Showing posts with label Silicon. Show all posts
Showing posts with label Silicon. Show all posts

Monday, September 10, 2018

Intel acquires NetSpeed Systems for interconnect fabric expertise

Intel has acquired NetSpeed Systems, a start-up based in San Jose, California, for its system-on-chip (SoC) design tools and interconnect fabric intellectual property (IP). Financial terms were not disclosed.

Intel said NetSpeed’s highly configurable and synthesizable offerings will help it more quickly and cost-effectively design, develop and test new SoCs with an ever-increasing set of IP.

NetSpeed provides scalable, coherent, network-on-chip (NoC) IP to SoC designers. NetSpeed’s NoC tool automates SoC front-end design and generates programmable, synthesizable high-performance and efficient interconnect fabrics. The company was founded in 2011.

The NetSpeed team is joining Intel’s Silicon Engineering Group (SEG) led by Jim Keller. NetSpeed co-founder and CEO, Sundari Mitra, will continue to lead her team as an Intel vice president reporting to Keller.

“Intel is designing more products with more specialized features than ever before, which is incredibly exciting for Intel architects and for our customers. The challenge is synthesizing a broader set of IP blocks for optimal performance while reining in design time and cost. NetSpeed’s proven network-on-chip technology addresses this challenge, and we’re excited to now have their IP and expertise in-house,” stated Jim Keller, senior vice president and general manager of the Silicon Engineering Group at Intel.

Wednesday, September 5, 2018

MACOM samples single-chip, 100G bidirectional optical device

MACOM Technology Solutions introduced an integrated, single-chip transmit and receive solution for short reach 100G optical transceivers, active optical cables (AOCs) and onboard optical engines.

The new MALD-37845 device, which is designed for use in CPRI, 100G Ethernet, 32G Fibre Channel and 100G EDR InfiniBand applications, integrates seamless integration of four-channel Transmit and Receive Clock Data Recovery (CDRs), four Transimpedance Amplifiers (TIAs) and four Vertical-Cavity Surface-Emitting Laser (VSCEL) drivers.

It supports a full range of data rates from 24.3 to 28.1 Gbps, it supports interoperability with a variety of VCSEL lasers and photodetectors, and is firmware-compatible with earlier-generation MACOM solutions.

Sampling is underway with production availability planned for the first half of 2019.

MACOM said the device will provide customers with a low power, single-chip solution ideally suited for small form-factor optical subassemblies.

“Optical module and AOC providers are under tremendous pressure to enable their customers with 100G connectivity at volume scale,” said Marek Tlalka, Senior Director of Marketing, High-Performance Analog, MACOM. “We believe that the MALD-37845 overcomes the integration and cost challenges inherent to legacy multi-chip offerings, providing an elegant, high-performance solution for short reach 100G applications.”

http://www.macom.com

Monday, September 3, 2018

NXP acquires OmniPHY for automotive Ethernet

NXP Semiconductors has acquired OmniPHY, a provider of automotive Ethernet subsystem technology. Financial terms were not disclosed.

NXP said OmniPHY's interface IP and communication technology along with NXP’s own automotive portfolio will form a “one-stop shop” for automotive Ethernet. The companies’ technology synergies will center on 1.25-28Gbps PHY designs and 10-, 100- and 1000BASE-T1 Ethernet in advanced processes.

“Our heritage in vehicle networks is rich and with our leadership positions in CAN, LIN, and FlexRay, we hold a unique viewpoint on automotive networks,” said Alexander E. Tan, vice president and general manager of Automotive Ethernet Solutions, NXP. “The team and technology from OmniPHY give us the missing piece in an extensive high-bandwidth networking portfolio.”

"We are very excited to join NXP – a leader in automotive electronics, for a front-row seat to the autonomous driving revolution, one that will deliver profound change to the way people live,” said Ritesh Saraf, CEO of OmniPHY. “The combination of our teams and technology will accelerate and advance the delivery of automotive Ethernet solutions providing our customers with high quality and world-class automotive Ethernet innovation."

