Monday, September 24, 2018

Open Data Initiative backed by Microsoft, Adobe, SAP

A new Open Data Initiative is being backed by Microsoft, Adobe and SAP with the promise of letting enterprises derive more value from their own data. The core focus is to eliminate data silos and enable a single view of the customer, helping companies to better govern their data and support privacy and security initiatives.

The Open Data Initiative is a common approach and set of resources for customers based on three guiding principles:

Every organization owns and maintains complete, direct control of all their data.
Customers can enable AI-driven business processes to derive insights and intelligence from unified behavioral and operational data.
A broad partner ecosystem should be able to easily leverage an open and extensible data model to extend the solution.

“Adobe, Microsoft and SAP are partnering to reimagine the customer experience management category,” said Shantanu Narayen, CEO, Adobe. “Together we will give enterprises the ability to harness and action massive volumes of customer data to deliver personalized, real-time customer experiences at scale.”

"Together with Adobe and SAP we are taking a first, critical step to helping companies achieve a level of customer and business understanding that has never before been possible,” said Satya Nadella, CEO of Microsoft. “Organizations everywhere have a massive opportunity to build AI-powered digital feedback loops for predictive power, automated workflows and, ultimately, improved business outcomes.”

Sunday, September 23, 2018

ECOC 2018: Progress with the 100G Lambda MSA

The 100G Lambda Multisource Agreement (MSA) Group, which was formed in October 2017, announced the release D2.0 of three specifications based on 100 Gbps per wavelength PAM4 optical technology.

These updated 100 GbE interface specifications are designated as 100G-FR and 100G-LR for duplex single mode links over 2 km and 10 km respectively.

The MSA has also updated the 400G-FR4 specification for 400 GbE duplex single mode fiber links relying on multiplexing 4 wavelengths of 100 Gb/s PAM4 modulated optical signals. In addition, the MSA is also working on a 400G-LR4 specification for a 10 km reach at 400 GbE.


In addition, members of the 100G Lambda MSA Group announce recently conducted a private interoperability private plugfest hosted by MultiLane. Twelve companies participated.

The areas of focus for this event included testing optical interoperability for 100 GbE and 400 GbE modules and modules that support 4x 100 GbE breakout.

“The rapid convergence of stakeholders and technical agreement highlights the strong industry effort and the demand to bring this technology to market as soon as possible,” said Mark Nowell, MSA co-chair.

“The successful testing between so many members involved in the plugfest shows the rapid maturity of the various product and technology developments across the ecosystem,” said Jeffery Maki, MSA co-chair.

At ECOC, the 100G Lambda MSA Group is hosting module interoperation demonstrations in the 100G Lambda MSA booth (Booth #123)/

The 100G Lambda MSA Group member companies are: Alibaba, Applied OptoElectronics, Arista, Broadcom, Ciena, Cisco, Color Chip, Credo, Delta, Finisar, Foxconn Interconnect Technologies, Fujitsu Optical Components, HiSense, Huawei, IDT, Inphi, Intel, Juniper Networks, Kaiam, Keysight Technologies, Lumentum, Luxtera, Macom, Maxlinear, Mellanox, Microsoft, Mitsubishi Electric, MultiLane, Molex, Neophotonics, Nokia, Oclaro, Rockley Photonics, Semtech, Sicoya, Source Photonics, Sumitomo Electric, TE Connectivity and Tektronix.

ECOC 2018: Source Photonics demos 50G and 400G PAM4 transceivers

Source Photonics will be participating in the Ethernet Alliance interoperability demonstration showcasing live traffic-utilizing 50G and 400G PAM4-based optical transceivers in OEM equipment at ECOC 2018, September 24-26 in Rome, Italy.

The live demonstration at the Ethernet Alliance Booth #618 will consist of multiple 400G and 50G links among participating network and test equipment manufacturers.

Source Photonics will contribute its 400GBASE-LR8 transceivers in QSFP-DD and CFP8 form factor as well as its 50GBASE-LR QSFP28 modules. Live traffic will be passed among the equipment of Ethernet Alliance member companies including Exfo, Huawei, Ixia, Spirent and Viavi.

Ed Ulrichs, Director PLM, commented: “Source Photonics offers advance solutions to support the migration to the next higher networking speed. The demonstration of our latest 50G and 400G optical transceivers attests the readiness of this technology for wide-scale deployment by connecting them to the networking equipment of various OEMs and proving interoperability.”

