Showing posts with label Silicon Photonics. Show all posts
Showing posts with label Silicon Photonics. Show all posts

Wednesday, May 5, 2021

GlobalFoundries adapts silicon photonics for quantum computing

GlobalFoundries is now manufacturing the silicon photonic and electronic chips that form the foundation of PsiQuantum's Q1 quantum computer.

PsiQuantum, a start-up based in Palo Alto, California, aims to be the first to deliver a commercially viable quantum computer with one million qubits.

PsiQuantum and GF have now demonstrated the ability to manufacture core quantum components, such as single-photon sources and single-photon detectors, with precision and in volume, using the standard manufacturing processes of GF’s semiconductor fab. The companies have also installed proprietary production and manufacturing equipment in two of GF’s 300mm fabs to produce thousands of Q1 silicon photonic chips at its facility in upstate New York, and state-of-the-art electronic control chips at its Fab 1 facility in Dresden, Germany.

PsiQuantum’s Q1 system represents breakthroughs in silicon photonics, which the company believes is the only way to scale to 1 million-plus qubits and beyond and to deliver an error-corrected, fault-tolerant, general-purpose quantum computer.

“In the past year, we have experienced a decade of technological change. Now, due to the digital transformation and the explosion of data we are faced with problems that require quantum computing to further accelerate the Renaissance of Compute,” said Amir Faintuch, senior vice president and general manager of Compute and Wired Infrastructure at GF. “PsiQuantum and GF’s partnership is a powerful combination of PsiQuantum’s photonic quantum computing expertise and GF’s silicon photonics manufacturing capability that will transform industries and technology applications across climate, energy, healthcare, materials science, and government.”

“This is a major achievement for both the quantum and semiconductor industries, demonstrating that it’s possible to build the critical components of a quantum computer on a silicon chip, using the standard manufacturing processes of a world-leading semiconductor fab,” said Pete Shadbolt, chief strategy officer and co-founder of PsiQuantum. “When we first envisioned PsiQuantum, we knew that scaling the system would be the existential question. Together with GLOBALFOUNDRIES, we have validated the manufacturing path for silicon photonics and are confident that by the middle of this decade, PsiQuantum will have completely stood up all the manufacturing lines and processes necessary to begin assembling a final machine.”

Thursday, April 29, 2021

University of Surrey: silicon could be a photonics game-changer

Silicon is an outstanding candidate for developing new types of devices for controling multiple light beams, according to new research from the University of Surrey, suggesting new possibilities for the production of lasers and displays.

The researchers found that silicon possesses the strongest nonlinearity for manipulating laser beams – for example, changing their colour. 

Ben Murdin, co-author of the study and Professor of Physics at the University of Surrey, said: "Our finding was lucky because we weren't looking for it. We were trying to understand how a very small number of phosphorus atoms in a silicon crystal could be used for making a quantum computer and how to use light beams to control quantum information stored in the phosphorus atoms.

"We were astonished to find that the phosphorus atoms were re-emitting light beams that were almost as bright as the very intense laser we were shining on them. We shelved the data for a couple of years while we thought about proving where the beams were coming from. It's a great example of the way science proceeds by accident, and also how pan-European teams can still work together very effectively."

The research is published in the journal Light: Science and Applications

https://www.nature.com/articles/s41377-021-00509-6

https://www.surrey.ac.uk/news/study-suggests-silicon-could-be-photonics-game-changer

Thursday, April 22, 2021

EPFL develops ultralow-loss integrated photonic circuits

Researchers at the École polytechnique fédérale de Lausanne (EPFL) are developing ultralow-loss integrated photonic circuits based on silicon nitride (Si3N4), whose exceptionally low optical loss are orders of magnitude lower than that of silicon.

The work, which is led by Professor Tobias J. Kippenberg at EPFL’s School of Basic Sciences, has just been published in Nature Communications.

"Combining nanofabrication and material science, the technology is based on the photonic Damascene process developed at EPFL. Using this process, the team made integrated circuits of optical losses of only 1 dB/m, a record value for any nonlinear integrated photonic material. Such low loss significantly reduces the power budget for building chip-scale optical frequency combs (“microcombs”), used in applications like coherent optical transceivers, low-noise microwave synthesizers, LiDAR, neuromorphic computing, and even optical atomic clocks. The team used the new technology to develop meter-long waveguides on 5x5 mm2 chips and high-quality-factor microresonators. They also report high fabrication yield, which is essential for scaling up to industrial production."

