Showing posts with label Silicon Photonics. Show all posts
Showing posts with label Silicon Photonics. Show all posts

Thursday, November 5, 2020

Ayar Labs raises $35m for its in-package optical interconnect

Ayar Labs, a start-up based in Santa Clara, California closed $35 million in Series B financing for its in-package optical interconnect (I/O) solutions.

Ayar Labs said optical I/O (OIO) solves the major computing bottlenecks in interconnect bandwidth, power consumption, and reach.  The company is developing a monolithic in-package optical I/O (MIPO) solution for applications that require high bandwidth, low latency and power-efficient short-reach interconnects. The company's patented approach uses industry-standard silicon processing techniques to develop high speed, high density, low power optical-based interconnect “chiplets” and lasers to replace traditional electrical-based I/O. The company was founded in 2015. 

Ayar Labs publicly demonstrated its monolithic electronic photonic TeraPHY chiplet at the Supercomputing 2019 conference and is now working with select semiconductor manufacturers, OEM systems builders, and end users. 

The funding round was co-led by Downing Ventures and BlueSky Capital. New investors include Applied Ventures, LLC, Castor Ventures, Downing Ventures (U.K.), and SGInnovate (Singapore), expanding Ayar Labs’ investor base with strategic ecosystem and global investors. Existing investor participation includes BlueSky Capital, Founders Fund, GLOBALFOUNDRIES, Intel Capital, Lockheed Martin Ventures, and Playground Global.

“Over the last year, we have continued to invest and grow our organization, and have demonstrated a number of technology firsts while securing additional customer and ecosystem relationships,” said Charles Wuischpard, CEO of Ayar Labs. “The investment interest from new and existing strategic and financial investors despite these difficult global times allows us to continue executing our long-range plan for making Ayar Labs Optical I/O a ubiquitous computing solution.”

http://www.ayarlabs.com

Ayar Labs has been selected as Intel’s optical I/O solution partner for their recently awarded DARPA PIPES (Photonics in Package for Extreme Scalability) project. The PIPES project aims to develop integrated optical I/O solutions co-packaged with next generation FPGA/CPU/GPU and accelerators in Multi-Chip Packages (MCP) to provide extreme data rates (input/output) at ultra-low power over much longer distances than supported by current technology....

Ayar raises $24m for TeraPHY chips, appoints CEO

Ayar Labs, a start-up based in Emeryville, California, raised $24 million in Series A funding for its work in silicon photonics for high-speed connectivity. Ayar Labs said it is pursuing a unique silicon photonics approach that uses fiber optic technology to move data between chips, rather than traditional copper pins and wires. It delivers improvements of 10x more bandwidth and 10x lower power compared to electrical interconnections. The funding...


Monday, October 12, 2020

Rockley Photonics secures $50 million in funding

 Rockley Photonics, a start-up specializing in integrated optical chips and modules, has closed an additional $50 million of growth funding from leading deep-tech VCs, strategic investors, and institutional funds including Credit Suisse backed SIG-i Capital and Applied Ventures, the venture capital arm of Applied Materials, as well as existing shareholders. To date, Rockley has raised over $225 million of financing to develop its unique silicon photonics platform.

“It is testament to the strength of our technology and emerging market opportunities that we have attracted such a preeminent list of new investors to join many of our existing shareholders in this funding round,” said Andrew Rickman, chief executive officer, Rockley Photonics. “This round provides the funding for Rockley as it moves into the next exciting growth phase and develops next generation disruptive silicon photonics powered healthcare and wellness sensors and communications products for its Tier-1 customers.”

Rockley Photonics was founded by Dr. Andrew Rickman in 2013. The company has offices in Pasadena, San Jose, Oxford, Cardiff, Cork, and Helsinki.

Wednesday, October 7, 2020

Acacia samples 100G coherent DWDM module in QSFP-DD

Acacia Communications has begun sampling a new 100G coherent DWDM pluggable aimed at edge and access applications. 

The new 100G coherent DWDM module , which is offered in the QSFP-DD form factor, is designed to provide scalable traffic aggregation. It also provides an upgrade path to migrate from existing 10G WDM networks to higher-performing 100G DWDM coherent links for new architectures in access networks, such as cable/fiber deep and 5G wireless X-haul applications.

