages (39 packages of 10 MHz each, in twelve regions) were auctioned for a total price of around EUR 188 million. The auction lasted over three weeks.

T-Mobile Austria acquired 110 MHz of spectrum throughout the country (11 packages of 10 MHz each in 12 regions), for a total price of €57 million.


Huawei announces 50G PON prototype

Huawei announced a single-wavelength 50G passive optical network (PON) prototype.

The new unit provides 50 Gbps downstream transmission rates and 25 Gbps/50 Gbps upstream transmission rates over a single wavelength.

Huawei's design is based on mature 25G optical components. It achieves 50 Gbps transmission rates over a single wavelength through fiber dispersion compensation and transmitter/receiver bandwidth compensation technologies on the physical PON links. Under the 1:64 split ratio, the prototype supports transmissions over 20 km, and enables customers to smoothly transition to 50G PON networks without needing to change the ODN of the live network. The prototype is also fully compatible with XG(S)-PON and 10G-EPON in the 50G PON wavelength planning. To protect operators' investment, 50G PON boards are designed so that they can be inserted and run in the Huawei new-generation smart distributed OLT MA5800.

In February 2018, the ITU-T officially initiated the 50G PON standards project and began developing technical solutions and standards. The standards are expected to be finalized in 2020 and put into commercial use in 2023.

Huawei notes that is a contributing member of the ITU-T and IEEE in 50G PON technology.

Sicoya to build silicon photonics packaging factory in China

Sicoya GmbH, which specializes in monolithically integrated Silicon Photonics, announces the build of a new factory in Tianjin, China focusing on assembly and test of optical transceivers and engines.

The factory installation includes anti-vibration foundations and clean room facilities that will allow the factory to perform CMOS wafer level post-processing steps and downstream packaging processes.

Sicoya says the facility will serve the Chinese market and will manufacture transceivers and engines for the 5G wireless fronthaul and 100G/400G Ethernet-based datacenter application utilizing Sicoya's monolithically integrated Silicon Photonics chips.

"The Chinese Market is very important for Sicoya and customers require local manufacturing and services at scale," said Dr. Sven Otte, CEO of Sicoya.

International customers in the US or Europe will be served out of both the factory in Tianjin and complementary out of the factory in Berlin, Germany.

"We need to stay flexible with respect to the installed capacity of the two factories," said Peter Neumann VP of Operations at Sicoya. "In the past the industry tended to consolidate operations in one place to gain scale and utilization of overhead cost but today staying flexible and being able to react quickly to changes in the political environment becomes a key asset that customers appreciate," he continuous.

http://www.sicoya.com

Source Photonics expands data center and routing portfolio

Source Photonics has expanded its portfolio of single-mode products for datacenter and routing applications. The new products leverage the company’s multi-year investment in 28Gbaud and 53Gbaud PAM4 developments and support applications such as the 400G DR4, FR4 and LR8, 100G DR/FR, and 50G LR and ER.

In addition, Source Photonics also announces the availability of its second-generation 100G QSFP28 CWDM4.

“Source Photonics led the market deployment of small form-factor 10 km products for several generations,” says Ed Ulrichs, Director of PLM at Source Photonics. “The performance of our advanced 50G, 100G and 400G PAM4 based products prove our technical and production capabilities to lead scale of the entire 500m to 40 km portfolio.”

Source Photonics’ portfolio of Datacenter and Routing products include:

  • 400G LR8 supporting 400GE links up to 10 km; the platform is expandable to support 400G-ER8 for 400G links up to 40 km by 2020
  • 400G DR4 supporting 400GE links for 500m as well as enhanced reach of up to 2 km; the platform supports breakout into 100G-DR/FR as well as high-density 100GE links
  • 400G FR4 supporting 400GE links up to 2 km over duplex single-mode fiber
  • 400G SR8 supporting 400GE links up to 100m (OM4) over multi-mode fiber
  • 100G DR/FR supporting single-channel 100G connectivity and supporting breakout from 400G DR4
  • 100G LR4 supporting 100GE links up to 10 km with support for Ethernet only and OTU4 as well as enhanced performance for E-temp and I-temp applications
  • 100G 4WDM-40 supporting 100GE links up to 40 km with Ethernet only and OTU4 support
  • 100G CWDM4 supporting 100GE links up to 2 km over duplex single-mode fiber
  • 100G SR4 supporting 100GE links up to 100m (OM4) over multi-mode fiber