Tuesday, August 28, 2018

Lattice Semiconductor appoints AMD exec as its new CEO

Lattice Semiconductor appointed Jim Anderson as its new President and Chief Executive Officer, and to the company’s Board of Directors. He most recently served as at Advanced Micro Devices (AMD) as the General Manager and Senior Vice President of the Computing and Graphics Business Group.

Jeff Richardson, Chairman of the Board, said, “On behalf of the Board, we are pleased to announce the appointment of Jim Anderson as Lattice’s new President and Chief Executive Officer. Jim brings a strong combination of business and technical leadership with a deep understanding of our target end markets and customers. The transformation he drove of AMD’s Computing and Graphics business over the past few years is just a recent example of his long track record of creating significant shareholder value.

President Trump blocks sale of Lattice Semi citing National Security

President Trump signed an order blocking the sale of Lattice Semiconductor to Canyon Bridge Capital Partners on national security grounds. The issue was referred to the President by the Committee on Foreign Investment in the United States (CFIUS) due to concerns regarding China Venture Capital Fund Corporation Limited and its interest in Canyon Bridge Capital Partners.

Darin G. Billerbeck, CEO of Lattice Semiconductor, issued the following statement:

“The transaction with Canyon Bridge was in the best interests of our shareholders, our customers, our employees and the United States. We also believe our CFIUS mitigation proposal was the single most comprehensive mitigation proposal ever proposed for a foreign transaction in the semiconductor industry and would have maximized United States national security protection while still enabling Lattice to accept Canyon Bridge’s investment and double American jobs. While it is disappointing that we were not able to prevail, the Board and I would like to thank Canyon Bridge for their support during this time.”

https://www.whitehouse.gov/the-press-office/2017/09/13/order-regarding-proposed-acquisition-lattice-semiconductor-corporation

Private Equity Firm Acquires Lattice Semi for $1.3 Billion - FPGAs

Canyon Bridge Capital Partners agreed to acquire all outstanding shares of Lattice Semiconductor Corporation (NASDAQ:LSCC) for approximately $1.3 billion inclusive of Lattice’s net debt, or $8.30 per share in cash. This represents a 30% premium to Lattice’s last trade price on November 2, 2016, the last trading day prior to announcement.

Lattice supplies low power FPGA, video ASSP, 60 GHz millimeter wave, and IP products to the consumer, communications, industrial, computing, and automotive markets worldwide. The company is based in Portland, Oregon.

Monday, August 27, 2018

Global Foundries hits the pause button on 7nm FiFET

GLOBALFOUNDRIES announced a strategic shift away from 7nm process technology and toward "clients in high-growth markets."

Specifically, GF's 7nm FinFET program is on hold indefinitely and the company will shift development resources to make its 14/12nm FinFET platform more relevant, with a focus on new features such RF, embedded memory, and low power.

The company announced a workforce reduction in conjunction with this move, although a number of top technologists will be redeployed on 14/12nm FinFET derivatives and other differentiated offerings.

GF also announced plans to establish its ASIC business as a wholly-owned subsidiary, independent from the foundry business.

Tom Caulfield, GF's CEO, stated “Demand for semiconductors has never been higher, and clients are asking us to play an ever-increasing role in enabling tomorrow’s technology innovations. The vast majority of today’s fabless customers are looking to get more value out of each technology generation to leverage the substantial investments required to design into each technology node. Essentially, these nodes are transitioning to design platforms serving multiple waves of applications, giving each node greater longevity. This industry dynamic has resulted in fewer fabless clients designing into the outer limits of Moore’s Law. We are shifting our resources and focus by doubling down on our investments in differentiated technologies across our entire portfolio that are most relevant to our clients in growing market segments.”

https://www.globalfoundries.com

Wednesday, August 22, 2018

Samsung debuts NB-IoT processor/modem/GNSS

Samsung Electronics Co. unveiled its new narrowband (NB) Internet-of-Things (IoT) chip.  The Exynos i S111 integrates a modem, processor, memory and Global Navigation Satellite System (GNSS) into a single chip design to enhance efficiency and flexibility for connected device manufacturers.

Samsung said its NB-IoT solution offers extremely wide coverage, low-power operation, accurate location feedback and strong security. It is optimized for real-time tracking applications such as safety wearables or smart meters.

