Showing posts with label Storage. Show all posts
Showing posts with label Storage. Show all posts

Wednesday, March 24, 2021

Samsung's 512GB DDR5 module targets bandwidth-intensive apps

Samsung Electronics began sampling a 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology. 

The memory module delivers more than twice the performance of DDR4 at up to 7,200 Mbps, making it suitable for the most high-bandwidth workloads in supercomputing, artificial intelligence (AI) and machine learning (ML), as well as data analytics applications.

Samsung said its DDR5 will utilize highly advanced HKMG technology that has been traditionally used in logic semiconductors. With continued scaling down of DRAM structures, the insulation layer has thinned, leading to a higher leakage current. By replacing the insulator with HKMG material, Samsung’s DDR5 will be able to reduce the leakage and reach new heights in performance. This new memory will also use approximately 13% less power, making it especially suitable for datacenters where energy efficiency is becoming increasingly critical. The HKMG process was adopted in Samsung's GDDR6 memory in 2018 for the first time in the industry. By expanding its use in DDR5, Samsung is further solidifying its leadership in next-generation DRAM technology.

Leveraging through-silicon via (TSV) technology, Samsung’s DDR5 stacks eight layers of 16Gb DRAM chips to offer the largest capacity of 512GB. TSV was first utilized in DRAM in 2014 when Samsung introduced server modules with capacities up to 256GB.

“Samsung is the only semiconductor company with logic and memory capabilities and the expertise to incorporate HKMG cutting-edge logic technology into memory product development,” said Young-Soo Sohn, Vice President of the DRAM Memory Planning/Enabling Group at Samsung Electronics. “By bringing this type of process innovation to DRAM manufacturing, we are able to offer our customers high-performance, yet energy-efficient memory solutions to power the computers needed for medical research, financial markets, autonomous driving, smart cities and beyond.”

“As the amount of data to be moved, stored and processed increases exponentially, the transition to DDR5 comes at a critical inflection point for cloud datacenters, networks and edge deployments,” said Carolyn Duran, Vice President and GM of Memory and IO Technology at Intel. “Intel’s engineering teams closely partner with memory leaders like Samsung to deliver fast, power-efficient DDR5 memory that is performance-optimized and compatible with our upcoming Intel Xeon Scalable processors, code-named Sapphire Rapids.”


Tuesday, March 9, 2021

AWS adds lower cost storage classes

Amazon Web Services introduced new Elastic File System (Amazon EFS) One Zone storage classes that reduce storage costs by 47% compared to existing Amazon EFS storage classes, while delivering the same features and benefits. 

One Zone storage classes redundantly store data within a single Availability Zone (AZ) and are ideal for customers who want cost-optimized file storage options for workloads and applications that do not require the level of availability and durability offered by regional Amazon EFS storage classes that redundantly store data across multiple geographically separated AZs. 

AWS said its One Zone storage classes allow customers to achieve a blended storage price of $0.043/GB-month, while also offering higher availability and durability than self-managed file systems. One Zone storage classes provide these lower costs while delivering the same elasticity and scalability benefits of Amazon EFS Standard and EFS Standard-Infrequent Access, as well as features like lifecycle management, and integration with AWS compute services, including Amazon Elastic Container Service (ECS), Amazon Elastic Kubernetes Service (EKS), AWS Fargate, and AWS Lambda. 

All Amazon EFS storage classes are designed for 99.999999999% (11 9’s) durability. Amazon EFS regional storage classes are designed to provide 99.99% (4 9’s) availability, while One Zone for Amazon EFS is designed to provide 99.9% (3 9’s) availability. For added data protection, Amazon EFS file systems in One Zone storage classes are automatically backed up using AWS Backup, and can be restored to any AZ within a Region, or copied to a different Region. Amazon EFS One Zone storage classes are available in US East (Ohio), US East (N. Virginia), US West (N. California), US West (Oregon), Asia Pacific (Hong Kong), Asia Pacific (Mumbai), Asia Pacific (Seoul), Asia Pacific (Singapore), Asia Pacific (Sydney), Asia Pacific (Tokyo), Europe (Frankfurt), Europe (Ireland), Europe (Milan), Europe (Stockholm), South America (Sao Paulo), Africa (Cape Town), Middle East (Bahrain), and all AWS GovCloud (US) regions, with more regions coming soon.

http://aws.amazon.com/efs


Tuesday, February 23, 2021

Samsung ships SSDs tuned for hyperscale operators

Samsung Electronics Co. has begun mass producing its most advanced line of data center SSDs, the PM9A3 E1.S.