The company said its 3D Siliconization approach, based on silicon photonics, will enable it to achieve high-volume manufacturing with this product. In addition, Acacia’s pluggable coherent solutions in QSFP-DD were designed to enable network scalability to 200G and 400G versions in the future. 

“As with our recently announced 100G point-to-point solutions, Acacia is working to satisfy the requirements of service provider edge and access applications with coherent solutions designed for this market,” said Anuj Malik, Director of Product Management at Acacia Communications. “The benefits of coherent have been demonstrated in the metro, long-haul and submarine markets and, with these new products, Acacia is looking to deliver the same scalability, operational simplicity and improved total cost of ownership to the edge and access space.”

“The edge of the network is evolving, and we’re bringing new solutions to market designed to provide scale and ease of use for new applications around IoT and edge computing,” said Jörg-Peter Elbers, Senior Vice President of Advanced Technology, ADVA. “As service providers upgrade their access and aggregation infrastructure, it is only a matter of time before coherent technologies make inroads in this space. Acacia has been a leading provider of pluggable coherent optics and their latest innovation provides interesting possibilities.” 

http://www.acacia-inc.com 

Thursday, September 3, 2020

Rain Tree Photonics and MaxLinear deliver 400G module for hyperscalers

Singapore-based Rain Tree Photonics (RTP) and MaxLinear announced the availability of a silicon photonics-based solution for 400G-DR4 optical modules for hyperscale data centers.

Rain Tree Photonics’ proprietary photonics engine leverages the company's silicon photonics integration technology and offers high yield and volume scalability. It is also developed to be ready for Co-Packaged Optics (CPO) architectures, while maintaining compatibility with pluggable module architectures.

MaxLinear’s MxL93542 Telluride PAM4 DSP is a key component in the development of high-speed, mega-scale data centers based on 100Gbps single lambda optical interconnects. This SOC and others in the Telluride family are the world’s first DSPs with integrated electro-absorption modulated laser (EA-EML) drivers for 100/400Gbps optical interconnects and breakout mode clocking support for 400Gbps DR4 optical modules.

The RTP1908, RTP’s 400G-DR4 silicon photonic engine, integrates multiple photonic devices allowing all 4 channels to fit into a tiny chip footprint. Each channel also features RTP’s energy-efficient modulator which is directly driven by the MxL93542’s integrated EA-EML driver. The entire photonic circuit is optimized for low optical insertion loss and features large mode-field-diameter fiber couplers that ensure high yield with standard packaging lines.

The MxL93542 16nm CMOS PAM4 DSP SoC consumes an extremely low 6.7W of power, which includes the integrated EA-EML driver power dissipation. The minimal power consumption of the MxL93542 meets the stringent power constraints of 400Gbps optical module form-factors, including QSFP-DD, OSFP and COBO devices.

“MaxLinear’s MxL93542 PAM4 DSP with integrated quad-channel EML drivers provides outstanding cost benefits for 400G-DR4 optical module customers. Driver integration also simplifies the module design, which together with RTP’s fabless++ approach, improves NPI cycle-time for customer adoption,” said Dr. Huang Ying, Co-founder at Rain Tree Photonics. “The MxL93542’s integrated drivers also work well with the high-efficiency, low-drive silicon photonic modulators in the RTP1908, achieving excellent TDECQ and OMA performance.”

“We are pleased with the successful pairing of the MxL93542 with Rain Tree Photonics’ RTP1908 silicon photonics engine to provide a compelling integrated solution for 400G-DR4 modules,” said Will Torgerson, Vice President and General Manager of MaxLinear’s High-Speed Interconnect Group. “The highly integrated Telluride DSPs offer superior link-margin performance and industry-leading power consumption.”


Wednesday, July 1, 2020

KVH leverages photonic integrated chip for inertial measurement

KVH Industries, which specializes in high-performance sensors and integrated inertial systems for military applications, introduced a new inertial measurement unit (IMU) that levergages its own photonic integrated chip (PIC) technology.

KVH’s PIC Inside technology features an integrated planar optical chip that replaces individual fiber optic components to simplify production while maintaining or improving accuracy and performance. The company says its PIC Inside product is designed to deliver 20 times higher accuracy than less expensive MEMS inertial measurement units, uses modular designs for ease of integration, and has outstanding repeatability unit-to-unit.