Source Photonics also said that it is now accepting sample orders for the high speed 400G QSFP-DD. The company is scheduled to go into production in January 2019. This small form factor module enables the migration to the next higher data rate in a wide field of applications such as datacenter connectivity, optical transport networks and metro networks.

The 50G QSFP28 will be in full production late this year and will support the expansion to converge networks in metro access and 5G applications.

Source Photonics -- booth #416
Ethernet Alliance -- booth #618

ECOC 2018: Keysight and Ixia demo 400GE and 110 GHz signal analysis

At ECOC 2018, Keysight Technologies is demonstrating its latest high-speed, test solutions in a private room (building SC3, room J), including coherent signal analysis solutions featuring the new Infiniium UXR-Series Real-Time Oscilloscopes and the new N4391B Optical Modulation Analyzer with up to 110 GHz Bandwidth, as well as the M8194A 120 GSa/s arbitrary waveform generator (AWG). The room will include demonstrations of new optical and electrical 400GE / PAM4 compliance test solutions, as well as 1.2 Terabit and 400ZR test equipment for coherent optical applications.

Ixia, a Keysight business, is also demonstrating its 400 Gigabit Ethernet (GE) test solutions in cooperation with other organizations. With the Ethernet Alliance (Stand 618), Ixia will participate in the first multivendor demonstration of interoperability in the 400GE ecosystem with a 400GE switch over OSFP optical transceivers which leveraged all 8 ports in the AresONE OSFP 8x400GE test system to deliver 3.2 Tbps of live Ethernet traffic. The demo also uses passive copper Direct Attached Cable (DAC) assemblies from Amphenol and TE Connectivity Ltd.

Keysight and Ixia solutions are also present at:

  • Fujitsu Optical Components (FOC) (Stand 703) is showing Keysight's N1092C DCA-M sampling scope with N1078A optical/electrical clock recovery unit and 86100D DCA-X mainframe with 86108B precision waveform analyzer for the development of their 400G OSFP/QSFPDD transceivers.
  • HUBER+SUHNER Cube Optics AG (Stand 410) will present a live demo at its booth of its latest ultra-compact integrated multi-lambda 200 Gbps PAM4 Receiver Optical Sub-Assembly (ROSA), compatible with the 200G and 400GBase-FR8 standard using Keysight’s N1092E DCA-M sampling oscilloscope for analysis.
  • Ciena (private room) is using Keysight’s M8290A optical modulation analyzer (OMA) to demonstrate its Wavelogic Ai coherent applications.
  • Finisar (Stand 400) is demoing their leading optical transceiver modules operating in the Ixia’s 2nd generation 400GE, AresONE test system. The demonstration consists of AresONE ports transmitting and receiving up to 3.2 Tbps of live Ethernet test traffic with Forward Error Correction (FEC).
  • Source Photonics (Stand 416) is demonstrating the maturity of the 400GE ecosystem using their 400G QSFP-DD LR8 transceiver and traffic from Ixia’s field-proven K400 QSFP-DD test system.
  • Mellanox Technologies (Stand 432) is using Ixia's AresONE 8x400GE QSFP-DD test system to demonstrate 200Gb/s live traffic using 200GBASE-SR4 multimode fiber transceivers and 400Gb/s QSFP-DD passive copper DAC assemblies.
  • Molex (Stand 606) will demonstrate line rate 400G Ethernet traffic with Ixia’s K400 over Molex’s new 3m QSFP-DD DAC. Real-time analysis on K400 will showcase test results of pre-FEC (forward error correction) per lane BER (bit error rate) better than IEEE specifications.

ECOC 2018: NeoPhotonics shows 400G EML and silicon photonics

At ECOC 2018 this week in Rome, NeoPhotonics is showing its suite of lasers and analog ICs for uncooled, non-hermetic single laser 100G and 4 laser 400G links within data centers.    The product suite includes Electro-Absorptively Modulated Lasers (EML) for 2 km PAM4 based links and high power CW laser sources for 0.5 and 2 km Silicon Photonics-based links, along with the photodetectors, drivers and trans-impedance amplifiers required.

