Showing posts with label Silicon. Show all posts
Showing posts with label Silicon. Show all posts

Tuesday, May 26, 2020

Samsung Electronics intros stand-alone security chip for mobiles

Samsung Electronics Co. introduced a Secure Element (SE) chip and enhanced security software for mobile devices that offers protection for tasks such as booting, isolated storage, mobile payment and other applications. The latest security chip is Common Criteria Evaluation Assurance Level (CC EAL) 6+ certified, the highest level acquired by a mobile component.

“In this era of mobility and contact-less interactions, we expect our connected devices, such as smartphones or tablets, to be highly secure so as to protect personal data and enable fintech activities such as mobile banking, stock trading and cryptocurrency transactions,” said Dongho Shin, senior vice president of System LSI marketing at Samsung Electronics. “With the new standalone security element solution (S3FV9RR), Samsung is mounting a powerful deadbolt on smart devices to safeguard private information.”

Samsung’s new security solution supports hardware-based root of trust (RoT), secure boot and device authentication that brings mobile security to the next level. Especially for service providers, manufacturers and organizations, secure device authentication is enhanced with the RoT when running proprietary applications on a mobile device. As a bootloader initiates, a chain of trust is activated through which each and every firmware with approved keys is sequentially validated. This secure booting process is handled by the RoT, guarding the device against any possible malicious attacks or unauthorized software updates.

Kyoto Semiconductor intros Two-Wavelength Photodiode

Kyoto Semiconductor Co. introduced a Two-Wavelength Photodiode with photosensitivity for a wide range of wavelengths, from 400 to 1,700 nm, arrayed along the same light axis. The device is capable of being surface-mounted, with silicon and indium-gallium-arsenide photodiodes. Samples will be available from August 31, 2020.

Applications could include spectroscopic analysis, enabling the identification of objects and their characteristics by reflecting light off those objects and measuring the degrees of transmission and reflection.

https://www.kyosemi.co.jp/en/lp/kpmc29

Monday, May 25, 2020

GLOBALFOUNDRIES adopts ITAR security and export control at Fab8

GLOBALFOUNDRIES will implement export control security measures at its most advanced manufacturing facility, Fab 8, in Malta, New York.

Specifically, the company plans to bring its Fab 8 facility into compliance with both the U.S. International Traffic in Arms Regulations (ITAR) standards and the Export Administration Regulations (EAR), making the company the most advanced ITAR foundry in the United States.

The new control assurances, which will go into effect later this year, will make confidentiality and integrity protections available for defense-related applications, devices or components manufactured at GF’s Fab 8 facility.

GF notes that it has invested over $13 billion in Fab 8 to date.


Wednesday, May 20, 2020

Samsung plans additional 5nm capacity at new fab in Pyeongtaek

Samsung Electronics will boost foundry capacity at the company's new production line in Pyeongtaek, Korea. The new foundry line will focus on EUV-based 5 nanometer (nm) and below process technology. Construction began this month and is expected to be in full operation in the second half of 2021.

Samsung recently added a new EUV-dedicated V1 line to its fab in Hwaseong, Korea. Initial mass production of the EUV-based 7nm process started in early 2019.  The company is on track to start mass production of 5nm EUV process in the Hwaseong fab in the second half of this year.

“This new production facility will expand Samsung’s manufacturing capabilities for sub-5nm process and enable us to rapidly respond to the increasing demand for EUV-based solutions,” said Dr. ES Jung, President and Head of Foundry Business at Samsung Electronics. “We remain committed to addressing the needs of our customers through active investments and recruitment of talents. This will enable us to continue to break new ground while driving robust growth for Samsung’s foundry business.”

With the addition of the Pyeongtaek fab, Samsung will have a total of seven foundry production lines located in South Korea and the United States, comprised of six 12-inch lines and one 8-inch line.

Tuesday, May 19, 2020

Sony to embed Microsoft Azure AI into its intelligent vision sensor

Sony will embed Microsoft Azure AI capabilities on its new intelligent vision sensor IMX500, which is being developed to extract useful information out of images in smart cameras and other devices.