One of the first customers has integrated the P-1775 IMU with PIC Inside into their next-generation rocket launch vehicle.

“I applaud the tremendous effort by our incredible engineers in developing this groundbreaking technology and I am thrilled that we have begun to incorporate PIC Inside technology into our existing products, a process that we expect to continue throughout the year,” says Martin Kits van Heyningen, KVH CEO.

Last year, KVH announced that it had delivered its first product prototypes containing PIC technology to leading automotive customers and presented the science behind the technology to an audience of engineers at a leading inertial sensor conference, describing the extensive development, testing, and benefits of the new technology.

http://www.kvh.com

Thursday, May 21, 2020

Nokia debuts WaveFabric Elements: photonic chips, devices, subsystems

Nokia unveiled its WaveFabric Elements portfolio of photonic chips, devices and subsystems, including its fifth generation coherent digital signal processor family, the Photonic Service Engine V (PSE-V).
The company said its WaveFabric Elements address the demanding power, performance, and cost-per-bit requirements of 400G networking across data center, metro, core and subsea applications.

Nokia’s WaveFabric Elements portfolio combines digital signal processing (DSP) and optics technologies focused on emerging end-to-end 400G applications. The new, fifth generation coherent DSP family consists of multiple designs optimized for different optical networking applications, form factors, and platforms. These include:

  • PSE-Vs (super coherent), which can run up to 90 Gbaud and employ the second generation of Nokia Bell Labs-pioneered probabilistic constellation shaping (PCS). PSE-Vs are capable of transporting up to 800G, while providing 60% greater reach, 40% lower power per bit, and 15% greater spectral efficiency than previous DSP generations. 
  • PSE-Vc (compact), which enables programmable capacity from 100G to 400G with metro to long haul capability. Its extremely low power enables integration into a variety of pluggable transceiver modules.

The new DSPs are complemented by the CSTAR portfolio of coherent optical modules from its recent acquisition of Elenion Technologies. CSTAR leverages state-of-the-art silicon photonics and packaging technology, and addresses applications, including intra-data center, metro DCI and long-reach optical transport. In addition to pairing them with the new PSE-V DSPs within Nokia platforms, the company will sell them independently to industry partners for integration into pluggable transceiver modules available to the broader market.

The CSTAR family of optical engines is currently shipping to customers. PSE-V-based platforms and pluggables will be available beginning in Q4 2020.

Sam Bucci, Head of Optical Networks at Nokia, said: "Networks are truly at an inflection point, and 400G will be a catalyst for a significant transformation. With our WaveFabric Elements portfolio, Nokia is committed to supplying the 400G optical ecosystem with components, subsystems and design services, as well as continuing to build the highest performing optical transport solutions for the 400G era and beyond."



https://www.nokia.com/networks/technologies/pse-super-coherent-technology/

Nokia to acquire Elenion for silicon photonics

Nokia agreed to acquire Elenion a start-up developing silicon photonics-based System-on-Chip solutions that can be produced in a CMOS foundry. Financial terms were not disclosed.

Elenion, which was founded in 2014 and is based in New York City, develops highly integrated, low-cost silicon photonics technologies for short-reach and high-performance optical interfaces and has pioneered a design toolset which enables a greatly simplified, low cost, scalable manufacturing process. The Elenion platform simplifies integration with optical chipsets, lowers power consumption, improves port density and helps to lower the overall cost per bit for network operators.

Nokia said Elenion's state-of-the-art silicon photonics design platform improves product costs by bringing simplification and scale to the optical supply chain. It is expected to bring time-to-market and cost advantages to Nokia’s broad portfolio of networking solutions.

Wednesday, March 25, 2020

Nokia completes acquisition of Elenion Technologies

Nokia completed its previously announced acquisition of   Elenion Technologies, a U.S.-based company focusing on silicon photonics technology. Financial terms were not disclosed.

Elenion, which was founded in 2014 and is based in New York City, develops highly integrated, low-cost silicon photonics technologies for short-reach and high-performance optical interfaces and has pioneered a design toolset which enables a greatly simplified, low cost, scalable manufacturing process. The Elenion platform simplifies integration with optical chipsets, lowers power consumption, improves port density and helps to lower the overall cost per bit for network operators.

Nokia said Elenion's state-of-the-art silicon photonics design platform improves product costs by bringing simplification and scale to the optical supply chain. It is expected to bring time-to-market and cost advantages to Nokia’s broad portfolio of networking solutions.

