Monday, March 20, 2017

Source Photonics Demos 400GBASE-FR8 OSFP module, 53 Gbaud PAM4 ROSA

Source Photonics, a provider of optical transceivers for data centre and broadband access connectivity, announced at OFC 2017 it will demonstrate for the first time its fully integrated 400GBASE-FR8 OSFP module, which it claims offers the first duplex single mode fibre module with a form factor capable of supporting a 12.8 Tbit/s 1 RU switch.

The company's 400 Gbit/s OSFP module is claimed to enable a 4x improvement in faceplate density over current 3.2 Tbit/s switches supported by 100 Gbit/s QSFP28 LR4, CWDM4 and PSM4 modules. The module integrates 8 transmit and receive channels, each operating at 50 Gbit/s using 25 Gbaud PAM4 modulation on both the electrical and the optical interfaces.

This demonstration will consist of an OSFP chassis with integrated 8-wavelength TOSA and ROSA components operating in electrical loop back through the OSFP connector with a display of the eight transmit wavelengths on an optical spectrum analyser. The prototype is based on a compact TOSA housing all eight EML lasers and wavelength multiplexing optics, as well as development of a compact ROSA package housing eight PD chips, TIAs and wavelength de-multiplexing optics.

Source Photonics also announced that at OFC, in cooperation with Semtech, a supplier of analogue and mixed-signal semiconductors, it is demonstrating a 53 GBaud PAM4 compact ROSA capable of supporting a single lambda 100 Gbit/s QSFP28.

The demonstration comprises an optical loop back from a Source Photonics' compact 53 GBaud TOSA using a production-grade EML laser and 53 GBaud ROSA based on Semtech's GN1089 TIA. The combined TOSA and ROSA link can support a loss budget of 5dB and achieve better than 1 x 10-5 BER over the tested link.


The 5G Imperative

5G was front and centre at this year's Mobile World Congress, which concluded on March 2nd. Last year, 5G was already on the tip of everyone's tongue, while this year 5G banners were all over Barcelona, from the arrival lounge at the airport to nearly every vendor stand. There is considerable industry pressure to move as quickly as possible to bring 5G to market and MWC 17 kicked off with a call by major mobile network operators and vendors to accelerate the 5G New Radio (NR) standardisation schedule to enable large-scale trials and deployments as early as 2019, a year earlier than the previous expected timeline.

The first 3GPP 5G NR specification will be part of Release 15, the global 5G standard that will make use of both sub-6 GHz and mmWave spectrum bands. An accelerated rollout for 5G could provide a strategic market advantage to certain carriers who gain a first-to-market advantage with new applications such as autonomous vehicles and fixed wireless access for residential services. Early deployments would also be welcomed by major vendors, many of which are under increasing financial pressure as new LTE installations dry up.


However, there is also a growing back pressure from some quarters, notably European operators and some regulators, not to rush things for the sake of boastfulness at the expense of technology maturity or market reality. In particular, the CTO of Telefonica was quoted in the industry press as saying that a premature lockdown of 5G specifications might prevent the technology from developing to its full potential.

Mobile operators racing to be first

In the highly competitive U.S. market, key players in 5G include Verizon, and perhaps to a slightly lesser extent AT&T. For Verizon, it is essential that it retains a network advantage over Sprint and T-Mobile. Sprint's current advertising campaign proclaiming that its network quality is within 1% of Verizon's is painful enough to the market leader, and falling behind with 5G would be disastrous. Ahead of MWC 17, Verizon announced plans to rollout 5G pre-commercial services to select customers in 11 markets by mid-2017 to create the 'largest 5G proving ground in the world'. The rollout will include several hundred cell sites that cover several thousand customer locations, with pilot markets including Ann Arbor, Atlanta, Bernardsville (New Jersey), Brockton (Massachusetts), Dallas, Denver, Houston, Miami, Sacramento, Seattle and Washington DC. Verizon's 5GTF ecosystem partners include Ericsson, Intel, Qualcomm Technologies and Samsung.

For AT&T, the first 5G business customer trial is already underway in Austin, Texas. The pilot, being conducted in partnership with Intel and Ericsson, uses millimetre wave (mmWave) technology, which can deliver multi-gigabit speeds using unlicensed spectrum. The carrier has previously reported 5G lab trials delivering speeds of up to 14 Gbit/s with less than 3 milliseconds of latency. In the first half of 2017, AT&T plans to conduct a trial in Austin, where residential customers can stream DIRECTV NOW video service over a fixed wireless 5G connection. The trial will include next-generation entertainment services over fixed 5G connections and is designed to evaluate how fixed wireless mmWave technology handles heavy video traffic.

Meanwhile in Australia, for Telstra being first to market with leading technology has also become a hallmark of the company, and Telstra was among the major carriers calling to accelerate the 5G NR standardisation schedule. Telstra has launched commercial gigabit LTE service is select capital cities across Australia enabled by LTE Advanced features including 4 x 4 MIMO, 3 CA (Carrier Aggregation) and higher order modulation (256QAM). Ericsson is a key technology provider for the rollout, with Qualcomm also a key partner.