The new PM9A3 fully complies with the Open Compute Project (OCP) NVMe Cloud SSD Specification to satisfy the rigorous demands of enterprise workloads. Defined by leading data center providers including Facebook, the OCP Specification is a set of unified interoperable standards, enabling SSD vendors to work toward next-generation storage designs with much more effectiveness.

The drives feature Samsung's sixth-generation (1xx-layer) V-NAND with double the sequential write speed at 3000MB/s, a 40% higher random read speed of 750K IOPS and 150% higher random writes at 160K IOPS.

"Wider 5G deployment and accelerating growth in IoT devices are fueling a hyperconnected lifestyle, driving the demand for more sophisticated hyperscale data centers," said Cheolmin Park, vice president of Memory Product Planning at Samsung Electronics. "Providing an optimal mix of performance, power, reliability and firmware, we believe our new PM9A3 will help advance today's data center storage technologies and expand the market for OCP-compliant SSDs."

“Innovations such as the OCP NVMe Cloud SSD and E1.S are important to solving today’s data center challenges. The OCP NVMe Cloud SSD Specification defines hyperscale SSD requirements, enabling SSD makers to provide leading-edge products that meet the challenging demands of hyperscale environments. Deploying storage at scale is very challenging and Samsung’s support for next-generation industry-leading technologies such as the OCP NVMe Cloud SSD and EDSFF E1.S is a great step forward,” said Ross Stenfort, Hardware Storage Engineer at Facebook.


Thursday, February 18, 2021

Kioxia and WD introduce 6th gen, 162-layer Flash memory

Kioxia (formerly Toshiba Memory) and Western Digital announced their sixth-generation, 162-layer 3D flash memory technology, increasing the manufactured bits per wafer by 70 percent and I/O performance by 66%. 

Kioxia's sixth-generation 3D flash memory moves beyond conventional eight-stagger memory hole array and achieves up to 10 percent greater lateral cell array density compared to the fifth-generation technology. This lateral scaling advancement, in combination with 162 layers of stacked vertical memory, enables a 40 percent reduction in die size compared to the 112-layer stacking technology, optimizing cost.

The Kioxia and Western Digital teams also applied Circuit Under Array CMOS placement and four-plane operation, which together deliver nearly 2.4 times improvement in program performance and 10 percent improvement in read latency compared to the previous generation. I/O performance also improves by 66 percent, enabling the next-generation interface to support the ever-increasing need for faster transfer rates.

“As Moore’s Law reaches its physical limits across the semiconductor industry, there’s one place where Moore’s Law continues its relevancy — that’s in flash,” said Dr. Siva Sivaram, President of Technology & Strategy, Western Digital. “To continue these advances and meet the world’s growing data demands, a new approach to 3D flash memory scaling is critical. With this new generation, Kioxia and Western Digital are introducing innovations in vertical as well as lateral scaling to achieve greater capacity in a smaller die with fewer layers. This innovation ultimately delivers the performance, reliability and cost that customers need.”

“Through our strong partnership that has spanned two decades, Kioxia and Western Digital have successfully created unrivaled capabilities in manufacturing and R&D,” said Masaki Momodomi, Chief Technology Officer, Kioxia. “Together, we produce over 30 percent1 of the world’s flash memory bits and are steadfast in our mission to provide exceptional capacity, performance and reliability at a compelling cost. We each deliver this value proposition across a range of data-centric applications from personal electronics to data centers as well as emerging applications enabled by 5G networks, artificial intelligence and autonomous systems.”


Wednesday, February 17, 2021

Toshiba intros 18TB HDDs

Toshiba Electronic Devices & Storage announced its 18TB MG09 Series HDD with a new energy-assisted magnetic recording technology. 

The new drives feature Toshiba’s third-generation, 9-disk helium-sealed design and Toshiba’s  Flux Control – Microwave Assisted Magnetic Recording (FC-MAMR) technology, to advance Conventional Magnetic Recording (CMR) density to 2TB per disk, achieving a total capacity of 18TB.