Thursday, March 5, 2020

Acacia samples 400ZR, OpenZR+, Open ROADM MSA

Acacia Communications has begun sampling multiple variants in its family of 400G pluggable optical transceiver modules, including 400ZR, OpenZR+, and Open ROADM MSA. Volume production is expected in the second half of 2020.

Acacia’s 400G pluggable module family features an expansive list of interoperability solutions in QSFP-DD, OSFP and CFP2-DCO pluggable form factors for cloud data center interconnects (DCIs) and service provider networks. The modules are based on Acacia's Greylock 7nm DSP, its 3rd generation of coherent DSP. The company is pursuing a 3D Siliconization approach that allows for high volume manufacturing processes.

OpenZR represents the combination of 400ZR and the Open ROADM MSA. It targets metro regional DCI applications.

Acacia said 400G pluggable modules represent a key architectural change in high-bandwidth data center interconnects because they can be plugged directly into switches and routers offering the same density for both coherent DWDM and client optics in the same chassis.

“We’re excited to be successfully passing traffic in the lab with the Acacia 400G-OSFP-ZR module in our 7000 Series switches and routers,” said Hacene Chaouch, Distinguished Engineer at Arista Networks. “400ZR is critical to meeting customer demand for growing data center interconnect bandwidth and we believe the thermal and optical performance of Acacia’s coherent platform in the OSFP form factor will provide network operators with a very reliable and power efficient solution.”

“Acacia is reinforcing its coherent pluggable leadership by sampling 400G technology in multiple form factors,” said Andrew Schmitt, Directing Analyst at Cignal AI. “Interoperable 400G solutions have the potential to transform cloud DCI and traditional operator architectures and create new applications for coherent optics at the edge of the network.”

Acacia also noted the following company milestones
> 200,000 coherent silicon photonic integrated circuits
> 400,000 coherent DSP ports
> 125,000 pluggable DCO modules

Wednesday, February 19, 2020

Nokia to acquire Elenion for silicon photonics

Nokia agreed to acquire Elenion a start-up developing silicon photonics-based System-on-Chip solutions that can be produced in a CMOS foundry. Financial terms were not disclosed.

Elenion, which was founded in 2014 and is based in New York City, develops highly integrated, low-cost silicon photonics technologies for short-reach and high-performance optical interfaces and has pioneered a design toolset which enables a greatly simplified, low cost, scalable manufacturing process. The Elenion platform simplifies integration with optical chipsets, lowers power consumption, improves port density and helps to lower the overall cost per bit for network operators.

Nokia said Elenion's state-of-the-art silicon photonics design platform improves product costs by bringing simplification and scale to the optical supply chain. It is expected to bring time-to-market and cost advantages to Nokia’s broad portfolio of networking solutions.

Sam Bucci, Head of Optical Networking at Nokia, said: “As a world-class provider of silicon photonics solutions, advanced packaging and custom design services, Elenion provides a strong strategic fit for Nokia. Its solutions can be readily integrated into Nokia’s product offerings and address multiple high growth segments including 5G, cloud and data center networking. When combined with Nokia, Elenion technologies will accelerate the growth and scale of Nokia’s optical networking business, while enabling us to cost-effectively address new markets.”

Larry Schwerin, CEO of Elenion Technologies, said: “Nokia is an industry leader in networking systems, including advanced coherent optical interfaces and hyperscale datacenter solutions. Elenion benefits by having its technology incorporated into an industry-leading portfolio and with a company offering solutions across a wide array of networking applications. Nokia’s strong optical industry leadership, size, scale, global reach, and ongoing commitment to investment in key technologies vastly accelerates the adoption of Elenion silicon photonics technology.”


Elenion debuts Silicon Photonic BGA Packaged Coherent Optical Sub-Assembly

Elenion Technologies, a start-up developing silicon photonics-based System-on-Chip solutions, announced its next-generation Coherent Silicon Transmitter and Receiver CSTAR optical BGA platform for transmission of up to 600G on a single wavelength, as well as new small form factors for compact pluggable modules such as OIF 400G ZR QSFP-DD.

The CSTAR-200 is a DSP agnostic, coherent optical engine that enables pluggables such as CFP2-DCO and on-board applications, from data center interconnect to long haul in 100/200G coherent optical communication links.