For Korean carriers, including SK Telecom and KT, both of whom were early movers with LTE, one could say there is a national imperative to lead in 5G. The next winter Olympic Games, scheduled for February 2018, in PyeongChang, Korea, are supposed to showcase commercial 5G service. KT has previously announced plans for commercial 5G in 2019, a year earlier than others, and is also a 5G development partner with Verizon, along with vendors Ericsson and ZTE. SK Telecom likewise has announced plans for 5G NR field trials in the second half of 2017 with the goal of showcasing the technology at the Winter Games. These upcoming trials will employ 3GPP 5G NR MIMO antenna technology with adaptive beamforming and beam tracking techniques, including non-line-of-sight (NLOS) environments and device mobility. Vendor partners again include Qualcomm and Ericsson.

In Japan, NTT DOCOMO has previously stated its intention to roll out commercial 5G services across Japan ahead of the 2020 Olympic Games in Tokyo. At MWC 17, NTT DOCOMO announced interoperability testing and over-the-air field trials in Japan based on the 5G NR specifications being developed by 3GPP. The trials will operate in mid-band spectrum at 4.5 GHz, as well as mmWave spectrum at 28 GHz, showcasing the unified 5G NR design across diverse spectrum bands. The trials will utilise device prototype and base station solutions from Qualcomm Technologies and Ericsson, respectively, along with trial environments from NTT DOCOMO to simulate real-world scenarios across a broad set of use cases and deployment scenarios.

DOCOMO said It is looking forward to timely commercial network launches based on 3GPP Release 15 standard-compliant 5G NR infrastructure and devices. The trial will showcase advanced 3GPP 5G NR technologies including MIMO antenna technology, beamforming techniques, adaptive self-contained TDD, scalable OFDM-based waveforms to support wider bandwidths, advanced coding and modulation schemes and a new flexible, low-latency slot structure based design. In addition, the trial will feature 5G NR operation in mmWave spectrum at 28 GHz, employing advanced 5G NR antenna technology to deliver robust and sustained mobile broadband communications including in non-line-of-sight (NLOS) environments and device mobility.

Vendors race to be first

Among vendors, there are also bragging rights and strategic imperatives at play, For Ericsson, 5G is the really the big bet that is keeping the company alive. The Ericsson stand at MWC was mostly a showcase for its 5G ambitions, and for Ericsson this future cannot come fast enough. The company's recent financial performance and on-going restructuring are no secret, with Q4 2016 revenue down 11% compared to a year earlier and the company reporting a climate of weak investments in mobile broadband in most regions of the world with many legacy 4G projects having wrapped up. At MWC 17, Ericsson showcased a 5G platform comprising the 5G core, radio and transport portfolios, together with digital support systems, transformation services and security, all clearly aimed at mobile operators seeking to be first movers in their markets.

For Nokia, the 5G imperative story is pretty much the same, although the company benefits from a more diverse product portfolio that includes IP and optical platforms that will sustain the company in the event that a 5G rollout is delayed or more gradual than expected. At MWC 17, Nokia also said it intends to give operators a first-to-market advantage based on early specifications. The company announced its 5G FIRST end-to-end solution incorporating its AirScale and AirFrame technology, including AirScale massive MIMO Adaptive Antenna, Cloud Packet Core and mobile transport. The solution is expected to launch in the second half of 2017.

For Huawei and ZTE, 5G is the opportunity to pull ahead of their western counterparts by being first to market. At MWC, ZTE demonstrated a range of 5G mmWave and sub-6 GHz pre-commercial base stations supporting 3GPP's 5G NR new air interfaces and mainstream 5G frequency bands. The base stations use massive MIMO, beam tracking, beamforming and other key 5G technologies to achieve a 50 Gbit/s peak rate. ZTE completed its first 5G mmWave field trials last year. ZTE also showed off an upcoming 5G-capable Gigabit Phone powered by the Qualcomm Snapdragon 835 chipset and which combines wireless carrier aggregation with 4 x 4 MIMO antenna technology and 256QAM modulation. Some may say this device is really pre-5G because it uses technology that is becoming available for 4G LTE, yet the announcement indicates that ZTE believes 5G handsets will be crucial for rapid upgrades to 5G infrastructure.

The issue of 5G handsets and other devices leads to Qualcomm, for whom it would simply be unacceptable to lose its lead. Anyone walking in to Barcelona's Fira convention centre saw dozens of banners proclaiming 'Snapdragon Gigabit LTE - first place in the race'. A rapid adoption of 5G NR would certainly be welcome by the California-based silicon vendor. In October 2016 Qualcomm made the first commercial 5G modem chipset announcement with its Snapdragon X50 5G modem, clearly aimed at operators and OEMs conducting lab tests, field trials and early deployments. The Snapdragon X50 5G modem initially supports operation in mmWave spectrum in the 28 GHz band and employs MIMO antenna technology with adaptive beamforming and beam tracking techniques for NLOS environments. It also offers 800 MHz bandwidth support for peak download speeds of up to 5 Gbit/s.