NeoPhotonics anticipates a technology shift to single-laser (lambda) 100Gbps and 4-laser (lambda) 400Gbps using 4 level pulse amplitude modulation (PAM4) driven by demand for higher port density and lower cost per bit for optical connections inside the data center.

The 100G/400G Component Suite from NeoPhotonics includes:

  • 53GBaud Uncooled CWDM4 EML, which includes the option for integration with NeoPhotonics’ open drain driver. With an uncooled operating temperature range from 20 to 70C and the capability to operate reliably in “open-air” transceiver designs, thus eliminating hermetic enclosures, this EML is a preferred transmitter solution for PAM4 based FR4 2 km data center applications. Versions are also available at 1310 nm for DR1 and DR4 500 meter applications.
  • 53GBaud Open Drain Driver (ODD) for linear operation of EML lasers. With a typical 90mW of power consumption per channel and small size, this high speed driver can be co-packaged with the EML reducing power and increasing linearity and is well suited for use in small form factor pluggable modules.
  • 53GBaud PIN photodetectors. The side illumination structure of the PIN PD enables a simple coplanar assembly with a mux/demux chip and TIA and is well suited for compact modules.
  • 53GBaud Transimpedance Amplifier (TIA). With low noise and a typical power consumption of 60mA over a 3.3V rail, this TIA is well suited for receiver signal amplification for up to 10km transmission.

In addition, transceiver developers have also begun deployment of silicon photonics based transceivers for industry standard MSAs such as CWDM4, CLR4 and PSM-4, which has led to the need for custom, high power and non-hermetic laser sources to drive these transceivers. To support this emerging Silicon Photonics eco-system, NeoPhotonics has developed and qualified a line of high power, uncooled lasers and laser arrays for several industry leading Silicon Photonics transceiver manufacturers, as well as offering single and quad drivers for Silicon Photonics modulators:

  • High Power 40mW and 70mW non-Hermetic CW Laser Sources for Silicon Photonics based CWDM4 FR4 and 1310nm DR1 and DR4 Applications. These efficient, high power DFB lasers can operate up to 75 deg. C and have completed the non-hermetic testing compliant with the Telcordia GR-468-CORE, making them well suited for use in non-hermetic Silicon Photonics based small form factor pluggable modules.
  • 53GBaud Quad MZM drivers for Silicon Photonics modulators. This quad driver has a high 3.5Vppd output per channel and a typical 2.2W low power consumption for all four channels designed for small form factor pluggable modules.  This component is also available in single driver configurations for DR1 applications.

“Our complete suite of 53GBaud Linear Optical Components provides all needed optical components for single laser 100Gbps transmitters and receivers, scalable to 400Gbps transceivers with CWDM4 wavelengths,” said Tim Jenks, Chairman and CEO of NeoPhotonics.  “Furthermore, our uncooled, high power CW DFB lasers and laser arrays are critical elements for any 100G, 200G or 400G Silicon Photonics based transceiver.  We are pleased to offer the lasers and critical analog electrical components for both next generation data center transceiver approaches,” continued Mr. Jenks.

ECOC 2018: NeoPhotonics cites progress with 64 GBaud for 600G

At ECOC 2018L NeoPhotonics is reporting that its suite of 64 GBaud optical components for coherent systems are currently being used by multiple major customers to develop systems with 600G per wavelength transport capacity.   64 GBaud components double the symbol rate over standard 100G (32 GBaud) coherent systems.

NeoPhotonics' suite consists of three components:

  • 64 GBaud CDM:  NeoPhotonics 64 GBaud, polarization multiplexed, quadrature coherent driver modulator (CDM) is shipping in limited availability and features a co-packaged InP modulator with a linear, high bandwidth, differential driver in a compact package designed to be compliant with the anticipated OIF Implementation Agreement.
  • 64 GBaud Micro-ICR:  NeoPhotonics Class 40 High Bandwidth Micro-Intradyne Coherent Receiver (Micro-ICR) is in volume production and is designed for 64 GBaud symbol rates, doubling the bandwidth of standard 100G ICRs. The compact package is designed to be compliant with the OIF Implementation Agreement OIF-DPC-MRX-02.0.
  • Low Profile Micro-TL:  NeoPhotonics ultra-narrow linewidth external cavity tunable laser features very low phase noise and power consumption and has been proven in volume production. It is now configured in a smaller, lower profile package that is compliant with the OIF Implementation Agreement OIF-MicroITLA-01.