Sony will also create a smart camera managed app powered by Azure IoT and Cognitive Services that complements the IMX500 sensor and expands the range and capability of video analytics opportunities for enterprise customers.

“By linking Sony’s innovative imaging and sensing technology with Microsoft’s excellent cloud AI services, we will deliver a powerful and convenient platform to the smart camera market. Through this platform, we hope to support the creativity of our partners and contribute to overcoming challenges in various industries,” said Terushi Shimizu, Representative Director and President, Sony Semiconductor Solutions Corporation.

“Video analytics and smart cameras can drive better business insights and outcomes across a wide range of scenarios for businesses,” said Takeshi Numoto, corporate vice president and commercial chief marketing officer at Microsoft. “Through this partnership, we’re combining Microsoft’s expertise in providing trusted, enterprise-grade AI and analytics solutions with Sony’s established leadership in the imaging sensors market to help uncover new opportunities for our mutual customers and partners.”

Monday, May 18, 2020

MediaTek's Dimensity 820 chip delivers 5G NR (sub-6GHz)

MediaTek introduced its Dimensity 820 5G system-on-chip (SoC), which packs a high performance Arm Mali G57 GPU graphics plus HyperEngine 2.0. It offer support for 120Hz high frame-rate displays, while leading HDR features with MediaTek MiraVision showcases the most vivid visuals in videos and streams.

"Our Dimensity 1000 is already powering impressive flagship 5G devices in a number of markets. With the new Dimensity 820, we're now making 5G much more accessible," said Dr. Yenchi Lee, Assistant General Manager of MediaTek's Wireless Communications Business Unit.  "The Dimensity 820 stands out beyond competitors by offering four high-performance Arm Cortex-A76 cores at 2.6GHz within its octa-core CPU, delivering superb performance and responsiveness, among its incredible AI, gaming and photography experiences."

MediaTek's Dimensity 820 integrates a 5G NR (sub-6GHz) modem into this single-chip solution with MediaTek's 5G UltraSave technologies, including exclusive 5G UltraSave Network Environment Detection and 5G UltraSave OTA Content Awareness, that altogether provides best-in-class energy efficiency. The 5G modem design also uses dynamic bandwidth part (BWP) adaption and connected mode discontinuous reception (C-DRX) power-saving technologies.

5G Carrier Aggregation (CA) technology delivers higher average speeds and a seamless handover between two 5G connection areas for the most reliable connectivity on the go. The Dimensity 820 also supports dual SIM, dual standby (DSDS) 5G technology for access to the fastest speeds and Voice over New Radio (VoNR) services on both SIMs.

Friday, May 15, 2020

U.S. tightens semiconductor restrictions on Huawei

U.S. Department of Commerce Bureau of Industry and Security (BIS) issued new rules aimed at cutting off Huawei's access to advanced semiconductors designed or fabricated using U.S. technology or software in other countries.

Specifically, BIS is amending its longstanding foreign-produced direct product rule and the Entity List to narrowly and strategically target Huawei’s acquisition of semiconductors that are the direct product of certain U.S. software and technology.

The following foreign-produced items will now be subject to the Export Administration Regulations (EAR):

  • Items, such as semiconductor designs, when produced by Huawei and its affiliates on the Entity List (e.g., HiSilicon), that are the direct product of certain U.S. Commerce Control List (CCL) software and technology; and
  • Items, such as chipsets, when produced from the design specifications of Huawei or an affiliate on the Entity List (e.g., HiSilicon), that are the direct product of certain CCL semiconductor manufacturing equipment located outside the United States.  Such foreign-produced items will only require a license when there is knowledge that they are destined for reexport, export from abroad, or transfer (in-country) to Huawei or any of its affiliates on the Entity List.

