Showing posts with label TE. Show all posts
Showing posts with label TE. Show all posts

Thursday, August 1, 2019

TE intros straddle-mount connectors for OCP NICs

TE Connectivity (TE) introduced its new Sliver straddle-mount connectors, which are the new standard form factor supporting a faceplate-pluggable Open Compute Project (OCP) NIC 3.0.  Applications include OCP NIC 3.0 cards in a low profile. OCP NIC 3.0 cards are horizontal and faceplate-pluggable, which helps to increase airflow through the enclosure and enable system ease of design. TE’s Sliver straddle-mount products are among the most cost-effective and highest performing solutions on the market.

TE said its Sliver straddle-mount connectors for SFF-TA-1002 support high speeds through PCIe Gen 5, with a roadmap to 112G. SFF-TA-1002 is a proposed alternative or replacement to many form factors, including M.2, U.2, and PCIe. The high-density, 0.6mm pitch of the Sliver straddle-mount connectors also supports next-gen silicon PCIe lane counts, which is where current products in the market begin to max out.

“OCP-compliant designs are taking the data center equipment industry by storm, and TE Connectivity is a major supplier of connectors for these designs,” said Ann Ou, product manager at TE Connectivity. “Our Sliver straddle-mount products deliver high performance and density in a standardized form factor to facilitate design and manufacturing for our data center equipment partners.”

https://www.te.com/usa-en/products/connectors/pcb-connectors/sliver-connectors.html?source=header-match&tab=pgp-story

Thursday, July 18, 2019

TE intros QSFP-DD connectors, cages and cable assemblies for 400G

TE Connectivity (TE) introduced its new Quad Small Form Factor Pluggable Double Density (QSFP-DD) connectors, cages and cable assemblies, which address next-generation data center needs by increasing density through an existing QSFP form factor to reach speeds up to 400 Gbps. This 8 lane solution is designed for both 28G NRZ and 56G PAM-4 protocols, with a roadmap to 112G PAM-4 for future system upgrades.

“As the world marches toward next generation connectivity in data center equipment, designers need new connector and cable assembly solutions to support this change,” said Zach Galbraith, product manager at TE Connectivity.  “We are excited to be one of the premier suppliers bringing QSFP-DD products to our customers, enabling 400 Gbps data rates through a single port. These products can provide much-needed flexibility to the industry’s end users, platform designers and system integrators.”

TE notes that its -DD products are backward-compatible. The new QSFP-DD products leverage proprietary zipper fin heatsink technology allowing them to work cost-effectively in 15-18W applications.

TE offers a broad QSFP-DD portfolio which includes 1x1 through 1x6 cages and surface mount (SMT) connectors on a 0.8mm pitch, along with various lengths and wire sizes of straight and breakout passive copper cable assemblies. Customer specific designs with different lightpipes, heatsinks and cable assemblies are also available, supported by TE signal integrity experts.

https://www.te.com/usa-en/products/connectors/pluggable-connectors-cages/qsfp-dd.html?tab=pgp-story

Video: The Road to On-Board Optics w Nathan Tracy of TE Connectivity



One minute video: Nathan Tracy at TE Connectivity discusses how COBO utilizes TE's high-speed connector and how the two companies form an industry partnership to enable new aggregate bandwidth rates for next-generation optical data centers.

https://youtu.be/_QNJqZY_RGg

Monday, March 4, 2019

TE Connectivity demos 400G connector and cable assemblies

TE Connectivity (TE) is showcasing its lineup of high-performance connectors, sockets, cable assemblies and power solutions.

TE products are showcased in the 100G and 400G active demonstrations in the Ethernet Alliance booth with SFP56, QSFP56, OSFP, QSFP-DD connectors and QSFP-DD-to-OSFP cable assemblies based on signaling at 25G and 50G individual pair signaling rates, along with an operating 800G capable OSFP cable based on 100G individual pair signaling.

In the OIF booth, TE will participate in active 100G individual pair signaling demonstrations with an OSFP to QSFP-DD cable assembly, an OSFP connector and cage, and a QSFP-DD connector and cage.

The COBO booth will include TE's demonstration of its 100Gbps capable Sliver COBO connector in partnership with Credo.