The Exynos i S111 incorporates a modem capable of LTE Rel. 14 support that can transmit data at 127-kilobits-per-second (kbps) for downlink and 158kbps uplink, and can operate in standalone, in-band and guard-band deployments.

NB-IoT adopts a data retransmission mechanism that continuously transmits data until a successful transfer, or up to a set number of retransmits. With a high number of these retransmit sessions, the S111 is able to cover the distance of 10-kilometers (km) or more.

“IoT will be able to evolve to offer new features beyond the conventional household space with IoT-dedicated solutions that present a broad range of opportunities,” said Ben Hur, vice president of System LSI marketing at Samsung Electronics. “Exynos i S111’s highly secure and efficient communication capabilities will bring more exciting NB-IoT applications to life.”

http://www.samsung.com/exynos

Sunday, July 29, 2018

Caixin: The Wake-Up Call for China’s Chip Industry

The near-death experience of ZTE due to the 88-day ban imposed the U.S. Department of Commerce is a wake-up call for China's semiconductor industry, according to an article in the business journal Caixin.

The article the foreign joint venture model, Chinese investments/acquisitions of tech companies abroad, and government-supported initiatives to build a strong, domestic ecosystem for semiconductor design and fabrication.

https://www.caixinglobal.com/2018-07-29/the-wake-up-call-for-chinas-chip-industry-101309608.html

Wednesday, July 18, 2018

Intel celebrates its 50th birthday

Intel marked the 50th anniversary of its founding on July 18, 1968 by Robert Noyce and Gordon Moore.

A ceremony in New York City and Santa Clara, California was presided over by Bob Swan, Intel’s chief financial officer and interim chief executive officer. Instead of ringing the Nasdaq opening bell, Intel’s well-known five-note jingle was played accompanied by the Intel bong.

“We’re only just beginning to explore the impact that technologies like autonomous driving, artificial intelligence and quantum computing can have. And over the next several decades, we’ll create computing platforms that make the world a better place — from safer and smarter models of mobility to the eradication of disease,” stated Bob Swan, Intel CFO and interim CEO.

Intel also set a new record for most synchronized drones flying in formation -- 500.


Wednesday, July 4, 2018

Baidu develops its own AI chip, rolls out first autonomous bus

At its second annual developer conference in Beijing this week, Baidu unveiled its "Kunlun" processor for AI applications.


Technical details on the new Kunlun silicon were scarce, but the company said its cloud-to-edge AI chip is built to accommodate high-performance requirements of a wide variety of AI scenarios, including deep learning and facial recognition.

Baidu is known to be developing FPGA designs for a number of years.

Baidu also announced volume production of China’s first commercially deployed fully autonomous bus. The first 100 "Apolong" buses are ready for the road.


Thursday, May 31, 2018

Marvell posts revenue of $605 billion, next quarter excludes $7m is sales to ZTE

Marvell Technology Group reported revenue for its first quarter of fiscal 2019 was $605 million, which exceeded the midpoint of the Company's guidance provided on March 8, 2018. GAAP net income from continuing operations for the first quarter of fiscal 2019 was $129 million, or $0.25 per diluted share. Non-GAAP net income from continuing operations for the first quarter of fiscal 2019 was $165 million, or $0.32 per diluted share. Cash flow from operations for the first quarter was $129 million.

"Fiscal 2019 is off to a strong start, driven by the performance of our storage, networking and connectivity businesses which grew 7% year over year in Q1. Marvell's R&D engine is executing well, and our newly announced products are fueling a growing design win pipeline," said Marvell President and CEO Matt Murphy. "Overall, I'm pleased with the results and thank the entire Marvell team for their effort and contribution."

Revenue for the company's second quarter of 2019 is expected to be $600 million to $630 million. The guidance range excludes approximately $7 million in revenue from a Chinese OEM due to the trade restrictions imposed by the U.S. government.

Monday, May 21, 2018

IDC forecasts semiconductor growth of 7.7%, reaching $450B in 2018

IDC is predicting that worldwide semiconductor revenue will grow for the third consecutive year in 2018 to $450 billion, up 7.7% over 2017, down from 24% in 2017.

