Showing posts with label Silicon. Show all posts
Showing posts with label Silicon. Show all posts

Tuesday, May 14, 2019

Samsung charts progress from 10nm to 3mm Gate-All-Around

Samsung Electronics is making rapid progress in 3nm Gate-All-Around (GAA) process technology, which could see first tape out in 2021 and mass market production as early as 2022.

Compared to 7nm technology, Samsung’s 3GAE process aims to deliver a 45% reduction in chip area with 50% percent lower power consumption, and 35% higher performance, potentially benefiting applications as diverse as mobile, network, automotive, Artificial Intelligence (AI) and IoT.   Samsung's GAA MBCFET (Multi-Bridge-Channel FET) uses a nanosheet architecture, enabling greater current per stack. WhileFinFET structures must modulate the number of fins in a discrete way, MBCFET™provides greater design flexibility by controlling the nanosheet width.

At Samsung Foundry Forum event in Santa Clara California, company executives outlined the fabrication roadmap from today's 10nm down to 3nm. Some highlights:
  • 14/10nm - these are in high volume manufacturing. These will remain long-lasting technologies into the future
  • 8nm - the most advanced non-EUV technology
  • 7nm FinFET - currently under mass production for mobile applications. The first tape out was in 2018. IP re-use is supported.
  • 6nm FinFET -- mass production of 6nm process devices in the second half of 2019
  • 5nm FinFET - the product design of Samsung’s 5nm FinFET process, which was developed in April, is expected to be completed in the second half of this year and go under mass production in the first half of 2020
  • 4nm FinFET - will represent the maximum scaling of the 7nm family, and development will be completed later this year - 
  • 3nm Gate-All-Around (GAA) process development is on track and will leverage MBCFET (Multi-Bridge-Channel FET) based on nanosheet technology. A Process Design Kit (PDK) version 0.1 for 3GAE was released in April. This will be the future beyond FinFET.
“We stand at the verge of the Fourth Industrial Revolution, a new era of high-performance computing and connectivity that will advance the daily lives of everyone on the planet,” said Dr. ES Jung, President and head of Foundry Business at Samsung Electronics. “Samsung Electronics fully understands that achieving powerful and reliable silicon solutions requires not only the most advanced manufacturing and packaging processes as well as design solutions, but also collaborative foundry-customer relationships grounded on trust and shared vision. This year’s Foundry Forum is filled with compelling evidence of our commitment to progress in all those areas, and we’re honored to host and converse with our industry’s best and brightest,” Dr. Jung added.

Monday, April 22, 2019

Cadence says ready for TSMC’s 5nm FinFET

Cadence Design Systems confirmed that its digital, signoff and custom/analog tools have been certified for Design Rule Manual (DRM) and SPICE v1.0, and Cadence IP has been enabled for the TSMC 5nm process. The corresponding process design kits (PDKs) featuring integrated tools, flows and methodologies are now available for traditional and cloud-based environments. Additionally, mutual customers have already completed several tapeouts using Cadence tools, flows and IP for full production development on the TSMC 5nm process technology.

Cadence said it has delivered a fully integrated digital implementation and signoff tool flow, which has been certified on TSMC’s 5nm process that has the benefits of process simplification provided by extreme ultraviolet (EUV) lithography. The Cadence full-flow includes the Innovus Implementation System, Liberate Characterization Portfolio, Quantus Extraction Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution and Pegasus™ Verification System.

“We’re continuing to broaden our collaboration with TSMC to facilitate 5nm FinFET adoption, giving customers access to the latest tools and IP for advanced process design creation,” said Dr. Chin-Chi Teng, senior vice president and general manager of the Digital & Signoff Group at Cadence. “Our R&D team has focused heavily on developing new features and performance improvements so that our digital and signoff and custom/analog tools and IP can be used with complete confidence, enabling customers to achieve first-pass silicon success and deliver end products within aggressive time-to-market schedules.”

http://www.cadence.com/go/tsmc5nmca


Wednesday, April 10, 2019

Aquantia and Qualcomm collaborate on 5G fixed CPE

Aquantia is collaborating Qualcomm Technologies on next-generation 5G NR fixed wireless access broadband equipment for high-speed Internet delivery to the customer premises.

The consumer premises equipment (CPE) platform will feature the Aquantia AQtion Multi-Gig Ethernet Controllers AQC107 (10GbE) and AQC111C (5GbE), which can be used in conjunction with the Qualcomm Snapdragon X55 5G modem available from Qualcomm Technologies.

The companies expect the first deployment in the United States in the first half of 2020. Aquantia has supplied samples of the reference design to early customers.

