Showing posts with label Silicon Photonics. Show all posts
Showing posts with label Silicon Photonics. Show all posts

Tuesday, July 2, 2019

Rockley Photonics raises $52 million

Rockley Photonics, a start-up based in Oxford, UK, announced US$52 million in the first closure in its Series E funding round for its silicon photonics technology.

Rockley Photonics, which was formed in 2013, developed a third-generation silicon photonics platform specifically designed for the optical I/O challenges facing next-generation sensor systems and communications networks. The company says its platform exploits optimized waveguide dimensions.

Andrew Rickman, chief executive officer at Rockley added: “Rockley is uniquely positioned having developed a proprietary photonics platform and manufacturing technologies, underpinned by a depth of expertise that goes back some 30 years. We are currently using our platform to address applications in the data center and high-performance computing, medical and life sciences, and 3D imaging/sensing verticals with the potential for additional verticals in the future.”

Mahesh Karanth, chief financial officer at Rockley explained: “With this latest round of investment, Rockley is strengthening its position as a leading integrated silicon photonics solutions provider. It will support the full execution of our business plan and continued growth as we make significant strides in co-packaging for optoASICs and data center connectivity, LiDAR and consumer electronic applications.”

Investors in the lastest funding round include a key strategic partner, Morningside Technology Ventures and numerous private investors. The company has now raised $165 million to date.

www.rockleyphotonics.com

Tuesday, December 18, 2018

Cisco to acquire Luxtera for silicon photonics -- $660M

Cisco agreed to acquire privately-held Luxtera, a developer of silicon photonic technologies, for $660 million in cash and assumed equity awards.

Luxtera, which is based in Carlsbad, California, focuses on silicon photonics process and packaging technologies for building integrated optics capabilities for webscale and enterprise data centers, service provider market segments, and other customers.

Luxtera leverages a hybrid integration approach wherein the photonics die forms the base of the transceiver chipset, while the light source and electronics die are attached on top. The company says its ability to integrate all optical components into a single silicon chip enables it to manufacture at wafer scale.

Cisco said the integration of Luxtera will broaden its portfolio of 100GbE and 400GbE optics. Cisco plans to incorporate Luxtera's technology across its intent-based networking portfolio, spanning enterprise, data center and service provider markets.

"With Cisco's 2018 Visual Networking Index projecting that global Internet traffic will increase threefold over the next five years, our customers are facing an exponential demand for Internet bandwidth," said David Goeckeler, executive vice president and general manager, Networking and Security Business at Cisco. "Optics is a fundamental technology to enable this future. Coupled with our silicon and optics innovation, Luxtera will allow our customers to build the biggest, fastest and most efficient networks in the world."

https://newsroom.cisco.com/press-release-content?type=webcontent&articleId=1959037


AT OFC 2018, Luxterra showcased its latest advances in  100G/λ technology, PAM4 signaling, extended reach, increased operating temperature range, liquid immersion cooling, increased density and photonic integration. Product demonstrations included: IEEE802.3bs compliant 400G-DR4 technology platform demonstrating increased throughput and performance in Luxtera’s next-generation products 30km, 50G-PAM4 single-lambda QSFP link demonstrating Luxtera’s extended reach capabilities with PAM4 signaling over duplex fiber 4x25G-LR QSFP28 modules...


Monday, September 24, 2018

ECOC 2018: Intel announces 100G silicon photonics transceivers for 5G

At ECOC 2018, Intel announced new 100G silicon photonics transceivers targetted at 5G wireless fronthaul applications. The new transceivers are designed to meet the harsh outdoor conditions of cellular towers with the capability to support optical transport to the nearest baseband unit or central office (up to 10 km). Commercial availability is expected in Q1 2019.

“Our hyperscale cloud customers are currently using Intel’s 100G silicon photonics transceivers to deliver high-performance data center infrastructure at scale. By extending this technology outside the data center and into 5G infrastructure at the edge of the network, we can provide the same benefits to communications service providers while supporting 5G fronthaul bandwidth needs,” stated Dr. Hong Hou, vice president and general manager of Intel’s Silicon Photonics Product Division.