These components work together to enable customers to implement single wavelength 600G or dual wavelength 1.2T data transmission over data center interconnect (DCI) distances of 80 km. 

“We are working closely with customers to provide a matched suite of high speed optical components for 600G per wavelength to enhance system performance and reduce time to market,” said Tim Jenks, Chairman and CEO of NeoPhotonics.  “With our next generation highly integrated COSA, operating at 64 Gbaud and beyond, and our Nano-Tunable Laser, we are working to enable highly compact pluggable 400G modules,” continued Mr. Jenks.

The company says three OEM customers have elected to use all three of these components in their development, while additional customers have elected to use a subset of the NeoPhotonics 64 GBaud coherent component suite.  The components also support 400G over metro distances of 400-600 km using 64 GBaud and 16 QAM or 200G over long-haul distances of greater than 1000 km using 64 GBaud and QPSK.

In addition, at 16:10 pm on Tuesday, September 25th Dr. Winston Way, NeoPhotonics’ CTO Systems, will present a paper entitled “Next-Generation Coherent Pluggable Transceivers in a CDC ROADM Based Optical Network” at the ECOC 2018 Exhibition Market Focus session entitled: “Optical Network Agility/Software Defined Networks.”

ECOC 2018: 5G requires fiber network infrastructure - Source Photonics

There may be a vast number of opportunities for mobile fronthaul and backhaul on the horizon but improvements in protocols, standards and technology will also need to be made, according to Supriyo Dey, Senior Director Product Line Management at Source Photonics, speaking on the opening day of the ECOC 2018 Exhibition, taking place in Rome, Italy.

Dey commented: “While an exciting era of unprecedented opportunity is almost here in the shape of 5G, it comes with a set of challenges for the whole industry. The advent of this technology is undeniably huge, but there’s a real challenge for those who are hungry to develop its capabilities to match their expectations in terms of performance. Applications such as 3D video, augmented reality, UHD screens, self-driving cars and smart cities to name a few will need to be supported by mobile front and backhaul.

“With these advances in capabilities come new requirements -, up to 10Gb/s data rate to support high quality video, ultra-reliable and low latency communication for autonomous vehicles and massive node communications for them Internet of things.

“The current 4G optical fronthaul and backhaul architecture will not be adequate to support these new applications. While several optical fronthaul and backhaul solutions have been proposed, we have yet to see a clear winner.”

Dey’s observations were delivered at the ECOC18 Exhibition’s Market Focus, as part of an agenda that tackled topics ranging from FTTX evolution and next-generation data centers to optics as an enabler for 5G.

Source Photonics is also showcasing some of its latest products at the exhibition in the form of live demos.

This includes a demonstration with equipment testing experts Ixia, of its 400G QSFP-DD LR8 transceiver. In addition, the company will also demonstrate its 25G SFP28 LR Lite which supports CPRI wireless and 25GBASE-LR applications.

ECOC 2018: IDT debuts100G Single Lambda EML driver and TIA for 200G/400G

At ECOC 2018, Integrated Device Technology (IDT) is introducing its latest single lambda EML driver and TIA for 200G/400G datacenter applications.

IDT said its 400GbE based on 100G single lambda designs will establish an ecosystem to lower the cost per bit, a key enabler for scalable Switch-to-Switch and Switch-to-Server Optical Links, supported with small form factor modules, such as 200G/400G QSFP-DD, OSFP and 400G OBO. The Electro-Absorption Modulated Laser (EML) and Trans-Impedance Amplifier (TIA) are key analog IC components, and the features of IDT's chip set of high bandwidth, high sensitivity and low power consumption are promising to support those modules.

The IDT 100G single lambda EML Driver is available as a die (HXT45100) and as a packaged driver (HXT45x01) with 1 or 4 channels. The driver family features broad bandwidth, high linearity and low power consumption for the QSFP-DD module form factor. The SMT-type packaged drivers integrate built-in Bias-T, internal high-frequency chokes and input DC blocks, and offers 2Vpp output voltage swing while consuming less than 300mW per channel power.  The bandwidth is over 40GHz with excellent phase flatness and channel isolation.