http://sourcephotonics.com

Spirent showcases 400/200/100/50 GigETes Test System

At OFC, Spirent Communications showcased its 8-port 1U-rack-mountable 400/200/100/50 Gigabit Ethernet (GbE) test system. The system claims to be the world’s highest density QSFP-DD test solution. It is designed to validate the forwarding performance and Quality of Service (QoS) of high-scale, next-generation-enabled, multi-terabit routers and switches, all contained in a single rack space.

Spirent is also showing the world’s highest-density native QSFP28 quint-speed series of test modules, supporting 100/50/40/25/10GbE from a single interface as part of the joint display, delivering the robust connectivity demanded by emerging markets and applications.

“It’s an exciting time as Ethernet speeds continue to evolve, and customers continue to design and develop solutions to meet future network requirements,” said Abhitesh Kastuar, general manager of Spirent’s Cloud and IP Business Unit. “Our innovation and test capabilities make Spirent the right partner for companies that are racing to bring their leading-edge network technologies to market first. We have been working with all the major network equipment vendors to deliver new chipsets so they can design and develop next-generation 400G products, enabling networking and services vendors to deploy faster and more reliably.”

https://www.spirent.com/HSE

Semtech expands its EPON portfolio

Semtech introduced a combo chip and a multi-rate burst mode Transimpedance Amplifier (TIA) for 10G EPON Optical Line Terminals (OLTs).

“The upsurge in the 10G EPON market is expected to continue and we believe these products will help drive this growth,” said Dr. Timothy Vang, Vice President of Marketing and Applications for Semtech’s Signal Integrity Products Group. “Our engineering team has produced another unique chipset that delivers higher performance and enables lower manufacturing costs through further integration.”

The combo chip is a fully bidirectional device that supports both 1G and 10G EPON. The transmit data path features Semtech’s 10G EML driver with ClearEdge CDR referenceless technology to effectively reset the path jitter budget. Tx path optimization can be accomplished via an I2C programmable PLL loop bandwidth control and a variety of jitter filter modes. The EML driver includes eye-shaping features and an automatic power control loop to deliver best-in-class transmit eye quality. The burst mode receive data path includes two separate limiting amplifiers, one for 1G EPON and the other for 10G EPON with a fast Burst Mode Signal Detect function. The Rx path outputs 10G data at CML levels, while the 1G Rx output is available at CML or LVPECL levels depending on the device version.

Semtech’s high sensitivity Burst Mode TIA is designed for 10G EPON OLT applications. The device features a fast automatic gain control loop to enable high dynamic range in burst mode applications. The GN7056 is offered in die form, supports industrial temperature range and uses a single 3.3V power supply.

MaxLinear cites momentum with its PAM4 DSP for 400G modules

Delta, a global supplier of power and thermal management solutions, has selected MaxLinear’s Telluride PAM4 DSP to develop its next-generation 400G-DR4 optical module. Delta’s proprietary single mode TOSA/ROSA design and package technology can be extended to DR4 single lambda optical modules.

MaxLinear’s MxL935xx Telluride family of SoCs are key components in the development of high-speed mega-scale data centers based on 100Gbps single lambda optical interconnects. The MxL935xx Telluride family of chips are the world’s first DSP SoCs with integrated electro-absorption modulated laser (EA-EML) drivers for 100/400Gbps optical interconnects and breakout mode clocking support for 400Gbps DR4 optical modules. The MxL93542 400G PAM4 DSP allows companies like Delta to develop a 400Gbps optical interconnect module in a compact form factor for intra-datacenter applications with a transmission distance up to 2 kilometers.

