Showing posts with label Samsung. Show all posts
Showing posts with label Samsung. Show all posts

Wednesday, March 25, 2020

Samsung ramps up module manufacturing with extreme ultraviolet tech

Samsung Electronics has shipped one million of the industry's first 10nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV) technology.

"With the production of our new EUV-based DRAM, we are demonstrating our full commitment toward providing revolutionary DRAM solutions in support of our global IT customers,” said Jung-bae Lee, executive vice president of DRAM Product & Technology at Samsung Electronics. "This major advancement underscores how we will continue contributing to global IT innovation through timely development of leading-edge process technologies and next-generation memory products for the premium memory market."

Samsung said it is the first to adopt EUV in DRAM production to overcome challenges in DRAM scaling. EUV technology reduces repetitive steps in multi-patterning and improves patterning accuracy, enabling enhanced performance and greater yields as well as shortened development time. EUV will be fully deployed in Samsung's future generations of DRAM, starting with its fourth-generation 10nm-class (D1a) or the highly-advanced 14nm-class, DRAM. Samsung expects to begin volume production of D1a-based DDR5 and LPDDR5 next year, which would double manufacturing productivity of the 12-inch D1x wafers.

Monday, March 16, 2020

Samsung Electronics delivers 512 GB flash storage for smartphones

Samsung Electronics has begun mass producing the first 512-gigabyte (GB) eUFS (embedded Universal Flash Storage) 3.1 for use in flagship smartphones.

The Samsung 512GB eUFS 3.1 offers a sequential write speed of over 1,200MB/s, which is more than twice the speed of a SATA-based PC (540MB/s) and over ten times the speed of a UHS-I microSD card (90MB/s). This means consumers can enjoy the speed of an ultra-slim notebook when storing massive files like 8K videos or several hundred large-size photos in their smartphones, without any buffering. Transferring contents from an old phone to a new device will also require considerably less time. Phones with the new eUFS 3.1 will only take about 1.5 minutes to move 100GB of data whereas UFS 3.0-based phones require more than four minutes.

In terms of random performance, the 512GB eUFS 3.1 processes up to 60 percent faster than the widely used UFS 3.0 version, offering 100,000 input/output operations per second (IOPS) for reads and 70,000 IOPS for writes.

Along with the 512GB option, Samsung will also have 256GB and 128GB capacities available for flagship smartphones that will be launched later this year.

Wednesday, March 4, 2020

Marvell partners with Samsung on RAN processing

Marvell and Samsung Electronics Co. are extending their collaboration to include additional segments of the Radio Access Network (RAN). The solutions will build on the OCTEON Fusion platform and integrating Samsung’s unique intellectual property.

To date, the companies have worked closely to deliver multiple generations of baseband and transport processing solutions for base stations based on Marvell’s OCTEON and OCTEON Fusion processors.

In addition, the companies are collaborating on innovative radio unit architectures designed to meet the dramatic increase in compute power required for the complex beamforming algorithms inherent to massive MIMO deployments. 

“Samsung is committed to helping mobile operators meet their performance targets,” said Jaeho Jeon, executive vice president and head of R&D, Networks Business at Samsung Electronics.  “Our relentless spirit to find innovative ways to address the next set of 5G market challenges will drive us to enhance our 5G technical capabilities.  Marvell is a valued collaborator in helping us achieve these goals.”

“Marvell believes that close collaboration with Samsung has allowed both companies to excel in the 5G infrastructure market,” said Raghib Hussain, chief strategy officer and executive vice president of the Networking and Processors Group at Marvell.  “It is our goal to ensure that infrastructure equipment suppliers such as Samsung can allow network operators to thrive in the fast-paced world of 5G.”

Wednesday, February 26, 2020

Samsung intros Secure Element chip with with CC EAL 5+ for mobiles

Samsung Electronics introduced a Common Criteria Evaluation Assurance Level (CC EAL) 5+ certified Secure Element (SE) chip for mobile devices.

The new Secure Element solution consists of a security chip and optimized software for protecting private data on an isolated data storage.

“Strong security measures have become a crucial feature in today’s smart devices as they evolve into essential tools that hold the key to our personal data connected to various services such as the cloud and financial transactions,” said Dongho Shin, senior vice president of System LSI marketing at Samsung Electronics. “Samsung has a long and proven history in security solutions such as smart card ICs, IoT processors and other semiconductor products that require robust security. Our new turnkey SE solution for mobile devices will not only keep user data safer on the go but also enable new mobile applications that will broaden and enrich our everyday lives.”

Samsung’s new SE solution is currently in mass production and is featured in Samsung’s recently-announced Galaxy S20 series smartphones.

Tuesday, February 25, 2020

Verizon hits 4.2 Gbps over 5G mmWave with 8-channel carrier aggregation

Verizon demonstrated speeds up to 4.2 Gbps over its live 5G network.

The trial, which took place using a commercial network cell site in Texas, aggregated 800 MHz of 28 GHz band spectrum using Samsung Network’s 5G NR 28 Ghz Access Unit, which has been commercially deployed by Verizon. Motorola Mobility and Qualcomm were also key technology providers.

“We’re continuing to expand our 5G Ultra Wideband network, built to enable unique and transformational experiences for our customers,” said Adam Koeppe, Senior Vice President of Technology Planning at Verizon. “We are only beginning to scratch the surface of what 5G can do, demonstrated by this latest milestone.