Intel's first 100G silicon photonics product was introduced in 2016. The company says its 100G data center products are now shipping at a run rate of more than a million units per year.

Intel projects the total market opportunity for its connectivity business, which includes silicon photonics, to grow from $4 billion today to an estimated $11 billion total addressable market by 2022.

From this year's Intel Data Center Innovation Summit in August


Monday, April 23, 2018

MIT: a new technique for assembling on-chip optics and electronics separately

A team of researchers led by groups at MIT, the University of California at Berkeley, and Boston University, have developed a technique for assembling on-chip optics and electronics separately using existing manufacturing processes.

The work, which is described in an article in the latest issue of Nature, allows the addition of optical communication components onto chips with modern transistors.

“The most promising thing about this work is that you can optimize your photonics independently from your electronics,” says Amir Atabaki, a research scientist at MIT’s Research Laboratory of Electronics and one of three first authors on the new paper. “We have different silicon electronic technologies, and if we can just add photonics to them, it’d be a great capability for future communications and computing chips. For example, now we could imagine a microprocessor manufacturer or a GPU manufacturer like Intel or Nvidia saying, ‘This is very nice. We can now have photonic input and output for our microprocessor or GPU.’ And they don’t have to change much in their process to get the performance boost of on-chip optics.”

http://news.mit.edu/2018/integrating-optical-components-existing-chip-designs-0419

Monday, April 24, 2017

IBM Joins AIM Photonics Consortium

IBM and The American Institute for Manufacturing Integrated Photonics (AIM Photonics), announced a patent and intellectual property licensing agreement and confirmed IBM has joined the AIM Photonics consortium, which seeks to advance integrated photonic circuit manufacturing and technology development.

Under the intellectual property licensing agreement , IBM will help AIM Photonics establish standard processes in the development of silicon photonics assemblies, such as couplings for communication signals and light sources. Industry and academic AIM Photonics members will access these technologies through a process design kit (PDK) and prototype development at the Rochester Test Assembly and Packaging (TAP) facility and the 300mm chip facility at SUNY Poly's Albany campus.

"Adding IBM as a member of AIM Photonics not only significantly strengthens this outstanding institute, but highlights the momentum the Finger Lakes region is experiencing in the high tech sector," said John Maggiore, New York State photonics board of officers chairman. "This announcement further validates the importance of this institute and the goals it has set out to achieve."

http://www.ibm.com

Thursday, March 16, 2017

Luxtera Partners with TSMC for Next Gen Silicon Photonics

Luxtera, a global provider of silicon photonics solutions, announced that it has partnered with TSMC for the manufacture of next generation silicon photonics solutions designed for future cloud, mobile infrastructure, enterprise and high-performance computing (HPC) platforms.

Under the agreement, Luxtera and TSMC are developing a new silicon photonics technology platform designed to provide more than double the optical link performance and four times the raw data throughput of competing silicon photonics solution on the market. The new silicon photonics platform will also enable full SoC integration of optical interconnect with the CMOS logic for applications such as network switch, storage or compute.

Luxtera stated that combined with TSMC silicon manufacturing capabilities and scale, its silicon photonic designs can enable optical interconnects that offer significantly higher performance at lower cost and power consumption to address the requirements of future data centres and 5G mobile networks.

Luxtera's latest platform will be used in a suite of next generation silicon photonics solutions to deliver 100 Gbit/s per lane optical interconnects, starting with 100GBase-DR and 400GBase-DR4 transceivers in 2018, and subsequently expanding to include other standards-based solutions for 25, 50, 100, 200, 400, 800 Gbit/s and 1 Tbit/s optical interconnects.

In addition, complementing the new silicon photonics technologies, Luxtera will leverage TSMC's 7 nm CMOS process to deliver high performance with low power across its product portfolio.

http://www.luxtera.com


  • In September 2016, Luxtera announced it had shipped more than one million silicon photonics PSM4 transceiver products designed for applications in cloud computing data centres. The Luxtera 100 Gbit/s PSM4 optical transceivers include four independent transmitter and receiver channels integrating phase modulators, photodetectors, waveguides, grating couplers, electrical re-timers and control circuitry, powered by a single integrated laser.