Molex has demonstrated MaxLinear’s “Telluride” (MxL935xx) pulse-amplitude-modulation (PAM4) digital signal processing (DSP) systems-on-chip (SoCs) for next generation 400G-DR4 and 100G-DR optical modules. Molex’s data center connectivity products include QSFP-DD, QSFP28, SFP-DD and 100G Lambda. Molex support for the Open19 Initiative with the Molex Impel Customized Data Cable solution aims to establish a new open standard for data center servers by delivering a flexible, scalable and secure platform.

ColorChip, a global leader in photonic integrated transceivers, has selected MaxLinear’s Telluride (MxL935xx) pulse-amplitude-modulation (PAM4) digital signal processing (DSP) systems-on-chip (SoCs) for their next generation 400G-DR4 and 100G-DR1 optical modules. The new optical modules join ColorChip’s multi-generational optical engine platforms, based on proprietary SystemOnGlass™ technology. ColorChip’s multi-generational optical engine platform has been refined over several generations of transceivers. Its PAM4 100G and 400G optical interconnects based on MaxLinear’s Telluride family are expected to be commercially available later this year.

MaxLinear demos QSFP-DD Optical Interoperability for 400G

At OFC 2019, MaxLinear privately showcased optical interoperability using 400Gbps QSFP-DD modules from early access customers.

The demonstration highlighted the capabilities of MaxLinear’s Telluride PAM4 DSP, the MxL93542, by enabling an end-to-end 400Gbps FR4 link between QSFP-DD modules from multiple vendors. In addition, optical interop will be demonstrated between a 400Gbps DR4 optical module and a 100Gbps DR1 optical module in breakout mode.

“We sampled our Telluride PAM4 DSP one year ago and in that time have enabled numerous customers to design and sample 100G DR1 and 400G DR4 & FR4 modules,” said Will Torgerson, Vice President and General Manager of MaxLinear’s High-Speed Interconnect Group. “We are very excited to be demonstrating some of those modules at OFC and sharing our plans to remain at the forefront of this major industry transition towards 400Gbps based on 100G per optical wavelength PAM4 technology.”

The Telluride family of chips includes the MxL93542 PAM4 DSP with integrated EA-EML driver and the MxL9154 quad linear PAM4 TIA.

Dell'Oro: Wireless Packet Core revenues up 7% in 4Q18

Wireless Packet Core (WPC) market revenues grew 7 percent Y/Y in 4Q 2018, according to a new report from Dell'Oro Group. For the full-year 2018, Huawei was the top-ranked vendor, achieving this annual designation for the first time ever.

Other findings in the report for the top-three Core vendor rankings for the full-year revenues in 2018 were as follows:

  • Wireless Packet Core (2G/3G/4G): Huawei, Ericsson, Nokia
  • Traditional Packet Core (2G/3G): Huawei, Ericsson, Nokia
  • Evolved Packet Core (4G): Ericsson, Huawei, Nokia

"The modest growth of the WPC market in 4Q 2018 was due to the 4G Evolved Packet Core (EPC) technologies that service providers are using for 4G networks, but also for EPC use in upcoming 5G network deployments," said Dave Bolan, senior analyst at Dell'Oro Group. "For 2018 WPC market shares, Huawei was the number on vendor based on revenues; however, Ericsson, retained its first-place ranking for the EPC market that was the largest sub-segment of the wireless packet core market," Bolan added.

http://www.delloro.com

IDT launches 80G linear drivers for next-gen coherent

Integrated Device Technology (IDT) introduced its new GX7847x 80G linear driver series, in die form, for next generation coherent optical integrated modules.

IDT said its GX7847x series 80G linear drivers are 4-channel integrated single die solutions that cover all optical modulator technologies in the market. The GX78471, GX78472 and GX78474 are optimized to provide the best performance for Lithium Niobate, Indium Phosphide, and Silicon Photonics modulators, respectively.