The following TE products will be featured in these demonstrations and displays:

  • I/O connectors: SFP56, SFP-DD, QSFP56, OSFP and QSFP-DD 400G interconnects, Nano-Pitch I/O connectors (NPIO), and COBO as well as thermally enhanced versions of all these pluggable interconnects. A demonstration of 800G OSFP will be included.
  • Copper cable assemblies: SFP56, SFP-DD, QSFP56, OSFP, and QSFP-DD direct attach cables, including a demo of 800G OSFP cables. In addition, Sliver cables (SFF-TA_1002, GenZ), and STRADA Whisper cables will be shown.
  • Board to Board: STRADA Whisper, Z-PACK Slim UHD, Z-PACK HM-eZd+ backplane connectors, and backplane cable assemblies.
  • Sockets: LGA 3647 (Socket P) and XLA 3800+ position sockets
  • Power Delivery: Open Compute Power, MULTI-BEAM HD
  • Internal Interconnects: Sliver Interconnects (SFF-TA-1002, GenZ, EDSFF, OCP NIC 3.0, DDIMM, COBO), Nano-Pitch I/O connectors (OCuLink), and STRADA Whisper in an internally cabled system.


Monday, July 30, 2018

TE Connectivity' next-gen connectors ready for 56G PAM4

TE Connectivity (TE) introduced its next-generation, 0.8mm free height board-to-board connectors designed for higher-speed, mezzanine board systems.

The company says its mezzanine connectors are capable of delivering 25 Gbps and higher signals for supporing PAM4 and PCIe Gen 5 architectures.

The new free height connectors are also said to deliver higher reliability through a stronger plug/receptacle mechanical design, maintaining the same performance when de-mated up to 0.5mm. In addition, modular tooling enables 1mm stack height increments and flexible pin counts.

Saturday, March 3, 2018

TE Connectivity targets higher density switches with zQSFP+ Stacked Belly-to-Belly Cages

TE Connectivity (TE) introduced its zQSFP+ stacked belly-to-belly cages designed for high-density switches with 48 or 64 silicon ports. The cage supports a single printed circuit board (PCB) architecture (versus two PCBs) in each line card.

The company said this new design addresses the requirements for higher density switches, including Open Compute Project (OCP) reference designs. The cages support up to 28G NRZ and 56G PAM-4 data rates to achieve faster speeds in these high-density switches. TE's zQSFP+ stacked belly-to-belly cages are dual-sourced with Molex and are drop-in replacements.

"These new zQSFP+ cages allow us to design denser switches while reducing costs by using just one PCB per line card," said Melody Chiang, product manager at Accton. "TE continually supports our efforts to design faster, denser switches, and this belly-to-belly configuration is just the latest example."

Thursday, October 13, 2016

Hawaiki Transpacific Cable Project is On Track

Pre-deployment work on Hawaiki, the 14,000 km transpacific cable system scheduled for completion in mid-2018, is on track. Hawaiki will link Australia and New Zealand to the mainland United States, as well as Hawaii, with options to expand to several South Pacific islands.

Hawaiki Submarine Cable LP and TE SubCom announced that system manufacturing has commenced. Some updates:

  • More than 1,000 kilometers of lightweight cable has been manufactured to date for Hawaiki at TE SubCom’s facility in Newington, N.H., USA.
  • Manufacturing of Hawaiki repeaters is underway.
  • Detailed landing surveys have been completed for sites in Pacific City, Oregon and Kapolei, Hawaii.
  • Completion of deep sea survey from Oregon to Hawaii.
  • Survey has covered all of U.S. Exclusive Economic Zone (EEZ), with the completion of the branch to American Samoa
  • In September 2016, Hawaiki Submarine Cable LP officially submitted for a submarine cable landing license from the U.S. Federal Communications Commission (FCC).
  • Demonstrating its commitment to the connectivity of Pacific Islands, Hawaiki has added three additional branching units to enable the future connection of New Caledonia, Fiji and Tonga. 

http://www.hawaikicable.co.nz
http://www.te.com

Wednesday, July 27, 2016

TE Launches micro Quad Small Form-Factor Pluggable I/O Connectors

TE Connectivity (TE) is the first to launch micro Quad Small Form-Factor Pluggable (microQSFP) input/output (I/O) interconnects.

