Showing posts with label Silicon+LTE. Show all posts
Showing posts with label Silicon+LTE. Show all posts

Monday, May 20, 2013

Sequans Offers LTE Modules

Sequans Communications introduced a new line of "EZLinkLTE" LTE modules based on its own LTE baseband chip.  The modules include a complete RF front end and key interfaces in a single, compact package.

The first EZLinkLTE module, sampling now, is the VZ20Q, which is one of the first modules in the industry to support both LTE bands 4 and 13. 

The baseband chip at the heart of the new module is Sequans’ SQN3120 Mont Blanc chip that was certified by Verizon Wireless in 2012. The chip is compliant with 3GPP release 9 and it delivers category 4 throughput of up to 150 Mbps in the downlink. Starting with the SQN3120 chip, the VZ20Q integrates all other elements necessary for a complete LTE modem system. These include an LTE-optimized RF transceiver provided by Sequans’ RF partner, Fujitsu Semiconductor, a complete dual-band RF front-end for bands 4 and 13, LP-DDR SDRAM, embedded boot Flash, and VC-TCXO, all in a single, surface-mountable package with a very compact footprint, 17 x 24 x 2 mm.

“Our EZLinkLTE modules provide great value to device designers in terms of cost savings and reduction of development risk and time,” said Georges Karam, Sequans CEO. “The EZLinkLTE modules are pre-integrated, pre-tested, and pre-certified by carriers, meaning that we’ve done most of the heavy lifting in advance and can offer device makers a very quick and easy solution for adding LTE connectivity to many types of devices.”

Monday, February 25, 2013

Octasic Intros Industry’s First Dual-Mode Small Cell Platform

Octasic introduced its newest Small Cell platform, the SDR4000, supporting simultaneous multi-standard operation over a cell range of 20 km.

Octasic's OEM-ready platform includes baseband hardware and software, three RF front ends, and an application processor.  It enables simultaneous 2G, 3G, and 4G operation in a compact (170x170 mm) form factor that can be powered over Ethernet with passive cooling. Capacity ranges from 16 to 100 active users across multiple cellular standards.

A key feature is that the SDR4000’s dynamically re-programmable radios can operate from 700 MHz to 2.7 GHz with bandwidth from 200 kHz to 20 MHz. The same platform can be used in all operator networks worldwide or for custom waveforms and frequency bands.

Octasic’s flexiPHY software offers 3GPP compliant physical layers for GSM, UMTS, and LTE, eliminating the need for OEMs to develop the baseband portion of
the design.  In addition, Octasic's Opus Studion development toolset lets OEMs enhance the flexiPHY software or enable them to develop their own proprietary PHY.

The design features three radio front-ends, enabling it to support continuously active network listen during cellular operation. This enables advanced Radio Resource
Management (RRM) strategies for powerful Self Organizing Network (SON) capabiliti

For the application processor, Octasic has selected the Intel Atom processor.  Specifically, Octasic is using the Intel Atom processor N2600. A single processor can run the UMTS RNC stack as well as the LTE Layer 2 and 3, supporting 100 active users. Furthermore, Intel QuickAssist Technology provides easy-to-use software for data-plane acceleration, while supporting migration across Intel-based devices.

“Small Cell technology is creating disruption in the conventional basestation landscape as well as enabling innovative new applications. Vendors are moving very quickly to stake claims in these new markets,” said Fabio Gambacorta, VP Sales and Business Development at Octasic.

Sunday, February 24, 2013

Fujitsu Ships Multimode, Multiband LTE Transceiver, Plans LTE-Advanced Single IC

Fujitsu Semiconductor Wireless Products has begun commercial shipment of its second LTE multimode product -- a 2G/3G/4G transceiver.

The single chip multiband, multimode transceiver supports all wireless communication modes including LTE (FDD & TDD), HSPA+, DC-HSPA, WCDMA, GSM, EDGE, CDMA and TD-SCDMA. The transceiver incorporates envelope tracking (ET) and antenna tuning (AT).