“We are excited to be partnering with Elenion on our award winning CFP2-DCO. Elenion’s CSTAR platform allows us to offer differentiated coherent solutions to our customers,” said Siraj ElAhmadi, President & General Manager, Menara Networks.

The CSTAR platform comprises a multi-chip-module (MCM) and integrates Elenion’s advanced Silicon Photonics and RFICs. Integrated into a non-hermetic BGA package, CSTAR offers the next generation coherent optical engine for todays and future 100 to 600Gb/s Network applications.

“From the beginning at Elenion, we’ve built our silicon photonic chips in a production CMOS fab, which enables us to build complex optical devices. Having leveraged on-chip complexity to eliminate all of the isolators, lenses, and other free space optics from our package, Elenion is taking these chips and having them assembled in a production electronics-attach environment, reusing the infrastructure investment from the ASIC industry. We believe that this is a milestone for the silicon photonics industry, and represents an inflection point with regard to the cost of packaging for silicon photonics and integrated photonic components in general,” said Michael Hochberg, CTO, Elenion.

Thursday, January 9, 2020

Inphi milestone: 100,000 COLORZ silicon photonics PAM4 units shipped

Inphi noted a company milestone -- the shipment of more than 100,000 COLORZ units, its Silicon Photonics PAM4 platform solution for 80km DWDM connectivity in a QSFP28 form factor.

Inphi said its unique approach in integrating PAM4 CMOS with silicon photonics enables the platform to achieve a 60% in cost and a 75% in power savings. Accomplishing the COLORZ ramp to 100k within a span of only three years also validates the network inflection point in the adoption of switch pluggable DWDM optics.

Initially developed for the requirements of Microsoft, the COLORZ platform solution has now been deployed by more than 40 network operators, ranging from wireless carriers to military and educational networks. The operational simplicity combined with the economic value proposition continues to drive the adoption of COLORZ in the market place.

“We are excited to announce this milestone as its both an extraordinary achievement for the DCI market and for Inphi,” said Dr. Ford Tamer, Chief Executive Officer at Inphi. “This significant accomplishment underscores Inphi’s commitment to delivering technological innovations that dramatically increase the speed of data movement between data centers and help reduce total cost of ownership for cloud network operators.”

Yousef Khalidi, Corporate Vice President, Azure Networking, Microsoft Corp. said, “Inphi shares our vision for DCI connectivity and we applaud their achievement of a significant milestone. Inphi’s COLORZ platform has been an important contributor to Microsoft’s high bandwidth metro design, to help enable greater cloud performance in a highly scalable solution.”

http://www.inphi.com

Thursday, December 19, 2019

Silicon-based optical parametric oscillator transforms wavelengths

Researchers from the National Institute of Standards and Technology (NIST), University of Maryland, and University of Colorado are developing a new optical parametric oscillator (OPO) light source that can produce output light at different wavelength than the input light. In addition to creating light at visible wavelengths, the OPO simultaneously generates near-infrared wavelengths that can be used for telecom applications.

The research is published in Optica, The Optical Society's (OSA) journal.

“Our power-efficient and flexible approach generates coherent laser light across a range of wavelengths wider than what is accessible from direct chip-integrated lasers,” said research team leader Kartik Srinivasan. “The on-chip creation of visible light can be used as part of highly functional compact devices such as chip-based atomic clocks or devices for portable biochemical analyses. Developing the OPO in a silicon photonics platform creates the potential for scalable manufacturing of these devices in commercial fabrication foundries, which could make this approach very cost-effective.”

“Nonlinear optical technologies are already used as integral components of lasers in the world’s best atomic clocks and many laboratory spectroscopy systems,” said Xiyuan Lu, first author of the paper and a NIST-University of Maryland postdoctoral scholar. “Being able to access different types of nonlinear optical functionality, including OPOs, within integrated photonics is important for transitioning technologies currently based in laboratories into platforms that are portable and can be deployed in the field.”

The Optical Society said the silicon-based device may enable variety of photonic applications across a range of wavelengths.