“These chip devices have already been used for parametric optical amplifiers, narrow-linewidth lasers and chip-scale frequency combs”, says Dr Junqiu Liu who led the fabrication at EPFL’s Center of MicroNanoTechnology (CMi). “We are also looking forward to seeing our technology being used for emerging applications such as coherent LiDAR, photonic neural networks, and quantum computing.”

https://news.epfl.ch/news/new-tech-builds-ultralow-loss-integrated-photonic-/

Tuesday, March 30, 2021

Imec demos ultrasound sensor in silicon photonics

Imec, a leading research and innovation hub in Belgium, has demonstrated an optomechanical ultrasound sensor on a silicon photonic chip that has an unprecedented sensitivity due to an innovative optomechanical waveguide.

By leveraging this high-sensitivity waveguide, Imec's 20-µm small sensor has a detection limit two orders of magnitudes better than piezoelectric elements of identical size. 

Potential clinical and biomedical applications of ultrasonic and photoacoustic imaging include deep-tissue mammography and the study of vascularization or innervation of potential tumorous tissue. 

 “The sensor we have demonstrated will be a gamechanger for deep tissue imaging in otherwise non-transparent tissues such as skin or brain. For applications such as sub-cutaneous melanoma imaging or mammography, it enables a more detailed view of the tumor and vascularization around, aiding in a more detailed diagnosis,” says Xavier Rottenberg, fellow wave-based sensors and actuators at imec.

Imec said its solution is based on a highly sensitive split-rib optomechanical waveguide fabricated using new CMOS-compatible processing. The sensitivity is two orders of magnitude larger than a state-of-the-art device. A low detection limit can improve the trade-off between imaging resolution and depth for ultrasound applications, and is crucial for photoacoustic imaging, where pressures are up to three orders of magnitude lower than in conventional ultrasound imaging techniques. 

Finally, a fine-pitched (30 µm) matrix of these tiny (20 µm) sensors can be easily integrated on-chip with photonic multiplexers. This opens the possibility of new applications such as miniaturized catheters because the sensor matrices require only few optical fibers to be connected instead of one electrical connection per element in the case of piezoelectric sensors.

https://www.imec-int.com/en/press/imec-demonstrates-ultra-sensitive-small-optomechanical-ultrasound-sensor-silicon-photonics

Tuesday, March 16, 2021

Rockley employs Synopsys for its silicon photonics designs

Rockley Photonics has adopted Synopsys solutions to accelerate the design and verification of silicon photonics for sensing and datacom applications. 

Specifically, Rockley is using tools from Synopsys' Photonic Solutions platform, including OptoCompiler, OptoDesigner, OptSim Circuit, RSoft Photonic Device Tools and IC Validator. Rockley plans to use Synopsys solutions to design and optimize photonic devices, create process design kits (PDKs) and tape out photonic ICs.

Rockley was an early adopter of Synopsys' OptoCompiler tool following its commercial launch in September 2020. OptoCompiler is the industry's first unified electronic and photonic design platform, combining mature and dedicated photonic technology with Synopsys' industry-proven custom and analog-mixed signal tools to enable engineers to produce and verify complex photonic IC designs quickly and accurately.

"Rockley's unique photonic chipset technology with silicon photonics at its core is driving the growth of integrated optical components in healthcare, machine vision and data communications," said Andrew Rickman, chief executive at Rockley. "The PDA platform Rockley has created by utilizing OptoCompiler allows our engineers to define, simulate, lay out and verify Photonic ICs quickly and efficiently to meet our quality and schedule goals. Synopsys' technical support has been instrumental in ensuring Rockley met its tape-out goals. We look forward to additional efficiency gains by expanding our use of Synopsys' Photonic Solutions tools."

https://www.synopsys.com/

Rockley Photonics secures $50 million in funding

 Rockley Photonics, a start-up specializing in integrated optical chips and modules, has closed an additional $50 million of growth funding from leading deep-tech VCs, strategic investors, and institutional funds including Credit Suisse backed SIG-i Capital and Applied Ventures, the venture capital arm of Applied Materials, as well as existing shareholders. To date, Rockley has raised over $225 million of financing to develop its unique silicon photonics platform.

“It is testament to the strength of our technology and emerging market opportunities that we have attracted such a preeminent list of new investors to join many of our existing shareholders in this funding round,” said Andrew Rickman, chief executive officer, Rockley Photonics. “This round provides the funding for Rockley as it moves into the next exciting growth phase and develops next generation disruptive silicon photonics powered healthcare and wellness sensors and communications products for its Tier-1 customers.”