To prevent immediate adverse economic impacts on foreign foundries utilizing U.S. semiconductor manufacturing equipment that have initiated any production step for items based on Huawei design specifications as of May 15, 2020, such foreign-produced items are not subject to these new licensing requirements so long as they are reexported, exported from abroad, or transferred (in-country) by 120 days from the effective date.

“Despite the Entity List actions the Department took last year, Huawei and its foreign affiliates have stepped-up efforts to undermine these national security-based restrictions through an indigenization effort.  However, that effort is still dependent on U.S. technologies,” said Secretary of Commerce Wilbur Ross.  “This is not how a responsible global corporate citizen behaves.  We must amend our rules exploited by Huawei and HiSilicon and prevent U.S. technologies from enabling malign activities contrary to U.S. national security and foreign policy interests.”

https://www.commerce.gov/news/press-releases/2020/05/commerce-addresses-huaweis-efforts-undermine-entity-list-restricts

TSMC to invest $12 billion in 5nm fab in Arizona

TSMC confirmed plans to build and operate an advanced semiconductor fab in Arizona -- its secend manufacturing site in the United States. The company already operates a fab in Camas, Washington and design centers in Austin and San Jose.

The new facility in Arizona represents a $12 billion investment. It will utilize TSMC’s 5-nanometer technology for semiconductor wafer fabrication, have a 20,000 semiconductor wafer per month capacity.

TSMC said the fabrication facility will create over 1,600 high-tech professional jobs directly, and thousands of indirect jobs in the semiconductor ecosystem. Construction is planned to start in 2021 with production targeted to begin in 2024.

TSMC cited a strong partnership with the U.S. administration and the State of Arizona on this project.

https://www.tsmc.com/tsmcdotcom/PRListingNewsAction.do?action=detail&newsid=THGOANPGTH


  • TSMC is expected to ramp 5nm production in Taiwan beginning in Q2

  • TSMC's 2020 current production capacity is approximately 12 million wafers

Wednesday, March 18, 2020

Intel readies Pohoiki Springs neuromorphic research chip

Intel announced the readiness of Pohoiki Springs, its latest and most powerful neuromorphic research system providing the computational capacity of 100 million neurons. Pohoiki Springs is a data center rack-mounted system. It integrates 768 Loihi neuromorphic research chips inside a chassis the size of five standard servers. Neuromorphic systems are not intended to replace conventional computing systems. Instead, they provide a tool for researchers to develop and characterize new neuro-inspired algorithms for real-time processing, problem solving, adaptation and learning.

The cloud-based system will be made available to members of the Intel Neuromorphic Research Community (INRC), extending their neuromorphic work to solve larger, more complex problems.

“Pohoiki Springs scales up our Loihi neuromorphic research chip by more than 750 times, while operating at a power level of under 500 watts. The system enables our research partners to explore ways to accelerate workloads that run slowly today on conventional architectures, including high-performance computing (HPC) systems,” stated Mike Davies, director of Intel’s Neuromorphic Computing Lab

Intel says its Loihi processors take inspiration from the human brain, processing certain workloads up to 1,000 times faster and 10,000 times more efficiently than conventional processors.


Intel releases Loihi research chip for neuromorphic processing

Intel introduced an 8 million-neuron neuromorphic system comprising 64 Loihi research chips — codenamed Pohoiki Beach.

Intel says the highly specialized processor applies principles found in biological brains to computer architectures. The Loihi devices aime to process information up to 1,000 times faster and 10,000 times more efficiently than CPUs for specialized applications like sparse coding, graph search and constraint-satisfaction problems.

“We are impressed with the early results demonstrated as we scale Loihi to create more powerful neuromorphic systems. Pohoiki Beach will now be available to more than 60 ecosystem partners, who will use this specialized system to solve complex, compute-intensive problems,” stated Rich Uhlig, managing director of Intel Labs.



https://newsroom.intel.com/news/intels-pohoiki-beach-64-chip-neuromorphic-system-delivers-breakthrough-results-research-tests/#gs.pyxrlk

IDC: The impact of COVID-19 on the semiconductor sector

International Data Corporation (IDC) has published a report that analyzes the impact of the COVID-19 pandemic on the global semiconductor market and presents several possible outcomes.