The 100G single lambda TIA, offered as 1 channel and 4 channel dies (HXR45x00),  provides under 5kohm transimpedance gain, 500mVpp maximum differential output voltage, excellent flat frequency response and low group delay with 3dB bandwidth higher than 36GHz, is very suitable for 100G single lambda applications, with a power dissipation as low as 168mW per channel. The HXR45x00 is configurable by I2C, for 28G applications, with a flat frequency response and 3dB bandwidth of 25GHz and reduced power dissipation down to 135mWper channel.

"We are very excited of the initial results of our single channel and four channel 112G/ch TIA," said Andrea Betti-Berutto, IDT Fellow. "This new generation of TIAs will well satisfy the high performance challenges required for 100G single lambda applications and simultaneously consume very little power and deliver a high sensitivity solution for lower rate applications, such as 28Gbaud-based small form factor modules."

Molex acquires Nistica for wavelength selective switching (WSS)

Molex has acquired Nistica, a manufacturer of wavelength selective switching (WSS) products. Financial terms were not disclosed.

Nistica, which was founded in 2005 and is based in Bridgewater, New Jersey, is a supplier of agile optical modules that simplify, automate and make affordable the delivery of high bandwidth applications for the global telecommunication markets. The company specializes in WSS, a signal routing engine for metro/long-haul telecom networks.

Molex said Nistica's wavelength management solutions will enhance its portfolio of solutions for metro and long-haul networks. Nistica’s business will be integrated into the Molex Optical Solutions Group, a global provider of optical solutions, including a wide range of optical connectivity, optoelectronics, and optical transport products.

"With the build-out of 5G wireless networks and the growth in data center traffic, our customers are looking for novel optical solutions at the edge and in the core of optical networks," added Ashish Vengsarkar, CEO of Nistica. "The acquisition by Molex enables us to scale in capacity and bring a comprehensive portfolio of next-generation products to the market.”

“The addition of the highly innovative Nistica team and technology portfolio to our business enables us to continue our mission of helping customers drive innovation in areas where optical technology provides them with a competitive advantage,” said Doug Busch, vice president and general manager, Molex Optical Solutions business unit. “Integrating high-port count WSS capability into our optical transport portfolio will allow us to expand our offering to customers driving the dynamic growth of communications networks.”

Comcast's acquisition of Sky brings 23m customers in 7 countries

Comcast NBCUniversal prevailed over 21st Century Fox and Walt Disney in an auction to acquire Sky, the leading entertainment and communications company in Europe.  The offer of £17.28 per Sky shareimplies a value of $40.0 billion (£30.6 billion) for the fully diluted share capital of Sky.

Sky serves 23 million customers in seven countries – U.K., Ireland, Germany, Austria, Italy, Spain, and Switzerland. Sky has TV ownership rights to English Premier League football for three years starting in 2019. It also holds exclusive partnerships with HBO and Showtime. Sky News is a top European cable news network, and there are additional Sky channels for sports, entertainment, and the arts. In addition, Sky Broadband is a leading (#2) residential broadband provider in the U.K./Ireland, and a new Sky Mobile MVNO was recently launched in Europe. Sky's 2017 revenue was $18.5 billion.

Comcast Chairman and CEO Brian L. Roberts said: “This is a great day for Comcast. Sky is a wonderful company with a great platform, tremendous brand, and accomplished management team. This acquisition will allow us to quickly, efficiently and meaningfully increase our customer base and expand internationally. We couldn’t be more excited by the opportunities in front of us. We now encourage Sky shareholders to accept our offer, which we look forward to completing before the end of October 2018.”

Thursday, September 20, 2018

Alibaba Cloud consolidates its no.1 position in China

Presented this week at the Alibaba Group Investor Day conference.

Telia Carrier to offer Cloud Connect service in TierPoint's data centers

Telia Carrier will offer its Cloud Connect service across 25 TierPoint data centers in the U.S. across 14 metro areas, including Boston, Charlotte, Chicago, Connecticut, Dallas, Kansas City, Milwaukee,  Nashville, New York, Omaha, Philadelphia, Raleigh, St. Louis, and Seattle.

Telia Carrier’s Cloud Connect provides multiple, geographically diverse connections to the world’s largest cloud providers, including Microsoft, Amazon, Google and IBM.

Customers in TierPoint’s facilities will also benefit from access to Telia Carrier’s MEF 2.0 certified data center-to-data center Ethernet service, which connects to more than 150 Points-of-Presence worldwide.