Rockley Photonics was founded by Dr. Andrew Rickman in 2013. The company has offices in Pasadena, San Jose, Oxford, Cardiff, Cork, and Helsinki.

Teramount raises $8 million for silicon photonics

Teramount, a start-up based in Jerusalem announced $8 million in series A funding. 

Teramount is developing a Photonic-Plug for connecting optics to silicon using standard semiconductor manufacturing processes and packaging. The company says its technology offers high assembly tolerances that allow for passive alignment processes and enables high volume packaging through standard CMOS assembly lines.

The funding was led by Grove Ventures with participation from Amelia Investments and former executive VP of Intel and company Chairman, David (Dadi) Perlmutter, along with additional private investors. 

http://www.teramount.com/ 

Monday, March 15, 2021

AEPONYX secures funding for silicon photonics on MEMS

AEPONYX, a start-up based in Montreal, announced the closing of a new $10 million funding round to support the buildout its 5G product portfolio.

Participants in this funding round were Fonds Ecofuel, BDC, Investissement Québec, and Fonds Innovexport.

“We are delighted to bring innovative products to the 5G market” says Philippe Babin, CEO of AEPONYX. “The creation of our integrated photonics with MEMS products enable the

Telecom industry to advance their next-generation networks. With the 5G adoption rate eclipsing where 4G was at this point in time, we see tremendous growth potential.”

AEPONYX said its integrated photonics innovations combined with their fast-tuning and ultra-small MEMS devices are well suited for telecom applications.

“While our technology works beautifully in quantum computing, LiDAR, and sensors, we are targeting telecom as our first market vertical” says Babin.

“These optical devices, combining high data rates with being quite small in size, are exactly what the market is looking for to advance the global 5G infrastructure significantly” stated Fonds Ecofuel’s Managing Partner, Richard Cloutier.

http://www.AEPONYX.com


Monday, January 11, 2021

Intel leverages silicon photonics for Mobileye's lidar system-on-chip

Mobileye, a division of Intel, unveiled a new silicon photonics processor for frequency-modulated continuous wave (FMCW) lidar. The new device, which was engineered at Intel’s silicon photonics fab in New Mexico, is expected to be in production by 2025. 

Mobileye envisions that AVs will use both radio- and light-based detection-and-ranging sensing.

The new software-defined imaging radar technology with 2304 channels, 100DB dynamic range and 40 DBc side lobe level that together enable the radar to build a sensing state good enough for driving policy supporting autonomous driving. 

“This is really game-changing. And we call this a photonic integrated circuit, PIC. It has 184 vertical lines, and then those vertical lines are moved through optics. Having fabs that are able to do that, that’s very, very rare. So this gives Intel a significant advantage in building these lidars,” stated Mobileye president and chief executive officer Amnon Shashua.

https://newsroom.intel.com/news-releases/ces-2021-mobileye-avs-on-move/

Tuesday, December 8, 2020

Optoscribe develops glass chip for low-loss coupling to silicon photonics

Optoscribe Ltd. introduced glass chip for low-loss coupling to silicon photonics (SiPh) grating couplers.

The new OptoCplrLT is designed to overcome fiber-to-SiPh photonic integrated circuit (PIC) coupling challenges to enable high volume automated assembly and help drive down costs. 

The device was created using Optoscribe’s proprietary high-speed laser writing technique. It features low-loss light turning curved mirrors, which are uniquely formed in the glass, to direct the light to or from SiPh grating couplers. This prevents the need for bend-tolerant fiber solutions, which are often expensive, challenging and have some significant limitations in size and profile.

To help address footprint challenges, OptoCplrLT has a low-profile interface of less than 1.5mm in height, which allows compact interface layouts that alleviate packaging constraints. It is also compatible with industry-standard materials and processes; for example, the glass chip has a coefficient of thermal expansion matched to the silicon chip, helping to maximise performance.

Russell Childs, CEO of Optoscribe, said: “With data center operators and transceiver manufacturers seeking innovative solutions to help address fiber-to-SiPh PIC coupling challenges, we are pleased to introduce OptoCplrLT™ to help meet market demands of performance, cost and volume, as well as helping to overcome such hurdles including SiPh transceiver packaging and integration.”