Thursday, March 9, 2017

Coriant Announces Short Reach CFP2-ACO Pluggable for Groove Network Disaggregation Platform

Coriant introduced a Short Reach CFP2-ACO pluggable for its Groove G30 Network Disaggregation Platform (NDP). The Groove Short Reach CFP2-ACO pluggable, which uses silicon photonics from Elenion Technologies, enables cost-optimized, power-efficient 200G connectivity for carrier transport and Data Center Interconnect (DCI) applications.

Coriant said its Short Reach CFP2-ACO represents a new class of analog coherent devices purpose-built for surging data traffic growth. Compared to PAM-4, the Short Reach CFP2-ACO preserves the operational and network engineering simplicity of coherent transmission while significantly lowering the cost and power for short reach interconnect applications. In combination with the Coriant Groove G30 Muxponder solution, the Short Reach CFP2-ACO helps support delivery of very high-capacity, low power, and cost-optimized connectivity for all applications requiring 10G, 40G, and 100G service aggregation and 200G DWDM transport. It also complements the Coriant Groove™ G30 Open Line System (OLS), enabling the industry’s highest density and lowest cost short reach transport.

“A faster pace of innovation and the shift to more open, disaggregated network solutions are enabling network operators and content providers to redefine their network architectures for scale, quality of experience, and total cost of ownership,” said J.C. Fahmy, Vice President of Product Management and Business Development, Data Center Solutions, Coriant. “With the Coriant Short Reach CFP2-ACO we are redefining the economics of short reach transport while building upon the proven value of our market-leading Groove Network Disaggregation Platform.”

http://www.coriant.com/

Thursday, January 5, 2017

NTT and Furukawa Announce 2 Joint Ventures for Optical Components

NTT Electronics Corporation and Furukawa Electric Co. agreed to establish two joint venture manufacturing companies for planar lightwave circuits and optical semiconductors. Both joint ventures will be based in Japan.

The companies said the deals were motivated by the need for stable and efficient supply capability of optical components has increased in response to the demand created by rapid growth in cloud services.

http://www.ntt-electronics.com/en/news/2016/12/ntt-electronics-and-furukawa-electric-establish-joint-venture.html

Thursday, December 15, 2016

Elenion Targets Innovation in Silicon Photonics

Elenion Technologies, a start-up headquartered in New York City with offices in San Jose, California and Munich, emerged from stealth and announced its plans to drive innovation in silicon photonics.

Elenion is backed by Marlin Equity Partners, a global investment firm, that also owns Coriant. Elenion is headed Larry Schwerin, who previously was CEO of Silicon Lightwave Services, a ground-breaking silicon photonics design services company, and Capella Intelligent Subsystems, a leading supplier of Wavelength Selective Switch technology acquired by Alcatel-Lucent in 2013. In addition, Michael Hochberg, a renowned silicon photonics expert and co-founder of Luxtera, serves as the CTO.

“Following over two years of focused R&D, including extensive coordination with Coriant, we are excited with the progress Elenion’s experienced team has demonstrated in the development of next-generation photonic integrated circuit products,” said Doug Bayerd, a principal at Marlin. “Elenion is uniquely positioned to capitalize on one of the industry’s most promising technologies and accelerate the introduction of commercially-ready advanced communications solutions.”

“Silicon photonics is redefining the economics of interconnect technologies and enabling the use of optics in exciting new markets and applications,” said Schwerin. “We look forward to working with our customers to deliver innovative photonic integrated circuit solutions that are far more complex and capable than previously possible.”

http://www.elenion.com

Tuesday, August 30, 2016

OIF Launches 100G Serial Electrical Links

The Optical Internetworking Forum (OIF) has begun work on a 100G Serial Electrical Link project.

The very short reach (VSR) CEI-112G chip-to-module interface project will support a nominal lane rate of 112 Gb/s, enabling narrower interfaces to optical modules and is expected to be more energy efficient than previous interfaces. The CEI-112G-VSR specification doubles data rates over the current generation CEI-56G-VSR interfaces.