Sample shipments of 18TB MG09 Series HDD to customers are expected to start sequentially at the end of March 2021.

“Toshiba’s new 18TB MG09 Series delivers new levels of storage density and power efficiency to our cost-conscious cloud-scale and storage solutions customers. Our HDD technology is able to achieve our customers’ critical TCO objectives at a cost of pennies per GB,” said Shuji Takaoka, General Manager of the Storage Products Sales & Marketing Division at Toshiba Electronic Devices & Storage Corporation. “Our 3rd generation 9-disk helium-sealed design provides a field-tested foundation for achieving a massive 18TB capacity. The addition of Toshiba’s innovative FC-MAMR technology advances CMR capacity to 18TB, delivering compatibility with the widest range of applications and operating environments.”


Tuesday, February 2, 2021

UNH-IOL tests multivendor NVM Express and NVMe over Fabrics

The University of New Hampshire InterOperability Lab (UNH-IOL) completed its second virtual multi-vendor plugfest focused on NVM Express (NVMe) and NVMe over Fabrics (NVMe-oF) technology test cases across eight unique devices and companies.

UNH-IOL said its NVMe technology plugfest events are designed to test against NVMe specifications to qualify them for the NVMe Integrator's List. The NVMe Integrator's List currently consists of configurations that have proven to be interoperable and conformant to NVMe specifications. The most recent of which included NVMe architecture testing for E1.S and E1.L form factor devices, sanitize testing, security, fused command and endurance group testing.


"The completion of the second virtual NVMe Plugfest has allowed companies to stay on schedule with their own internal testing and development,” said Kerry Munson, Operations Manager, Datacenter Technologies, UNH-IOL. “Being able to continue hosting our test events has posed to be a major accomplishment to the IOL and our members, as devices continue to be tested against NVMe technology conformance standards.”

“We are pleased to see the UNH-IOL continue their proven NVMe technology conformance and interoperability testing in a virtual format,” said Amber Huffman, NVM Express President. “With the shift to virtual testing, companies can easily take advantage of the robust testing services the UNH-IOL provides. This testing remains crucial to ensuring vendor products are conformant to the NVMe specifications, providing end-users with confidence that the purchased products successfully operate and allow them to reap all the benefits NVMe technology has to offer.”


Monday, November 9, 2020

Western Digital intros faster NVMe SSDs for data centers

Western Digital introduced a news suite of new NVMe SSDs for  next-generation, data-centric architectures for data centers, industrial IoT, automotive and client applications. 

The new family includes:

  • the Ultrastar DC ZN540 ZNS NVMe SSD for designing a more efficient data center storage tier with competitive TCO. The Ultrastar DC ZN540 ZNS SSD includes a vertically integrated, dual-port, high-availability NVMe controller with capacities up to 8TB in a standard U.2 form-factor; 
  • the Western Digital IX SN530 Industrial SSD for the extreme environments of industrial and automotive applications. The IX SN530 NVMe SSD features a broad operating temperature range from -40°C to +85°C, and delivers a 20G operating vibration specification; 
  • and the 2TB WD Blue SN550 NVMe SSD for speeding up PC performance.

Zoned Storage is the new storage architecture for the next-generation enterprise data center. In addition to championing the Zoned Storage Initiative and ZoneStorage.io, and contributing to the NVMe Working Group ZNS specification and the Linux open-source community to further ecosystem development, Western Digital today announced that it is now sampling the new Ultrastar DC ZN540 ZNS NVMe SSD to select customers. 

Western Digital says the new DC ZN540 SSD delivers up to 4x performance and 2.5x QoS improvements, as well as better efficiency, utilization, and scale while lowering TCO for public and private cloud infrastructure.

Sunday, September 27, 2020

Spectra Logic's tape library stores one Exabyte uncompressed

 Spectra Logic's ninth-generation LTO tape library is now able to store an industry-first exabyte (one million terabytes) of uncompressed data in a single 45-frame system.

The company said its latest LTO technology surpasses the per-cartridge capacity of LTO-8 by 50 percent to 18TB native, and advances full height LTO-9 drive performance by 15 percent to 400 MB/s native. 