Some highlights:
The OPO based on a microring made from silicon nitride.
It is fed by approximately 1 milliwatt of infrared laser power — about the same amount of power found in a laser pointer.
As the light travels around the microring it increases in optical intensity until powerful enough to create a non-linear optical response in silicon nitride.
This enables frequency conversion, a nonlinear process that can be used to produce an output wavelength, or frequency, that is different from that of the light going into the system.
The device was used to convert 900-nanometer input light to 700-nanometer-wavelength (visible) and 1300-nanometer-wavelength (telecommunications) bands.
The OPO accomplished this using less than 2 percent of the pump laser power required by previously reported microresonator OPOs developed for generating widely separated output colors.

number of compact chip lasers combined with flexible and versatile nonlinear nanophotonics.”

Paper: X. Lu, G. Moille, A. Singh, Q. Li, D. A. Westly, A. Rao, S.-P. Yu, T. C. Briles, S. B. Papp, K. Srinivasan, “Milliwatt-threshold visible-telecom optical parametric oscillation using silicon nanophotonics,” Optica, 6, 12, 1535-1541 (2019).
DOI: https://doi.org/10.1364/OPTICA.6.001535

https://www.osapublishing.org/optica/home.cfm

Sunday, December 8, 2019

Inphi qualifies TowerJazz for data center PIC production

Inphi has qualified TowerJazz for production of silicon photonics integrated circuits (PICs) for data center interconnects based on TowerJazz’s open foundry Silicon Photonics platform.

TowerJazz said its PH18 Silicon Photonics platform offers a rich set of optical components including ultra-high bandwidth modulators, and photodetectors, serving the demand in data center and infrastructure optical communication markets. This platform complements TowerJazz’s SiGe BiCMOS processes, providing enhanced solutions to its already strong customer base serving optical communication needs in the growing data transport markets.

Inphi’s Silicon Photonics PAM4 technology is the first low power, 100G DWDM platform in QSFP28 form factor for between data center interconnects.

“We worked with TowerJazz due to their unique ability to develop new cutting edge technology and offer it in a high-volume, high-quality environment. With Inphi’s proven design expertise and first to market success in the areas of high electrical and optical speed data interconnects, we are looking forward to the continued partnership with TowerJazz in developing the next generation of Silicon Photonics Integrated Circuit components,” said Dr. Radha Nagarajan, CTO, Interconnect, Inphi.

“TowerJazz is proud to have partnered with a market and product leader such as Inphi in the area of Silicon Photonics. Further, we are excited about this open foundry Silicon Photonic platform complementing our SiGe technology and bringing additional value to our customers as they develop new, breakthrough products for Data Center and 5G Infrastructure markets,” said Dr. Marco Racanelli, TowerJazz Sr. Vice President and General Manager of Analog IC Business Unit.

https://towerjazz.com/2019/12/04/04122019/

Tuesday, July 2, 2019

Rockley Photonics raises $52 million

Rockley Photonics, a start-up based in Oxford, UK, announced US$52 million in the first closure in its Series E funding round for its silicon photonics technology.

Rockley Photonics, which was formed in 2013, developed a third-generation silicon photonics platform specifically designed for the optical I/O challenges facing next-generation sensor systems and communications networks. The company says its platform exploits optimized waveguide dimensions.

Andrew Rickman, chief executive officer at Rockley added: “Rockley is uniquely positioned having developed a proprietary photonics platform and manufacturing technologies, underpinned by a depth of expertise that goes back some 30 years. We are currently using our platform to address applications in the data center and high-performance computing, medical and life sciences, and 3D imaging/sensing verticals with the potential for additional verticals in the future.”

Mahesh Karanth, chief financial officer at Rockley explained: “With this latest round of investment, Rockley is strengthening its position as a leading integrated silicon photonics solutions provider. It will support the full execution of our business plan and continued growth as we make significant strides in co-packaging for optoASICs and data center connectivity, LiDAR and consumer electronic applications.”

Investors in the lastest funding round include a key strategic partner, Morningside Technology Ventures and numerous private investors. The company has now raised $165 million to date.

www.rockleyphotonics.com

Tuesday, December 18, 2018

Cisco to acquire Luxtera for silicon photonics -- $660M

Cisco agreed to acquire privately-held Luxtera, a developer of silicon photonic technologies, for $660 million in cash and assumed equity awards.

Luxtera, which is based in Carlsbad, California, focuses on silicon photonics process and packaging technologies for building integrated optics capabilities for webscale and enterprise data centers, service provider market segments, and other customers.