IDC's new Semiconductor Applications Forecaster (SAF) also forecasts that semiconductor revenues will log a compound annual growth rate (CAGR) of 2.9% from 2017-2022, reaching $482 billion in 2022.

"Market consolidation in the semiconductor industry over the past five years continues to shape the competitive landscape for semiconductor suppliers as each company continues to refine its core markets and make acquisitions to find new and emerging sectors for growth. The pace of change and technology is expected to accelerate as machine learning and autonomous systems enable a more diverse set of architectures to address the opportunity. This will fuel the engine of growth for semiconductor technology over the next decade," said Mario Morales, program vice president, Semiconductors at IDC.

Some key findings from IDC's Semiconductor Application Forecaster (excluding memory) include:


  • Semiconductor revenue for the computing industry segment will decline 4.0% this year and will show a negative CAGR of -0.7% for the 2017-2022 forecast period. Two bright spots for the computing segment are computing and enterprise SSDs, growing in high double digits and 9.8% CAGR respectively for 2017-2022.
  • Semiconductor revenue for the mobile wireless communications segment will grow 5.5% year over year this year with a CAGR of 5.8% for 2017-2022. Semiconductor revenue for 4G mobile phones will experience an annual growth rate of 10.9% in 2018 and a CAGR of 3.1% for 2017-2022. 5G will also drive growth in the later part of the forecast as the technology becomes mainstream by the middle of the next decade.
  • Communications infrastructure semiconductors are forecast to grow at a 1.7% CAGR from 2017-2022 with the strongest growth coming from consumer networks.
  • The automotive market and the industrial markets will continue to be the leading areas of growth for the semiconductor market throughout the forecast period, growing at a 9.6% and 6.8% CAGR from 2017-2022. 

Thursday, May 17, 2018

Tachyum announces its Universal Processor Platform

Tachyum, a start-up based in San Jose, California with offices in Slovakia, unveiled its new processor family – codenamed “Prodigy” – that combines the advantages of CPUs with GP-GPUs, and specialized AI chips in a single universal processor platform. The company says its processor architecture attains ten times the processing power per watt compared to conventional designs.

A key innovation of the design is the ability to connect very fast transistor with very slow wires, but technical details on the device physics have not yet been disclosed.

The universal processor promises programming ease comparable to a CPU with performance and efficiency comparable to GP-GPU. It is designed to handle hyperscale workloads, AI, HPC, and other demanding applications

Tachyum claims its Prodigy universal processor will enable a super-computational system for real-time full capacity human brain neural network simulation by 2020. One target application would be the real-time Human Brain Project, where there’s a need for more than 1019 Flops (10,000,000,000,000,000,000 floating-point operations per second - 10 exaflop).

“Rather than build separate infrastructures for AI, HPC and conventional compute, the Prodigy chip will deliver all within one unified simplified environment, so for example AI or HPC algorithms can run while a machine is otherwise idle or underutilized,” said Tachyum CEO Dr. Radoslav ‘Rado’ Danilak. “Instead of supercomputers with a price tag in the hundreds of millions, Tachyum will make it possible to empower hyperscale datacenters to produce more work in a radically more efficient and powerful format, at a lower cost.”

“Despite efficiency gains from virtualization, cloud computing, and parallelism, there are still critical problems with datacenter resource utilization particularly at a size and scale of hundreds of thousands of servers,” said Christos Kozyrakis, professor of electrical engineering and computer science at Stanford, who leads the university’s Multiscale Architecture & Systems Team (MAST), a research group for cloud computing, energy-efficient hardware, and operating systems. “Tachyum’s breakthrough processor architecture will deliver unprecedented performance and productivity.” Kozyrakis is a corporate advisor to Tachyum.

http://tachyum.com


  • Tachyum is headed by Dr. Radoslav ‘Rado’ Danilak, who previously was founder and CEO of Skyera, a supplier of ultra-dense solid-state storage systems, acquired by WD in 2014. He also was cofounder and CTO of SandForce, which was acquired by LSI in 2011 for $377M. Its cofounders include Rodney Mullendore (previously Sandforce, Nishan Systems, Sandia National Labs); Igor Shevlyakov (previously Skyera); Ken Wagner (previously Wave Computing, Silicon Analystics and Theseus Logic).
  • Tachyum is funded by IPM Growth, the venture capital division of InfraPartners Management LLP.