At MWC 17, Qualcomm announced support for the 5G NR accelerated plan and is expanding its Snapdragon X50 5G modem family to include 5G NR multi-mode chipset solutions compliant with the 3GPP-based 5G NR global system supporting operation in the sub-6 GHz and multi-band mmWave spectrum. This includes support of both Non-Standalone (NSA) operation (where control signalling is sent over LTE), and Standalone (SA) operation (where all control signalling and user data are sent over 5G NR), and are designed to enable the next generation of premium-tier mobile cellular devices while also aiding operators to execute early 5G trials and deployments. The first commercial products integrating 5G NR modems from the Snapdragon X50 family are expected to be available to support the first large-scale 5G NR trials and commercial network launches starting in 2019.

Big questions remain

The question remains, is there a business case for an accelerated adoption of 5G? The upgrade to 4G brought with it concurrent improvements to the overall network infrastructure; 5G is being preceded with network advancements, including network virtualisation technologies, open systems, and even continued improvements of the underlying metro optical transport network. In addition, 4.5G technologies such as carrier aggregation and MIMO are already adding significant capacity to mobile networks. The chief financial officers of the mobile network operators will look at this and ask whether there are in fact end customers willing to pay to be the first aboard fully 5G commercial services.


Perhaps there are certain customers, like the operators of fully-autonomous vehicle fleets, that are eager to sign up for the first available 5G service, but for now it looks as though certain vendors and operators are pressing full-steam ahead because they have no other choice than to be first with 5G.

OE Solutions Intros Smart SFPs for TDM over Packet

South Korea's OE Solutions and AimValley of the Netherlands have announced the introduction of the final products within their portfolio of Network Migration Smart SFPs, which enable customers to deliver TDM services over packet network via a plug-and-play portfolio that offers support for TDM services from 1.5 Mbit/s up to 2.5 Gbit/s.

The family of network migration Smart SFP modules is designed to facilitate the transition from legacy TDM to all-packet networks by converting PDH or SONET/SDH signals to a packet stream.

The Smart SFP products are designed to provide operators with a cost-effective alternative to upgrading systems using dedicated TDM-over-packet cards or installing new equipment. The Smart SFP modules can be added to any router or packet switch where a TDM service is required.

OE Solutions stated that adding legacy PDH or SDH/SONET services to a packet network can be achieved via first provisioning an EPL service into the packet network and then inserting a Smart SFP at each endpoint of the EPL service. This provides a reliable point to point connection for the delivery of services such as E1 to a legacy base station.

For more complex application, such as PDH to SONET aggregation, Smart SFPs are inserted at locations where an PDH or SONET service is required, and using EPL or EVPL the connections in the network can be set up to aggregate legacy services, for example T1 service aggregation into an OC-3 service. The companies noted that Smart SFPs support industrial temperature range operation and offer a range of optical and electrical interfaces for different applications.

Last week, OE Solutions announced the release of extended reach 10 Gbit/s CWDM SFP+ transceivers and high-density transceivers, including 2 x 10 Gbit/s compact SFP+, 4 x 10 Gbit/s QSFP+ and 25 Gbit/s SFP28, for wireless fronthaul applications.

The CWDM SFP+ transceivers support 1 and 10 Gigabit Ethernet, as well as CPRI-2 to CPRI-8 for wireless network applications, and utilise cooled DFB laser diodes combined with wide dynamic range APD detectors to enable reach up to 20 km for wavelengths up to 1611 nm.

The new industrial temperature grade, high density transceivers are designed to enable high port densities in radio access network equipment to support the roll-out of next generation wireless infrastructures. Products include a 2 x 10 Gbit/s multi-rate bidirectional compact-SFP+ solution for distances up to 20 km, a 4 x 10 Gbit/s multi-rate QSFP+ device offering reach up to 300 metres, and a 25 Gbit/s SFP28 solution with multiple rate and protocol options for distances up to 10 km.

http://www.oesolutions.com/main/view/

Sunday, March 19, 2017

Telefónica Provides Vodafone with Wholesale Access to Fiber Network

Telefónica and Vodafone announced that they have entered into a commercial agreement providing for wholesale access to Telefonica's fibre optic network.

Through the new agreement, Vodafone will immediately have access Telefonica's fibre infrastructure, both in certain municipalities that are subject to regulation and in other municipalities where Telefónica has been freed of wholesale fibre access obligations. The agreement allows Vodafone to utilise the Telefónica fibre to supplement its network coverage and significantly extend the service area where it can offer high speed broadband and TV services.

The agreement is based on purchase commitments over a five year period and is intended to leverage the synergies that can be generated through Vodafone accessing Telefónica's network, which will increase network utilisation and enhance the efficiency of deployments and optimise investment for both parties.

The agreement is also expected to provide consumers with improved coverage and greater choice in terms of services and next generation networks and to expand the availability of services as part of the digital economy.

Telefónica stated that the new agreement represents a key development in its wholesale business strategy through enabling the company to take a more active role in offering wholesale services in a dynamic and evolving market. It also provides more options both in terms of the provision of services by third party operators and the development of co-investment models and the delivery of its own services.

https://www.telefonica.com/es/web/press-office/-/telefonica-and-vodafone-sign-a-commercial-agreement-for-wholesale-access-to-fibre-optics

IBM Launches Enterprise-Ready Blockchain Services for Hyperledger Fabric

IBM InterConnect is launching the first enterprise-ready blockchain service based on the Linux Foundation's Hyperledger Fabric version 1.0.