Extending to Generation 12, the new LTO roadmap outlines future per-cartridge capacities of LTO technology, with LTO-10 achieving up to 36TB native; LTO-11 up to 72TB native, and LTO-12 up to 144TB native. This progression provides tape users with the assurance that their investment in tape is secure and that they will benefit from the best cost per gigabyte to store their data over its lifespan.

“We’re pleased to have the increased capacity and performance of LTO-9 tape technology, as well as the roadmap to LTO-12,” said Nathan Thompson, CEO of Spectra Logic. “The native 400MB/second transfer rate of the LTO-9 full height drive now matches the high performance Enterprise tape drive. We’re gratified to be the first in the industry to deliver a tape library that can store an astounding exabyte of native data with LTO-9 drives and media – and are pleased with the long-term roadmap of LTO.”

Highlights of TFinity include:

  • Tri-Media – The only tape library to support three tape technologies in the same library (LTO, IBM’s TS 11xx and Oracle’s T10000)
  • Scalable from 3 to 45 frames, over 56,000 slots, with bulk load capability
  • Advanced robotics for higher performance and greater reliability
  • Only tape library with isolation service frames for high availability robotic serviceability
  • Modern linear design fits in standard rack-row data center environment
  • Enhanced management controls with user-friendly interface for greater productivity
  • Modular design that allows for easy service and upgradeability
  • Maximum compatibility to work with any third-party software package

Monday, August 24, 2020

AWS launches next-gen SSDs for its Elastic Block Store

Amazon Web Services announced the general availability of io2, the next generation Provisioned IOPS SSD volumes for Amazon Elastic Block Store.

The new io2 volume is designed for 100x higher volume durability (99.999%) when compared to the 99.9% durability offered by io1 Amazon EBS volumes. Higher volume durability reduces the likelihood of storage failures and makes the primary copy of customers’ data more resilient, resulting in better application availability.

AWS said its new SSD volumes will enable customers todrive 10x higher input/output operations per second (IOPS) from their provisioned storage at the same price as io, so performance improves significantly without increasing storage cost. io2 is ideal for performance-intensive, business critical applications that need higher availability like ERP, CRM, and online transaction systems and the databases like SAP HANA, Oracle, Microsoft SQL Server, IBM DB2, Apache Cassandra, MySQL, and PostreSQL that back them.

“Customers rely on highly durable AWS block storage to keep their business-critical applications running at any scale,” said Mai-Lan Tomsen Bukovec, Vice President, Block and Object Storage, AWS. “Today, we are excited to announce new high durability io2 volumes, that provide existing customers 100x higher volume durability than io1 at no additional cost. For new customers where five nines of storage durability is critical to migrate on-premises business critical applications to AWS, io2 brings together performance, durability, and agility all in a single EBS volume.”

https://aws.amazon.com/ebs

Wednesday, June 24, 2020

Western Digital unveils OpenFlex Data24 NVMe-oF Storage Platform

Western Digital unveiled its new OpenFlex Data24 NVMe-oF Storage Platform, a new shared storage JBOF (Just a Bunch of Flash) enclosure that extends the value of NVMe to multiple hosts over a low-latency Ethernet fabric network. The new enclosure leverages the company's new dual-port, performance Ultrastar DC SN840 NVMe SSDs and in-house RapidFlex NVMe-oF controllers.

The new OpenFlex Data24 holds up to 24 hot-swappable Ultrastar DC SN840 NVMe SSDs, providing up to 368TB in a compact 2U form factor. The newly branded RapidFlex RDMA-enabled NVMe-oF controllers allows up to six hosts to be directly attached with 100Gb Ethernet without the need for an external switch. RapidFlex controllers provide sub-500 nanosecond latency for projected platform performance topping 13M IOPS/70GB/s when adding up to six network adapters to the OpenFlex Data24.

“Data infrastructure has never been as vital to the world’s economy as it is today,” said Yusuf Jamal, senior vice president of Western Digital’s Devices and Platforms Business. “As a leading provider of essential data infrastructure, our mission is to help enterprises architect next-generation data centers to support business-critical applications and bandwidth-hungry workloads at scale. Western Digital’s leadership in NAND Flash, capacity-enterprise HDDs and supporting technologies are being relied upon now more than ever. We’re fully committed to helping companies transition to NVMe and move to new composable architectures that can maximize the value of their data storage resources.”

https://www.westerndigital.com/



Monday, June 15, 2020

Kioxia introduces SSD with 30.72 TB capacity

Kioxia introduced its 6th generation enterprise SAS SSD family with capacities up to 30.72 TB.

