Showing posts with label Standards. Show all posts
Showing posts with label Standards. Show all posts

Monday, December 7, 2020

Open Eye Consortium completes 50Gbps LR1 and LR4 specs

The Open Eye Consortium (Open Eye MSA)  announced two new specifications targeted for 50Gbps per lane applications: LR1 and LR4 for 10 kilometers, based on the CWDM4 wavelength grid, over a single mode fiber. These new specifications complement the Open Eye MSA’s previously released single and multi-mode specifications.


The Open Eye MSA said its specifications provide an alternative to higher power and higher cost DSP-based solutions. These new specifications are aimed at 53Gbps SFP28 Long-Reach (LR) and 200Gbps QSFP Long Reach (LR) optical module designs for next generation 5G wireless, enterprise and data center networking applications.

The Open Eye MSA aims to accelerate the adoption of PAM-4 optical interconnects scaling to 50Gbps, 100Gbps, 200Gbps, and 400Gbps by expanding upon existing standards to enable optical module implementations using less complex, lower cost, lower power, and optimized analog clock and data recovery (CDR) based architectures in addition to existing digital signal processing (DSP) architectures.

The Open Eye MSA defines the requirements for analog PAM-4 solutions for 50G SFP, 100G DSFP, 100G SFP-DD, 200G QSFP, 400G QSFP-DD and OSFP modules. 

A whitepaper is available to view and download here for interested parties to learn more about the Open Eye’s MSA mission and latest technical information. To access more information about the Open Eye MSA single- and multi-mode specifications please visit: https://www.openeye-msa.org/.

The Open Eye MSA is also excited to announce that its membership has grown to 38 members with the addition of Credo Semiconductor, Fuji Xerox, Hisense and Lumentum to its list of members.

https://www.openeye-msa.org

Monday, November 23, 2020

Broadband Forum publishes 3 specs targeting 5G

Broadband Forum published three new standards including 5G Wireless Wireline Convergence Architecture (TR-470), Access Gateway Function (AGF) Functional Requirements (TR-456) and Device Data Model (TR-181). Together, these documents provide functions and interfaces for Fixed Mobile Convergence (FMC), the AGF, and customer premises equipment (CPE) such as 5G-enabled routers.


Highlights:

  • TR-470 – produced in conjunction with 3GPP – describes the 5G FMC architecture, providing a high-level guide for network architects and planners and enabling fixed and mobile functions to coexist over a shared infrastructure. This will facilitate multi-access connectivity and give consumers a seamless, access-independent service experience.
  • TR-456 describes the functional requirements of the access gateway function. The AGF resides between fixed access networks and the 5G core network to support 5G and wireline Residential Gateways, creating a truly converged deployment. Alongside this, Broadband Forum’s Device: 2 data model (TR-181 Issue 2 Amendment 14), which is used by User Services Platform (USP), has been extended to address 5G Residential Gateways. The Device: 2 data model applies to all types of TR-069 or USP-enabled devices, including end devices, Residential Gateways, and other network infrastructure devices.
  • TR-124 - the Functional Requirements for Broadband Residential Gateway Devices specification is expected to be finalized in Q4 2020. Moving from the network into the home, TR-124 has been extended to add requirements related to the 5G Residential Gateway extending the 5G control plane to the premises to open up new service opportunities with real time fulfillment.

“Operators are keen to harness and deploy fifth generation technology to exploit new opportunities to enhance existing revenue streams and secure new ones by launching new services and applications,” said Broadband Forum CEO Robin Mersh. “Spanning the full scope of the network, including CPE, these specifications take a holistic approach to network management and operation and will greatly accelerate 5G deployments, ensuring operator confidence through an open ecosystem.”

https://www.broadband-forum.org/projects/5g

Tuesday, November 10, 2020

OIF begins co-packaging framework IA project

OIF has kicked off a Co-Packaging Framework Implementation Agreement (IA) umbrella project to study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. 


A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.

“It is critical that the industry be aligned on the solutions needed to move co-packaged interoperability forward,” said Jeff Hutchins, Ranovus and OIF Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “With its member-driven focus, OIF is the ideal forum to facilitate industry conversation and drive interoperability of co-packaging with ASICs.”

The scope of the Co-Packaging Framework project is to:

  • Identify the key co-packaged applications and their requirements
  • Study and identify key issues associated with co-packaged optics
  • Identify opportunities and develop industry consensus to pursue interoperability standards
  • Document the study in the Framework IA (a technical whitepaper)
  • Launch follow-on standardization activities at the OIF or other appropriate standard bodies

http://www.oiforum.com


CXL Consortium releases 2.0 spec for CPU-to-device interconnect

The CXL Consortium, which was formed in 2019 to develop an open industry standard group for high-speed CPU interconnect, announced the release of the CXL 2.0 specification. 