The Aquantia AQtion AQC107 is a high-performance, 5-speed, 10 G PCI Express (PCIe)–to–Multi-Gig Ethernet controller that integrates PCIe, MAC, and PHY to provide power and space-efficient connectivity for client systems. An x4/x2/x1 PCIe interface enables the AQC107 to easily handle up to 10Gbps line-rate performance while delivering maximum flexibility. The AQrate PHY technology integrated into the AQC107 delivers up to 10 Gbps network connectivity speed through 100 m of Cat 6a and up to 5 Gbps network connectivity speed on legacy Cat 5e or Cat 6 cabling.

The Aquantia AQtion AQC111C is a high-performance, Multi-Gig Ethernet controllers housed in a compact 9 x 9 mm package. Its ultra-small footprint and low-cost design makes it the perfect solution for embedded platforms as well as other PCIe LAN on Motherboard (LOM) implementations. By offering Multi-Gig Ethernet speeds of up to 5 and 2.5 GbE, Aquantia AQtion AQC111C offers flexible design options for a variety of networked devices including OEMs of consumer premises equipments, PCs and any device using a motherboards which to offer a seamless, Multi-Gig upgrade path.

“For more than 30 years, Qualcomm has provided foundational wireless technologies that help to transform industries. We are continuing that legacy by providing a robust platform designed to support seamless 5G connectivity in the connected home and enterprises, powered by our second generation Snapdragon X55 5G modem with support for both mmWave and sub-6 GHz spectrum bands,” said, Gautam Sheoran, Senior Director, Product Management, Qualcomm Technologies, Inc. “We are excited to work with Aquantia, as the use of our 5G connectivity platform with their Multi-Gig wired backhaul in the connected home and enterprises can help support the growth of connected devices and provide unsurpassed user experience.”

“Aquantia is very pleased to work with Qualcomm Technologies on this new class of service provider access device,” said LK Bhupathi, Vice President of Marketing at Aquantia. “Use of the Snapdragon X55 5G modem with Aquantia’s Multi-Gig wired backhaul has the potential to create new business models beyond what has traditionally been offered by Internet service providers. More importantly it can also spur the delivery of rich content services such as ultra-high definition video streaming, cloud gaming and virtual reality.”


Tuesday, April 2, 2019

Intel Xeon processors pack up to 56 cores, add capabilities

The 2nd-Gen Intel Xeon Scalable platform will deliver an evolutionary leap in agility and scalability.

At Intel’s “Data-Centric Innovation Day” in San Francisco, the company outlined many new Xeon benchmarks and capabilities:

  • Support for Intel Optane DC persistent memory, delivering up-to 36TB of system-level memory capacity when combined with traditional DRAM.
  • Intel Turbo Boost Technology 2.0 ramps up-to 4.4GHz, alongside memory subsystem enhancements with support for DDR4-2933 MT/s and 16 Gb DIMM densities.
  • Built-in Intel Deep Learning Boost delivers up to 14x2 inference throughput improvement, and combined with software optimized Intel Distribution of OpenVINO toolkit
  • Intel Speed Select will enable new Xeon Scalable processors to be configured to performance settings of core counts and frequencies, effectively creating “Three CPUs in One.”
  • Enhanced Intel Infrastructure Management Technologies will enable increased utilization and workload optimization across data center resources.
  • New side-channel protections are directly incorporated into hardware.
  • Intel Security Libraries for Data Center (Intel SecL-DC) is designed to simplify the integration and deployment of hardware-rooted Intel security technologies at cloud scale. Intel SecL-DC brings optimized programming interfaces and management tools for many Intel security technologies together in one easy-to-use set of libraries and tools compatible with cloud environments like OpenStack, Docker and Kubernetes Extensions. 
  • For security-sensitive organizations, Intel engineers have worked with Lockheed Martin to deliver a new hardened virtualization platform. This Intel Select Solution for Hardened Security with Lockheed Martin is a full-stack solution, from hardware through hypervisor that features greater data confidentiality through VM memory encryption and cache isolation. It offers robust platform integrity with trusted boot all the way through to runtime, and improved availability through more deterministic Quality of Service and protections from Noisy Neighbors.
  • The new Intel Xeon Platinum 9200 processors feature up to 56 cores and 12 memory channels to deliver breakthrough levels of performance with the highest Intel architecture FLOPS per rack, along with the highest DDR4 native memory bandwidth support of any Intel Xeon processor platform.
  • The new Intel Xeon Platinum Processor (8200 Series) will offer up to 28 cores and 2, 4 and 8+ socket configurations.
  • The Intel Xeon Gold Processor (6200 Series) is Networking Specialized (NFVi optimized) with Intel Speed Select Technology – Base Frequency. It offers up to 1.76x NFV workload perf improvement and additional flexibility to enable up to 8 high-priority cores that support virtualized workload acceleration for maximum performance and power efficiency. It scales to up to 24 cores.

https://newsroom.intel.com/news/fact-sheet-intel-unveils-new-technologies-accelerate-innovation-data-centric-world/#gs.3lgjeu



Wednesday, March 27, 2019

ON Semiconductor to acquire Quantenna

ON Semiconductor agreed to acquire Quantenna Communications for $24.50 per share in cash, representing an equity valye of approximately $1.07 billion and enterprise value of approximately $936 million, after accounting for Quantenna’s net cash.