Monday, April 30, 2018

Semiconductor sales top $111 billion in Q1, up 20%

Worldwide sales of semiconductors reached $111.1 billion during the first quarter of 2018, an increase of 20 percent compared to the first quarter of 2017, but 2.5 percent less than the fourth quarter of 2017, according to the Semiconductor Industry Association (SIA). Sales for the month of March 2018 came in at $37.0 billion, an increase of 20 percent compared to the March 2017 total of $30.8 billion and 0.7 percent more than the February 2018 total of $36.8 billion.

"The global semiconductor market has demonstrated impressive growth through the first quarter of 2018, far exceeding sales through the same point in 2017, which was a record year for semiconductor revenues," said John Neuffer, president and CEO, Semiconductor Industry Association. "Sales in March increased year-to-year for the 20th consecutive month. All regional markets experienced double-digit growth compared to last year, and all major semiconductor product categories experienced year-to-year growth, with memory products continuing to lead the way."

Friday, April 27, 2018

Mediatek halts shipments to ZTE

Following an order from Taiwan's Bureau of Foreign Trade, Mediatek has suspended shipment of its chips and components to ZTE, according to Nikkei Asian Review.

Mediatek is the second largest global supplier of systems-on-chip (SoC) solutions for mobile devices. It also supplies a range of connectivity chips for home networking and broadband CPE, along with a new line of optical components.

https://s.nikkei.com/2HFl4q4

Sunday, April 22, 2018

Alibaba acquires C-SKY Microsystems for embedded IoT CPUs

Alibaba has acquired Hangzhou Zhongtian Microsystem Co. (C-SKY Microsystems, a leading developer of embedded CPUs, for an undisclosed sum.

C-SKY, which was founded in 2001 and is based in Hangzhou's Hi-Tech Zone, offers a series of 32-bit "C-SKY" embedded CPU cores based on independent intellectual property rights. The chips are widely used in Internet of Things intelligent hardware, digital audio and video, information security, networking and communications, industrial control, and automotive electronics.


Friday, April 20, 2018

Intel cuts water usage in semiconductor manufacturing

Intel is investing in a massive water recycling facility at its plant in Hillsboro, Oregon as part of a corporate goal to return 100 percent of water used in its global manufacturing to communities and watersheds for local use by 2025.

When complete, the huge water recycling plant in Hillsboro, will be able to recycle about 1 billion gallons of water every year – the equivalent of 90,000 Olympic-size swimming pools.

Wednesday, March 28, 2018

Ambarella intros next gen CV2 computer vision processor

Ambarella, which specializes in low-power, HD and Ultra HD video processing semiconductors, announced its next generation CV2 computer vision processor, which will provide up to 20 times the computer vision performance of CV1 in a fully-integrated SoC. Key features of the 10nm CV2 Computer Vision SoC:

  • CVflow processor with CNN/deep learning support
  • 4Kp60/8-Megapixel AVC and HEVC encoding with multi-stream support
  • Multi-sensor support for 3-channel electronic mirror and 4-channel AVM systems, multi-channel stereo sensing systems (up to 4 stereo pairs), and multi-imager IP cameras
  • Quad-core 1.2-GHz ARM™ Cortex A53 with NEON DSP extensions and FPU
  • Advanced security features, including OTP for secure boot, TrustZone and IO virtualization
  • Real-time hardware-accelerated 360-degree de-warping and Lens Distortion Correction (LDC) engine

Ambarella also demonstrated a fully autonomous EVA (Embedded Vehicle Autonomy) vehicle on Silicon Valley roads.

Ambarella's autonomous car leverages the company's embedded computer vision processors. The company said its EVA’s high-resolution stereovision cameras deliver the 360-degree short and long distance viewing capability required for advanced perception and precise self-location. EVA includes sensor fusion of the vision information with Radar and map data to provide the information necessary for path planning and merging maneuvers without the need for additional LiDAR systems.