The service enables production blockchain networks on the IBM Cloud, and is underpinned by the IBM LinuxONE server.

"IBM has applied decades of experience running the world's largest transaction systems for banks, airlines, governments and retailers, to build the most secure blockchain services for the enterprise," said Marie Wieck, general manager, IBM Blockchain. "IBM's blockchain services are built on IBM's High Security Business Network and designed for organizations that require blockchain networks that are trusted, open and ready for business."

IBM said blockchain networks are only as safe as the infrastructures on which they reside. Security features it provides includes:


  • Protection from insider attacks - helps safeguard entry points on the network and fight insider threats from anyone with system administrator credentials
  • The industry's highest certified level of isolation for a commercial system - Evaluation Assurance Level certification of EAL5+ is critical in highly regulated industries such as government, financial services and healthcare, to prevent the leakage of information from one party's environment to another
  • Secure Service Containers – to help protect code throughout the blockchain application – effectively encapsulating the blockchain into a virtual appliance, denying access even to privileged users
  • Tamper-responsive hardware security modules - to protect encrypted data for storage of cryptographic keys. These modules are certified to FIPS 140-2 Level 4, the highest level of security certification available for cryptographic modules
  • A highly auditable operating environment – comprehensive log data supports forensics, audit and compliance


IBM also announced today the first commercially available blockchain governance tools, and new open-source developer tools that automate the steps it takes to build with the Hyperledger Fabric from weeks to days.

http://www.ibm.com

Friday, March 17, 2017

NeoPhotonics Demos Coherent Transceiver for 400/600Gbps

At this week's Optical Fiber Communications (OFC) Conference and Exhibition in Los Angeles NeoPhotonics will demonstrate its pluggable Coherent CFP2-ACO module for 400G and up on a single wavelength over metro distances.

The NeoPhotonics' ClearLight CFP2-ACO Platform is capable of achieving single wavelength 200G, 400G and 600 Gbps transmission over Data center Interconnect through metro/regional distances.

The company said its ClearLight CFP2-ACO platform uses next generation optical components which are based on platforms that have been proven in volume production for 100G and 200G network applications. The platform uses NeoPhotonics’ high bandwidth Class 40 Coherent Receiver capable of 64Gbaud with 16-QAM to 64-QAM modulation.  This high bandwidth receiver maintains high sensitivity to simplify migration from 100G to 200G and 400G links.  The platform also uses NeoPhotonics’ industry leading high power, external cavity, ultra-narrow line width tunable laser with low power consumption. The ultra-narrow line widths enables higher order constellations with less processing requirements from the DSP.

The ClearLightTM  64 Gbaud CFP2-ACO demonstrates the ability to scale data capacity to 400G/600G on a single wavelength while maintaining performance and link budgets in DCI or metro/regional links.  The data capacity scaling optimizes the cost per bit and thus enables broad deployment of coherent transmission from short to long reaches.

"Our new ClearLightTM 64 Gbaud CFP2-ACO 400G/600G pluggable coherent transponder demonstrates a powerful new platform for NeoPhotonics which is capable of efficiently implementing 400G to 600G transmission networks," said Tim Jenks, Chairman and CEO of NeoPhotonics. "This exciting new platform is made possible by our Advanced Hybrid Photonic Integration technology utilizing our latest advances in high bandwidth receivers and ultra-narrow linewidth lasers in conjunction with higher order modulation, " continued Mr. Jenks.

http://www.neophotonics.com

Telia Carrier Tests TIP's Voyager Platform with Coriant

Telia Carrier, the wholesale carrier division of Sweden-based Telia, announced that the Telecom Infra Project (TIP) and Facebook have completed a trial of 100 and 200 Gbit/s transmission utilising Voyager equipment and technology developed by Coriant over its 1,089 km Stockholm to Hamburg route.

Telia Carrier stated that a key feature of the trial was the demonstration of the ability to effectively implement 16QAM signalling over long distances. Facebook has contributed Voyager, a whitebox transponder and routing solution that is being made available to the Telecom Infra Project (TIP) with the aim of enabling more open networks and a more connected world.

The company noted that the TIP aim of bringing a new approach to building and deploying telecom networks aligns with its own Carrier Declarations program, designed to help Telia Carrier expand and develop its network organically and be a leader in industry innovation.


For the trial, Telia Company, the parent company of Telia Carrier and a TIP member, supported Telia Carrier in conducting the test of the Voyager solution and has shared the results of the trial with other member companies. Carried out in early March, the trial demonstrated that decoupled DWDM transponder systems can offer a low cost, low power option, while also providing the necessary flexibility and accessibility to allow service providers to implement them within existing networks.

Following the trial, Telia Carrier is working with TIP, Facebook and Coriant towards the objective of disaggregating the hardware and software components of the network stack as part of the wider effort to make connectivity available to all.

Facebook unveiled Voyager at the TIP Summit last November and contributed the design to the TIP community. Recently, TIP cited forthcoming trial deployments of the solution by Telia, and noted that Orange was working with Facebook and the TIP Open Optical Pack Transport project group to evaluate the solution


When it introduced the platform in November, TIP stated that Equinix had tested Voyager with Lumentum's open line system over 140 km of production fibre, and that MTN had shared the results of a test of Voyager over its production network in South Africa. In addition, it was noted that Facebook, Acacia Communications, Broadcom, Celestica, Lumentum and Snaproute would deliver a disaggregated hardware and software optical networking platform, while ADVA was providing support for the solution.