Quantenna, which is a leading developer of Wi-Fi technology and software, was founded in 2006 and is based in San Jose, California.

“We are very pleased to welcome Quantenna to ON Semiconductor’s team. The acquisition of Quantenna is another step towards strengthening our presence in industrial and automotive markets. The combination of ON’s expertise in highly efficient power management and broad sales and distribution reach, and Quantenna’s industry leading Wi-Fi technologies and software expertise creates a formidable platform for addressing fast growing markets for low-power connectivity in industrial and automotive applications,” said Keith Jackson, president and chief executive officer of ON Semiconductor. “I am very excited about the opportunity this acquisition creates for customers, shareholders, and employees of the two companies.”

“Today’s announcement is great news for Quantenna employees and customers worldwide. As part of ON Semiconductor, Quantenna will benefit from a world-class organization in our commitment to providing the best end user experience for our customers,” stated Dr. Sam Heidari, chairman and chief executive officer of Quantenna. “We are proud of our accomplishments and look forward to a smooth transition with the ON Semiconductor team to pursue exciting new opportunities for Quantenna’s talented employees and reinforce our longstanding position as a leading Wi-Fi technology innovator.”

http://www.onsemi.com


  • Earlier this month, Quantenna Communications announced a new benchmark for Wi-Fi network performance by achieving over 2 Gbps total throughput. This was attained by connecting multiple laptops with commercially available Intel Wireless-AC 9260 2x2AC MIMO wireless modems to a Quantenna-based 8x8 MIMO access point and utilizing the latest Wi-Fi features such as multi-user MIMO (MU-MIMO).

    “Quantenna is proud of its continuous innovation to perfect Wi-Fi connectivity and user experience. We prove it once again by reaching this multi-gigabit milestone,” said Dr. Sam Heidari, chairman and CEO of Quantenna.

    Quantenna’s Wi-Fi 6 QSR10GU-AX Plus chipset provides integrated dual-band, dual-concurrent 2.4GHz and 5GHz functionality, supporting up to a maximum speed of 10 Gbps and 12 simultaneous streams. It includes the SmartScan feature that offers enhanced radar detection and spectrum analyzer capabilities with wide frequency range analysis. The QSR10GU-AX Plus also supports advanced MU-MIMO schemes, allowing for transmission to multiple devices at the same time. The Intel Wireless-AC 2X2 160 MHz delivers Gigabit Wi-Fi speeds and includes two antennas for reliable connections, making it possible for users to experience smooth gaming and 4K UHD video streaming, and fast file transfers and backups on their devices.

Tuesday, March 12, 2019

Calista Redmond appointed CEO of RISC-V Foundation

Calista Redmond has been appointed Chief Executive Officer (CEO) of the RISC-V Foundation, which promotes the adoption and implementation of the free and open RISC-V instruction set architecture (ISA).

Redmond brings more than 20 years of senior-level management and alliance experience, including as Vice President of IBM Z Ecosystem, where she was instrumental in growing the IBM Z Ecosystem. During her 12 years at IBM, she led strategic relationships with chip, hardware, and software providers, system integrators, business partners, clients, and developers, as well as fostered broader industry visibility and engagement.  Redmond was instrumental in the strategic formation of OpenPOWER as the IBM Director of OpenPOWER Global Alliances as well as elected President of the OpenPOWER Foundation in 2016.

“I’ve always understood the potential short- and long-term impact of the RISC-V license-free ISA on the open source community. Having spent a lot of my career working in the open source ecosystem, I’m excited to help RISC-V grow and deliver on  the Foundation’s mission of paving the way for the next 50 years of computing design and innovation,” said Redmond, CEO of the RISC-V Foundation. “From its inception in 2015 until now, the RISC-V Foundation has grown tremendously. I’m ready to leverage that momentum to expand the already impressive RISC-V ecosystem.”

The RISC-V Foundation, which was founded in 2015, now comprises more than 235 members building the first open, collaborative community of software and hardware innovators powering a new era of processor innovation.