  

Thursday, December 3, 2020

Intel shows micro-ring modulators, all-silicon photodetectors, multi-lambda lasers

Intel showcased a number of advancements in the field of optical interconnects, advancing its long-term ambition to bring optical I/O directly into silicon packages. During a virtual Intel Labs day presentatio, the company demonstrated advances in key technology building blocks, including with light generation, amplification, detection, modulation, complementary metal-oxide semiconductor (CMOS) interface circuits and package integration. 

Key technology building blocks showcased:

  • Micro-ring modulators: Conventional silicon modulators take up too much area and are costly to place on IC packages. By developing micro-ring modulators, Intel has miniaturized the modulator by a factor of more than 1,000, thereby eliminating a key barrier to integrating silicon photonics onto a compute package.
  • All-silicon photodetector: For decades, the industry has believed silicon has virtually no light detection capability in the 1.3-1.6um wavelength range. Intel showcased research that proves otherwise. Lower cost is one of the main benefits of this breakthrough.
  • Integrated semiconductor optical amplifier: As the focus turns to reducing total power consumption, integrated semiconductor optical amplifiers are an indispensable technology, made possible with the same material used for the integrated laser.
  • Integrated multi-wavelength lasers: Using a technique called wavelength division multiplexing, separate wavelengths can be used from the same laser to convey more data in the same beam of light. This enables additional data to be transmitted over a single fiber, increasing bandwidth density.
  • Integration: By tightly integrating silicon photonics and CMOS silicon through advanced packaging techniques, we can gain three benefits: lower power, higher bandwidth and reduced pin count. Intel is the only company that has demonstrated integrated multi-wavelength lasers and semiconductor optical amplifiers, all-silicon photodetectors, and micro-ring modulators on a single technology platform tightly integrated with CMOS silicon. This research breakthrough paves the path for scaling integrated photonics.

Intel said these advancements will enable future architectures that are more disaggregated, with multiple functional blocks such as compute, memory, accelerators and peripherals spread throughout the entire network and interconnected via optical and software in high-speed and low-latency links.

“We are approaching an I/O power wall and an I/O bandwidth gap that will dramatically hinder performance scaling. The rapid progress Intel is making in integrated photonics will enable the industry to fully re-imagine data center networks and architectures that are connected by light. We have now demonstrated all of the critical optical technology building blocks on one silicon platform, tightly integrated with CMOS silicon. Our research on tightly integrating photonics with CMOS silicon can systematically eliminate barriers across cost, power and size constraints to bring the transformative power of optical interconnects to server packages,” stated James Jaussi, senior principal engineer and director of PHY Lab, Intel Labs.

Without such advancements, Intel warns the industry will soon reach the practical limits of electrical I/O performance - what it calls an "I/O power wall".



Thursday, November 5, 2020

Ayar Labs raises $35m for its in-package optical interconnect

Ayar Labs, a start-up based in Santa Clara, California closed $35 million in Series B financing for its in-package optical interconnect (I/O) solutions.

Ayar Labs said optical I/O (OIO) solves the major computing bottlenecks in interconnect bandwidth, power consumption, and reach.  The company is developing a monolithic in-package optical I/O (MIPO) solution for applications that require high bandwidth, low latency and power-efficient short-reach interconnects. The company's patented approach uses industry-standard silicon processing techniques to develop high speed, high density, low power optical-based interconnect “chiplets” and lasers to replace traditional electrical-based I/O. The company was founded in 2015. 

Ayar Labs publicly demonstrated its monolithic electronic photonic TeraPHY chiplet at the Supercomputing 2019 conference and is now working with select semiconductor manufacturers, OEM systems builders, and end users. 

The funding round was co-led by Downing Ventures and BlueSky Capital. New investors include Applied Ventures, LLC, Castor Ventures, Downing Ventures (U.K.), and SGInnovate (Singapore), expanding Ayar Labs’ investor base with strategic ecosystem and global investors. Existing investor participation includes BlueSky Capital, Founders Fund, GLOBALFOUNDRIES, Intel Capital, Lockheed Martin Ventures, and Playground Global.

“Over the last year, we have continued to invest and grow our organization, and have demonstrated a number of technology firsts while securing additional customer and ecosystem relationships,” said Charles Wuischpard, CEO of Ayar Labs. “The investment interest from new and existing strategic and financial investors despite these difficult global times allows us to continue executing our long-range plan for making Ayar Labs Optical I/O a ubiquitous computing solution.”

http://www.ayarlabs.com

Ayar Labs has been selected as Intel’s optical I/O solution partner for their recently awarded DARPA PIPES (Photonics in Package for Extreme Scalability) project. The PIPES project aims to develop integrated optical I/O solutions co-packaged with next generation FPGA/CPU/GPU and accelerators in Multi-Chip Packages (MCP) to provide extreme data rates (input/output) at ultra-low power over much longer distances than supported by current technology....