The OIF said this work will be followed by both shorter and longer reach projects.

“As bandwidth increases, electrical interfaces need to reflect that trend. Given the lead times, development of standards for the next generation of electrical links needs to start now,” said David Stauffer of Kandou Bus and the OIF’s Physical and Link Layer Working Group Chair and board member. “The OIF is continuing its roadmap for 100 Gb/s thru 400 Gb/s and beyond applications, addressing multiple reaches for chip-to-chip and chip-to module interfaces.”

http://www.oiforum.com

Wednesday, August 17, 2016

Intel Releases 100G Silicon Photonic Transceiver

After 16 years of investing in R&D, Intel announced the commercial release of its first silicon photonics product -- a 100G CWDM4 QSFP28 optical transceiver supporting in data center distances of up 2km over duplex single-mode fiber, with high speed and low-power consumption. The new product is designed to be compliant with 100G CWDM4 and CLR4 MSA, QSFP28, and CAUI-4 specifications.

The compact QSFP28 form factor enables high faceplate density in networking equipment. It supports the CWDM wavelength grid (1271, 1291, 1311, and 1331 nm) for uncooled operation, and the electrical interface is  compliant with IEEE 802.3bm CAUI-4 standard.

In a keynote address, Intel's Diane Bryant said silicon photonics would play an increasing role in the company's vision for future data center architecture.

http://itpeernetwork.intel.com/bringing-light-intels-silicon/







Sunday, August 14, 2016

University of Cambridge: Liquid Light Switch

Researchers at the University of Cambridge announced a miniature electro-optical switch with the potential for more energy-efficient signal processing.

The switch can change the spin – or angular momentum – of a liquid form of light by applying electric fields to a semiconductor device a millionth of a metre in size.

The project, which was conducted at the Cambridge NanoPhotonics Centre with funding from the UK Engineering and Physical Sciences Research Council (EPSRC), the European Research Council (ERC) and the Leverhulme Trust, leverages a state of matter called Polariton Bose-Einstein condensate, which enables the switch to mix electric and optical signals.

https://www.cam.ac.uk/research/news/liquid-light-switch-could-enable-more-powerful-electronics


Tuesday, August 2, 2016

Juniper to Acquires Aurrion for Silicon Photonics

Juniper Networks agreed to acquire Aurrion, a start-up developing silicon-photonics technology. Financial terms were not disclosed.

Aurrion, which is based in Santa Barbara, California and was founded in 2008, has been working on technology to change how photonic transceivers can be packaged and integrated into systems. Its new approach to optics manufacturing could be used for systems in hyperscale data centers.

In a blog post, Juniper's Pradeep Sindhu writes "Aurrion’s breakthrough technology will result in fundamental and permanent improvements in cost per bit-per-second, power per bit-per-second, bandwidth density, and flexibility of networking systems."

http://www.juniper.net


Thursday, March 24, 2016

#OFC2016: Inphi Targets DCI with QSFP28 Design

Inphi unveiled a QSFP28 reference design that uses advanced Pulse Amplitude Modulation (PAM4) signaling to deliver up to 4 Tbps of bandwidth over a single fiber at distances up to 80km.  The target application is metro Data Center Interconnect (DCI). Commercial launch date was not specified.

Key features of Inphi's "ColorZ":

  • QSFP28 form factor supporting 100G Ethernet
  • Extended reach up to 80km
  • Enables 4Tb/s capacity over a single fiber
  • 4.5W power dissipation
  • ITU wavelength grid compatible
  • "InphiNity" Core DSP Engine with a unique mixed-mode DSP architecture for high performance, low power applications needing adaptability and configurability
  • Multiple programmable FEC options with varying levels of pre-FEC BER performance
  • Numerous self-test and loopback modes that allow diagnostic monitoring of channel and system parameters
  • Eye-scan, samplers and monitors on all receiver interfaces for link margin and stress testing along with GUI and API routines for data and error analytics  