The microQSFP connectors are the next step forward in high-density faceplates for data center infrastructure. MicroQSFP connectors deliver QSFP28 functionality in a smaller, generally SFP-sized form factor while providing significantly better thermal performance to help save energy costs, improved electrical performance at 25 gigabits per second (Gbps) and 33 percent higher density than QSFP to fit more ports on a standard line card.

The new microQSFP connectors deliver 56Gbps performance with backward compatibility to 28Gbps to support next generation designs. Built-in fins on TE’s new connectors eliminate the need for additional clips and heatsinks and allow faceplate airflow to the interior of the equipment, which helps microQSFP deliver significantly better thermal performance than QSFP28 and other leading solutions.

TE is a member of the microQSFP Multi Source Agreement (MSA) group, which is working to build an industry-wide ecosystem for microQSFP, and ensuring that products can be easily adopted and integrated into existing data center designs.

“At a time when faceplate real estate and thermal performance are at a premium, TE’s microQSFP products deliver on both counts,” said Phil Gilchrist, CTO, TE Data and Devices. “The technological innovations of TE’s microQSFP products can revolutionize the industry by enabling customers to place up to 72 ports of 100 Gbps each on a 1RU line card.”

http://www.microQSFP.com
http://www.te.com/microqsfp

Monday, June 29, 2015

TE Connectivity Intros Fiber-rich Distribution Hub for FTTH

TE Connectivity (TE) introduced a new line of fiber distribution hubs featuring higher fiber counts, smaller footprint and improved mounting options.

The new sealed fiber distribution hub (FDH) 4000 brings high-density fiber connectivity to a compact, weatherproof enclosure. It serves to connect the feeder and distribution cables via optical splitters in the fiber to the home (FTTH) network. It features 144 distribution ports, 9 splitter ports and 72 pass-through ports. Its small, compact size overcomes space challenges in crowded hand holes and strands, and offers less visual impact to meet aesthetic or security requirements.

In addition, TE said its FDH 3000 enclosure now offers double the splitter capacity – up to 48 splitter slots – giving network engineers more options in deploying high-bandwidth services over FTTH networks. Additional splitter slots allow engineers to reduce split ratios or add CWDM and DWDM components to deliver even higher bandwidth services.

"Service providers are under pressure to deliver more bandwidth to their customers, but increasingly, regulatory restrictions are impeding their ability to do that," said Jaxon Lang, general manager and vice president of TE Broadband Network Solutions. "Our FDH 4000 and FDH 3000 solutions help solve these challenges by providing service providers with more high-capacity solutions in a smaller footprint. As a result, service providers are able to realize faster network construction and gain better cost control of their FTTH assets."

http://www.TE.com  

Wednesday, January 28, 2015

CommScope to Acquire TE Connectivity's Telecom, Enterprise and Wireless Units

CommScope agreed to acquire TE Connectivity’s telecom, enterprise and wireless businesses for $3 billion in cash.

TE Connectivity's telecom, enterprise and wireless businesses generated annual revenues of approximately $1.9 billion in its fiscal year ended September 26, 2014, consisting of $1.1 billion from its telecom business, where it is a world leader; $627 million from enterprise; and $164 million from wireless.

TE Connectivity holds approximately 7,000 patents and patent applications worldwide.  Its fiber technology is expected to help CommScope better address a transition to fiber deployments deeper into networks and data centers as consumers and businesses generate increasing bandwidth requirements.

CommScope said the acquisition will accelerate its entrance into attractive adjacent markets and to broaden its position as a leading communications infrastructure provider.  In addition, CommScope will have greater geographic and business diversity following the completion of the transaction.

“This is an important and transformative acquisition for CommScope, bringing together complementary geographic and customer coverage, products and technologies for the benefit of our stockholders, customers and employees,” said Eddie Edwards, CommScope president and chief executive officer. “This transaction has many clear strategic and financial benefits for all of our stakeholders.  It creates enhanced scale with a combined, diversified portfolio that we believe is well-positioned to take advantage of opportunities in the marketplace.