Thursday, January 24, 2019

Intel grew 13% in 2018 but outlook disappoints

Intel reported Q4 2018 revenue of $18.7 billion, up 9 percent year-over-year (YoY); and full-year revenue set an all-time record of $70.8 billion, up 13 percent YoY. Q4 earnings per share amounted to $1.12 ($1.28 on a non-GAAP basis);

The Q4 results, however, fell short of analyst expectations, as did the company's outlook for 2019. Data center revenues came in below market expectations. The company has not yet appointed a permanent CEO. Intel said it remains on-track to launch 10nm products in volume during 2019.

“2018 was a truly remarkable year for Intel with record revenue in every business segment and record profits as we transform the company to pursue our biggest market opportunity ever,” said Bob Swan, Intel CFO and Interim CEO. “In the fourth quarter, we grew revenue, expanded earnings and previewed new 10nm-based products that position Intel to compete and win going forward. Looking ahead, we are forecasting another record year and raising the dividend based on our view that the explosive growth of data will drive continued demand for Intel products.”


Some highlights:

The PC-centric business (CCG) was up 10 percent in the fourth quarter due to continued strong demand for Intel's higher performance products and strength in commercial and gaming. CCG expanded its product portfolio for 2019 with the recent launch of new 9th Gen Intel® Core™ processors and unveiled "Ice Lake" the upcoming, 10nm-based PC processor, which is expected to be in OEM systems on shelves for holiday, 2019.

Collectively, Intel's data-centric businesses grew 9 percent YoY in the quarter and 20 percent YoY in 2018. In the fourth quarter, DCG achieved 24 percent cloud segment growth and 12 percent communications service provider segment growth while enterprise revenue declined 5 percent. Intel recently announced that the new "Cascade Lake" family of high performance Intel® Xeon® processors with advanced AI and memory capabilities is now shipping.

Fourth-quarter Internet of Things Group (IOTG) revenue declined 7 percent YoY. However, excluding Wind River, which Intel divested in the second quarter, fourth-quarter IOTG revenue was up 4 percent YoY despite supply tightness. Record quarterly revenue in Intel's memory business (NSG) was up 25 percent YoY. Intel's Programmable Solutions Group (PSG) also achieved record quarterly revenue, up 8 percent YoY driven by strength in the data center and communications market segments.

Mobileye fourth-quarter revenue of $183 million was up 43 percent YoY as customer momentum continued. In 2018, Mobileye achieved 28 new design wins and 78 vehicle model launches.

Thursday, January 3, 2019

Arm intros image signal processors

Arm introduced two image signal processors (ISPs) designed for everyday devices including drones, smart home assistants and security, and internet protocol (IP) cameras.

The Mali-C52 and Mali-C32 devices, which leverage Arm’s Iridix technology and other industry-leading algorithms for noise and color management, apply over twenty-five processing steps to each pixel, of which three critical ones deliver key differentiation in terms of image output quality. These include high-dynamic range (HDR), noise reduction and color management. Arms said its Mali-C52 and Mali-C32 ISPs efficiently deliver all three at high resolution and in real-time (e.g. 4k resolution at 60fps).

The Mali-C52 can be configured for two different optimizations - image quality or area. This flexibility allows our silicon partners to use the same IP and software across a range of products and use cases. The Mali-C32 is optimized specifically for area in lower-power, cost-sensitive embedded vision devices such as entry-level access control or hobby drones.


Monday, December 17, 2018

Qualcomm IoT modem integrates LTE-M, NB-IoT, 2G/E-GPRS

by James E. Carroll

Qualcomm introduced a modem that integrates global multimode LTE category M1 (eMTC), NB2 (NB-IoT) as well as 2G/E-GPRS connectivity capabilities

The new Qualcomm 9205 LTE modem is designed for Internet of Things (IoT) applications such as asset trackers, health monitors, security systems, smart city sensors and smart meters, as well as a range of wearable trackers.  In addition to connectivity, the integrated chipset performs application processing, geolocation, and hardware-based security. It offers support for cloud services and accompanying developer tools.

Qualcomm said that compared to its predecessor, the 9205 modem can reduce power consumption by up to 70% in idle mode, a critical consideration for battery-powered IoT devices that need to operate for 10 years or longer in the field. The Qualcomm 9205 LTE modem is also 50% smaller and more cost-effective than its predecessor. The new modem is also softwarecompatible with the company’s prior LTE IoT solutions which allows module manufacturers to reuse software investments to develop new module solutions.

“The innovations included in the Qualcomm 9205 LTE modem are critical to support many of the 6 billion IoT devices expected to use low-power, wide-area connectivity by 2026,” said Vieri Vanghi, vice president, product management, Qualcomm Europe, Inc. “LTE IoT technologies are the foundation of how 5G will help connect the massive IoT, and we are making these technologies available to customers worldwide to help them build innovative solutions that can help transform industries and improve people’s lives.”