“As enterprises continue to entrust their critical business processes to the cloud, direct and secure connectivity which bypasses the public internet becomes vital,” said Staffan Göjeryd, CEO, Telia Carrier. “In partnering with TierPoint, we’re able to bring enhanced global connectivity and our award winning customer care to many additional new locations, providing the quality of service and performance that enterprise customers expect. We’re really excited about expanding this relationship and in particular, the tangible benefits it will bring to TierPoint’s customers.”

“This new partnership with Telia Carrier is yet another key step in the process of expanding the connectivity options for clients using our data centers and cloud pods,” said TierPoint Chief Technology Officer Terry Morrison. “It further enhances our market-leading, edge-infrastructure solutions.”

  • Earlier this month, Telia Carrier announced the activation of a new PoP (Point-of-Presence) in Tokyo, Japan. Telia Carrier noted that recently there has been a significant increase in the amount of IP traffic moving through APAC, a region that loves its online gaming, rich Internet and video content. 

ECOC 2018: First COBO-compliant optical modules

The world’s first optical modules compliant with Consortium for On-Board Optics (COBO) will be shown at next week's ECOC Exhibition 2018 in Rome, Italy.

Specifically, COBO will present a showcase of solutions from Molex, Ciena and SENKO, TE Connectivity, Credo, and AOI.

A goal of COBO is to bring interoperable and interchangeable optical modules into the manufacturing of networking equipment to help address industry challenges, including continual traffic growth, the need for lower power consumption and the increasing speeds of networking technologies such as 400 Gigabit Ethernet.

“Next-generation technologies such as Artificial Intelligence, 5G, and the Internet of Things (IoT) are progressing at a rapid rate and all stand to benefit from equipment manufacturers’ adoption of on-board optics,” said Brad Booth, President of COBO. “The data produced by these applications needs to move efficiently and rapidly between devices and the demonstrations not only represent a significant step forward in achieving this through board-mounted optical modules but also a big step towards mass deployment of interoperable solutions.”

Some highlights:

  • Molex will display a COBO module-based reference layout board that includes high-density front panel Optical EMI shielding adapters, a blind-mate optical backplane interconnect and an on-card optical cabling featuring FlexPlane technology. The demo will highlight how system vendors can utilize Molex optical cable management technologies to integrate COBO on-board optical modules into next-generation system architectures.
  • Ciena and SENKO will show how low-profile face plate connector solutions can enhance the air flow capability and fiber management inside equipment, which will include the CS Connector, a new high-density solution, MPO PLUS Bayonet, and μ-LC that can create more space inside the equipment. In addition, two white papers will be available. The first looks at Data Center Interconnect traffic growth and how this drives the need for increased electrical high-speed signaling, best in-class layout and selection of printed circuit board laminate, where analysis is made of different material properties in the context of COBO applications and verification is made of the compliance to OIF CEI-56G-VSR-PAM4. The second study performs a thermal assessment including the coherent application in context to verify thermal capabilities of the COBO module for 14.4Tb/s capacity 1RU line card.
  • A 112Gbps demonstration will be performed jointly by TE Connectivity and Credo via a test set-up that provides a feasibility demonstration for future COBO applications using 100Gbps electrical lanes based on TE Connectivity’s channel and high-speed connector driven by Credo Semiconductor transceiver silicon.
  • AOI will exhibit a 400G 16 lane on-board optics device that can achieve 2km reach at 1310nm wavelength. It leverages the COBO form factor, electrical pin out and electrical connector specifications released earlier this year. AOI is taking advantage of the SiP technology for this compact device which has a highly integrated design for an on-board optics module.

COBO - Stand 608 at ECOC Exhibition 2018

Filmed at NetEvents 2018 in San Jose, California

A look at COBO and the drive for on-board optics

The Consortium for On-Board Optics (COBO) was formed three years ago to develop specifications to permit the use of board-mounted optical modules in the manufacturing of networking equipment, such as switches and even servers. The specifications will cover electrical interfaces, pin-outs, connectors, thermals, etc.  The idea is to drive the development of interchangeable and interoperable optical modules that can be mounted onto motherboards...