"The emergence of COVID-19 has brought with it travel bans and quarantines; massive slowing of the supply chain; uncertainty in the stock market; falling business confidence, and growing panic among the population," said Mario Morales, program vice president, Semiconductors and Enabling Technologies at IDC. "Despite the growing uncertainty and panic, technology suppliers must continue to focus on their long-term investments, maintain engagement with partners and prospects, and look to specific markets for stability. Emerging technologies like 5G, the Internet of Things, high-performance computing, and intelligent edge will be fundamental to an overall recovery by the technology sector."

The report provides a framework to evaluate the market impact through four scenarios that assess the range of possible outcomes. Each scenario is based on varying assumptions and severity of the impact to business for technology suppliers. For each scenario, a range of critical factors are assessed with a resulting updated forecast, presented with leading indicators to help clients navigate this emergency.

Some highlights:

  • There is nearly an 80% chance for significant contraction in worldwide semiconductor revenues in 2020, instead of a previously expected minor overall growth of 2%.
  • There is still a one-in-five chance that a fast, strong bounce back from COVID-19 in 2020 is possible.
  • On a global level, the COVID-19 crisis is just beginning, with too many variables to immediately craft a single forecast in response.
  • The impact to technology supply chains in China are significant, but the timing of the recovery is uncertain.



Wednesday, March 4, 2020

Nokia looks to Marvell for 5G silicon development

Nokia is working with Marvell to develop 5G multi-RAT (Radio Access Technology) silicon, including multiple generations of custom silicon and infrastructure processors.

The new generation of custom system-on-chip (SoC) and infrastructure processors will expand the range of Nokia ReefShark chipsets. Marvell brings its multi-core Arm processor platforms.

Nokia said these new chipsets are designed to be deployed in several building blocks of its AirScale radio access solution.

Tommi Uitto, President of Mobile Networks at Nokia, said: “This important announcement highlights our continued commitment to expanding the variety and utilization of ReefShark chipsets in our portfolio. This ensures that our 5G solutions are equipped to deliver best-in-class performance to our customers. As service providers continue to evolve their 5G plans and support growing traffic and new vertical services, the infrastructure and components must evolve rapidly. Adopting the latest advancements in silicon technology is a critical step to better serve our customers’ needs.” 

Matt Murphy, CEO and President of  Marvell: “Marvell is excited and honored to partner with Nokia to enable next-generation solutions for 5G networks. Our platform of semiconductor solutions for data infrastructure in combination with Nokia’s technology and market leadership will enable wireless networks of the future to deliver on the promise of 5G and open a world of new business opportunities.”

Nokia's ReefShark silicon cuts massive MIMO antenna size and power consumption

Nokia unveiled its ReefShark 5G chipsets for radio frequency (RF) units such as the radio used in antennas. The chipsets, which were developed in-house, significantly improve radio performance resulting in halving the size of massive MIMO antennas. Nokia says its ReefShark chipsets also reduce power consumption in baseband units by 64%, compared to current technology.

The ReefShark chipsets comprise:

  • ReefShark Digital Front End for LTE and 5G radio systems supporting massive MIMO
  • ReefShark RFIC front-end module and transceiver: massive MIMO Adaptive Antenna solution
  • ReefShark Baseband Processor: All-in-one compute heavy design, capable of supporting the massive scale requirements of 5G. This is the brain power of baseband processing.

Monday, March 2, 2020

Marvell unveils 5th gen OCTEON with up to 36 Arm v8 cores

Marvell unveiled its OCTEON TX2 family of infrastructure processors targeting a wide variety of wired and wireless networking equipment including switches, routers, secure gateways, firewall, network monitoring, 5G base stations, and smart NICs.