Xilinx to Demo FPGAs in 400G Ethernet, FlexE

At this week's Optical Fiber Communications (OFC) Conference and Exhibition in Los Angeles Xilinx will debut a number of solutions for high speed data center interconnect (DCI) solutions.

Xilinx will participate in a 400GE multi-vendor network demo featuring the world's first standards-based 400GE MAC and PCS IP in a Xilinx Virtex UltraScale+™ VU9P FPGA. Showcasing the emerging 400GE standard interoperability between multiple vendors, the demo illustrates the Xilinx 400G solution connecting to a Finisar 400GE CFP8 module which in turn connects to a Spirent 400G test module in the Ethernet Alliance booth.

Xilinx will also showcase a complete FlexE 1.0 solution with bonding, sub-rating and channelization on its UltraScale+ FPGAs. This solution demonstrates how multiple clients can be transported using FlexE and highlights the ability of FlexE to carry larger data pipes and match them to transport links for optimal utilization of the link budget. This solution allows network operators to maximize optical performance and lower operating costs over existing infrastructure.

A third demo shows how LLDP packets can be snooped on transport line cards to allow a SDN controller to build a network topology for automation integral to data center networks. It also shows the use of IEEE compliant MACsec to encrypt and authenticate the link for security. As more and more critical applications and data migrate to the cloud, MACsec provides data encryption and authentication to preserve privacy. Such a solution is mandatory in front of a traditional DSP to provide a complete DCI solution.

Another demonstration showcases Xilinx's new 56G PAM-4 transceiver test chip in 16nm FinFET delivering optimized performance for backplane and LR applications.

http://www.xilinx.com

VPIphotonics Upgrades its Photonic Simulation and Analysis Tools

VPIphotonics, a provider of photonic design automation solutions for components, systems and networks, has announced the release of VPIphotonics Design Suite Version 9.8, a simulation and analysis environment for optical components and transmission systems.

The latest release of VPIphotonics Design Suite supports four application-specific simulation tools - VPIcomponentMakerPhotonic Circuits, VPIcomponentMakerFiber Optics, VPItransmissionMaker Optical Systems and VPIlabExpert, and offers enhancements to the user interface and tools operation to help streamline the design and analysis processes. In addition, improved simulation capabilities enhance support for research and product development for new technologies, components and systems.

Target applications for VPIphotonics Design Suite span integrated photonics and optoelectronics, fibre-based lasers and amplifiers and low-cost high-speed direct detection and high-capacity flexible digital coherent systems.

Key new capabilities featured in version 9.8 include:

1. Data-sheet model for directly modulated lasers driven by multilevel data signals as used in PAM applications.

2. Added functionality for synchronising received and reference sequences for DSP and performance estimation.

3. Enhanced multimode fibre module to support coupling between different mode groups.

4. Improved doped multimode fibre solver to support cross-sections spectra of 2-level rare-earth dopant ions, besides Erbium ions, plus analysis tool for multimode amplifiers to characterise gain, noise, mode-resolved signal and noise powers, OSNRs and BERs.

5. Bidirectional electro-optic amplitude and phase modulator allowing control of the electro-absorption and -refraction effects in waveguides.

6. Enhanced modelling of curved waveguides with arbitrary shapes and a new library of waveguides with frequently used curvature shapes.

7. M x N arrayed waveguide grating model using the scattering matrix approach based on datasheet or measured data.

VPIphotonics' noted that Design Suite also incorporates over 850 demonstrations to show the functionality and application range, with new demonstrations for applications such as coded modulation, Stokes vector modulation, PAM, PON transceiver characterisation, 5G wireless backhaul over fibre, DBR fibre lasers and electrooptic components.

GigPeak to showcase 200G PAM4 VCSEL/DML

GigPeak, a supplier of semiconductor ICs and software solutions for high-speed connectivity and video compression over the network and in the cloud that is in the process of being acquired by Integrated Device Technology (IDT), announced that it will showcase a range of products for data centre and telecom markets at OFC 2017.

During OFC, the company will display technology including 200 Gbit/s PAM4 VCSEL and DML drivers for 200/400 Gbit/s applications, 100 Gbit/s LR TOSA and ROSA reference designs in partnership with Shijia Photons Technology, and its 64 Gbaud quad-channel linear optical modulator driver in a 14 x 9.1 mm SMT package for 400/600 Gbit/s coherent applications.

Datacom demonstrations conducted by GigPeak will include its HXT42400 in a TOSA reference design, providing a 4-channel 100 Gbit/s LR NRZ DML laser driver in TOSA, and HXR42400 in ROSA reference design, offering a 4-channel 100 Gbit/s LR NRZ TIA in ROSA, that enable customers to build TOSA/ROSA devices based on its reference design. It will also demonstrate its HXC42400 low power 4-channel 100 Gbit/s LR NRZ CDR integrated with the 100 Gbit/s LR NRZ TOSA/ROSA reference designs.