The 24G SAS doubles the data throughput of its predecessor, while implementing new features and enhancements. Featuring Kioxia’s 96-layer BiCS FLASH 3D TLC flash memory, the PM6 series delivers SAS SSD sequential read performance of up to 4,300MB/s (4,101MiB/s), which is more than a 2x improvement over the previous generation.

Key features include:

  • Dual-port for high-availability
  • Full range of endurance options for a wide variety of workloads: read-intensive (1 DWPD3), mixed-use (3 DWPD) and write-intensive (10 DWPD)
  • Multistream write support to reduce write amplification and extend endurance
  • Full suite of security options available: sanitize instant erase (SIE), TCG Enterprise self-encrypting drive (SED) and FIPS 140-2 certification.

Tuesday, June 2, 2020

Rancher releases cloud-native container storage solution

Rancher Labs, which offers a widely used Kubernetes management platform, announced the general availability (GA) of Longhorn, an enterprise-grade, cloud-native container storage solution.

The company says Longhorn directly answers the need for an enterprise-grade, vendor-neutral persistent storage solution that supports the easy development of stateful applications within Kubernetes.

the resources required to manage data and operate environments, enabling teams to focus on shipping code faster, and delivering better applications.

Longhorn is 100% open source, distributed block storage built using microservices. Since the product was released in Beta in 2019, thousands of users have battle-hardened Longhorn by stress-testing the product as a Cloud Native Computing Foundation (CNCF) Sandbox project.

The GA version of Longhorn delivers a rich set of enterprise storage features, including:


  • Thin-provisioning, snapshots, backup, and restore
  • Non-disruptive volume expansion
  • Cross-cluster disaster recovery volume with defined RTO and RPO
  • Live upgrade of Longhorn software without impacting running volumes
  • Full-featured Kubernetes CLI integration and standalone UI
  • Users can leverage Longhorn to create distributed block storage mirrored across local disks. Longhorn also serves as a bridge to integrate enterprise-grade storage with Kubernetes by enabling users to deploy Longhorn on existing NFS, iSCSI, and Fibre Channel storage arrays and on cloud storage systems like AWS EBS, all the while adding useful features such as application-aware snapshots, backups, and remote replication.

“As enterprises deploy more production applications in containers, the need for persistent container storage continues to grow rapidly,” said Sheng Liang, CEO at Rancher Labs. “Longhorn fills the need for a 100% open source and easy-to-deploy enterprise-grade Kubernetes storage solution.”

Tuesday, May 19, 2020

SD cards to hit 4GB/sec transfer rate with PCIe 4.0

The latest SD 8.0 Specification for SD Express memory cards will offer top transfer speed of nearly 4GB/sec by using the PCI Express (PCIe) 4.0 specification. The full-sized SD cards use the NVMe Express (NVMe) upper layer protocol enabling an advanced memory access mechanism, while maintaining backward compatibility.

SD Express will be offered on SDHC, SDXC and SDUC memory cards.

“By dramatically increasing the speeds for SD Express we’re giving device manufacturers and system developers more storage choices,” said Hiroyuki Sakamoto, SDA president. “SD 8.0 may open even more opportunities for extra high performance solutions using removable memory cards.”

“PCI-SIG is pleased to see that SDA is continuing to adopt even faster PCIe technology configurations using PCIe 4.0 interface and dual lanes for one of the top leading removable memory cards – SD,” said Al Yanes, PCI-SIG president and chairman. “PCIe specification conformance tests are available today by major test vendors, offering a significant advantage for any new PCIe technology adopter.”

“NVMe is the industry-recognized performance SSD interface from the client to the datacenter, shipping in millions of units,” said Amber Huffman, NVM Express™ Inc. president. “Consumers will benefit by SD Association continuing the adoption of the NVMe base specification for their latest SD Express cards.”

https://www.sdcard.org/

Tuesday, May 12, 2020

Samsung unveils "ruler form factor" NVMe SSDs for OCP

Samsung announced a solid state drive with an E1.S form factor and full PCIe Gen 4 support.