The fifth-generation OCTEON TX2 family promises a 2.5x improvement over the previous generation and scaling up to 200Gbps of packet processing throughput. OCTEON TX2 combines up to 36 cores, based on the Arm v8-A architecture with configurable and programmable hardware accelerator blocks, connected by Marvell’s field-proven and highly scalable coherent interconnect.

The OCTEON platform is enabled by a mature and widely deployed SDK, supported by robust software ecosystems consisting of both open source and commercial offerings.  The platform includes firmware, Linux OS and multiple distributions, virtualization, containers, data plane development kit (DPDK), protocol stacks, infrastructure management and orchestration like OpenStack and Kubernetes, and virtual network functions (VNFs).  In addition, Marvell supports a full routing stack including TCP, SSL, and IPSEC support and DPDK support for L2/L3 forwarding and IPSEC.

“Today’s data infrastructure requires significantly faster network throughput and higher end-to-end security at all nodes of the network,” said John Sakamoto, vice president of Infrastructure Processor Business Unit at Marvell.  “Built on more than a decade of expertise, the OCTEON TX2 family extends Marvell’s performance leadership in supporting high-performance datapath and security applications with a 2.5x performance boost over previous generations.”

Marvell’s CN91xx, CN92xx, CN96xx, and CN98xx processor families include:

  • 4 - 36 cores based on the Armv8-A architecture ranging up to 2.4 GHz frequency
  • I/O with 25G SerDes-based I/O interfaces, e.g. 100GbE, 50GbE, 40GbE, 25GbE, 10GbE, 2.5GbE, 1GbE Ethernet ports and PCIe gen4 interfaces supporting root-complex and end-point configurations
  • Enhanced NITROX V security co-processors which accelerate a comprehensive set of asymmetric and symmetric cryptographic operations
  • Hardware accelerators support with comprehensive packet processing hardware offload, including packet receive, flexible packet parsing, flow classification, buffer management, QoS (quality of service), transmit processing and hierarchical traffic shaping and scheduling
  • Load-balancing and work scheduling hardware which accounts for QoS, packet ordering and synchronization


In addition, Marvell is introducing a new generation family of OCTEON Fusion processors built on the OCTEON TX2 platform and optimized for cellular base station designs including baseband unit and smart radio unit applications.  The OCTEON Fusion family is ideally suited for layer 1 processing in traditional all-in-one base stations as well as Distributed Unit (DU) processing in 5G split architectures.  In addition, the highly scalable multi-core OCTEON Fusion architecture enables it to address a multitude of base station solutions from mid-capacity small cells to high-capacity modular macro cells.  In the Radio Unit (RU), the family offers processing solutions for smart radio heads requiring more compute power to support the complex beamforming algorithms associated with massive MIMO antenna arrays.

The Marvell RAN portfolio includes:

  • OCTEON Fusion: Complete 4G and 5G layer 1 baseband processing
  • OCTEON TX2: Layer 2 and 3 transport and control plane processing
  • Prestera: A line of Ethernet switching solutions for fronthaul, backhaul and intra-RAN connectivity
  • Ethernet Connectivity: Marvell’s Ethernet adapter, controller, and PHY product lines provide a comprehensive set of connectivity options for RAN infrastructure
  • Custom and semi-custom ASICS: OEM-differentiated solutions for baseband and radio unit designs


https://www.marvell.com/

Wednesday, February 26, 2020

Samsung intros Secure Element chip with with CC EAL 5+ for mobiles

Samsung Electronics introduced a Common Criteria Evaluation Assurance Level (CC EAL) 5+ certified Secure Element (SE) chip for mobile devices.

The new Secure Element solution consists of a security chip and optimized software for protecting private data on an isolated data storage.

“Strong security measures have become a crucial feature in today’s smart devices as they evolve into essential tools that hold the key to our personal data connected to various services such as the cloud and financial transactions,” said Dongho Shin, senior vice president of System LSI marketing at Samsung Electronics. “Samsung has a long and proven history in security solutions such as smart card ICs, IoT processors and other semiconductor products that require robust security. Our new turnkey SE solution for mobile devices will not only keep user data safer on the go but also enable new mobile applications that will broaden and enrich our everyday lives.”