Ayar raises $24m for TeraPHY chips, appoints CEO

Ayar Labs, a start-up based in Emeryville, California, raised $24 million in Series A funding for its work in silicon photonics for high-speed connectivity. Ayar Labs said it is pursuing a unique silicon photonics approach that uses fiber optic technology to move data between chips, rather than traditional copper pins and wires. It delivers improvements of 10x more bandwidth and 10x lower power compared to electrical interconnections. The funding...


Monday, October 12, 2020

Rockley Photonics secures $50 million in funding

 Rockley Photonics, a start-up specializing in integrated optical chips and modules, has closed an additional $50 million of growth funding from leading deep-tech VCs, strategic investors, and institutional funds including Credit Suisse backed SIG-i Capital and Applied Ventures, the venture capital arm of Applied Materials, as well as existing shareholders. To date, Rockley has raised over $225 million of financing to develop its unique silicon photonics platform.

“It is testament to the strength of our technology and emerging market opportunities that we have attracted such a preeminent list of new investors to join many of our existing shareholders in this funding round,” said Andrew Rickman, chief executive officer, Rockley Photonics. “This round provides the funding for Rockley as it moves into the next exciting growth phase and develops next generation disruptive silicon photonics powered healthcare and wellness sensors and communications products for its Tier-1 customers.”

Rockley Photonics was founded by Dr. Andrew Rickman in 2013. The company has offices in Pasadena, San Jose, Oxford, Cardiff, Cork, and Helsinki.

Wednesday, October 7, 2020

Acacia samples 100G coherent DWDM module in QSFP-DD

Acacia Communications has begun sampling a new 100G coherent DWDM pluggable aimed at edge and access applications. 

The new 100G coherent DWDM module , which is offered in the QSFP-DD form factor, is designed to provide scalable traffic aggregation. It also provides an upgrade path to migrate from existing 10G WDM networks to higher-performing 100G DWDM coherent links for new architectures in access networks, such as cable/fiber deep and 5G wireless X-haul applications.

The company said its 3D Siliconization approach, based on silicon photonics, will enable it to achieve high-volume manufacturing with this product. In addition, Acacia’s pluggable coherent solutions in QSFP-DD were designed to enable network scalability to 200G and 400G versions in the future. 

“As with our recently announced 100G point-to-point solutions, Acacia is working to satisfy the requirements of service provider edge and access applications with coherent solutions designed for this market,” said Anuj Malik, Director of Product Management at Acacia Communications. “The benefits of coherent have been demonstrated in the metro, long-haul and submarine markets and, with these new products, Acacia is looking to deliver the same scalability, operational simplicity and improved total cost of ownership to the edge and access space.”

“The edge of the network is evolving, and we’re bringing new solutions to market designed to provide scale and ease of use for new applications around IoT and edge computing,” said Jörg-Peter Elbers, Senior Vice President of Advanced Technology, ADVA. “As service providers upgrade their access and aggregation infrastructure, it is only a matter of time before coherent technologies make inroads in this space. Acacia has been a leading provider of pluggable coherent optics and their latest innovation provides interesting possibilities.” 

http://www.acacia-inc.com 

Thursday, September 3, 2020

Rain Tree Photonics and MaxLinear deliver 400G module for hyperscalers

Singapore-based Rain Tree Photonics (RTP) and MaxLinear announced the availability of a silicon photonics-based solution for 400G-DR4 optical modules for hyperscale data centers.

Rain Tree Photonics’ proprietary photonics engine leverages the company's silicon photonics integration technology and offers high yield and volume scalability. It is also developed to be ready for Co-Packaged Optics (CPO) architectures, while maintaining compatibility with pluggable module architectures.

MaxLinear’s MxL93542 Telluride PAM4 DSP is a key component in the development of high-speed, mega-scale data centers based on 100Gbps single lambda optical interconnects. This SOC and others in the Telluride family are the world’s first DSPs with integrated electro-absorption modulated laser (EA-EML) drivers for 100/400Gbps optical interconnects and breakout mode clocking support for 400Gbps DR4 optical modules.