GigPeak will also show telecom demonstrations including the GX66471 4 channel 64 Gbaud driver targeting linecard and pluggable module vendors developing 400/600 Gbit/s products.

GigPeak noted that the TOSA/ROSA demonstration will involve the combined devices delivering 4 x 25.78 Gbit/s over a distance of more than 10 km of single mode fibre. The optical sub-assemblies utilise Shijia Photons Technology's TOSA/ROSA design and packaging capabilities, designed to simplify evaluation and expand availability of the designs.

The company noted that it is sampling in die form its DML driver and TIA, and expects to begin sampling 56 Gbit/s PAM4 DML drivers and TIAs in die form, as well as Shijia-manufactured TOSAs and ROSAs, in the second half of 2017.

http://www.gigpeak.com

Thursday, March 16, 2017

Nokia Expands its 1830 Optical Portfolio

Nokia today announced an expansion of its flagship 1830 optical product family to help operators to scale their networks across premises access, metro aggregation and long haul data center interconnect (DCI).

Highlights of Nokia's new optical innovations include:


  • The Nokia 1830 Photonic Service Demarcation (PSD) is a carrier-class network demarcation device supporting Ethernet and wavelength services. It cost effectively extends metro optical networks to the customer premise, enabling resilient, high-capacity access to cloud services while providing end-to-end service assurance.
  • The  Nokia 1830 Photonic Service Interconnect (PSI) integrates the super coherent technology of the Photonic Service Engine 2 (PSE-2s) into a data center physical and operational form-factor, delivering the highest proven optical performance and flexibility available in a purpose-built DCI platform. Its unique modulation formats maximize spectral efficiency and distance for metro, long haul, and subsea networks.
  • New 100G line cards for the 1830 Photonic Service Switch address the high-capacity, low latency aggregation required to connect cloud service consumers to metro colors and edge data centers. Powered by the PSE-2 Compact (PSE-2c) metro-optimized 100G digital signal processor, the new 100G OTN and packet cards efficiently transport packet and OTN services in a compact, cost-effective form factor.


All new capabilities will be available in the first half of 2017.

http://www.nokia.com

ADVA Intros Direct Detect Open Optical Layer for DCI

ADVA Optical Networking introduced its direct detect open optical layer for Internet Content Providers and Cloud Network Providers who want to avoid the expense of traditional coherent solutions.

The new solution, which is a key expansion of the ADVA FSP 3000 CloudConnect platform, is available in two distinct formats. It can either be bought as an Open Line System (OLS) in a disaggregated manner or as a complete solution that includes the terminal and the line system.

ADVA Optical Networking said one compelling feature of its OLS is its SmartAmp technology that enables direct detect transmissions to be transported up to 100km. By disaggregating the terminal functions from the line system, customers are able to evolve and optimize each network layer separately. Not only does this lead to significant savings in regards to footprint and power, but it also means that wavelengths can be used with any terminal equipment, such as switch routers or classic transponders.

“Our FSP 3000 CloudConnect™ helped change the DCI market. It transformed people’s expectations. Since its launch, we’ve continually innovated and driven forward our vision for the OLS,” said Christoph Glingener, CTO, COO, ADVA Optical Networking.

http://www.advaoptical.com/

EchoStar XXIII Blasts into Orbit in SpaceX's

The EchoStar XXIII successfully launched into geostationary transfer orbit from the historic Launch Complex 39A (LC-39A) at NASA’s Kennedy Space Center in Florida aboard a SpaceX Falcon 9 rocket.

EchoStar XXIII is a highly flexible Ku-band satellite based on Space Systems Loral's 1300 platform with four main reflectors and multiple sub-reflectors supporting multiple mission profiles. Initial commercial deployment of EchoStar XXIII will be at 45° West, and the Satellite End of Life (EOL) Power is 20 kilowatts (kW).

“This is the third satellite built for EchoStar by SSL to be placed on orbit since last June,” said John Celli, president of SSL. I would like to thank EchoStar, SpaceX and our own engineers and technicians who all worked as a team to make this launch a success.”

http://www.echostar.com

NeoPhotonics launches 1310nm Lasers for 100G QSFP28

NeoPhotonics has announced general availability of high power 1310 nm lasers and laser arrays qualified for applications in low-cost, non-hermetic packages for 100 Gbit/s silicon photonics-based QSFP28 modules targeting the data centre market.

NeoPhotonics stated that the new lasers and laser arrays are designed to address the need for custom high-power and non-hermetic lasers that provide the light source for silicon photonics-based transceivers providing 100 Gbit/s connectivity within the data centre. The company added that deployment of these transceivers delivered in standard MSA formats such as CWDM4, CLR4 and PSM4, typically in a QSFP28 form factor, is currently underway.

To support the emerging silicon photonics ecosystem, NeoPhotonics has developed and qualified according to the Telcordia GR-468-CORE Issue 2 standard, a range of high power, uncooled lasers and laser arrays for a number of major silicon photonics transceiver manufacturers.

NeoPhotonics' new lasers are designed to provide an efficient, high power light source that leverages a specific implementation of silicon-based high speed analogue and digital electronic devices and photonic components. The high power 1310 nm CW DFB lasers are qualified compliant with Telcordia GR-468-CORE Issue 2, which encompasses criteria including damp heat testing for powered non-hermetic devices. The products are production ready.