Samsung’s new SE solution is currently in mass production and is featured in Samsung’s recently-announced Galaxy S20 series smartphones.

Tuesday, January 28, 2020

Semtech debuts LoRa transceiver for Smart Home IoT sensors

Semtech introduced a transceiver designed for battery-powered LPWAN based smart home, community and consumer applications. The new Semtech LoRa Smart Home transceiver provides low power, broad coverage for indoor and neighborhood area IoT devices connecting to sensors and actuators for safety, environmental and convenience use cases. The company said its design will power sensors with multi-year operation. It features 600nA of sleep current and 4.6 mA of active receive current consumption.

Key Product Features of LoRa Smart Home (LLCC68)

  • High sensitivity to -126 dBm
  • +22 dBm output power with high efficiency PA
  • System works well even when the signal is 10dB below noise
  • Minimal external BOM/matching
  • Small size foot print, 24-pin 4x4
  • Works with existing LoRaWAN-based gateways
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  • 25 mA TX @ +14dBm
  • Integrated DC-DC and LDO
  • Supports LoRaWAN and other protocols

“With its simple and flexible network architecture, Semtech’s new LoRa® Smart Home device offers a unique opportunity to accelerate the consumer adoption of smart home connected solutions. As an end-to-end solution, or as a complement to Wi-Fi, LoRa Smart Home broadens smart home solutions by enabling connectivity for low cost and battery powered end points both indoors and outdoors,” said Pedro Pachuca, Director of IoT Wireless in Semtech’s Wireless and Sensing Products Group. “The new LoRa Smart Home device provides a flexible and cost effective solution for low latency smart home applications, including smart key locks and lighting, enabling low cost network extension and providing a bridge to the many LoRaWAN®-based B2B and B2C solutions available in the IoT market today.”

Thursday, January 23, 2020

Deutsche Telekom certifies Sequans' LTE-M

Sequans Communications' dual-mode LTE-M/NB-IoT Monarch chip and its Monarch-based module have been certified for LTE-M by Deutsche Telekom.

“Being certified by Deutsche Telekom is very important to our customers building LTE-M devices for Europe, and we are pleased to have the stamp of approval from Deutsche Telekom for our Monarch platform,” said Georges Karam, Sequans CEO. “Monarch is now certified by many carriers worldwide and our customers will benefit from this proven maturity as they build low power IoT devices for global use. Also the certification of our Monarch GM01Q module, which includes an LTE-optimized transceiver and a Single-SKU™ RF front end, further accelerates the time to market for new IoT devices.”

Tuesday, January 21, 2020

Sequans opens 5G design center in Israel

Paris-based Sequans Communications S.A. announced the expansion of its research and development resources in Israel with the opening of a new design center for the purpose of accelerating Sequans’ 5G new product development.

Sequans' new team is mainly focused on the development of 5G broadband and critical IoT products that will complement its existing massive IoT products, including the company’s flagship Monarch and Calliope platforms. The 5G products Sequans is readying for production include its 5G-compliant Monarch 2 LTE-M/NB-IoT chip announced in 2019 that will address the massive IoT market, and the coming new Taurus 5G chip that will address the broadband and critical IoT markets.

“Our new R&D center in Israel has been established to accelerate our ongoing 5G development and is a reflection of our commitment to keep our IoT products at the leading edge with best-in-class performance and lowest cost,” said Georges Karam, Sequans CEO. “Our 5G knowledge will be leveraged and augmented by this new team of experts who will ensure that we get across the goal line and get our new 5G products to market according to plan.”

Tuesday, January 14, 2020

Gartner: Worldwide semiconductor revenue drops 11.9% in '19

Worldwide semiconductor revenue totaled $418.3 billion in 2019, down 11.9% from 2018, according to preliminary results by Gartner, Inc. The report cites the drop in the memory market as the top reason for the decline. Sales analog products’ declined 5.4% while optoelectronics grew 2.4%.