CXL is an open industry-standard interconnect offering coherency and memory semantics using high-bandwidth, low-latency connectivity between host processor and devices such as accelerators, memory buffers, and smart I/O devices. The CXL 2.0 specification adds support for switching for fan-out to connect to more devices; memory pooling for increased memory utilization efficiency and providing memory capacity on demand; and support for persistent memory – all while preserving industry investments by supporting full backwards compatibility with CXL 1.1 and 1.0.

Key Highlights of the CXL 2.0 Specification:

  • Adds support for switching to enable device fan-out, memory scaling, expansion and the migration of resources.
  • Includes memory pooling support to maximize memory utilization, limiting or eliminating the need to overprovision memory.
  • Introduces standardized fabric manager specification for inventory and resource allocation to enable easier adoption and management of CXL-based switch and fabric solutions.
  • Provides standardized management of the persistent memory interface and enables simultaneous operation alongside DDR, freeing up DDR for other uses.
  • Introduces managed hot-plug support to take a CXL device online or offline from the system.
  • Adds link-level Integrity and Data Encryption (CXL IDE) to provide confidentiality, integrity and replay protection for data transiting the CXL link.
  • Supports a wide variety of industry interconnect form factors and standardized management interfaces to ease implementation.
  • Includes Compliance and Interoperability specifications and in-system testing to enable a robust and interoperable multi-vendor ecosystem.

Compute Express Link (CXL) promises high-speed CPU interconnect

Alibaba, Cisco, Dell EMC, Facebook, Google, Hewlett Packard Enterprise, Huawei, Intel and Microsoft have teamed up to form Compute Express Link (CXL), an open industry standard group for high-speed CPU interconnect.


CXL will maintain memory coherency between the CPU memory space and memory on attached devices, which allows resource sharing for higher performance, reduced software stack complexity, and lower overall system cost. The technology is built upon PCI Express (PCIe) infrastructure, leveraging the PCIe 5.0 physical and electrical interface to provide advanced protocol in three key areas:

  • I/O Protocol 
  • Memory Protocol, initially allowing a host to share memory with an accelerator
  • Coherency Interface
The group has completed work on a CXL Specification 1.0 for interconnect between the CPU and platform enhancements and workload accelerators, such as GPUs, FPGAs and other purpose-built accelerator solutions.

https://www.computeexpresslink.org/

Monday, August 10, 2020

SFP-DD MSA updates spec for 100G

The Small Form Factor Pluggable Double Density (SFP-DD) Multi-Source Agreement (MSA) Group released an updated (v4.1) hardware specification for 100+ Gbps, high-density networking equipment. The SFP-DD form factor uses 2-lane pluggable modules, is backward compatible with SFP+ and offers improved host to module management communication based on a Two-Wire-Interface (TWI).

SFP-DD revision 4.1 hardware specification includes added features to support ResetL, dual function IntL/TXFaultDD and ePPS. Newly added timing tables will also allow for low speeds signals, soft control and module status. The former chapter 7 Management Interface is now part of chapter 4, Electrical Specification. The updated hardware specification includes port mapping, optical connectors and module color coding moved out of Mechanical and Board Definition chapter 5 and into a new chapter 5. Lastly, TS-1000 Normative Module and Connector performance requirements were added as Appendix A.

Targeting support of optical modules up to 3.5 W, the SFP-DD form factor addresses the technical challenges of achieving a double-density interface and ensuring mechanical interoperability for module components produced by different manufacturers while still enabling the use of legacy SFP modules. This updated specification supersedes previous versions and has updated mechanical connector dimensions. Users should note that the connector dimensions specified in the 4.1 supersede all previous versions.

SFP-DD MSA promoters include Alibaba, Broadcom, Cisco, Dell EMC, HPE, Huawei, II-VI Incorporated, Intel, Juniper Networks, Lumentum, Molex, Nvidia and TE Connectivity. Contributors include Accelink, Amphenol, AOI, Eoptolink, FIT, Fourte, Genesis, Hisense, Infinera, Innolight, Maxim Integrated, Multilane, Nokia, Oclaro, Senko, Source Photonics, US Conec and ZTE.

http://sfp-dd.com/2020/08/sfp-dd-msa-releases-updated-4-1-hardware-specification/


Sunday, July 19, 2020

Multi-access Edge Computing spec expected in Q3

The 5G Future Forum expects to release its first specification for Multi-access Edge Computing (MEC) in the third quarter of 2020.