“The current gap in the inter-data center interconnects is at the sub 80km segment, which is being supported by 10G solutions today. ColorZ is filling the gap with 100G links matching the rest of the data center network,” said Dr. Loi Nguyen, founder, senior vice president, Optical Interconnect at Inphi. “This demonstrates Inphi’s continued industry leadership, as we build on our technology foundation to dramatically reduce the cost of data movement.”

https://www.inphi.com/media-center/press-room/press-releases-and-media-alerts/inphi-debuts-100g-dwdm-solution-for-80km-data-center-interconnects.php

#OFC2016: Inphi Develops Silicon Photonics for Data Centers

Inphi announced a highly integrated Silicon Photonics (SiPho) chip that includes multi-channel modulators, photodetectors, multiplexers, demultiplexers, optical power monitors and fiber coupling structures on the same integrated circuit (IC).  The chip is targeted at 100G intra and inter data center optical interconnects.

The company said it expects a 100G upgrade cycle in data centers to begin this year with the introduction of a new generation of 3.2T switches using QSFP28 pluggable transceivers.

Inphi believes its SiPho technology, coupled with its low power DSP-based PAM4 and linear amplifiers/drivers, will deliver the industry’s first 100G DWDM PAM4 platform reference design for the QSFP28 form factor.

“Inphi selected Silicon Photonics over competing platforms, because it allows us to integrate multiple key photonics components in a single IC,” said Dr. Radha Nagarajan, chief technology officer, Optical Interconnect at Inphi. “Silicon Phonics technology enables us to deliver innovative solutions to solve customer’s pain points today.  Silicon Photonics also scales well into the future for next-generation optics.”

https://www.inphi.com

Wednesday, March 9, 2016

Macom Announces CWDM4 L-PIC for 100G Datacenter Applications

M/A-COM Technology Solutions (MACOM) introduced a silicon photonic integrated circuit integrated with lasers (L-PIC) for a 100G transmit solution for CWDM4 and CLR4 applications.

MACOM’s MAOP-L284CN features four high bandwidth Mach-Zehnder modulators integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM multiplexer, with each channel operating at up to 28 Gbps. The L-PIC operates on a standard single mode optical fiber, and includes integrated tap detectors for fiber alignment, system initialization and closed loop control. A single fiber aligned to the output edge coupler of this 4.1 x 6.5 mm die is the only optical requirement for implementing this device into QSFP28 transceiver applications. MACOM is also offering the MASC-37053A modulator driver integrated with CDR, matched with this L-PIC™ for optimized performance and power dissipation.

“Silicon-based photonic integrated circuits, or PICs, enable integration of optical devices such as modulators and multiplexer onto a single chip. We believe that MACOM’s L-PIC™ solves the key challenge of aligning lasers to the silicon PIC with high yield and high coupling efficiency, making the adoption of Silicon PICs a reality for high-speed optical interconnects within the Datacenter,” said Vivek Rajgarhia, Vice President of Strategy, High-Speed Networking, for MACOM.

http://www.macom.com

Wednesday, December 9, 2015

VI Systems Launches Opto Wafer Test Services

VI Systems GmbH, which specialized in high performance optical semiconductor components, is expanding its service portfolio for optic semiconductor wafers of up to 6 inches.

The new semi-automatic wafer prober station performs high-speed electrical and optical testing of wafers early in the manufacturing process. The test parameters include optical output power and optical spectrum. Electrical parameters which can be tested include operation voltage, bias voltage, drive current and dark current.

In addition, high frequency characterization test of up to 38 GHz can be performed including digital transmission experiments of up to 64 Gbps. The new facilities also include nearfield and farefield analysis tools as well microscopic characterization equipment.

http://www.v-i-systems.com/

Saturday, October 31, 2015

Indium Phosphide Lasers Monolithically Grown on 300nm Silicon

Imec and Ghent University demonstrated for the first time the ability to grow indium phosphide lasers monolithically integrated on 300mm silicon substrates in a CMOS pilot line.

The researchers used a production grade metal-organic vapor-phase epitaxial (MOVPE) growth reactor to grow an indium phosphide semiconductor in a pre-patterned oxide template , realizing indium phosphide waveguide arrays across the entire 300mm substrate.