The drivers are designed for 400G ZR, Metro, and Data Center Interconnect (DCI) applications, are compliant with the Optical Interconnect Forum (OIF) standard, and are used in highly integrated optical sub-assembly modules such as the High Bandwidth Coherent Driver Modulator (HB-CDM) and Integrated Coherent Transmitter-Receiver Optical Sub-Assembly (IC-TROSA).  The HB-CDM and IC-TORSA using the GX7847x series have higher bandwidth without any degradations in terms of output voltage swing, linearity, power consumption and die size. 

http://www.idt.com

Renesas to acquire Integrated Device Technology for $6.7 billion

Renesas Electronics Corporation of Japan has agreed to acquire Integrated Device Technology (IDT, NASDAQ: IDTI) for approximately US$6.7 billion (approximately 733.0 billion yen at an exchange rate of 110 yen to the dollar), combing two recognized leaders in embedded processors and analog mixed-signal semiconductors. IDT shares are to be acquired at a price of US$49.00 per share.

IDT, which is based in San Jose, California, is a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power. Renesas is the leading global supplier of microcontrollers, and a leader in analog & power and SoC products. The acquisition will provide Renesas with analog mixed-signal capabilities in embedded systems, including RF, advanced timing, memory interface & power management, optical interconnect, wireless power, and smart sensors.

The combination of these product lines with Renesas’ advanced MCUs and SoCs and power management ICs enables Renesas to offer comprehensive solutions that support the increasing demand of high data processing performance.

Luna Innovations acquires General Photonics

Luna Innovations has acquired General Photonics Corporation, a Chino, California-based supplier of optical components, modules and test equipment. General Photonics is focused on the generation, measurement and control of polarized light critical in fiber optic-based applications. The purchase price was $20 million, which includes a potential $1 million earnout payment.

Luna said General Photonics’ component and module product lines are an ideal addition to its own product portfolio. Its polarization measurement instruments are highly complementary to Luna’s line of optical measurement tools.

“We are excited to announce the acquisition of General Photonics, another step in the execution of our core strategy. This acquisition brings a highly complementary product portfolio to the capabilities of Luna’s communications test products,” said Scott Graeff, President and Chief Executive Officer of Luna. “We intend to drive a quick and smooth integration as both company’s products are built on similar electronics, optics and software platforms for high-precision measurement and control of light. This deal further demonstrates our commitment to use capital prudently for transactions that are quickly accretive to our earnings, and it is consistent with our previously stated goal to drive long-term value.”

CREDO highlights electrical and optical 100G PAM4

At this week's OFC 2019, CREDO conducted multiple live demonstrations of its low power, high-performance 112Gbps (G) PAM4 Serializer-Deserializer (SerDes) technologies.

“New high demand workloads such as artificial intelligence are moving to the cloud and are driving the need to deliver dramatic increases in throughput overall for data center, enterprise and high-performance computing environments,” said Rajan Pai, vice president of system applications at Credo. “Our 112G PAM4 demonstrations with industry leading standards bodies are laying the groundwork for providing ubiquitous 112G lane-rate connectivity at the performance and scale required.”

“Credo’s 112G single lane rate electrical and optical connectivity technologies are being well received,” said Jeff Twombly, vice president of business development at Credo. “End customers continue to push for significant increases in network bandwidth and the industry as a whole will benefit greatly by a rapid move to single lane rate, end-to-end 112G deployments.”

http://www.credosemi.com

Wednesday, March 6, 2019

Infinera demos 600G over 250km

Infinera has successfully demonstrated 600G per wavelength transmission over 250 km in a production network with the Infinera Groove G30 muxponder solution.

The field trial was completed on the backbone network of a leading European service provider using the Infinera Groove G30 CHM2T solution operating over the Infinera 7300 multi-haul dense wavelength-division multiplexing transport platform. In addition to achieving the delivery of error-free 600G 64 quadrature amplitude modulation (64QAM) transmission over a 250-km link in the production network, Infinera also successfully demonstrated 500G 32QAM over 500 km of fiber during the trial, another industry first.