  • The “MEC Experience Management” technical specification defines a set of intent-based APIs for functional exposure of edge and workload discovery with potential expansion to include future MEC functions and capabilities which are driven by network intelligence
  • The “MEC Deployment” technical specification defines the set of specifications to enable hyperscalers and service providers to deploy and integrate global MEC physical frameworks, including facilities (e.g. power and cooling), monitoring, operational considerations, and security.

The 5G Future Forum was established in January 2020 by América Móvil, KT Corp., Rogers, Telstra, Verizon, and Vodafone to develop 5G interoperability specifications to accelerate the delivery of 5G and MEC solutions around the world. Over the past six months, the Forum’s founding members have been working to create the governance structure for the 5GFF, as well as develop both technical and commercial workstreams.

The specifications will be released in August 2020. Following release of the specifications, the Forum anticipates expanding its membership to qualified new entrants. Other topics are being planned among the existing members with publication timeframes to be communicated shortly.

“The 5G Future Forum was set up to unlock the full potential of 5G and MEC applications and solutions around the globe,” said Rima Qureshi, chief strategy officer, Verizon. “5G is a key enabler of the next industrial revolution, where technology should transform how we live and work through applications including machine learning, autonomous industrial equipment, smart cars and cities, Internet of Things (IoT) and augmented and virtual reality. The release of these first specifications marks a major step forward in helping companies around the world create a seamless global experience for their customers.”

Thursday, July 9, 2020

New H.266/VVC codec improves efficiency by 50%

After devoting several years to its research and standardization, Fraunhofer HHI, together with partners including Apple, Ericsson, Intel, Huawei, Microsoft, Qualcomm, and Sony, announced the release of H.266/Versatile Video Coding (VVC).

The new H.266/VVC global video coding standard reduces bandwidth requirements by around 50% relative to the previous standard H.265/High Efficiency Video Coding (HEVC) without compromising visual quality.

H.266/VVC provides efficient transmission and storage of all video resolutions from SD to HD up to 4K and 8K, while supporting high dynamic range video and omnidirectional 360° video.

Fraunhofer HHI said H.266/VVC represents the pinnacle of (at least) four generations of international standards for video coding. The previous standards H.264/Advanced Video Coding (AVC) and H.265/HEVC, which were produced with substantial contributions from Fraunhofer HHI, remain active in more than 10 billion end devices, processing over 90% of the total global volume of video bits.

As an example of improved efficiency, the previous standard H.265/HEVC requires ca. 10 gigabytes of data to transmit a 90-min UHD video. H.266/VVC requires only 5 gigabytes of data to achieve the same quality. Because H.266/VVC was developed with ultra-high-resolution video content in mind, the new standard is particularly beneficial when streaming 4K or 8K videos.

“After dedicating almost three years toward this standard, we are proud to have been instrumental in developing H.266/VVC," says Benjamin Bross, head of the Video Coding Systems group at Fraunhofer HHI and editor of the +500-page standard specification of H.266/VVC. “Because of the quantum leap in coding efficiency offered by H.266/VVC, the use of video will increase further worldwide. Moreover, the increased versatility of H.266/VVC makes its use more attractive for a broader range of applications related to the transmission and storage of video.”

"If you consider that Fraunhofer HHI already played a key role in the development of the previous video coding standards H.264/AVC and H.265/HEVC, then we are happy with the fact that more than 50% of the bits on the Internet are generated by a Fraunhofer HHI technology,” adds Dr. Detlev Marpe, head of the Video Coding and Analytics department at Fraunhofer HHI.

A uniform and transparent licensing model based on the FRAND principle (i.e., fair, reasonable, and non-discriminatory) is planned to be established for the use of standard essential patents related to H.266/VVC.

Wednesday, July 1, 2020

O-RAN delivers its Bronze release with 23 new or updated specs

The O-RAN Alliance has launched its second open source software release featuring 23 new or updated specifications.

The O-RAN "Bronze" release also includes an initial set of O-RAN use cases and cloud native deployment support options.


Highlights of O-RAN Bronze:

  • an initial release of an A1 policy manager and an A1 controller that implements the Non-Real-Time Radio Intelligent Controller (Non-RT RIC) architecture.
  • the Near-Real-Time RIC updated to current O-RAN E2 and A1 specifications with 5 sample xAPPs.
  • initial O-CU and O-DU Low/High code contributions that support a FAPI framework and integration between the O-DU and RIC with E2 functionality and subscription support.
  • a Traffic Steering and Quality Prediction use case leveraging an E2 interface data ingest pipeline to demonstrate the functionality of RAN traffic steering with an E2 interface KPI monitoring capability.
  • OAM use cases that exercise Health Check call flows including the Near-RT RIC and its O1 and A1 interfaces.