Fujitsu's LTE-focused multiband transceivers have been certified in multiple regions with multiple operators. These transceivers are deployed by multiple baseband providers worldwide, because  they support the entire frequency range of 700 to 2700 MHz, function in all modes of operation, and support a high number of simultaneous bands and modes in a single product configuration, covering almost any operator's needs for domestic use and global roaming.

Wednesday, February 20, 2013

Altair's Latest Silicon Supports LTE Release 10

Altair Semiconductor unveiled a new family of chipsets, including two new baseband processors - the FourGee-3800 and FourGee-3802 - and a new radio chip - the FourGee-6300.

Key features of the new chipset family include:
  • Support for LTE Release-10 features
  • Based on Altair's 3rd generation SDR architecture, software upgradable to future Release-11
  • Category 4 throughput 150 Mbps DL / 50 Mbps UL
  • Support for Carrier Aggregation (CA)
  • High performance 700MHz network processor subsystem
  • Wide frequency band span of 400-3800MHz with 6 concurrent LTE bands for both primary and diversity antennas, enabling global band combinations
  • Integrated IMS/VoLTE with support for HD-Voice
  • Incorporates Altair's proprietary interference cancellation (INCA™) technology
  • Incorporates Envelope Tracking (ET) technology
  • Supports enhanced Inter-cell Interference Coordination (eICIC)  
  • Ultra low Active and Idle power consumption
  • Rich set of host and peripheral interfaces to support a variety of applications including smartphones, tablets, mobile hotspots, routers and M2M.

Marvell Supports LTE TDD/FDD on Quad-core Modem Chip

Marvell released LTE TDD/FDD Capability on its quad-core world-mode modem chip.

Marvell's LTE solution supports 5-mode cellular modems, including LTE TDD and FDD, High Speed Packet Access Plus (HSPA+), Time division High Speed Packet Access Plus (TD-HSPA+) and Enhanced Data for GSM Environment (EDGE).

"Marvell has accelerated the pace of innovation and commercialization by bringing our industry leading TDD-LTE and FDD-LTE solutions into our quad-core mobile platform. We believe that with our design win success we can support our partners to accelerate the mass adoption of LTE solutions around the world," said Weili Dai, Co-Founder of Marvell.

At Mobile World Congress, ZTE will demo the first Dual Radio Dual Standby (DRDS) LTE smartphone based on Marvell's LTE solution. Marvell's LTE platform will support both TD-SCDMA and dual-radio dual standby LTE voice solution, in addition to a Circuit Switched Fallback (CSFB) voice solution.

Tuesday, February 19, 2013

LSI Introduces ARM-based Axxia 5500 Processors for 4G Base Stations

LSI introduced its ARM-based family of Axxia 5500 processors designed for multi-radio LTE base stations, cell site routers, gateways and mobile backhaul equipment.

The new processors combine up to 16 ARM Cortex-A15 cores with LSI specialized networking accelerators to optimize performance and power efficiency.  On-chip network accelerators deliver up to 50 Gbps packet processing, 20 Gbps security processing and 160 Gbps of Ethernet switching via 16 10G Ethernet interfaces. LSI plans to offer several versions with different core counts and throughput capabilities.  The chip design leverages ARM’s CoreLink CCN-504 low-latency interconnect in 28nm process technology.

LSI said its combination of networking expertise, specialized acceleration engines and Virtual Pipeline technology with ARM’s power-efficient processors and interconnect IP delivers communication processors that are uniquely suited for building intelligent, heterogeneous networks.

“The combination of ARM’s leading coherent interconnect, energy-efficient multicore processor technology and advanced physical IP in the LSI Axxia 5500 series delivers significant gains in performance density. This will enable highly efficient systems with new levels of software flexibility and scalability for heterogeneous networks,” said Ian Ferguson, vice president of Segment Marketing, ARM. “LSI and ARM enjoy a strong relationship, and we are working to meet the needs of customers who are focusing on building next-generation network infrastructure.”