Qualcomm 9205 LTE modem technology highlights

  • Global multimode LTE IoT modem and connectivity: Support for both 3GPP release 14 Category M1 and NB2 for operation with networks using any of these LTE IoT modes, as well as 2G/E-GPRS to allow for connectivity in areas where LTE IoT is not yet deployed. Category M1 mode also supports voice for applications such as monitored security panels, and mobility for applications such as asset trackers.
  • RF transceiver with fully integrated front-end: The Qualcomm 9205 LTE modem features an RF transceiver with extended bandwidth support from 450 MHz to 2100 MHz. It also integrates a comprehensive RF front-end, a commercial first in the cellular IoT space, which is designed to greatly simplify the design and certification of products using the new modem, and therefore accelerate time to commercialization.
  • Advanced battery life management: To maximize battery life, the modem couples ultra-low system-level cut-off voltage with provisions for adapting power usage according to the state of charge of the battery.
  • Applications processor: Arm Cortex A7 up to 800MHz with support for ThreadX and AliOS Things real-time operating systems. The integrated applications processor avoids the need for an external microcontroller to improve cost-efficiency, and device security.
  • Geolocation: Integrated global positioning support for Global Navigation Satellite Systems (GNSS) including GPS, Beidou, Glonass, and Galileo. The Qualcomm 9205 LTE modem enables design flexibility allowing for the use of either a shared GNSS/LTE
  • antenna or a dedicated one.
  • Hardware-based security: Secure boot from hardware root-of-trust, Qualcomm Trusted Execution Environment, hardware cryptography, storage, and debug security. 
  • LTE IoT Software Development Kit (SDK): Designed to support developers in running custom software on the integrated applications processor, as well as to provide them access to additional capabilities of the Qualcomm 9205 LTE modem, such as geolocation. The SDK offers pre-integrated support for many cloud platforms, including Alibaba Cloud Link One, China Mobile OneNET, DTSTON DTCloud, Ericsson IoT Accelerator, Gizwits and Verizon ThingSpace, and it also allows developers to extend this integration further and develop support for other major IoT cloud providers.


Monday, December 10, 2018

Barefoot's Tofino 2 chip delivers 12.8 Tbps switching for 32x400GE

Barefoot Networks is now sampling its Tofino 2 chip, the second generation of its P4-programmable Tofino Ethernet switch application-specific integrated circuit (ASIC) family.

Tofino 2 doubles the performance of the first generation Tofino chip, now delivering 12.8 Tbps of packet processing capacity for hyperscale data centers, cloud, enterprise and service provider networks. The device leverages 7nm process technology and is designed for full P4-programmability.

Tofino 2 highlights:

  • World’s first 7nm switch ASIC 
  • Supports up 32x400GE on a single chip.
  • Supports up to 256x10/25/50GE ports on a single chip.
  • Fully P4-programmable, enabling various deployment options, from a standard top-of-rack switch to a service provider router, or even a feature-rich switch appliance. 
  • Support for unrivaled table sizes for routing, tunnels, and access control lists (ACLs).
  • Support for Barefoot SPRINT™- Barefoot's enhanced version of the industry-standard In-band Network Telemetry (INT), providing fine-grained per-packet intelligent real-time visibility of network traffic. 
  • Leverages the growing industry-wide P4 Ecosystem supported by multiple switch and network interface controller (NIC) chips.
  • Modular architecture enabling rapid integration of 112G SerDes and silicon photonics.
“Until Tofino arrived in 2016, networking switch ASICs hadn’t changed much in 20 years; they all ran pretty much the same tired old features. Our industry is stuck in a dinosaur way of doing things, and it takes years to add new features,” said Nick McKeown, Co-Founder, and Chief Scientist at Barefoot Networks. “Thankfully, networking is changing. Tofino, the first chip based on the PISA architecture, moved protocols - old and new - up and out of hardware into software, where they evolve at the pace of software. Tofino started it, now Tofino 2, at twice the capacity and twice the resources, demonstrates there is no going back. Within five years all switches will be programmable. We believe programming your network should be as easy as programming your computer.”

Customers cited in the Barefoot press release include Goldman Sachs, Cisco, Alibaba Infrastructure Services, Tencent, Baidu, JD Cloud, and Ucloud.

https://www.barefootnetworks.com/products/brief-tofino-2/

Monday, December 3, 2018

Samsung Foundry looks to 3nm Gate-All-Around technology

The evolution of advanced foundry technologies will be crucial to enable the design and manufacture of innovative semiconductors for AI, cloud computing, autonomous vehicles, and smart home applications, said Dr. ES Jung, president and head of Foundry Business at Samsung Electronics, speaking at the 2018 IEEE* International Electron Devices Meeting (IEDM).