“The new use cases, the Bronze software release, and the new O-RAN ALLIANCE members are indications that this global forum is working exactly as intended, reaching across borders to drive innovation and build consensus,” said Andre Fuetsch, Chairman of the O-RAN ALLIANCE and Chief Technology Officer – Network Services, at AT&T. “As this coalition evolves, we look forward to seeing how it continues to broaden access to 5G and other new access technologies.”

“Over the past 6 months, O-RAN working groups and the O-RAN Software Community have extensively engaged to achieve tight alignment between the specifications and the Bronze release open source code,” said Chih-Lin I, the Co-Chair of O-RAN Technical Steering Committee. “Specific progress related to both the Non-RT-RIC and the Near-RT-RIC frameworks and associated key interfaces deserves special mention for its importance in enabling AI/ML capabilities in RAN. The O-RAN virtual showcase further demonstrates the growing momentum towards global adoption and deployment of O-RAN solutions.”

“Ericsson is actively engaged in shaping the future of the O-RAN initiative by enabling Non-RT RIC (Non-Real-Time RAN Intelligent Controller) and A1 interface to support fine-grained intelligent steering of the RAN,” said Per Beming, Head of Standards and Industry Initiative in Ericsson. “During OSC Bronze release, Ericsson continued as the key contributor to Non-RT RIC project by improving support for intent based intelligent RAN optimization using A1 interface. This specific capability allows operators to leverage both RAN and non-RAN data to enrich end user experience.”

https://www.o-ran.org/software

Wednesday, March 11, 2020

QSFP-DD800 MSA releases initial 800G transceiver spec

The Quad Small Form Factor Pluggable Double Density 800 (QSFP-DD800) Multi Source Agreement (MSA) group has released a new hardware specification for the QSFP-DD800 transceiver form factor.

The new QSFP-DD800 1.0 specification is intended to be incremental to the existing QSFP-DD 5.0 specification. As signal integrity and thermal performance remain imperative, the transceiver pads have been optimized to improve signal integrity for 100 Gbps performance per lane without affecting backwards compatibility. The new specification additionally defines a novel 2x1 connector/cage, with cabled upper ports as an option to address signal loss issues associated with tradition PCBs. Looking ahead, QSFP-DD800 promoters will continue to work on new connector/cage variants, including 2x1 SMT versions that operate at 100 Gbps per lane.

The MSA group was formed to advance the development of high-speed, double-density QSFP modules which support 800 Gbps connectivity and includes the following promoters: Broadcom, Cisco, II-VI, Intel, Juniper Networks, Marvell, Molex and Samtec.

“In the short time our group has collaborated, we are thrilled to introduce this first specification for the next generation of the QSFP family of modules,” said Scott Sommers, co-chair of the QSFP-DD800 MSA. “As signal integrity and thermal management remain challenges for the optical communications industry, our MSA group is confident that its solutions will meet performance needs.”

“With their superior system integration and design flexibility, QSFP modules continue to be the cornerstone in building next generation networks and network equipment, especially as port speeds increase to 800G,” said Mark Nowell, co-chair of the QSFP-DD800 MSA. “Furthermore, their ability to increase switch and routing bandwidth density without sacrificing backwards compatibility with QSFP-DD, QSFP56 and QSFP28 modules provide network operators tremendous commercial and operational advantages.”

http://www.qsfp-dd800.com

Tuesday, March 10, 2020

Open Eye Consortium specification defines 53Gbps per lane PAM-4

The Open Eye Consortium (Open Eye MSA) published its 53 Gbps single-mode specification defining the requirements for analog PAM-4 solutions for 50G SFP, 100G DSFP, 200G QSFP, and 400G QSFP-DD and OSFP single-mode modules.

The Open Eye MSA aims to accelerate the adoption of PAM-4 optical interconnects scaling to 50Gbps, 100Gbps, 200Gbps, and 400Gbps by expanding upon existing standards to enable optical module implementations using less complex, lower cost, lower power, and optimized analog clock and data recovery (CDR) based architectures in addition to existing digital signal processing (DSP) architectures.

A whitepaper is available to view and download.

In addition, the Open Eye MSA announced the draft of its multi-mode specification available to its members for comments, with general availability targeted for release in Fall 2020.

http://www.openeye-msa.org

Tuesday, March 3, 2020

OIF's Coherent Common Management Interface Spec supports 400ZR

OIF has completed the Coherent Common Management Interface Specification (C-CMIS) Implementation Agreement (IA), which serves as an extension to the CMIS (QSFP-DD/OSFP/COBO) management specification, specifically targeting DCO modules.