Luxtera leverages a hybrid integration approach wherein the photonics die forms the base of the transceiver chipset, while the light source and electronics die are attached on top. The company says its ability to integrate all optical components into a single silicon chip enables it to manufacture at wafer scale.

Cisco said the integration of Luxtera will broaden its portfolio of 100GbE and 400GbE optics. Cisco plans to incorporate Luxtera's technology across its intent-based networking portfolio, spanning enterprise, data center and service provider markets.

"With Cisco's 2018 Visual Networking Index projecting that global Internet traffic will increase threefold over the next five years, our customers are facing an exponential demand for Internet bandwidth," said David Goeckeler, executive vice president and general manager, Networking and Security Business at Cisco. "Optics is a fundamental technology to enable this future. Coupled with our silicon and optics innovation, Luxtera will allow our customers to build the biggest, fastest and most efficient networks in the world."

https://newsroom.cisco.com/press-release-content?type=webcontent&articleId=1959037


AT OFC 2018, Luxterra showcased its latest advances in  100G/λ technology, PAM4 signaling, extended reach, increased operating temperature range, liquid immersion cooling, increased density and photonic integration. Product demonstrations included: IEEE802.3bs compliant 400G-DR4 technology platform demonstrating increased throughput and performance in Luxtera’s next-generation products 30km, 50G-PAM4 single-lambda QSFP link demonstrating Luxtera’s extended reach capabilities with PAM4 signaling over duplex fiber 4x25G-LR QSFP28 modules...


Monday, September 24, 2018

ECOC 2018: Intel announces 100G silicon photonics transceivers for 5G

At ECOC 2018, Intel announced new 100G silicon photonics transceivers targetted at 5G wireless fronthaul applications. The new transceivers are designed to meet the harsh outdoor conditions of cellular towers with the capability to support optical transport to the nearest baseband unit or central office (up to 10 km). Commercial availability is expected in Q1 2019.

“Our hyperscale cloud customers are currently using Intel’s 100G silicon photonics transceivers to deliver high-performance data center infrastructure at scale. By extending this technology outside the data center and into 5G infrastructure at the edge of the network, we can provide the same benefits to communications service providers while supporting 5G fronthaul bandwidth needs,” stated Dr. Hong Hou, vice president and general manager of Intel’s Silicon Photonics Product Division.

Intel's first 100G silicon photonics product was introduced in 2016. The company says its 100G data center products are now shipping at a run rate of more than a million units per year.

Intel projects the total market opportunity for its connectivity business, which includes silicon photonics, to grow from $4 billion today to an estimated $11 billion total addressable market by 2022.

From this year's Intel Data Center Innovation Summit in August


Monday, April 23, 2018

MIT: a new technique for assembling on-chip optics and electronics separately

A team of researchers led by groups at MIT, the University of California at Berkeley, and Boston University, have developed a technique for assembling on-chip optics and electronics separately using existing manufacturing processes.

The work, which is described in an article in the latest issue of Nature, allows the addition of optical communication components onto chips with modern transistors.

“The most promising thing about this work is that you can optimize your photonics independently from your electronics,” says Amir Atabaki, a research scientist at MIT’s Research Laboratory of Electronics and one of three first authors on the new paper. “We have different silicon electronic technologies, and if we can just add photonics to them, it’d be a great capability for future communications and computing chips. For example, now we could imagine a microprocessor manufacturer or a GPU manufacturer like Intel or Nvidia saying, ‘This is very nice. We can now have photonic input and output for our microprocessor or GPU.’ And they don’t have to change much in their process to get the performance boost of on-chip optics.”

http://news.mit.edu/2018/integrating-optical-components-existing-chip-designs-0419

Monday, April 24, 2017

IBM Joins AIM Photonics Consortium

IBM and The American Institute for Manufacturing Integrated Photonics (AIM Photonics), announced a patent and intellectual property licensing agreement and confirmed IBM has joined the AIM Photonics consortium, which seeks to advance integrated photonic circuit manufacturing and technology development.

Under the intellectual property licensing agreement , IBM will help AIM Photonics establish standard processes in the development of silicon photonics assemblies, such as couplings for communication signals and light sources. Industry and academic AIM Photonics members will access these technologies through a process design kit (PDK) and prototype development at the Rochester Test Assembly and Packaging (TAP) facility and the 300mm chip facility at SUNY Poly's Albany campus.