The new drive, which leverages the production efficiencies of the company’s sixth-generation (1xx-layer), three-bit V-NAND, uses the new form factor to maximize the number of drives possible in a 1-RU chassis.

“Offering the most 1U server-optimized form-factor, the PM9A3 will improve space utilization, add PCIe Gen4 speeds, enable increased capacity and more,” said Mr. Jongyoul Lee, senior vice president of Samsung’s Memory Software Development Team at the Open Compute Project Virtual Global Summit. “We see it eventually becoming the most sought-after storage solution on the market for tier one and tier two cloud datacenter servers, and one of the more cost-effective,” he added.

The newly announced PM9A3 drive, to be available in three versions, is expected to feature a PCIe Gen 4 (x4) interface for more than twice the sequential read performance of PCIe Gen 3 (3200MB/s), and include dedicated hardware accelerators for nearly twice the random writes (180,000 IOPs) of the previous generation. Capacities will range from 960 GB to 7.68 TB.


Sunday, April 19, 2020

Marvell enables NVMe over Fabrics storage disaggregation for VMware

Marvell's QLogic Fibre Channel and FastLinQ Ethernet adapters are now supporting NVMe over Fabrics (NVMe-oF) technology in VMware vSphere 7.0.

This enables high-performance NVMe flash storage to be effectively shared, pooled and managed across a fabric.

Specifically, Marvell FastLinQ 41000 and 45000 Series Ethernet Adapters support NVMe/RDMA over both RoCEv2 and iWARP protocols. Starting with VMware vSphere 7.0, customers can leverage NVMe/RoCEv2 capabilities of FastLinQ NICs while future-proofing their data centers for potential use cases of NVMe/iWARP and NVMe/TCP. FastLinQ Universal RDMA capability, combined with future support for NVMe over TCP, provides IT managers with the broadest choice of options to scale out NVMe.

"NVMe over Fabric technologies are unlocking the value of NVMe flash by delivering a variety of low latency, scalable and trusted fabrics," said Vikram Karvat, vice president and general manager, Server Connectivity Business Unit at Marvell. "The introduction of Marvell's QLogic FC-NVMe and FastLinQ NVMe/RoCEv2 technologies into industry-leading virtualization platforms from VMware enables end users to leverage economies of scale when deploying NVMe without compromising the performance, reliability or manageability of their infrastructure."

"VMware and Marvell solutions have been an integral part of every wave of virtualization and storage innovation in the data center for several years," said Sudhanshu Jain, director of product management, Cloud Platform, VMware. "Marvell's QLogic FC and FastLinQ Ethernet technology with vSphere 7.0 enables customers to leverage existing SAN infrastructure and migrate to FC-NVMe to take advantage of performance and cost matrix."

Monday, February 3, 2020

Samsung launches 3rd gen High Bandwidth Memory 2E

Samsung Electronics launched its 'Flashbolt' third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is targeted at high performance computing (HPC) systems and help system manufacturers to advance their supercomputers, AI-driven data analytics and state-of-the-art graphics systems in a timely manner.

The 16GB capacity is achieved by vertically stacking eight layers of 10nm-class (1y) 16-gigabit (Gb) DRAM dies on top of a buffer chip. This HBM2E package is then interconnected in a precise arrangement of more than 40,000 ‘through silicon via’ (TSV) microbumps, with each 16Gb die containing over 5,600 of these microscopic holes.

The data transfer speed is 3.2 Gbps by leveraging a proprietary optimized circuit design for signal transmission, while offering a memory bandwidth of 410GB/s per stack. Samsung’s HBM2E can also attain a transfer speed of 4.2Gbps, the maximum tested data rate to date, enabling up to a 538GB/s bandwidth per stack in certain future applications. This would represent a 1.75x enhancement over Aquabolt's 307GB/s.

"With the introduction of the highest performing DRAM available today, we are taking a critical step to enhance our role as the leading innovator in the fast-growing premium memory market," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "Samsung will continue to deliver on its commitment to bring truly differentiated solutions as we reinforce our edge in the global memory marketplace."

Monday, January 6, 2020

HPE’s StoreFabric M-Series Ethernet Switches run Cumulus Linux

Cumulus Networks and Hewlett Packard Enterprise are working together on open, highly automated and scalable storage networking for data centers.