“High resolution 8-Megapixel stereovision combined with superior perception in challenging lighting conditions allows EVA to “see” its surroundings with much higher reliability than was previously possible,” said Professor Alberto Broggi, General Manager of Ambarella Italy. “Moving to an implementation based on dedicated Ambarella CVflow processors brings us much closer to making self-driving cars a practical reality.”

Wednesday, March 21, 2018

Samsung posts specs on its 10nm Exynos 7 Series 9610

Samsung Electronics Co. posted key specifications on its latest application processor (AP), the Exynos 7 Series 9610, for high-end smartphones.

The Exynos 9610 is built on Samsung’s 10-nanometer (nm) FinFET process. The CPU is comprised of four Cortex-A73 cores running at 2.3 gigahertz (GHz), and four 1.6GHz Cortex-A53 cores to load apps quickly and run multiple tasks simultaneously.

The GPU is a second-generation Bifrost-based ARM Mali-G72.

There is an embedded Cortex-M4F-based low-power sensor hub, which efficiently manages the sensors in real-time without waking the main processor.

The embedded all-network LTE modem supports Cat.12 3CA (carrier aggregation) at 600 Mbps for downlink and Cat.13 2CA at 150Mbps for uplink.

The processor also features 802.11ac 2x2 MIMO Wi-Fi, faster and longer range Bluetooth 5.0, and FM for radio. In addition, for global location positioning coverage, it embeds a 4-mode Global Navigation Satellite System (GNSS) receiver that includes GPS (Global Positioning System), GLONASS, BeiDou and Galileo.

The Exynos 7 Series 9610 is expected to be mass produced in the second half of this year.

Monday, March 12, 2018

Trump blocks Broadcom's proposed takeover of Qualcomm

President Trump signed an executive order prohibiting Broadcom from acquiring Qualcomm or proceeding with any substantially equivalent merger, acquisition, or takeover of the firm whether effected directly or indirectly.

The order cited "credible evidence" that Broadcom, along with its partners, subsidiaries, or affiliates, impairs the national security of the United States.

Trump said he was taking this action upon review of a recommendation from the Committee on Foreign Investment in the United States.

Broadcom issued a statement saying it was reviewing the order.

Qualcomm issued a statement saying all of Broadcom’s director nominees are also disqualified from standing for election as directors of Qualcomm. 'the company will reconvene its 2018 Annual Meeting of Stockholders on the earliest possible date. Stockholders of record on January 8, 2018 will be entitled to vote at the meeting.

Broadcom’s Terabit Monterey Chip extends Ethernet to LTE and 5G Radios

Broadcom introduced a terabit-class Ethernet switching chip designed for high-capacity cellular fronthaul networks.

The Broadcom Monterey Ethernet switch (BCM56670) targets Ethernet-based 5G radios and while also supporting existing CPRI-based radios.

It supports the IEEE’s new 802.1CM (Time-Sensitive Networking for Fronthaul) standard, which provides an Ethernet synchronization solution, CPRI-to-Ethernet bridging, and nanosecond-scale jitter and delay control.

IEEE 802.1CM specifies how to carry cellular radio traffic over Ethernet, It relies on pre-emption, Synchronous Ethernet, and the 1588 Precision Timing specification.

Broadcom said its Monterey silicon offers an order-of-magnitude increase in synchronization accuracy by moving time stampers from Ethernet MAC to SerDes I/O, exceeding 3GPP, IEEE, and ITU-T specifications for 4G & 5G networks.

Monterey Ethernet switch key attributes:

  • Transports CPRI across standard Ethernet
  • Enables cellular-system designers to leverage the merchant-silicon-based Ethernet ecosystem
  • Connects directly to new Ethernet-based radios and installed CPRI-based radios
  • Terabit-class capacity to meet the 10x increase in capacity needed by 5G networks
  • Serves as a critical component in building mobile-edge computing platforms
  • Hardware support for key 5G requirements, including nanosecond-scale synchronization

“We are very pleased to announce another ground-breaking solution that addresses fundamental problems and opens a new, major market for our switching products,” said Ram Velaga, vice present and general manager, Switch Products at Broadcom. “The Monterey Ethernet switch is an excellent example of Broadcom’s deep commitment to 5G innovation and strategic R&D investment.”
Sampling is underway.

See also