ECOC 2018: Acacia presents 600 Gbps per Wavelength Coherent Transmission

At the upcoming the European Conference on Optical Communications (ECOC) in Rome, Acacia Communications will demonstrate its AC1200 coherent module with dual-core design enabling 1.2 Tbps error-free transmission over fiber with 600 Gbps per wavelength.

The Acacia AC1200 module supports transmission capacity of up to 1.2 Tbps in a footprint that is 40 percent less than the size of the 5” x 7” modules that support transmission speeds of 400 Gbps today.

The module is based on Acacia’s Pico DSP ASIC, which utilizes two wavelengths that can be configured to support from 100 Gbps to 600 Gbps capacity each. The Acacia AC1200 supports a suite of advanced three-dimensional (3D) shaping features that may be optimized to enable performance approaching theoretical limits on a wide range of network configurations.

Acacia shipped its first AC1200 module customer samples in March 2018 and anticipates production to begin by the end of 2018.

Acacia said its high-capacity solution targets the requirements for connections between large data centers with reaches of 100km and above using standard single-mode fiber.

At ECOC, Acacia will also be leading various discussions on topics such as Digital Signal Processing (DSP), subsea communications and lab automation.

9:00 a.m. -12:30 p.m. – Christian Rasmussen, founder and vice president of digital signal processing and optics, will share his thoughts on the “Future scaling and capabilities of DSP algorithms” in the Coherent DSP in Optical Communications Workshop.

9:00 a.m. -12:30 p.m. – Timo Pfau, principal DSP engineer, will present on “What can DSP bring to optical access” in the DSP for Next Generation Optical Access Workshop.

9:00 a.m. -12:30 p.m. – Hongbin Zhang, principal DSP engineer, will present on the “Future of transponders for submarine transmission” in the Submarine Systems Workshop.

Tuesday, September 25

1:30 - 3:00 p.m. – BinBin Guan, optical engineer, will lead the Lab Automation Hackathon in which there will be eight demonstrations for various common lab automation tasks.

Wednesday, September 26

1:30 p.m. - Timo Pfau will present his invited paper titled, “High performance coherent ASIC” as part of the SC3 - Digital Signal Handling Techniques for Optical Communication Systems session.

ECOC 2018: Foxconn Interconnect Technology shows 400 Gbps interconnects

Foxconn Interconnect Technology (FIT) will showcase its latest 400 Gbps interconnect solutions in featured product and technology demonstrations at ECOC 2018.

Specifically, live traffic demonstrations will incorporate a selection of FIT's 400G QSFP-DD interconnect solutions that include various configurations of optics, cables, cages and connectors that combine to deliver 400 Gbps solutions.

"FIT is committed to the development of 400G PAM4 based products and technologies that will add to one of the broadest portfolios of transceivers, cages/connectors, and direct attach copper (DAC) on the market. The product and technology showcases that will take place at this year's ECOC demonstrate both our commitment to the QSFP-DD and OSFP MSA's, and our position as a market and technology leader," said Steve Shultis, Senior Director of Product Marketing at Foxconn Interconnect Technology.

In addition to contributing to the QSFP-DD and OSFP Multisource Agreements (MSAs), FIT is one of the founding promoters of both the 100G Lambda MSA supporting single-mode fiber optic links and the new 400G BiDi MSA supporting links over widely available and deployed parallel multimode links.

ECOC 2018: eSilicon to show 7nm 56G PAM4 long-reach SerDes

eSilicon plans to demonstrate the silicon performance of its 7nm 56G long-reach SerDes during ECOC 2018 (Anritsu booth #408).

eSilicon will show a periodic pattern generator (PPG)-to-chip live demo with different backplane reaches. Specifically, the demonstration will show 56G PAM4 data transfer running at 56Gb/s over two different BERTSCOPE channels with two different reaches, both driven by the Anritsu MP1900A Signal Quality Analyzer-R using a passive and an active PAM4 combiner. The demo with Anritsu is significant because it will show how it is possible to leverage TX finite impulse response (FIR) capabilities to increase performance and improve power figure of merit (FOM) and functionality. A key feature is high insertion loss tolerance with low bit-error rates to support increased bandwidth in legacy equipment.

“To obtain such reach and effectively stress the PAM4 SerDes receiver, it is very important to be able to generate an original extremely high-quality signal, and include equalization and stress tools for full control of the TX side. During the bring-up period, a flexible solution like Anritsu’s MP1900A is the best choice for an interoperability test,” said Anritsu EMEA Wireline Marketing Director Alessandro Messina.