“The C-CMIS IA is an important part of the developing 400ZR ecosystem,” said Ian Betty, Ciena and OIF Board Member. “It defines additional management registers, and monitors, together with new functionality, mechanisms, or behaviors, as needed.”

The C-CMIS IA provides register definition for coherent modules in pages and parameters that were previously reserved. Users that have previously implemented software to manage optical modules using CMIS will be able to quickly add support for these coherent pages and parameters. This release, which augments the existing CMIS specification which focused on addressing direct detect client optics, is targeted at the 400ZR application.

The technology and complexity of coherent modules requires additional monitoring parameters for use in field applications. This additional monitoring is primarily focused on Forward Error Correction (FEC) monitoring and optical/analog monitoring including items like Chromatic Dispersion, Differential Group Delay and Electrical Signal to Noise Ratio (eSNR). The C-CMIS IA provides specifications to monitor the standard parameters in a normative manner while taking advantage of the flexibility of the CMIS specification to monitor any additional proprietary parameters. 

“The current IA is focused on supporting the OIF 400ZR IA, which supports a single data path with eight-lane host electrical interface for a 400GBASE-R PCS signal and a single-lane 400G coherent media interface (with a new signal format called 400ZR),” explained Betty. “However, we expect future versions to include more complex Metro modules and may even extend these management features to other form factors.”

https://www.oiforum.com/

Sunday, January 26, 2020

CBRS Release 2 opens door to further innovation

The Wireless Innovation Forum (WInnForum) announced the approval of a new Release 2 specification defining enhancements to the baseline CBRS Operational and Functional Requirements. It defines optional features and functionality that can be incorporated at any time, with special focus on supporting specific vertical markets and their deployments.

“Our new release of the CBRS standards opens the way for substantial additional innovation in the CBRS band,” said Andrew Clegg, Chair of the WInnForum’s Spectrum Sharing Committee CBRS Functional and Operational Requirements Working Group. “Now anyone can rapidly add features to CBRS simply by contributing a suitable appendix to the Release 2 specification, and, pending committee approval and appropriate certification requirements, the feature is ready for adoption by CBRS users, equipment manufacturers, and Spectrum Access System (SAS) Administrators, on demand.”

Based on the Release 2 additions, exciting emerging technologies can be considered and implemented. Examples include:


  • Single Frequency Group - a set of CBSDs that require a common radio frequency assignment and reassignment when frequency reassignment is necessary or preferred; and,
  • 2D Antenna Patterns - requirements on how CBSD two-dimensional antenna patterns should be specified and used by the SAS to calculate CBSD antenna gain in a certain direction, taking both horizontal and vertical separation into account.

Additional emerging technologies can be considered in subsequent releases. Development is already underway on additional features to be added to Release 2 very shortly. Other planned features include enhanced group handling, flexible grants and grant updates, indoor penetration loss measurements, refined propagation modeling, registration enhancements, and support for beamforming. The Release 2 specifications will include updates to the SAS to SAS and SAS to CBSD protocols to support these new features, and a Release 2 test specification allowing industry to self-certify against requirements that do not impact Part 96.

https://cbrs.wirelessinnovation.org/enhancements-to-baseline-specifications
http://www.WirelessInnovation.org.

Wednesday, January 15, 2020

5G Future Forum aims for mobile-edge computing

A new 5G Future Forum is getting underway with the backing of America Movil, KT, Rogers, Telstra, Verizon and Vodafone to develop uniform interoperability specifications to improve speed to market for developers and multinational enterprises working on 5G-enabled solutions. In addition, Forum participants will develop public and private marketplaces to enhance developer and customer access to 5G, and will share global best practices in technology deployment.

"5G is a key enabler of the next global industrial revolution, where technology will transform how we live and work. It's critical that technology partners around the world unite to create the most seamless global experience for our customers," said Hans Vestberg, Chairman and CEO of Verizon. "We are proud to join with our fellow 5G leaders to unlock the full potential of applications and solutions that will transform with 5G's fast speeds, high reliability, improved security and single-digit latency."

Wednesday, January 8, 2020

Four new NFC specifications released

The NFC Forum released four new specifications aimed at the robustness and communications speed for Near Field Communication (NFC) devices, like smartphones.