Dr. Jung introduced some of recent research and development in future silicon technology, including MRAM, a non-volatile memory solution embedded in conventional logic process, and 3nm Gate-All-Around (GAA) technology.

Samsung calculates that MRAM will be far more power efficient than conventional technologies, consuming only 0.5% of power compared to SRAM at 1,024Mb. MRAM also has smaller cell area, which allows design flexibility.

Samsung's unique GAA technology called Multi-Bridge-Channel FET (MBCFET) uses vertically stacked multiple nanosheet channels. With variable width of nanosheet, this technology provides not only optimal performance and power characteristics but also high design flexibility. Furthermore, MBCFET is fabricated using 90% or more of FinFET process with only a few revised masks, allowing easy migration.

Also with one of its newly published papers at 2018 IEDM, Samsung Electronics shared the development progress of 3nm, a successful demonstration of fully functioning high-density SRAM circuit. The development of Samsung's first process node applying MBCFET technology is on schedule.

https://www.samsungfoundry.com


Wednesday, October 31, 2018

Netronome proposes open "chiplets" for domain specific workloads

Netronome unveiled its open architecture for domain-specific accelerators .

Netronome is collaborating with six leading silicon companies, Achronix, GLOBALFOUNDRIES, Kandou, NXP, Sarcina and SiFive, to develop this open architecture and related specifications for developing chiplets that promise to reduce silicon development and manufacturing costs.

The idea is fo chiplet-based silicon to be composed using best-of-breed components such as processors, accelerators, and memory and I/O peripherals using optimal process nodes. The open architecture will provide a complete stack of components (known good die, packaging, interconnect network, software integration stack) that lowers the hardware and software costs of developing and deploying domain-specific accelerator solutions. Implementing open specifications contributed by participating companies, any vendor’s silicon die can become a building block that can be utilized in a chiplet-based SoC design.

“The end of Moore’s Law will increase the use of domain-specific accelerators to meet power-performance requirements in cloud infrastructure, network infrastructure and IoT/wireless edge applications,” said Bob Wheeler, principal analyst, The Linley Group. “With its modular approach, the open domain-specific accelerator architecture could change the chiplet paradigm from single-vendor solutions to a world of choice, thereby enabling OEMs and operators to develop and deploy advanced SoC solutions.”

“Netronome’s domain-specific architecture as used in its Network Flow Processor (NFP) products has been designed from the ground up keeping modularity, and economies of silicon development and manufacturing costs as top of mind,” said Niel Viljoen, founder and CEO at Netronome. “We are extremely excited to collaborate with industry leaders and contribute significant intellectual property and related open specifications derived from the proven NFP products and apply that effectively to the open and composable chiplet-based architecture being developed in the ODSA Workgroup.”

https://www.netronome.com/

Sunday, October 28, 2018

Broadcom intros first full-duplex G.fast

Broadcom introduced the first full-duplex modem implementation based on G.fast.

Broadcom said the innovation builds on the advantages of G.fast for high-density residential environments. Full-duplex utilizes the entire frequency spectrum of G.fast simultaneously in both the downstream and upstream communication paths, effectively doubling the simplex capacity of G.fast. Depending on the nature of an operator’s copper plant, this will result in either a doubling of the peak bandwidth, or the maximum distance from the distribution point to the customer premise, as compared with the existing G.fast standard.

Broadcom’s full-duplex implementation is available today on the production-released BCM65400 device family. 

Broadcom is working with the next-generation G.mgfast initiative within the ITU to bring a fully-standardized full-duplex solution to the broadband market, pending completion and ratification of the new standard.

“We are excited to pioneer another innovative copper solution, one that effectively doubles the performance of current G.fast,” said Greg Fischer, senior vice president and general manager, Broadband Carrier Access, Broadcom. “Full-duplex technology will provide telecom operators with yet another option to leverage the investment in their existing copper networks, with a competitive, minimal capex multi-gigabit broadband service for many years to come.”

Monday, October 15, 2018

Samsung intros automotive app processors and image sensor

Samsung Electronics introduced two new automotive solution brands -- Samsung Exynos Auto and Samsung ISOCELL Auto – targeting application processors and image sensors.

“Samsung's new automotive brand solutions, Exynos Auto and ISOCELL Auto, bring Samsung's market-proven technologies to automotive applications with enhanced features and durability required by the market,” said Kenny Han, vice president of Samsung’s Device Solutions Division. “With fast telecommunication, accurate sensing and powerful processing capabilities, Samsung’s Auto-branded solutions will enable new driving experiences to next-generation smart vehicles.”