“The memory market, which accounted for 26.7% of semiconductor sales in 2019, experienced a 31.5% decline in revenue in 2019,” said Andrew Norwood, research vice president at Gartner. “Within memory, DRAM revenue declined 37.5% due to an oversupply that started at the end of 2018 and lasted throughout 2019. The oversupply was caused by a sudden fall in demand from the hyperscale market. This revealed excessive OEM inventory levels that took the first half of the year to correct. Excessive inventory at DRAM vendors in the second half of 2019 pushed pricing lower and resulted in an average selling price (ASP) decline of 47.4% in 2019.”

“In 2020, we expect to see semiconductor market revenue increase after the high inventory clearance to drive up the chip ASP, especially in the memory sector,” said Mr. Norwood. “The U.S.-China trade war seems to be easing as we move into 2020. However, during 2019 the U.S. added several Chinese companies, including Huawei, to the Entity List restricting the sale of U.S. components. The immediate impact was to push Huawei into looking outside the U.S. for alternative silicon suppliers, with wholly owned HiSilicon at the top of the list as well as alternative suppliers based in Japan, Taiwan, South Korea and China. This will be an area to watch in 2020.”

Tuesday, December 17, 2019

Samsung readies production of Baidu's KUNLUN AI silicon

Baidu’s first cloud-to-edge AI accelerator chip has completed development and will be mass-produced early next year by Samsung Electronics.

Baidu KUNLUN chip is built on the company’s advanced XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsung’s 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution.

The chip offers 512 gigabytes per seconds (GBps) memory bandwidth and supplies up to 260 Tera operations per second (TOPS) at 150 watts. In addition, the new chip allows Ernie, a pre-training model for natural language processing, to inference at three times faster than that of conventional GPU/FPGA-accelerating model.

“Baidu KUNLUN is an important milestone for Samsung Foundry as we’re expanding our business area beyond mobile to datacenter applications by developing and mass-producing AI chips. Samsung will provide comprehensive foundry solutions from design support to cutting-edge manufacturing technologies, such as 5LPE, 4LPE, as well as 2.5D packaging.”

“We are excited to lead the HPC industry together with Samsung Foundry,” said OuYang Jian, Distinguished Architect of Baidu. “Baidu KUNLUN is a very challenging project since it requires not only high level of reliability and performance at the same time, but is also a compilation of the most advanced technologies in the semiconductor industry. Thanks to Samsung's state of the art process technologies and competent foundry services, we were able to meet and surpass our goal to offer superior AI user experience.”

“We are excited to start a new foundry service for Baidu using our 14nm process technology,” said Ryan Lee, vice president of Foundry Marketing at Samsung Electronics. “Baidu KUNLUN is an important milestone for Samsung Foundry as we’re expanding our business area beyond mobile to datacenter applications by developing and mass-producing AI chips. Samsung will provide comprehensive foundry solutions from design support to cutting-edge manufacturing technologies, such as 5LPE, 4LPE, as well as 2.5D packaging.”

Wednesday, December 11, 2019

The design philosophy of Cisco Silicon One



About 5 years ago, Cisco set out to design a new silicon architecture, one which could serve multiple markets and scale over time.

Eyal Dagan, SVP Silicon, Cisco, shares his views on the design philosophy of Cisco Silicon One. It was a clean sheet approach. A key question -- is it possible to create a routing chip with the efficiency of switching silicon?

https://youtu.be/P5QwOKaxRtI



The 400G-ZR Transition



400G-ZR is going to shift network architectures, says Bill Gartner, SVP/GM of Cisco's Optical Systems and Optics Group. Many customers will continue to deploy chassis solutions, but others will choose pluggables in a router for coherent transmission.

Cisco is also discussing the changing consumption models for network silicon and optics as some customers seek fully disaggregated solutions.

https://youtu.be/RrKqRv8-7po