“Delivering optimal reach, performance and capacity to meet the evolving network demands of our customers is at the heart of our Infinite Network vision,” said Glen Laxdal, Senior Vice President, Product Line Management at Infinera. “This achievement underscores Infinera’s commitment to continue delivering innovative solutions for network operators with capacity and scale while simplifying operations.”

MACOM announces dual and quad channel 64GBaud TIA for 600G

MACOM Technology Solutions introduced new dual and quad channel 64 GBaud transimpedance amplifier (TIA) solutions for coherent applications up to 600G.

The new dual-channel MATA-006806 and quad-channel MATA-006406 offer customers the low noise, low power and high bandwidth required to enable Integrated Coherent Receivers (ICRs) and Integrated Coherent Transmit-Receive Optical Sub-Assemblies (ICTROSAs) operating up to 600Gbps in Telecom and Data Center Interconnect (DCI) applications.

MACOM’s 64 GBaud driver and TIA solutions feature high transimpedance gain, high bandwidth, low input referred noise and low THD to support up to 64Gbaud symbol rates and 64 QAM modulation. The MATA-006806 has purely analog control while the MATA-006406 includes both analog and integrated SPI control for full digital operation.

“MACOM has always raised the bar in providing excellent driver solutions to our customers and helping them to design best-in-class coherent transmit channels. We’re extending our leadership to supporting new 600G ICR designs, and engaging with all Tier 1 customers to qualify in our TIA,” said Rajiv Somisetty, Senior Product Marketing Manager at MACOM. “MACOM’s TIA devices will provide customers with essential low noise and high performance. Partnered with our quad channel drivers, these solutions will ease the design and development cycle of our customers.”

OIF and Ethernet Alliance run FlexE traffic over 400G

At OFC in San Diego, OIF and the Ethernet Alliance are running Flex Ethernet (FlexE) traffic sent over three bonded and subrated 100 GbE interfaces streaming over the Ethernet Alliance 400 GbE network. The demo, which provides a live interconnection between the OIF and Ethernet Alliance booths on the show floor, is designed to showcase the Ethernet Alliance’s IEEE 802.3bs 400 Gbps network and OIF’s FlexE 2.0 Implementation Agreement (IA).

“The Ethernet Alliance’s 400 GbE network over the OFC exhibit floor is the perfect setting to illustrate the real-world features and capabilities of the OIF FlexE 2.0 IA that allows network operators to tailor their traffic while still leveraging Ethernet,” according to Nathan Tracy, OIF’s President and Technologist at TE Connectivity. “The Ethernet Alliance’s deployment of the 400 GbE network at OFC combined with OIF’s FlexE demonstration illustrates the coincident availability of these new technologies.”

“We’re pleased to be able to make our 400 GbE network available to the OIF for this demonstration at OFC,” said Ethernet Alliance chairman John D’Ambrosia. “We applaud the OIF for its work in leveraging 100 GbE and 400 GbE in its FlexE 2.0 implementation agreement. Their efforts will increase the capabilities of these solutions to help address the market needs of the Next Ethernet Era.“

The member companies participating in the OIF demo include Amphenol, Cisco, Credo Semiconductor (HK) LTD, Finisar, Inphi, Juniper Networks, Keysight Technologies, Molex, Spirent Communications, TE Connectivity, VIAVI Solutions, Xilinx and YAMAICHI ELECTRONICS.

Rhe Ethernet Alliance’s OFC 2019 demo incorporates equipment and solutions from 21 different companies: Amphenol; Anritsu; Arista Networks; Cisco; Credo Semiconductor; EXFO; Finisar; Intel; Ixia / Keysight Technologies; Juniper Networks; Lumentum; Nexans S.A.; Panduit; Source Photonics; Spectra7 Microsystems; Spirent Communications; TE Connectivity; Tektronix; Teledyne LeCroy; VIAVI and Xilinx, Inc.

Huawei files suit against U.S. government in U.S. federal cout

Huawei has filed a lawsuit in a U.S. federal court in Plano, Texas against the U.S. government arguing that restrictions against the firm and other actions by the U.S. government are unconstitutional. Huawei is seeking a permanent injunction against these restrictions.