The RTP1908, RTP’s 400G-DR4 silicon photonic engine, integrates multiple photonic devices allowing all 4 channels to fit into a tiny chip footprint. Each channel also features RTP’s energy-efficient modulator which is directly driven by the MxL93542’s integrated EA-EML driver. The entire photonic circuit is optimized for low optical insertion loss and features large mode-field-diameter fiber couplers that ensure high yield with standard packaging lines.

The MxL93542 16nm CMOS PAM4 DSP SoC consumes an extremely low 6.7W of power, which includes the integrated EA-EML driver power dissipation. The minimal power consumption of the MxL93542 meets the stringent power constraints of 400Gbps optical module form-factors, including QSFP-DD, OSFP and COBO devices.

“MaxLinear’s MxL93542 PAM4 DSP with integrated quad-channel EML drivers provides outstanding cost benefits for 400G-DR4 optical module customers. Driver integration also simplifies the module design, which together with RTP’s fabless++ approach, improves NPI cycle-time for customer adoption,” said Dr. Huang Ying, Co-founder at Rain Tree Photonics. “The MxL93542’s integrated drivers also work well with the high-efficiency, low-drive silicon photonic modulators in the RTP1908, achieving excellent TDECQ and OMA performance.”

“We are pleased with the successful pairing of the MxL93542 with Rain Tree Photonics’ RTP1908 silicon photonics engine to provide a compelling integrated solution for 400G-DR4 modules,” said Will Torgerson, Vice President and General Manager of MaxLinear’s High-Speed Interconnect Group. “The highly integrated Telluride DSPs offer superior link-margin performance and industry-leading power consumption.”


Wednesday, July 1, 2020

KVH leverages photonic integrated chip for inertial measurement

KVH Industries, which specializes in high-performance sensors and integrated inertial systems for military applications, introduced a new inertial measurement unit (IMU) that levergages its own photonic integrated chip (PIC) technology.

KVH’s PIC Inside technology features an integrated planar optical chip that replaces individual fiber optic components to simplify production while maintaining or improving accuracy and performance. The company says its PIC Inside product is designed to deliver 20 times higher accuracy than less expensive MEMS inertial measurement units, uses modular designs for ease of integration, and has outstanding repeatability unit-to-unit.

One of the first customers has integrated the P-1775 IMU with PIC Inside into their next-generation rocket launch vehicle.

“I applaud the tremendous effort by our incredible engineers in developing this groundbreaking technology and I am thrilled that we have begun to incorporate PIC Inside technology into our existing products, a process that we expect to continue throughout the year,” says Martin Kits van Heyningen, KVH CEO.

Last year, KVH announced that it had delivered its first product prototypes containing PIC technology to leading automotive customers and presented the science behind the technology to an audience of engineers at a leading inertial sensor conference, describing the extensive development, testing, and benefits of the new technology.

http://www.kvh.com

Thursday, May 21, 2020

Nokia debuts WaveFabric Elements: photonic chips, devices, subsystems

Nokia unveiled its WaveFabric Elements portfolio of photonic chips, devices and subsystems, including its fifth generation coherent digital signal processor family, the Photonic Service Engine V (PSE-V).
The company said its WaveFabric Elements address the demanding power, performance, and cost-per-bit requirements of 400G networking across data center, metro, core and subsea applications.

Nokia’s WaveFabric Elements portfolio combines digital signal processing (DSP) and optics technologies focused on emerging end-to-end 400G applications. The new, fifth generation coherent DSP family consists of multiple designs optimized for different optical networking applications, form factors, and platforms. These include:

  • PSE-Vs (super coherent), which can run up to 90 Gbaud and employ the second generation of Nokia Bell Labs-pioneered probabilistic constellation shaping (PCS). PSE-Vs are capable of transporting up to 800G, while providing 60% greater reach, 40% lower power per bit, and 15% greater spectral efficiency than previous DSP generations. 
  • PSE-Vc (compact), which enables programmable capacity from 100G to 400G with metro to long haul capability. Its extremely low power enables integration into a variety of pluggable transceiver modules.

The new DSPs are complemented by the CSTAR portfolio of coherent optical modules from its recent acquisition of Elenion Technologies. CSTAR leverages state-of-the-art silicon photonics and packaging technology, and addresses applications, including intra-data center, metro DCI and long-reach optical transport. In addition to pairing them with the new PSE-V DSPs within Nokia platforms, the company will sell them independently to industry partners for integration into pluggable transceiver modules available to the broader market.

The CSTAR family of optical engines is currently shipping to customers. PSE-V-based platforms and pluggables will be available beginning in Q4 2020.