Samsung’s Exynos automotive processors bring the efficient qualities of Exynos’ mobile versions and are designed to meet industry requirements for harsher environments for automotive infotainment, advanced driving assistance systems (ADAS) and telematics.

Samsung’s ISOCELL image sensors feature the company’s innovative pixel isolation technology. The automotive grade ISOCELL sensors provide greater visibility of the road and surroundings even in low-light environments while enabling more precise identification of objects.

Monday, October 1, 2018

Intel touts new Xeon server performance benchmarks

Intel reported 95 new performance world records for its Xeon Scalable processors as achieved in servers from major original equipment manufacturers, ranging from single-socket systems up to eight-socket systems.

The new performance benchmarks were achieved in a variety of server platforms, ranging from general computing workloads running on single-socket systems to advanced technical computing and big data analytics workloads running on eight-socket systems. All systems tested include mitigations for Spectre and Meltdown.

“I’m extremely proud of the 95 world record performance benchmarks that our partners have delivered, but even more delighted to see the real-world performance that our customers are achieving on the fastest ramping Intel Xeon processor family in history,”
stated Lisa Spelman, vice president and general manager of Intel Xeon products and data center marketing.

Last week, Intel CFO and Interim CEO, Bob Swan, disclosed that its data-centric businesses grew 25 percent through June, and cloud revenue grew a whopping 43 percent in the first six months of the year. Responding to increasing demand for server and PC processors, Intel updated its CAPEX guidance for the year, saying it now plans to invest a record $15 billion in capital expenditures in 2018, up approximately $1 billion from the beginning of the year. Intel is investing $1 billion into its 14nm manufacturing sites in Oregon, Arizona, Ireland and Israel. Swan also cited progress with 10nm, stating that volume production will begin in 2019.

https://www.intel.com/content/www/us/en/benchmarks/server/xeon-scalable/1st-gen-xeon-world-record.html

Monday, September 10, 2018

Intel acquires NetSpeed Systems for interconnect fabric expertise

Intel has acquired NetSpeed Systems, a start-up based in San Jose, California, for its system-on-chip (SoC) design tools and interconnect fabric intellectual property (IP). Financial terms were not disclosed.

Intel said NetSpeed’s highly configurable and synthesizable offerings will help it more quickly and cost-effectively design, develop and test new SoCs with an ever-increasing set of IP.

NetSpeed provides scalable, coherent, network-on-chip (NoC) IP to SoC designers. NetSpeed’s NoC tool automates SoC front-end design and generates programmable, synthesizable high-performance and efficient interconnect fabrics. The company was founded in 2011.

The NetSpeed team is joining Intel’s Silicon Engineering Group (SEG) led by Jim Keller. NetSpeed co-founder and CEO, Sundari Mitra, will continue to lead her team as an Intel vice president reporting to Keller.

“Intel is designing more products with more specialized features than ever before, which is incredibly exciting for Intel architects and for our customers. The challenge is synthesizing a broader set of IP blocks for optimal performance while reining in design time and cost. NetSpeed’s proven network-on-chip technology addresses this challenge, and we’re excited to now have their IP and expertise in-house,” stated Jim Keller, senior vice president and general manager of the Silicon Engineering Group at Intel.

Wednesday, September 5, 2018

MACOM samples single-chip, 100G bidirectional optical device

MACOM Technology Solutions introduced an integrated, single-chip transmit and receive solution for short reach 100G optical transceivers, active optical cables (AOCs) and onboard optical engines.

The new MALD-37845 device, which is designed for use in CPRI, 100G Ethernet, 32G Fibre Channel and 100G EDR InfiniBand applications, integrates seamless integration of four-channel Transmit and Receive Clock Data Recovery (CDRs), four Transimpedance Amplifiers (TIAs) and four Vertical-Cavity Surface-Emitting Laser (VSCEL) drivers.

It supports a full range of data rates from 24.3 to 28.1 Gbps, it supports interoperability with a variety of VCSEL lasers and photodetectors, and is firmware-compatible with earlier-generation MACOM solutions.

Sampling is underway with production availability planned for the first half of 2019.

MACOM said the device will provide customers with a low power, single-chip solution ideally suited for small form-factor optical subassemblies.

“Optical module and AOC providers are under tremendous pressure to enable their customers with 100G connectivity at volume scale,” said Marek Tlalka, Senior Director of Marketing, High-Performance Analog, MACOM. “We believe that the MALD-37845 overcomes the integration and cost challenges inherent to legacy multi-chip offerings, providing an elegant, high-performance solution for short reach 100G applications.”

http://www.macom.com

Monday, September 3, 2018

NXP acquires OmniPHY for automotive Ethernet

NXP Semiconductors has acquired OmniPHY, a provider of automotive Ethernet subsystem technology. Financial terms were not disclosed.