NeoPhotonics noted that its lasers are designed with a focus on three key customer requirements: the need for high optical power output, ranging from 40 to 7 0mW, for both NRZ and PAM4 modulation; proven reliability in non-hermetic packages to meet the volume and low cost requirements associated with mega-data centre applications; and custom features to allow the use of automated laser attach and alignment methods to help reduce assembly costs.

Regarding the products, Tim Jenks, chairman and CEO of NeoPhotonics, said, "These uncooled, high power non-hermetic CW DFB lasers and laser arrays are a key component for… emerging 100, 200 or 400 Gbit/s silicon photonics-based transceivers for data centre switching applications… the new lasers illustrate the wide ranging applications for NeoPhotonics' advanced hybrid photonic integration technology, efficiently combining high power InP laser technology with partners' silicon photonics modulator technology".

London Internet Exchange Picks Ciena for DCI

London Internet Exchange (LINX) has deployed Ciena’s Waveserver stackable data center interconnect (DCI) platform for connecting its data centers throughout London.

LINX has 11 points of presences (PoPs) across London, with more than 740 members connecting more than 70 different countries. LINX offers its members cost-effective and high-capacity links between its data centers to efficiently exchange traffic between a large number of diverse international peering partners.

Ciena said its Waveserver, LINX can provide multiple terabits of connectivity between its Harbour Exchange, Equinix LD5 and Interxion locations, enabled by the platform’s massive capacity and density—400 Gb/s of line capacity plus any mix of 10G, 40G or 100G of client Ethernet services up to 400 Gb/s, in a compact, one rack unit form factor.

http://www.ciena.com

German service provider Exaring deploys ADVA FSP 3000 for 100G

ADVA Optical Networking announced that German digital service provider Exaring has deployed its technology in what is believed to be Germany's first fully integrated platform for the delivery of IP entertainment services.

Based on the ADVA FSP 3000 solution, Exaring's new national backbone network is designed to transmit high-quality, on-demand TV and gaming services to approximately 23 million households across the country. The 100 Gbit/s core transport infrastructure deployed for Exaring, which also features the FSP Network Manager to provide high service availability, has a total of over 12,000 km of fibre. ADVA noted that its long-term partner dacoso designed and installed the network.

Exaring's new 80-channel optical transport system provides high capacity and low latency performance and will be used solely for the transmission of IP entertainment applications, including new technologies such as UHD 8K TV.

ADVA noted that the dedicated, high-capacity DWDM network for on-demand streaming and multi-player gaming will help Exaring to bypass Internet bottlenecks and deliver delay-free services to its customers. The flexible architecture is additionally designed to enable Exaring to quickly integrate and roll-out new services.

In November 2016, ADVA announced today that New England-based fibre communications provider 186 Communications has deployed its FSP 3000 in the northeast U.S. to expand its fibre backbone and address growing demand from broadband providers and enterprise customers.

Last December, ADVA announced that Columbia College Chicago had deployed the FSP 3000 platform for a 100 Gbit/s optical transport network designed to eliminate reliance on managed services and to enable the college to offer e-learning classes. The DWDM network connected the college's ten campus sites and featured low-latency, Layer 1 traffic protection.

http://www.advaoptical.com

Luxtera Partners with TSMC for Next Gen Silicon Photonics

Luxtera, a global provider of silicon photonics solutions, announced that it has partnered with TSMC for the manufacture of next generation silicon photonics solutions designed for future cloud, mobile infrastructure, enterprise and high-performance computing (HPC) platforms.

Under the agreement, Luxtera and TSMC are developing a new silicon photonics technology platform designed to provide more than double the optical link performance and four times the raw data throughput of competing silicon photonics solution on the market. The new silicon photonics platform will also enable full SoC integration of optical interconnect with the CMOS logic for applications such as network switch, storage or compute.

Luxtera stated that combined with TSMC silicon manufacturing capabilities and scale, its silicon photonic designs can enable optical interconnects that offer significantly higher performance at lower cost and power consumption to address the requirements of future data centres and 5G mobile networks.

Luxtera's latest platform will be used in a suite of next generation silicon photonics solutions to deliver 100 Gbit/s per lane optical interconnects, starting with 100GBase-DR and 400GBase-DR4 transceivers in 2018, and subsequently expanding to include other standards-based solutions for 25, 50, 100, 200, 400, 800 Gbit/s and 1 Tbit/s optical interconnects.

In addition, complementing the new silicon photonics technologies, Luxtera will leverage TSMC's 7 nm CMOS process to deliver high performance with low power across its product portfolio.

http://www.luxtera.com


  • In September 2016, Luxtera announced it had shipped more than one million silicon photonics PSM4 transceiver products designed for applications in cloud computing data centres. The Luxtera 100 Gbit/s PSM4 optical transceivers include four independent transmitter and receiver channels integrating phase modulators, photodetectors, waveguides, grating couplers, electrical re-timers and control circuitry, powered by a single integrated laser.