Specifically, HPE’s StoreFabric M-Series Ethernet Switches will run Cumulus Linux and NetQ, delivering a flexible networking fabric that is predictable, scalable and reliable.

"Many modern data centers feature all-flash storage architectures designed to meet the needs of high-performance applications, but what’s often limited these applications from reaching their true potential was networking," said Josh Leslie, CEO of Cumulus Networks. "The combination of Cumulus Linux and NetQ with HPE’s M-Series Ethernet Switches now provides organizations a more open, flexible networking fabric that is predictable, scalable, and reliable to help drive businesses forward."

"Storage networks built on M-series switches deliver high levels of performance and ultra-low latency," said Marty Lans, General Manager Storage Connectivity, HPE. "Adding Cumulus Linux and NetQ to the M-series now provides enterprises with greater network flexibility, increased scale, and deeper levels of automation making this a compelling solution for Ethernet Storage Fabrics."

Western Digital demos 8TB portable SSD

At the Consumer Electronics Show 2020 (CES® 2020) Western Digital Corporation (NASDAQ: WDC) will showcase new innovations in its extensive lineup of storage solutions built for every consumer use, including a demonstration of

Western Digital demonstrated an 8TB pocket-sized, portable SSD prototype featuring a SuperSpeed USB 20Gbps interface. The company is also releasing the 1TB SanDisk Ultra Dual Drive Luxe USB Type-C drive for smartphones and laptops.

“Consumers are generating more content than ever and require more advanced solutions to help them capture, access, share and manage it all. Our top priority is to empower people by giving them complete control of their content, so they have peace of mind that it’s reliably stored and at their fingertips when and where they need it,” said David Ellis, vice president, product marketing, Western Digital.

Wednesday, September 25, 2019

Intel outlines “Barlow Pass” - 2nd gen Optane DC persistent memory

Intel outlined a series of milestones in advancing memory and storage for cloud, artificial intelligence and network edge applications.

Developments include:

  • Intel plans to operate a new Optane technology development line at its facilities in Rio Rancho, New Mexico; 
  • The second-generation of Intel Optane DC Persistent Memory, code-named “Barlow Pass,” scheduled for release in 2020 with Intel’s next-generation Intel Xeon® Scalable processor 
  • Intel’s industry-first demonstration of 144-layer QLC (Quad Level Cell) NAND for data center SSDs (solid-state drives), which are also expected in 2020.


Intel said the combination of its Optane technology with QLC 3D NAND technology on a single M.2 module enables Intel Optane memory expansion into thin and light notebooks and certain space-constrained desktop form factors – such as all-in-one PCs and mini PCs. The new product also offers a higher level of performance not met by traditional Triple Level Cell (TLC) 3D NAND SSDs today and eliminates the need for a secondary storage device.

Wednesday, September 4, 2019

Samsung's prototype Key Value SSD offloads processing from server

Samsung Electronics announced the first standards-based prototype of a new type of SSD that moves the storage workload from the server CPUs into the SSD.

Samsung’s KV SSD prototype is based on a new open standard for a Key Value Application Programming Interface (KV API) that was recently approved by SNIA.

Samsung says there are numerous benefits of KV storage technology. Rather than operating as a block device, the KV SSD moves resource-draining storage operations from the host CPU to the SSD itself. This results in:

  • Much-improved system-level performance
  • Freeing the CPU from computational work, such as block operations and storage-level garbage collection
  • Substantially greater scalability in the number of linked SSDs by reducing CPU overload
  • Greatly reduced write amplification (WAF)
  • Much less wear on each SSD
  • Greater software efficiency

SNIA’s KV API standard was developed in response to growing concern that as the speed of SSDs further increases, system-level performance was reaching the point of saturation, allowing relatively few SSDs to be optimally interlinked. As the performance of SSDs continues to improve, the situation is expected to worsen when ever-increasing loads are placed on the CPU to manage block operations.

While there are other approaches to this now under development, KV SSD technology is likely to be the most cost-efficient for use with many storage appliances and IT systems.

“The SNIA KV API specification, which provides an industry-wide interface between an application and a Key Value SSD, paves the way for widespread industry adoption of a standardized KV API protocol,” said Michael Oros, SNIA Executive Director.