  • Digital Protocol Technical Specification Version 2.2: This specification addresses the digital protocol for NFC-enabled device communication, providing an implementation specification on top of the ISO/IEC 18092 and ISO/IEC 14443 standards. The new specification adds error recovery for Type 2 and Type 5 Tags communication. This update improves the user experience by ensuring reliable NFC communication in difficult environments where NFC communications might be disturbed.
  • Type 2 Tag to Type 5 Tag Technical Specifications Version 1.1: Type 2 Tag to Type 5 Tag Specification Version 1.1 defines NFC-enabled devices in Reader/Writer Mode and detects, reads and writes an NFC Data Exchange Format message on NFC Forum Tags. The specification was updated to support time-optimized implementations to improve the performance for reading NFC Forum tags in support of the new TNEP protocol.
  • Activity Technical Specification Version 2.1 and Profiles Technical Specification Version 1.0: These specifications were created from Activity 2.0 by splitting it into two specifications to ease in the future maintenance of these specifications. The Profiles section of Activity 2.0 is now described in the Profiles 1.0 Technical Specification. It adds a new Profile to discover all services eventually offered with different technologies. The specification explains how the NFC Digital Protocol Specification can be used to set up the communication protocol with another NFC device or NFC Forum tag.

“We are constantly improving on the global specifications to improve the overall user experience for NFC users. NFC Forum members take this responsibility very seriously as their decisions impact the majority of smartphone users and many businesses,” said Mike McCamon, executive director, NFC Forum. “The specifications we are announcing today enhance the quality of NFC communications and allow users to exchange more data, faster in support of the rapid increase we are seeing in the use of TNEP.”


Tuesday, September 3, 2019

HiWire aims for standard Active Electrical Cables at 400G and up

A new HiWire Consortium has been established to pursue the standardization and certification of a new category of Active Electrical Cables (AEC). The group is dedicated to the establishment and ongoing development of an AEC standard that defines a specific implementation of the many industry MSAs and a formal certification process. This will enable an ecosystem of trusted Plug and Play AECs, available from multiple sources, for the hyperscale data center, telecom and enterprise markets.

HiWire AECs provide a full solution for layer 1 and 2 interconnect to deliver persistent and deterministic connectivity necessary for the next generation of data centers as the industry moves to 400G and beyond.

The founding companies of the HiWire Consortium are: Accton Technology, Alpha Networks, Arrcus, Bizlink, Cameo Communications, Zhejiang Canaan Technology, Centec Networks, Chelsio Communications, Credo, Dell EMC, Delta Electronics, Edom Technology, Cheng Uei Precision Industry Co.(Foxlink), Innovium, Barefoot Networks (an Intel Company), Inventec, Juniper Networks, Keysight Technologies, Quanta, Senao, Spirent Communications, Steligent Information Technologies Co., Wistron, Wistron NeWeb, and Wywinn Corporation.

“We are delighted and humbled by the widespread support for Credo and the HiWire Consortium,” said Bill Brennan, CEO of Credo. “The founding members all share a desire for thinner, longer and more reliable interconnect solutions. The consortium provides the framework to deliver a robust supply of interoperable solutions for 400G and beyond.”

“As new high-performance software workloads hit the network, the availability of reliable, low cost 400G interconnect is crucial,” said Ed Doe, vice president in Intel’s Connectivity Group and General Manager of the Barefoot Division. “The HiWire Consortium will go a step beyond MSAs and deliver to the datacenter what they have demanded from the start – truly interoperable interconnect solutions from a broad vendor base which will accelerate the adoption of our 12.8 Tbps P4-programmable Barefoot Ethernet switch series.”

“400G Ethernet represents a very challenging transition for the networking industry,” said Bob Wheeler, Principal Analyst at The Linley Group. “Creating a specific implementation and formal certification program around the many industry MSAs and standards is key to enabling trusted cables from multiple sources.”

https://hiwire.org



USB4 delivers 40Gbps bi-directionally

The new USB4 spec was officially published by the USB Implementers Forum (USB-IF).

The USB4 architecture is based on the Thunderbolt protocol specification recently contributed by Intel Corporation to the USB Promoter Group. It doubles the maximum aggregate bandwidth of USB and enables multiple simultaneous data and display protocols. It also maintains compatibility with existing USB 3.2, USB 2.0 and Thunderbolt 3 hosts and devices is supported; the resulting connection scales to the best mutual capability of the devices being connected.