Mellanox: 100G Transceiver Shipments Ramp Up Quickly

Mellanox Technologies reported that it has shipped more than 200,000 VCSEL and silicon photonics transceiver modules to serve the growing demand of hyperscale Web 2.0, cloud, and enterprise 100Gb/s networks. The modules are delivered in the QSFP28 form factor as Active Optical Cables (AOCs) or as standalone pluggable transceivers.

“The 100Gb/s optical transceivers market has ramped very quickly and we have ramped our optical manufacturing capabilities with it, and are shipping multiple product families in high volume,” said Amir Prescher, senior vice president of business development and general manager of the interconnect business at Mellanox. “Multi-mode optics are the most cost effective solution on the market today to connect 25G and 100G Ethernet servers and switches over shorter data center reaches. For longer reaches, customers selected our silicon photonics-based PSM4 transceivers as the most cost effective, highest configurable, single-mode transceiver available.”

Recently, Mellanox announced that is has shipped over 100,000 Direct Attach Copper (DAC) cables for 100Gb/s networks. DAC are used to link servers and storage to Top-of-Rack switches; typically less than 3 meters in length. Transceivers and AOCs offer lengths up to 2km.

http://www.mellanox.com

OE Solutions Unveils 10G CWDM SFP+, 10/25G Transceivers

South Korea-based OE Solutions, a supplier of optical transceivers for communications applications, has announced the release of extended reach 10 Gbit/s CWDM SFP+ transceivers and high-density transceivers, including 2 x 10 Gbit/s compact SFP+, 4 x 10 Gbit/s QSFP+ and 25 Gbit/s SFP28, for wireless fronthaul applications.

CWDM transceivers

OE Solutions' new CWDM SFP+ transceivers which offer support for 1 and 10 Gigabit Ethernet, as well as CPRI-2 to CPRI-8 for wireless network applications, utilise cooled DFB laser diodes combined with wide dynamic range APD detectors and proprietary circuitry to enable reach of up to 20 km for wavelengths up to 1611 nm.

The industrial temperature grade, extended reach transceivers are available for CWDM wavelengths from 1471 up to 1611 nm and complement the company's standard line of DFB-based 10 Gbit/s CWDM transceivers for wavelengths from 1271 to 1451 nm to provide a total of 18 channels.

The company noted that extended reach transceivers with directly modulated DFB lasers offer a cost effective alternative to EMLs for access network applications such as for wireless fronthaul and Ethernet service delivery.

The OE Solutions extended reach 10 Gbit/s CWDM SFP+ transceivers are currently sampling, with volume production scheduled to start in the second quarter of 2017.

New high-density transceivers

The industrial temperature grade high density transceivers are designed to enable high port densities in radio access network equipment to support the roll-out of next generation wireless infrastructures.

OE Solutions noted that in 2017 it is estimated that the number of 10 Gbit/s CPRI ports deployed will increase rapidly and exceed the total of all lower rate ports installed. In addition, the use of 25 Gbit/s transceivers is expected to significantly raise wireless fronthaul capacity over the next 12-18 months. Both of these developments are driving demand for physically denser solutions, which can be cost effectively addressed by increasing the number of wavelengths per transceiver cage and the bit rate per wavelength.

The new high-density transceivers being introduced by OE Solutions are as follows:

1. A 2 x 10 Gbit/s multi-rate (1270 and 1330 nm) bidirectional compact-SFP+ solution for distances up to 20 km.

2. A 4 x 10 Gbit/s multi-rate 850 nm QSFP+ device offering reach of up to 300 metres.

3. A 25 Gbit/s 1310 nm SFP28 solution with multiple rate and protocol options for distances up to 10 km.

The new high-density transceivers are currently sampling, with volume production due to commence in the second quarter of the year.

http://www.oesolutions.com

Arvizio Targets Augmented Reality Software

Arvizio of Ottawa, Canada, a developer of software solutions enabling augmented and mixed reality experiences, has announces the launch of the company and the completion of an initial funding round and opened its global headquarters in Ottawa.

Arvizio offers what is believed to be the first enterprise-class mixed reality server platform designed to enable real time collaboration and 3D visualisation across locations utilising platforms such as Microsoft HoloLens and other mixed reality devices.

Arvizio was co-founded in Ottawa in 2016 by Jonathan Reeves, current CEO, Alex Berlin, the company's president and COO, and Borys Vorobyov, current CTO. Mr. Reeves previously served at CloudLink Technologies (acquired by EMC), founded Mangrove Systems (acquired by Carrier Access), Sirocco Systems (acquired by Sycamore Networks) and Sahara Networks (acquired by Cascade communications).

Previously, Mr. Berlin was a founder and served as CEO of CloudLink Technologies, was co-founder and CEO of AFORE Solutions (acquired by Kuatro/Jabil) and chairman of Ambercore Software. Mr. Vorobyov previously founded SightPower, a company focused on large scale spatial data analysis and 3D visualisation, and co-founded Ambercore Software.

Arvizio has a team of experienced technology professionals with expertise in the areas of 3D spatial data processing, secure network communications, IoT and artificial intelligence (AI) and is applying this expertise to create advanced mixed reality solutions. By combining collaboration and 3D visualisation techniques, the company offers solutions that target a range of industry verticals, including healthcare, industrial, enterprise and education.

https://www.arvizio.io/