Tuesday, February 12, 2013

Broadcom Announces 28nm 4G LTE Modem

Broadcom announced a 28nm 4G LTE modem with integrated radio and cellular baseband reduces board area by approximately 35 percent while supporting LTE-Advanced with carrier aggregation, HSPA+, TD-SCDMA and EDGE/GSM.

Broadcom's multi-mode, multi-band solution – the BCM21892 – is aimed at next generation 4G LTE smartphones and tablets. The device combines a full-featured cellular baseband with a world-band radio that can support virtually any designated 3GPP LTE frequency band and combination, which aids in 4G LTE roaming. The LTE-Advanced capability will support LTE Category 4 speeds of 150 Mbps with seamless hand-offs between the various 4G LTE, 3G and 2G interface technologies.

A Voice over LTE (VoLTE) solution that enables high-definition voice calls. Broadcom estimates its VoLTE service consumes approximately 40 percent less power than a comparable WCDMA voice call.

Significantly, Broadcom said its design employs advanced power management techniques that can save up to 25 percent of the power typically consumed during data transmissions to the network.

"Broadcom's new 4G LTE modem combined with our Wi-Fi, Bluetooth, GPS and NFC technologies gives OEMs all the communications technologies needed to build advanced devices that will offer consumers the features, speed and functionality they demand in their next smartphone purchase," said Robert A. Rango, Broadcom Executive Vice President and General Manager, Mobile and Wireless Group.  "Broadcom's 4G LTE modem will also help carriers drive new 4G LTE features, such as carrier aggregation, into commercial networks."

BCM21892 is now sampling to early access customers, with anticipated production in 2014.

Sunday, February 3, 2013

Fujitsu's Vector Processing DSP Promises LTE Performance Gains

Fujitsu Laboratories has developed a digital signal processor (DSP) for mobile device baseband processing that uses the same vector processing architecture employed in supercomputers.

Fujitsu's 28-nanometer DSP runs at 250 MHz and is  capable of processing data at 12 GOPS (12 billion operations per second). Excluding memory, the DSP measures only 0.4 mm2, and it consumes 30 milliwatts (mW) of power, 20% less than existing DSPs. It can run highly repetitive processes common in LTE and other wireless processes.

Fujitsu said that while typical processors execute a single instruction on a single piece of data at a time (scalar data), its vector processor will execute a single instruction on multiple pieces of data (vector data) at a time. The company said this vector approach is especially effective with LTE, which uses OFDM modulation and communicates by bundling data that is carried by up to 1,200 "subcarriers" in a wireless signal. The vector DSP can be used to extract information from an incoming signal.

Fujitsu said its new DSP can lengthen talk times, usage times and standby times for smartphones and other mobile devices. In addition, the DSP can handle ongoing upgrades to the signal processing algorithm.

Wednesday, November 14, 2012

Symmetricom and Cavium Partner on IEEE 1588 Synchronization

Symmetricom and Cavium announced a collaboration for delivering synchronization for 3G and 4G/LTE equipment.

Symmetricom's SoftClock fully supports both the IEEE 1588 Precision Time Protocol (PTP) standard as well as the Network Time Protocol (NTP) and has now been certified for operation on Cavium's OCTEON Fusion base station-on-a-chip products.

Sunday, September 9, 2012

Sequans Gains LTE Baseband Chip Approval from China’s MIIT

Sequans Communications' 2nd gen LTE baseband chip has been officially approved by China’s Ministry of Industry and Information Technology (MIIT) for use in China. Sequans’ first generation LTE technology was approved by MIIT last year.

Sequans said this clears the way for it to participate in the phase 2 large-scale LTE trials of MIIT now being deployed by China Mobile. The trials demonstrate the operation of LTE Release 9 and dual-mode TD-SCDMA and LTE as required in China.