"Adding IBM as a member of AIM Photonics not only significantly strengthens this outstanding institute, but highlights the momentum the Finger Lakes region is experiencing in the high tech sector," said John Maggiore, New York State photonics board of officers chairman. "This announcement further validates the importance of this institute and the goals it has set out to achieve."

http://www.ibm.com

Thursday, March 16, 2017

Luxtera Partners with TSMC for Next Gen Silicon Photonics

Luxtera, a global provider of silicon photonics solutions, announced that it has partnered with TSMC for the manufacture of next generation silicon photonics solutions designed for future cloud, mobile infrastructure, enterprise and high-performance computing (HPC) platforms.

Under the agreement, Luxtera and TSMC are developing a new silicon photonics technology platform designed to provide more than double the optical link performance and four times the raw data throughput of competing silicon photonics solution on the market. The new silicon photonics platform will also enable full SoC integration of optical interconnect with the CMOS logic for applications such as network switch, storage or compute.

Luxtera stated that combined with TSMC silicon manufacturing capabilities and scale, its silicon photonic designs can enable optical interconnects that offer significantly higher performance at lower cost and power consumption to address the requirements of future data centres and 5G mobile networks.

Luxtera's latest platform will be used in a suite of next generation silicon photonics solutions to deliver 100 Gbit/s per lane optical interconnects, starting with 100GBase-DR and 400GBase-DR4 transceivers in 2018, and subsequently expanding to include other standards-based solutions for 25, 50, 100, 200, 400, 800 Gbit/s and 1 Tbit/s optical interconnects.

In addition, complementing the new silicon photonics technologies, Luxtera will leverage TSMC's 7 nm CMOS process to deliver high performance with low power across its product portfolio.

http://www.luxtera.com


  • In September 2016, Luxtera announced it had shipped more than one million silicon photonics PSM4 transceiver products designed for applications in cloud computing data centres. The Luxtera 100 Gbit/s PSM4 optical transceivers include four independent transmitter and receiver channels integrating phase modulators, photodetectors, waveguides, grating couplers, electrical re-timers and control circuitry, powered by a single integrated laser.

Thursday, March 9, 2017

Coriant Announces Short Reach CFP2-ACO Pluggable for Groove Network Disaggregation Platform

Coriant introduced a Short Reach CFP2-ACO pluggable for its Groove G30 Network Disaggregation Platform (NDP). The Groove Short Reach CFP2-ACO pluggable, which uses silicon photonics from Elenion Technologies, enables cost-optimized, power-efficient 200G connectivity for carrier transport and Data Center Interconnect (DCI) applications.

Coriant said its Short Reach CFP2-ACO represents a new class of analog coherent devices purpose-built for surging data traffic growth. Compared to PAM-4, the Short Reach CFP2-ACO preserves the operational and network engineering simplicity of coherent transmission while significantly lowering the cost and power for short reach interconnect applications. In combination with the Coriant Groove G30 Muxponder solution, the Short Reach CFP2-ACO helps support delivery of very high-capacity, low power, and cost-optimized connectivity for all applications requiring 10G, 40G, and 100G service aggregation and 200G DWDM transport. It also complements the Coriant Groove™ G30 Open Line System (OLS), enabling the industry’s highest density and lowest cost short reach transport.

“A faster pace of innovation and the shift to more open, disaggregated network solutions are enabling network operators and content providers to redefine their network architectures for scale, quality of experience, and total cost of ownership,” said J.C. Fahmy, Vice President of Product Management and Business Development, Data Center Solutions, Coriant. “With the Coriant Short Reach CFP2-ACO we are redefining the economics of short reach transport while building upon the proven value of our market-leading Groove Network Disaggregation Platform.”

http://www.coriant.com/

Thursday, January 5, 2017

NTT and Furukawa Announce 2 Joint Ventures for Optical Components

NTT Electronics Corporation and Furukawa Electric Co. agreed to establish two joint venture manufacturing companies for planar lightwave circuits and optical semiconductors. Both joint ventures will be based in Japan.

The companies said the deals were motivated by the need for stable and efficient supply capability of optical components has increased in response to the demand created by rapid growth in cloud services.

http://www.ntt-electronics.com/en/news/2016/12/ntt-electronics-and-furukawa-electric-establish-joint-venture.html