Hot Interconnects: UCIe Brings On-Package Memory to the Forefront
At the IEEE Hot Interconnects 2025, Intel’s Debendra Das Sharma outlined how the Universal Chiplet Interconnect Express (UCIe) can extend the performance of on-package memory, offering a path to low-power, high-bandwidth, low-latency, and cost-effective solutions for AI and HPC systems. Das Sharma, joined by colleagues from Intel and AMD, noted that today’s AI workloads are […]