Thursday, September 6, 2012

Mindspeed Collaborates with China Mobile Research Institute on Small Cells

Mindspeed Technologies and China Mobile Research Institute, the research institution of China’s largest mobile operator, signed a Memorandum of Understanding to collaborate on Nanocell research in China.

Nanocell is defined as radio access equipment that integrates cellular small cell and carrier grade WLAN access points.

Mindspeeed said this is an important milestone for the continued rapid build-out of China Mobile’s heterogeneous network (HetNet) and Mindspeed’s small cell base station platform based on its Picochip TD-SCDMA and Transcede LTE system on a chip (SoC) solutions. Mindspeed was selected to participate in this pioneering program based on its current leadership in small cells and its future product roadmap.

Mindspeed has demonstrated dual-mode support for both HSPA and LTE in its small cell SoCs, and the only one to have shown both frequency-division duplexing (FDD) LTE and time-division LTE (TD-LTE) solutions.

Tuesday, August 21, 2012

Lantiq Targets VoLTE Enabled Home Gateways

Lantiq is collaborating with D2 Technologies and Ecrio Inc. to enable rich, native communications services for 4G LTE clients. Specifically, Lantiq will offer integration and test support for each company's Voice over LTE software with the Lantiq XWAY GRX Gateway Platform, providing networking OEMs and carriers with a path to faster deployment of wireless broadband enabled home gateways. Reference designs are expected in early 2013.

D2 Technologies is the developer of mCUE 4G and vPort, advanced IMS VoLTE and RCS software solutions that offer IMS IP communications services such as HD voice, real time video call, instant message, presence, SMS and VCC on 4G mobile networks.

Ecrio offers its commercially deployed Mobile Communications Client Suite (MCCS) powered by FlexIMS Architecture, which supports such 4G/LTE services as Voice, Video, SMS and other Rich Communication Suite Services.

The Lantiq XWAY GRX Gateway Platform includes a powerful multi-core network processor and proven Universal Gateway software stack for core networking functions and support for Lantiq�s broad connectivity and voice product portfolio, including Fast/Gigabit-Ethernet, WLAN, and DECT/CAT-iq solutions.

Lantiq has previously announced collaboration with LTE-chipset supplier Altair Semiconductor.

"These cooperations mark the next step in our LTE Gateway strategy. Last year saw a significant increase of LTE CPE deployments by major carriers and now we expect VoLTE to enter the mass market. As we develop an ecosystem of solution providers specifically for this new segment of the home broadband market, we add valuable services to our portfolio," said Dirk Wieberneit, Head of the Customer Premises Equipment Business Unit of Lantiq.

Wednesday, May 9, 2012

Huawei Achieves 150 Mbps in European LTE Cat 4 Field Trial

Huawei has achieved data rates of 150 Mbps in an LTE Category 4 field trial on a commercial LTE network in Europe.

The trial was based on an LTE Category 4 device powered by the first Hisilicon LTE multi-mode chipset to support LTE R9. 

Sunday, April 29, 2012

Mindspeed Powers LTE + Wi-Fi Femtocell for SK Telesys

Mindspeed Technologies has supplied its Transcede wireless baseband processors for an LTE + Wi-Fi femtocell from SK Telesys, the wireless system manufacturer in SK Group Korea.

The Wi-Fi integrated LTE femtocells will be first deployed in densely populated regions in South Korea, focusing primarily on the commercial centers of major cities. The rollout will then be expanded to areas with high data demand – i.e. indoor areas like shopping centers, offices, houses and schools – based on an analysis of LTE service usage patterns.

Mindspeed's Transcede family of processors are complete NodeB and eNodeB SoC solutions that support concurrent 3G and LTE processing in a single device, including time division synchronous code division multiple access (TD-SCDMA), W-CDMA/HSPA+ and both frequency division duplexing LTE (FDD-LTE) and time division duplexing LTE (TDD-LTE).

See also