Huawei announced the lawsuit at a press conference in Shenzhen, China.

"The U.S. Congress has repeatedly failed to produce any evidence to support its restrictions on Huawei products. We are compelled to take this legal action as a proper and last resort," Guo Ping, Huawei Rotating Chairman said. "This ban not only is unlawful, but also restricts Huawei from engaging in fair competition, ultimately harming U.S. consumers. We look forward to the court's verdict, and trust that it will benefit both Huawei and the American people."

Guo Ping added, "If this law is set aside, as it should be, Huawei can bring more advanced technologies to the United States and help it build the best 5G networks. Huawei is willing to address the U.S. Government's security concerns. Lifting the NDAA ban will give the U.S. Government the flexibility it needs to work with Huawei and solve real security issues."

Zayo evaluates strategic alternatives

Zayo is postponing its Analyst Day scheduled for March 14, 2019, in Boulder, Colorado.

The company said its Board of Directors is "currently evaluating strategic alternatives that may enhance shareholder value."

“Zayo’s purpose is to provide mission-critical bandwidth to the world’s most impactful companies. We accomplish this by executing a focused strategy centered on communications infrastructure. With our deep and expansive fiber networks in North America and Europe, we play a unique and compelling role at the core of our customers’ networks,” said Dan Caruso, Zayo Chairman and CEO. “Whether public or private, this will remain Zayo’s focus and we will continue to expand the depth and breadth of our fiber infrastructure.”

MACOM and CIG demo 200G QSFP module

MACOM Technology Solutions demonstrated a 200G optical module designed in collaboration with Cambridge Industries Group (CIG).

The new 200G (4 x 50Gbps) QSFP module was developed by CIG leveraging a high-performance analog chipset from MACOM, and is optimized for volume-scale deployment in high-density Cloud Data Center links.

MACOM’s fully analog transmit and receive chipset is comprised of the MAOM-38053 four-channel transmit CDR with integrated EML driver and, on the receive side, features MACOM BSP56B photodetectors, a MATA-03819 quad TIA and the MASC-38040 four-channel receive CDR.

“MACOM is applying its expertise and market leadership in 25Gbps and 100Gbps solutions to 50Gbps PAM-4 applications and specifically to 200G QSFP and 2 x 200G OSFP/QSFP-DD modules to bring the benefits of low power and low latency solutions to Cloud Data Centers,” said Marek Tlalka, Senior Director of Marketing, High-Performance Analog, MACOM. “We are excited to collaborate with CIG to deliver the industry’s first 200G optical module based fully on a low cost and low power analog chipset.”

“CIG has again advanced its leadership in 200G QSFP module applications with MACOM’s low cost, lower power, fully analog technology for volume production in our highly automated production lines,” said Michael Xin, VP of Sales and Marketing, CIG. “This breakthrough affirms our commitment to advancing optical module technology and enabling a new ecosystem for analog technology in Data Center interconnects.”

Molex highlights 100G Lambda and Coherent platforms

At this week's OFC, Molex announced the general availability of its 100G Lambda product platform. Volume production starts in Q2 2019. Multiple 100GbE and 400GbE products will be offered such as 100G-DR QSFP28, 100G-FR QSFP28, 100G-LR QSFP28, 400G-DR4 QSFP-DD, 400G-FR4 QSFP-DD and 400G-LR4 QSFP-DD.

In addition, Molex is showcasing the coherent product platform, which supports products such as OIF 400G ZR compliant transceivers in OSFP and QSFP-DD form factors.

Molex is also hosting a joint live demo with Cisco, Innovium and Ixia that shows end-to-end Ethernet traffic through 400G-DR4, 100G-DR, 100G-FR and 100G-LR transceivers. The demo highlights the 100G Lambda Multi-Source Agreement (MSA) compliant technology’s readiness to support next-generation high-speed, high-density networking. Sharing the same optoelectronic technology, the 100G Lambda product platform is scalable to support future serial 100G and 800G products.

https://www.connector.com/solutions/ofc