Key characteristics of the USB4 solution include:

  • Two-lane operation using existing USB Type-C cables and up to 40Gbps operation over 40Gbps certified cables
  • Multiple data and display protocols that efficiently share the maximum aggregate bandwidth
  • Backward compatibility with USB 3.2, USB 2.0 and Thunderbolt 3

Over 50 companies are actively participating in the final stages of review of the draft specification.

http://www.usb.org

Wednesday, August 21, 2019

MEF publishes SD-WAN standard

MEF officially published SD-WAN Service Attributes and Services (MEF 70) -- the industry’s first global standard defining an SD-WAN service and its service attributes. The standard was officially approved by MEF members and ratified by the MEF Board of Directors at the organization’s recent Annual Members Meeting.

The SD-WAN standard describes requirements for an application-aware, over-the-top WAN connectivity service that uses policies to determine how application flows are directed over multiple underlay networks irrespective of the underlay technologies or service providers who deliver them.

MEF 70, among other things, defines:

  • Service attributes that describe the externally visible behavior of an SD-WAN service as experienced by the subscriber.
  • Rules associated with how traffic is handled.
  • Key technical concepts and definitions like an SD-WAN UNI, the SD-WAN Edge, SD-WAN Tunnel Virtual Connections, SD-WAN Virtual Connection End Points, and Underlay Connectivity Services.
SD-WAN standardization offers numerous benefits that will help accelerate SD-WAN market growth while improving overall customer experience with hybrid networking solutions. Key benefits include:

  • Enabling a wide range of ecosystem stakeholders to use the same terminology when buying, selling, assessing, deploying, and delivering SD-WAN services.
  • Making it easier to interface policy with intelligent underlay connectivity services to provide a better end-to-end application experience with guaranteed service resiliency.
  • Facilitating inclusion of SD-WAN services in standardized LSO architectures, thereby advancing efforts to orchestrate MEF 3.0 SD-WAN services across automated networks.
  • Paving the way for creation and implementation of certified MEF 3.0 SD-WAN services, which will give users confidence that a service meets a fundamental set of requirements.
“We want to thank the SD-WAN team for the incredible job they have done in bringing this industry-first standard to market in a timely manner,” said Nan Chen, President, MEF. “Combining standardized SD-WAN services with dynamic high-speed underlay connectivity services – including Carrier Ethernet, Optical Transport, and IP – enables service providers to deliver powerful MEF 3.0 hybrid networking solutions with unprecedented user- and application-directed control over network resources and service capabilities.”

MEF already has begun work on the next phase of SD-WAN standardization – MEF 70.1 – that will be of high interest to many enterprises. This work includes defining:
  • Service attributes for application flow performance and business importance.
  • SD-WAN service topology and connectivity.
  • Underlay connectivity service parameters.
MEF also is progressing related standards work focused on:
  • Application security for SD-WAN services.
  • Intent-based networking for SD-WAN that will simplify the subscriber-to-service provider interface.
  • Information and data modeling standards that will accelerate LSO API development for SD-WAN services.
“We’re seeing a significant change in how customers are using SD-WAN now versus two years ago, and that evolution is what makes service standards from MEF so critical. Today, and moving forward, SD-WAN is about delivering application performance. As the underlying networks — Optical Transport, Carrier Ethernet, and IP — are under greater pressure to be more ubiquitous, easy to provision, on-demand and elastic, that is where the MEF 3.0 construct comes into play. MEF’s role is creating a standards-based, intelligent network across multiple carriers that will eliminate friction as we work with each other to deliver application performance at the level of efficiency our customers are seeking,” stated Roman Pacewicz, Chief Product Officer, AT&T Business.

“Verizon is pleased to support MEF’s industry-leading SD-WAN standardization work. SD-WAN is the way to interface policy with an intelligent software defined network, and standardization makes it easier for integration to work across multiple types of underlying transport services. What that means for our end customers is it lets them get a better overall experience relative to their applications, with support for a broader range of use cases, guaranteed service resiliency, and improved service capabilities in an always on, always connected world,” stated Shawn Hakl, Senior Vice President Business Products, Verizon.

In addition, MEF remains on track to launch its MEF 3.0 SD-WAN Certification pilot program in 4Q 2019. This certification will test a set of service attributes and their behaviors defined in MEF 70 and described in detail in the upcoming MEF 3.0 SD-WAN Certification Test Requirements (MEF 90) document.

https://wiki.mef.net/pages/viewpage.action?pageId=89003131



Tuesday, June 18, 2019

PCIe 6.0 to leverage 56G PAM-4 to hit 64 GT/s transfer rate

PCI Express (PCIe) 6.0 technology will double the data rate to 64 GT/s while maintaining backwards compatibility with previous generations. PCI-SIG, which is the consortium that owns and manages PCI specification, said PCIe 6.0 is on target for release in 2021.