Such laser-powered photonic integrated circuits (PICs) could be used to interface between future logic and memory chips.

http://www2.imec.be/be_en/press/imec-news/ghent-university-nature-si-photonics-indium-phosphide-lasers.html

Australian Researchers Build Quantum Logic Gate in Silicon


Researchers at the University of New South Wales in Australia have built a quantum logic gate in silicon for the first time -- a major step toward quantum computers. “We’ve demonstrated a two-qubit logic gate – the central building block of a quantum computer – and, significantly, done it in silicon. Because we use essentially the same device technology as existing computer chips, we believe it will be much easier to manufacture a full-scale processor...

IBM Charts Post-Silicon Future with Carbon Nanotube


IBM researchers have demonstrated announced a new transistor contact approach that could accelerate the use carbon nanotubes as a replacement for silicon. Previously, IBM shown that carbon nanotube transistors can operate as excellent switches at channel dimensions of less than ten nanometers – less than half the size of today’s leading silicon technology. IBM's new contact approach overcomes the other major hurdle in incorporating carbon nanotubes...

IBM Implements 100G Optical Transceiver in Sub-100nm CMOS


IBM announced another significant advancement with is CMOS integrated nano-photonics technology. The company said its researchers for the first time have tested a fully integrated wavelength multiplexed silicon photonics chip, which will soon enable manufacturing of 100 Gbps optical transceivers. The design implements multiple optical components side-by-side with electrical circuits on a single silicon chip using sub-100nm CMOS technology. “Making...

100G and Beyond - @Huawei Comments at #OFC2015


What changes will we see as network transport evolves to 100G and beyond? Peter Ashwood-Smith, Technical VP of Optical Product Line at Huawei, breaks it down into a discussion of the control layer and the physical interface.  He sees 100G as the "workhorse" of optical transport for the next 3-5 years. We'll see improvements in density and the adoption on pluggable formats in 100G interfaces. Another factor for 100G is silicon photonics. See...

Luxtera Debuts 100G QSFP28 Module and Silicon Photonics Chipset


At this week's #OFC2015 in Los Angeles, Luxtera confirmed commercial availability of its 100G-PSM4 compliant chipset and QSFP optical module. The company said its low cost single mode products  make it well positioned for an industry-shift from copper and legacy multimode fiber to single mode fiber at volume scale. LUX42604 Key Features 100Gb optical transceiver QSFP28 compliant module form-factor Four 4 x 26 Gbps independently operating...



Mellanox Intros Next Gen 100 Gbps Silicon Photonics Transceivers


Mellanox Technologies introduced three new LinkX 100 Gb/s solutions that support the high-density, low-power, QSFP28 connector-based Switch-IB switch platform. The Switch-IB 36-port 100Gb/s InfiniBand switch delivers 7.2Tb/s of aggregate throughput in a 1U, making it the world’s highest performance, ultra-dense end-to-end platform. Mellanox said the robustness and density of standard QSFP connectors and cables enables 100Gb/s networks to be as...

Saturday, October 10, 2015

Australian Researchers Build Quantum Logic Gate in Silicon

Researchers at the University of New South Wales in Australia have built a quantum logic gate in silicon for the first time -- a major step toward quantum computers.

“We’ve demonstrated a two-qubit logic gate – the central building block of a quantum computer – and, significantly, done it in silicon. Because we use essentially the same device technology as existing computer chips, we believe it will be much easier to manufacture a full-scale processor chip than for any of the leading designs, which rely on more exotic technologies," stated Andrew Dzurak, Scientia Professor and Director of the Australian National Fabrication Facility at UNSW.

“This makes the building of a quantum computer much more feasible, since it is based on the same manufacturing technology as today’s computer industry,” he added.

Professor Kohei M. Itoh from Keio University in Japan provided specialised silicon wafers for the project.

http://newsroom.unsw.edu.au/news/science-tech/crucial-hurdle-overcome-quantum-computing

NIST Researchers Teleport Quantum State over 100km of Fiber


Researchers from the National Institute of Standards and Technology (NIST) and NTT have transferred quantum information carried in light particles over 100 km of optical fiber, four times farther than the previous record. The breakthrough could lead to quantum repeaters, opening the door to quantum communications over long distances of fiber. Previously, quantum state has been teleported over free space, but transfers over optical have been limited...