NXP said OmniPHY's interface IP and communication technology along with NXP’s own automotive portfolio will form a “one-stop shop” for automotive Ethernet. The companies’ technology synergies will center on 1.25-28Gbps PHY designs and 10-, 100- and 1000BASE-T1 Ethernet in advanced processes.

“Our heritage in vehicle networks is rich and with our leadership positions in CAN, LIN, and FlexRay, we hold a unique viewpoint on automotive networks,” said Alexander E. Tan, vice president and general manager of Automotive Ethernet Solutions, NXP. “The team and technology from OmniPHY give us the missing piece in an extensive high-bandwidth networking portfolio.”

"We are very excited to join NXP – a leader in automotive electronics, for a front-row seat to the autonomous driving revolution, one that will deliver profound change to the way people live,” said Ritesh Saraf, CEO of OmniPHY. “The combination of our teams and technology will accelerate and advance the delivery of automotive Ethernet solutions providing our customers with high quality and world-class automotive Ethernet innovation."

Tuesday, August 28, 2018

Lattice Semiconductor appoints AMD exec as its new CEO

Lattice Semiconductor appointed Jim Anderson as its new President and Chief Executive Officer, and to the company’s Board of Directors. He most recently served as at Advanced Micro Devices (AMD) as the General Manager and Senior Vice President of the Computing and Graphics Business Group.

Jeff Richardson, Chairman of the Board, said, “On behalf of the Board, we are pleased to announce the appointment of Jim Anderson as Lattice’s new President and Chief Executive Officer. Jim brings a strong combination of business and technical leadership with a deep understanding of our target end markets and customers. The transformation he drove of AMD’s Computing and Graphics business over the past few years is just a recent example of his long track record of creating significant shareholder value.

President Trump blocks sale of Lattice Semi citing National Security

President Trump signed an order blocking the sale of Lattice Semiconductor to Canyon Bridge Capital Partners on national security grounds. The issue was referred to the President by the Committee on Foreign Investment in the United States (CFIUS) due to concerns regarding China Venture Capital Fund Corporation Limited and its interest in Canyon Bridge Capital Partners.

Darin G. Billerbeck, CEO of Lattice Semiconductor, issued the following statement:

“The transaction with Canyon Bridge was in the best interests of our shareholders, our customers, our employees and the United States. We also believe our CFIUS mitigation proposal was the single most comprehensive mitigation proposal ever proposed for a foreign transaction in the semiconductor industry and would have maximized United States national security protection while still enabling Lattice to accept Canyon Bridge’s investment and double American jobs. While it is disappointing that we were not able to prevail, the Board and I would like to thank Canyon Bridge for their support during this time.”

https://www.whitehouse.gov/the-press-office/2017/09/13/order-regarding-proposed-acquisition-lattice-semiconductor-corporation

Private Equity Firm Acquires Lattice Semi for $1.3 Billion - FPGAs

Canyon Bridge Capital Partners agreed to acquire all outstanding shares of Lattice Semiconductor Corporation (NASDAQ:LSCC) for approximately $1.3 billion inclusive of Lattice’s net debt, or $8.30 per share in cash. This represents a 30% premium to Lattice’s last trade price on November 2, 2016, the last trading day prior to announcement.

Lattice supplies low power FPGA, video ASSP, 60 GHz millimeter wave, and IP products to the consumer, communications, industrial, computing, and automotive markets worldwide. The company is based in Portland, Oregon.

Monday, August 27, 2018

Global Foundries hits the pause button on 7nm FiFET

GLOBALFOUNDRIES announced a strategic shift away from 7nm process technology and toward "clients in high-growth markets."

Specifically, GF's 7nm FinFET program is on hold indefinitely and the company will shift development resources to make its 14/12nm FinFET platform more relevant, with a focus on new features such RF, embedded memory, and low power.

The company announced a workforce reduction in conjunction with this move, although a number of top technologists will be redeployed on 14/12nm FinFET derivatives and other differentiated offerings.

GF also announced plans to establish its ASIC business as a wholly-owned subsidiary, independent from the foundry business.

Tom Caulfield, GF's CEO, stated “Demand for semiconductors has never been higher, and clients are asking us to play an ever-increasing role in enabling tomorrow’s technology innovations. The vast majority of today’s fabless customers are looking to get more value out of each technology generation to leverage the substantial investments required to design into each technology node. Essentially, these nodes are transitioning to design platforms serving multiple waves of applications, giving each node greater longevity. This industry dynamic has resulted in fewer fabless clients designing into the outer limits of Moore’s Law. We are shifting our resources and focus by doubling down on our investments in differentiated technologies across our entire portfolio that are most relevant to our clients in growing market segments.”

https://www.globalfoundries.com

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