Sam Bucci, Head of Optical Networks at Nokia, said: "Networks are truly at an inflection point, and 400G will be a catalyst for a significant transformation. With our WaveFabric Elements portfolio, Nokia is committed to supplying the 400G optical ecosystem with components, subsystems and design services, as well as continuing to build the highest performing optical transport solutions for the 400G era and beyond."



https://www.nokia.com/networks/technologies/pse-super-coherent-technology/

Nokia to acquire Elenion for silicon photonics

Nokia agreed to acquire Elenion a start-up developing silicon photonics-based System-on-Chip solutions that can be produced in a CMOS foundry. Financial terms were not disclosed.

Elenion, which was founded in 2014 and is based in New York City, develops highly integrated, low-cost silicon photonics technologies for short-reach and high-performance optical interfaces and has pioneered a design toolset which enables a greatly simplified, low cost, scalable manufacturing process. The Elenion platform simplifies integration with optical chipsets, lowers power consumption, improves port density and helps to lower the overall cost per bit for network operators.

Nokia said Elenion's state-of-the-art silicon photonics design platform improves product costs by bringing simplification and scale to the optical supply chain. It is expected to bring time-to-market and cost advantages to Nokia’s broad portfolio of networking solutions.

Wednesday, March 25, 2020

Nokia completes acquisition of Elenion Technologies

Nokia completed its previously announced acquisition of   Elenion Technologies, a U.S.-based company focusing on silicon photonics technology. Financial terms were not disclosed.

Elenion, which was founded in 2014 and is based in New York City, develops highly integrated, low-cost silicon photonics technologies for short-reach and high-performance optical interfaces and has pioneered a design toolset which enables a greatly simplified, low cost, scalable manufacturing process. The Elenion platform simplifies integration with optical chipsets, lowers power consumption, improves port density and helps to lower the overall cost per bit for network operators.

Nokia said Elenion's state-of-the-art silicon photonics design platform improves product costs by bringing simplification and scale to the optical supply chain. It is expected to bring time-to-market and cost advantages to Nokia’s broad portfolio of networking solutions.

Thursday, March 5, 2020

Acacia samples 400ZR, OpenZR+, Open ROADM MSA

Acacia Communications has begun sampling multiple variants in its family of 400G pluggable optical transceiver modules, including 400ZR, OpenZR+, and Open ROADM MSA. Volume production is expected in the second half of 2020.

Acacia’s 400G pluggable module family features an expansive list of interoperability solutions in QSFP-DD, OSFP and CFP2-DCO pluggable form factors for cloud data center interconnects (DCIs) and service provider networks. The modules are based on Acacia's Greylock 7nm DSP, its 3rd generation of coherent DSP. The company is pursuing a 3D Siliconization approach that allows for high volume manufacturing processes.

OpenZR represents the combination of 400ZR and the Open ROADM MSA. It targets metro regional DCI applications.

Acacia said 400G pluggable modules represent a key architectural change in high-bandwidth data center interconnects because they can be plugged directly into switches and routers offering the same density for both coherent DWDM and client optics in the same chassis.

“We’re excited to be successfully passing traffic in the lab with the Acacia 400G-OSFP-ZR module in our 7000 Series switches and routers,” said Hacene Chaouch, Distinguished Engineer at Arista Networks. “400ZR is critical to meeting customer demand for growing data center interconnect bandwidth and we believe the thermal and optical performance of Acacia’s coherent platform in the OSFP form factor will provide network operators with a very reliable and power efficient solution.”

“Acacia is reinforcing its coherent pluggable leadership by sampling 400G technology in multiple form factors,” said Andrew Schmitt, Directing Analyst at Cignal AI. “Interoperable 400G solutions have the potential to transform cloud DCI and traditional operator architectures and create new applications for coherent optics at the edge of the network.”

Acacia also noted the following company milestones
> 200,000 coherent silicon photonic integrated circuits
> 400,000 coherent DSP ports
> 125,000 pluggable DCO modules

Wednesday, February 19, 2020

Nokia to acquire Elenion for silicon photonics

Nokia agreed to acquire Elenion a start-up developing silicon photonics-based System-on-Chip solutions that can be produced in a CMOS foundry. Financial terms were not disclosed.

Elenion, which was founded in 2014 and is based in New York City, develops highly integrated, low-cost silicon photonics technologies for short-reach and high-performance optical interfaces and has pioneered a design toolset which enables a greatly simplified, low cost, scalable manufacturing process. The Elenion platform simplifies integration with optical chipsets, lowers power consumption, improves port density and helps to lower the overall cost per bit for network operators.