"Our decision to sell our BNS business reflects our strategy to continue focusing on and expanding our leadership position in the attractive connectivity and sensor markets, with particular emphasis on harsh environment applications," said Tom Lynch, TE Connectivity Chairman and Chief Executive Officer. "These markets represent a $165 billion opportunity for TE and have strong growth rates and attractive profit levels driven by the global trends of a safer, smarter, greener and more connected world."

http://ir.commscope.com/


Friday, January 23, 2015

TE Connectivity Boosts Cellular Service with DAS for NFL Championship Game

TE Connectivity (TE) has deployed its FlexWave Prism and FlexWave Spectrum distributed antenna systems (DAS) in preparation for the 49th NFL championship game on February 1 in Phoenix, Arizona.

At the University of Phoenix stadium, TE deployed FlexWave Spectrum DAS to provide 48 sectors of mobile coverage and capacity for a neutral host provider serving the nation’s four largest mobile operators at the stadium. The massive deployment includes 96 main hubs, 49 expansion hubs, and 225 remote antenna units to cover the stadium bowl, luxury boxes and service areas. The system supports various 700, 800, 850, 1900 and 2100 MHz LTE, CDMA, EVDO and UMTS services. In the Glendale area where the stadium is located, TE equipment is being used to link a base station hotel with DAS in the Renaissance Hotel and the Gila River Arena, making use of existing operator infrastructure to manage capacity spikes.

In downtown Phoenix, TE’s FlexWave Prism DAS has been deployed at the Hyatt Regency Hotel (headquarters for NFL executives in the month leading up to the game) and at CityScape, an outdoor visitor center. Elsewhere, TE’s FlexWave Spectrum DAS with the CPRI digital interface unit (CDIU) has been deployed at US Airways Arena, which will serve as the event’s media center. In addition, TE’s unique host-to-host technology has been deployed to link a base station hotel in downtown Phoenix with US Airways Arena, the Hyatt Regency, Chase Field and the Phoenix Convention Center. The host-to-host technology transports base station signals for miles over a digital fiber link between the base station hotel and the venues.

“TE is the vendor of choice at the world’s most important events and venues,” said Peter Wraight, president of TE’s Wireless business unit. “Our all-digital solutions deliver outstanding capacity and performance at events like this, where the network needs to be able to withstand significant capacity increases and maintain connectivity reliably.”

http://www.te.com

Monday, July 28, 2014

TE Connectivity Floats $1 Billion in Senior Notes

TE Connectivity Ltd. (NYSE: TEL) ("TE Connectivity") today announced that its wholly-owned subsidiary, Tyco Electronics Group, has priced an offering of:

  • $500 million aggregate principal amount of its floating rate senior notes due 2016;
  • $250 million aggregate principal amount of its 2.350% senior notes due 2019; and
  • $250 million aggregate principal amount of its 3.450% senior notes due 2024.

http://www.te.com

Wednesday, June 18, 2014

TE Connectivity to Acquire Measurement Specialties for Sensor Business

TE Connectivity agreed to acquire Measurement Specialties (NASDAQ: MEAS), a leading supplier of sensors, for $86 cash per share or a total transaction value of approximately $1.7 billion (including assumption of net debt).

Measurement Specialties, which expects revenue of $540 million in its current fiscal year, offers a broad portfolio of sensor technologies including pressure, vibration, force, temperature, humidity, ultrasonics, position and fluid, for a wide range of applications and industries.  The company is based in Fremont, California.

"The acquisition of Measurement Specialties is a key part of our strategy to be a leader in the very attractive, high-growth sensor industry and adds nearly $40 billion to our addressable market," said Tom Lynch, TE Connectivity Chairman and CEO. "We are excited about this acquisition as it enables TE to provide customers with an unmatched range of connectivity and sensor solutions that are essential in a world where everything is increasingly connected. We look forward to combining Measurement Specialties' strong breadth of products and technologies with our deep customer relationships and global scale. We are also delighted to welcome their talented team to TE."