NTT and University of Tokyo Cite Progress in Quantum Cryptography


Nippon Telegraph and Telephone(NTT) and The University of Tokyo reported progress in developing a quantum cryptography scheme that can assure security without monitoring the error rate of photon transmission. In an article in the UK science journal “Nature Photonics”, the researchers describe a quantum key distribution (QKD) experiment based on a novel QKD scheme called the round-robin differential phase shift (RRDPS) protocol. NTT said the experiment...

Intel Invests in QuTech for Quantum Computing


Intel will invest US$50 million and provide significant engineering resources to Delft University of Technology and TNO, the Dutch Organisation for Applied Research, to accelerate advancements in quantum computing. Intel said its goal is to extend the university's physics expertise and diverse quantum computing research efforts by contributing advanced manufacturing, electronics and architectural expertise. "A fully functioning quantum computer...


Saturday, October 3, 2015

IBM Charts Post-Silicon Future with Carbon Nanotube

IBM researchers have demonstrated announced a new transistor contact approach that could accelerate the use carbon nanotubes as a replacement for silicon.

Previously, IBM shown that carbon nanotube transistors can operate as excellent switches at channel dimensions of less than ten nanometers – less than half the size of today’s leading silicon technology. IBM's new contact approach overcomes the other major hurdle in incorporating carbon nanotubes into semiconductor devices, which could result in smaller chips with greater performance and lower power consumption.

The breakthrough required the invention of a metallurgical process akin to microscopic welding that chemically binds the metal atoms to the carbon atoms at the ends of nanotubes. IBM said this "end-bonded contact scheme" allows the contacts to be shrunken down to below 10 nanometers without deteriorating performance of the carbon nanotube devices.

“These chip innovations are necessary to meet the emerging demands of cloud computing, Internet of Things and Big Data systems,” said Dario Gil, vice president of Science & Technology at IBM Research. “As silicon technology nears its physical limits, new materials, devices and circuit architectures must be ready to deliver the advanced technologies that will be required by the Cognitive Computing era. This breakthrough shows that computer chips made of carbon nanotubes will be able to power systems of the future sooner than the industry expected.”

http://www-03.ibm.com/press/us/en/pressrelease/47767.wss

IBM Achieves 7nm Test Chips in Siilcon Germanium


IBM Research has produced the first 7nm (nanometer) node test chips with functioning transistors.  The milestone was achieved using Silicon Germanium (SiGe) channel transistors and Extreme Ultraviolet (EUV) lithography integration at multiple levels. Current generation microprocessors are generally implemented in silicon using 22nm or 14nm technology. IBM partnered with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute’s Colleges of...

IBM's Silicon Nanophotonics Integrates 25G Tranceivers in 90nm CMOS


IBM has integrated multiple optical components alongside electrical circuits using 90nm semiconductor process technology.

Essentially, IBM has successfully added a variety of silicon nanophotonics components, such as wavelength division multiplexers (WDM), modulators, and detectors, alongside CMOS electrical circuitry using a conventional semiconductor foundry.

IBM’s CMOS nanophotonics used transceivers exceeding 25 Gbps per channel. IBM said its integration is capable of feeding a number of parallel optical data streams into a single fiber by utilizing compact on-chip wavelength-division multiplexing devices. The ability to multiplex large data streams at high data rates will allow future scaling of optical communications capable of delivering terabytes of data between distant parts of computer systems.

http://www-03.ibm.com/press/us/en/pressrelease/39641.wss


  • In October 2012, IBM announced a breakthrough in building a semiconductor using carbon nanotubes instead of silicon.  IBM researchers created a device consisting of more than ten thousand working transistors made of nano-sized tubes of carbon.  Standard semiconductor processes were used to fabricate the device.  IBM has previously demonstrated that carbon nanotube transistors can operate as excellent switches at molecular dimensions of less than ten nanometers – less than half the size of the leading silicon technology. 

See also