ECOC 2018: Semtech exhibits CDR platform for 25G SFP28 SR modules and AOCs

At ECOC 2018, Semtech will highlight multiple products including its ClearEdge CDR platform for low-cost 25G SFP28 SR modules and Active Optical Cables.

Semtech will also feature its laser drivers, limiting amplifiers, ROSAs, signal conditioners, transceivers, and transimpedance amplifiers (TIAs).

Semtech supplies high-speed optical transceiver ICs and offers optical networking solutions that support multiple next-generation PAM4 and NRZ connectivity standards including Ethernet, PON, Optical Transport Network (OTN), Fibre Channel, and InfiniBand.

ECOC 2018: Go!Foton shows its latest fiber management hub

At ECOC 2018, Go!Foton will showcase the newest member of its line of "PEACOC" high-density fiber management solutions.

The new PEACOC Fiber Distribution Hub (FDH) is designed to be utilized beyond central offices and data centers.

“The PEACOC FDH reinvents the concept of OSP cable management, by providing open, front-side access to all of the operating assets including cabling, splices and optical components,” said Michael Zammit, VP and GM of Connectivity Solutions at Go!Foton.

It features Go!Foton's patented spreadable adapter technology, which improves technician access to small form factor connectors while providing superior fiber management and routing. By enabling this functional modularity, flexible cable management, and multiple mounting options, the Go!Foton FDH can be customized to meet the needs of any customer and deployment situation.

The high-density PEACOC FDH is available in both a hermetically sealed dome enclosure for underground use or a more traditional pole and wall mounted metallic enclosure. Providing options for either factory pre-stub cables or field fusion splicing of both the feeder and distribution cables, the PEACOC FDH leverages Go!Foton’s existing legacy in the manufacture of passive optical components. The solution can also be equipped with a wide assortment of PLC optical splitters without sacrificing easy access to both front and rear subscriber connections.

ECOC 2018: InnoLight demos 400G QSFP-DD DR4

InnoLight Technology, which is based in Suzhou, China, will demonstrate a 400G QSFP-DD DR4 interoperating with 100G single lambda DR1 at ECOC 2018.

In addition, InnoLight will introduce its family of 400G optical transceivers, including 400G OSFP, 400G QSFP-DD and 100G QSFP28 single lambda optical products.

Innolight's current and upcoming products include: OSFP SR8, QSFP-DD SR8, QSFP28 DR1, OSFP 2XFR4, QSFP-DD DR4/DR4+, QSFP28 FR1, OSFP DR4/DR4+,  QSFP-DD FR4, SFP-DD AOC, OSFP FR4, QSFP-DD LR4, OSFP LR4.

"New applications such as digital reality, artificial intelligence, machine learning, and 5G wireless are driving the network traffic to an unprecedented level. Cloud operators need continuing innovation in optical solutions to support bandwidth demand. InnoLight's comprehensive family of 400G solutions will enable cloud operators to rapidly upgrade its networks from 100G to 400G.  InnoLight, with its advanced R&D capability, strong technology partnerships, state-of the-art manufacturing capability will continue to provide better solutions for the industry," said Osa Mok, Chief Marketing Officer of InnoLight Technology.

ECOC 2018: II-VI to show twin flexband 1xN WSS, OTDR

II-VI, a vertically integrated manufacturing company based in Saxonburg, Pennsylvania and offering optoelectronic products, plans to showcase its products for ROADM line cards and highly compact optical amplifier solutions tailored to enable high bit rate DWDM transceivers.

These will include:

  • The twin flexband 1xN WSS powered by the Gen-2 LightFlow(TM) switch engine with 12.5 GHz bandwidth granularity for next-generation coherent long haul and metro networks. 
  • The dual port pluggable Optical Time Domain Reflectometer (OTDR) for embedded network monitoring applications in carrier and data center networks. 
  • The 3-pin micro-pump and 8-pin mini-DIL pump lasers now available at 400 mW and 500 mW respectively, to enable next-generation coherent transceivers.
  • II-VI's product showcase includes one of the industry's broadest and most vertically integrated portfolios of products for ROADM line cards and highly compact optical amplifier solutions tailored to enable high bit rate DWDM transceivers.