Frank Guidone, CEO of Measurement Specialties, said, "The sensor market is quite strong, with both the number of applications and the content per unit increasing every year. We are excited to expand our product offerings to customers around the world through TE's unparalleled go-to-market capabilities. We look forward to working with TE toward a seamless integration for our customers and employees, and becoming the supplier of choice for customers' sensing requirements."

http://investors.te.com
http://www.meas-spec.com/

Friday, February 21, 2014

TE Connectivity Unveils New Active Optics Platform Technology to Drive 100G, 300G and 400G

TE Connectivity (TE) introduced  "Coolbit optical engines" - new, active 25Gmdevices that convert data from electrical signals to optical signals for 100G, 300G and 400Gs.

In 2014, TE will bring to market four active optics products that include Coolbit optical engine platform:

  • 100G QSFP28 active optical cables (AOCs)
  • 100G QSFP28 transceivers
  • 300G Mid board optical modules
  • 400G CDFP AOCs

The QSFP28 modules perform at less than 1.5 Watts per transceiver. representing up to 60 percent more power savings than existing solutions.

Each Coolbit optical engine, developed in TE's fabrication facility in Jarfalla, Sweden, uses 25G VCSEL and PIN devices, a TIA amplifier and a driver IC. From research to distribution, TE controls the entire manufacturing process of the Coolbit optical engines and active optic end products. This integrated approach allows TE to transfer cost savings to the customer, while helping to ensure the quality and reliability of its products.

"TE is a technology engineering company that operates with the agility of a start-up. Creating 100G to 400G high-speed active optics will enable the industry to create breakthrough platforms and products," said Philip Gilchrist, chief technology officer and vice president of TE Data Communications. "TE makes the hard stuff first. Our long trusted legacy in connectivity, coupled with a dedication to developing the next impossible technology, we've driven active optics to new levels of performance in terms of higher speeds at incredibly lower power consumption. We can't wait to see what radical new products our partners will create with our Coolbit engine-based products."

http://www.te.com/coolbitgo

Tuesday, January 28, 2014

TE Connectivity Enhances its FlexWave Prism Distributed Antenna System

TE Connectivity is expanding its FlexWave Prism distributed antenna system (DAS) with new high-density modules capable of supporting up to 75 MHz per band, with two frequency bands per module. The new modules enable a 2-bay FlexWave Prism remote unit to support up to four frequency bands, 40 watts, or up to 300 MHz of spectrum.

TE is positioning its new module for delivering 1800 MHz, 2100 MHz, or 2600 MHz MIMO and 800 MHz digital dividend services in the EMEA and Asia-Pacific regions of the world.

“The FlexWave Prism DAS supports multi-operator, multi-protocol services in a compact, cost-effective, and power-efficient manner,” said Peter Wraight, vice president, TE Wireless. “It is ideal for mobile operators who want to deploy DAS with multiple frequencies and high power levels without the complexity of multiple DAS equipment overlays.”


The new FlexWave Prism modules support migration from 3G to 4G services as well as multi-operator applications where two or more mobile operators share a power amplifier. Moreover, by using digital simulcast to deliver services between the DAS head end and remote units, the FlexWave Prism module enables operators to easily shift capacity from one area to another as subscriber needs dictate. The digital DAS reaches up to 20 kilometers to serve urban and suburban areas as well as stadiums, office parks, and other facilities.

http://www.TE.com

Tuesday, January 14, 2014

TE Connectivity Reduces Cost of Connecting Distributed Antenna Systems

TE Connectivity introduced a FlexWave Active Integration Panel (AIP) that provides multi-carrier, multi-protocol connectivity between mobile operator base stations (BTS) and distributed antenna systems (DAS).

The FlexWave AIP is a rack-mountable unit that supports up to eight BTS TX/RX inputs, enabling it to connect multiple BTS in a multi-operator or neutral host application. The FlexWave AIP handles BTS power levels up to 100 Watts.  It is compatible with DAS products from TE Connectivity. It can also be used with other vendors’ DAS offerings.

“FlexWave AIP takes the guesswork, complexity, and cost out of integrating multiple BTS in a DAS deployment,” said Tony Lefebvre, director of product management of TE’s Wireless business unit. “With this new addition to the FlexWave family, we continue to simplify DAS deployment, delivering remotely-monitored control of BTS power levels in a compact system.”

http://www.te.com

See also