Nokia said Elenion's state-of-the-art silicon photonics design platform improves product costs by bringing simplification and scale to the optical supply chain. It is expected to bring time-to-market and cost advantages to Nokia’s broad portfolio of networking solutions.

Sam Bucci, Head of Optical Networking at Nokia, said: “As a world-class provider of silicon photonics solutions, advanced packaging and custom design services, Elenion provides a strong strategic fit for Nokia. Its solutions can be readily integrated into Nokia’s product offerings and address multiple high growth segments including 5G, cloud and data center networking. When combined with Nokia, Elenion technologies will accelerate the growth and scale of Nokia’s optical networking business, while enabling us to cost-effectively address new markets.”

Larry Schwerin, CEO of Elenion Technologies, said: “Nokia is an industry leader in networking systems, including advanced coherent optical interfaces and hyperscale datacenter solutions. Elenion benefits by having its technology incorporated into an industry-leading portfolio and with a company offering solutions across a wide array of networking applications. Nokia’s strong optical industry leadership, size, scale, global reach, and ongoing commitment to investment in key technologies vastly accelerates the adoption of Elenion silicon photonics technology.”


Elenion debuts Silicon Photonic BGA Packaged Coherent Optical Sub-Assembly

Elenion Technologies, a start-up developing silicon photonics-based System-on-Chip solutions, announced its next-generation Coherent Silicon Transmitter and Receiver CSTAR optical BGA platform for transmission of up to 600G on a single wavelength, as well as new small form factors for compact pluggable modules such as OIF 400G ZR QSFP-DD.

The CSTAR-200 is a DSP agnostic, coherent optical engine that enables pluggables such as CFP2-DCO and on-board applications, from data center interconnect to long haul in 100/200G coherent optical communication links.

“We are excited to be partnering with Elenion on our award winning CFP2-DCO. Elenion’s CSTAR platform allows us to offer differentiated coherent solutions to our customers,” said Siraj ElAhmadi, President & General Manager, Menara Networks.

The CSTAR platform comprises a multi-chip-module (MCM) and integrates Elenion’s advanced Silicon Photonics and RFICs. Integrated into a non-hermetic BGA package, CSTAR offers the next generation coherent optical engine for todays and future 100 to 600Gb/s Network applications.

“From the beginning at Elenion, we’ve built our silicon photonic chips in a production CMOS fab, which enables us to build complex optical devices. Having leveraged on-chip complexity to eliminate all of the isolators, lenses, and other free space optics from our package, Elenion is taking these chips and having them assembled in a production electronics-attach environment, reusing the infrastructure investment from the ASIC industry. We believe that this is a milestone for the silicon photonics industry, and represents an inflection point with regard to the cost of packaging for silicon photonics and integrated photonic components in general,” said Michael Hochberg, CTO, Elenion.

Thursday, January 9, 2020

Inphi milestone: 100,000 COLORZ silicon photonics PAM4 units shipped

Inphi noted a company milestone -- the shipment of more than 100,000 COLORZ units, its Silicon Photonics PAM4 platform solution for 80km DWDM connectivity in a QSFP28 form factor.

Inphi said its unique approach in integrating PAM4 CMOS with silicon photonics enables the platform to achieve a 60% in cost and a 75% in power savings. Accomplishing the COLORZ ramp to 100k within a span of only three years also validates the network inflection point in the adoption of switch pluggable DWDM optics.

Initially developed for the requirements of Microsoft, the COLORZ platform solution has now been deployed by more than 40 network operators, ranging from wireless carriers to military and educational networks. The operational simplicity combined with the economic value proposition continues to drive the adoption of COLORZ in the market place.

“We are excited to announce this milestone as its both an extraordinary achievement for the DCI market and for Inphi,” said Dr. Ford Tamer, Chief Executive Officer at Inphi. “This significant accomplishment underscores Inphi’s commitment to delivering technological innovations that dramatically increase the speed of data movement between data centers and help reduce total cost of ownership for cloud network operators.”

Yousef Khalidi, Corporate Vice President, Azure Networking, Microsoft Corp. said, “Inphi shares our vision for DCI connectivity and we applaud their achievement of a significant milestone. Inphi’s COLORZ platform has been an important contributor to Microsoft’s high bandwidth metro design, to help enable greater cloud performance in a highly scalable solution.”

http://www.inphi.com