PCIe 6.0 Specification Features

  • Delivers 64 GT/s raw bit rate and up to 256 GB/s via x16 configuration
  • Utilizes PAM-4 (Pulse Amplitude Modulation with 4 levels) encoding and leverages existing 56G PAM-4 in the industry
  • Includes low-latency Forward Error Correction (FEC) with additional mechanisms to improve bandwidth efficiency
  • Maintains backwards compatibility with all previous generations of PCIe technology

“PCI Express technology has established itself as a pervasive I/O technology by sustaining bandwidth improvements for five generations over two decades,” Dennis Martin, an analyst at Principled Technologies, said. “With the

“Continuing the trend we set with the PCIe 5.0 specification, the PCIe 6.0 specification is on a fast timeline,” Al Yanes, PCI-SIG Chairman and President, said. “Due to the continued commitment of our member companies, we are on pace to double the bandwidth yet again in a time frame that will meet industry demand for throughput.”

http://www.pcisig.com


Tuesday, May 7, 2019

Open Eye MSA Consortium targets 50/100/200/400G modules

The Open Eye Consortium has established a Multi-Source Agreement (MSA) aimed at standardizing advanced specifications for lower latency, more power efficient and lower cost 50 Gbps, 100 Gbps, 200 Gbps, and up to 400 Gbps optical modules for datacenter interconnects over single-mode and multimode fiber.

The MSA aims to accelerate the adoption of PAM-4 optical interconnects scaling to 50 Gbps, 100 Gbps, 200 Gbps, and 400 Gbps by expanding upon existing standards to enable optical module implementations using less complex, lower cost, lower power, and optimized clock and data recovery (CDR) based architectures in addition to existing digital signal processing (DSP) architectures. The idea is to minimize the use of digital signal processing in optical modules.

The Open Eye industry consortium said it is committed to developing an industry-standard optical interconnect that leverages seamless component interoperability among a broad group of industry-leading technology providers, including providers of electronics, lasers and optical components.

 The initial Open Eye MSA specification will focus on 53 Gbps per lane PAM-4 solutions for 50G SFP, 100G DSFP, 100G SFP-DD, 200G QSFP, and 400G QSFP-DD and OSFP single-mode modules. Subsequent specifications will aim to address multimode and 100Gbps per lane applications. The initial specification release is planned for Fall 2019, with product availability to follow later in the year.

MACOM and Semtech Corporation initiated the formation of the Open Eye MSA with 19 current members in Promoter and Contributing membership classes.

Promoters include Applied Optoelectronics Inc., Cambridge Industries (CIG), Color Chip, Juniper Networks, Luxshare-ICT, MACOM, Mellanox, Molex and Semtech Corporation.

Contributors include: Accelink, Cloud Light Technology, InnoLight, Keysight Technologies, Maxim Integrated, O-Net, Optomind, Source Photonics and Sumitomo Electric.

“Through its participation in the Open Eye MSA, AOI is leveraging our laser and optical module technology to deliver benefits of low cost, high-speed connectivity to next generation data centers.” David (Chan Chih) Chen, AVP, Strategic Marketing for Transceiver, AOI

“MACOM continues to drive the industry’s technical requirements towards meeting the demands of Cloud Service Providers. Leveraging our proven leadership in 25G, 50G and 100G analog chipsets and optical components, we co-founded the Open Eye MSA to accelerate the adoption of 200G and 400G PAM optical interconnects. At the same time we are working in parallel to advance the DSP technologies necessary for faster connectivity speeds for future applications.” Preet Virk, Senior Vice President and General Manager, Networks, MACOM.

Companies interested in joining the Open Eye MSA can contact: admin@openeye-msa.org.

http://www.openeye-msa.org

Sunday, March 24, 2019

ETSI Multi-access Edge Computing phase 2 specs released

The ETSI Multi-access Edge Computing group (MEC ISG) released the first set of its Phase 2 specifications, including ETSI GS MEC 002 which includes new requirements for Phase 2, ETSI GS MEC 003 dealing with architecture and framework, and  ETSI GS MEC 009 giving general principles for service APIs.

The updated specs focus on the integration of NFV integration. The specification also describes example use cases and their technical benefits, for the purpose of deriving requirements. In addition, the release includes a report on MEC support for vehicle to infrastructure and vehicle to vehicle use cases.

“With this Release, the group continues to strengthen the leadership role that ETSI has played in edge computing since day one. I am proud of the quality of the work this team keeps delivering, making sure that the MEC marketplace evolves to an efficient, interoperable and open environment” says Alex Reznik, MEC ISG Chair. 

https://www.etsi.org/newsroom/press-releases/1567-2019-03-etsi-multi-access-edge-computing-releases-phase-2-specifications