“We continue to innovate and introduce advanced technologies on our 5G network that will help us reach never-before seen mobile capabilities and create new and exciting use cases across the consumer and enterprise landscape. Using 5G carrier aggregation, we are able to achieve unprecedented mobile speeds and bring the massive bandwidth available with mmWave spectrum to life,” said Koeppe.

The companies said eight channel carrier aggregation using mmWave will be widely available on the 5G network in 2020.

Monday, February 24, 2020

Samsung ships 16GB LPDDR5 mobile DRAM

Samsung Electronics has begun mass producing the first 16-gigabyte (GB) LPDDR5 mobile DRAM package for next-generation premium smartphones.

Data transfer rate for the 16GB LPDDR5 comes in at 5,500 megabits per second (Mb/s), approximately 1.3 times faster than the previous mobile memory (LPDDR4X, 4266Mb/s). Compared to an 8GB LPDDR4X package, the new mobile DRAM delivers more than 20-percent energy savings while providing up to twice the capacity.

The first 12GB LPDDR5 DRAM began shipping in July 2019.

“Samsung has been committed to bringing memory technologies to the cutting edge in allowing consumers to enjoy amazing experiences through their mobile devices. We are excited to stay true to that commitment with our new, top-of-the-line mobile solution for global device manufacturers,” said Cheol Choi, senior vice president of memory sales & marketing, Samsung Electronics. “With the introduction of a new product lineup based on our next-generation process technology later this year, Samsung will be able to fully address future memory demands from global customers.”

Saturday, February 22, 2020

U.S. Cellular awards 5G contract to Samsung

U.S. Cellular awarded a contract for 5G and 4G LTE network solutions to Samsung Electronics. Financial terms were not disclosed.

“We are excited at the prospect of working with Samsung to extend groundbreaking 4G LTE and 5G technology to our customers, expanding what is possible in consumer experiences and business applications,” said Mike Irizarry, Executive Vice President and Chief Technology Officer, U.S. Cellular.

“We look forward to this new collaboration with U.S. Cellular, a key provider of mobile services to millions of customers across the U.S.,” said Mark Louison, Senior Vice President and General Manager, Networks Division, Samsung Electronics America. “As our latest network solutions become a larger part of the U.S. market, we are excited to advance Samsung’s 5G innovation and leadership, and continue our journey in delivering new communications technologies, including 4G LTE and 5G.”

Monday, February 3, 2020

Samsung launches 3rd gen High Bandwidth Memory 2E

Samsung Electronics launched its 'Flashbolt' third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is targeted at high performance computing (HPC) systems and help system manufacturers to advance their supercomputers, AI-driven data analytics and state-of-the-art graphics systems in a timely manner.

The 16GB capacity is achieved by vertically stacking eight layers of 10nm-class (1y) 16-gigabit (Gb) DRAM dies on top of a buffer chip. This HBM2E package is then interconnected in a precise arrangement of more than 40,000 ‘through silicon via’ (TSV) microbumps, with each 16Gb die containing over 5,600 of these microscopic holes.

The data transfer speed is 3.2 Gbps by leveraging a proprietary optimized circuit design for signal transmission, while offering a memory bandwidth of 410GB/s per stack. Samsung’s HBM2E can also attain a transfer speed of 4.2Gbps, the maximum tested data rate to date, enabling up to a 538GB/s bandwidth per stack in certain future applications. This would represent a 1.75x enhancement over Aquabolt's 307GB/s.

"With the introduction of the highest performing DRAM available today, we are taking a critical step to enhance our role as the leading innovator in the fast-growing premium memory market," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "Samsung will continue to deliver on its commitment to bring truly differentiated solutions as we reinforce our edge in the global memory marketplace."

Monday, January 13, 2020

Samsung to acquire TWS, a network integrator in U.S. market

Samsung Electronics Co. agreed to acquire TeleWorld Solutions (TWS), a privately-owned network services provider headquartered in Chantilly, VA.

TWS provides network design, testing and optimization services to mobile service and cable operators, equipment OEMs and other companies across the U.S. The company has network builds associated with 5G and 4G LTE underway in the U.S.

Samsung Electronics said the service offerings and customers of TWS complement its own growth among networks infrastructure clients. Key competencies include radio frequency (RF) and network design service—as well as installation, testing, and optimization services—TWS will continue to serve its existing customers and clients they currently support with Samsung. The TWS leadership team will continue to manage the business and, together with Samsung, address the network upgrade cycle occurring in the U.S.

“The acquisition of TWS will enable us to meet mobile carriers’ growing needs for improving their 4G and 5G networks, and eventually create new opportunities to enhance our service capabilities to our customers,” said Paul Kyungwhoon Cheun, Executive Vice President and Head of Networks Business at Samsung Electronics. “Samsung will continue to drive innovation in communications technology, while providing optimization services for network deployments that accelerate U.S. 5G network expansion.”

“Everyone at TeleWorld Solutions is excited to be part of the Samsung family,” said Shervin Gerami, CEO of TeleWorld Solutions. “The advent of 5G and the amount of new spectrum coming into the U.S. market requires scale and innovation for the next generation of wireless technologies. Joining forces with Samsung will accelerate innovation to help our customers fulfill their needs for network strategy, deployment, and automation.”

http://www.teleworldsolutions.com

Sunday, December 15, 2019

Videotron picks Samsung for 4G/5G in Quebec

Videotron has selected Samsung Electronics to provide 4G LTE-Advanced (LTE-A) and 5G radio access networks solutions.

Starting in early 2020, Samsung will deliver 4G LTE-A solutions across Quebec and Ottawa in which the solutions from Samsung include Massive MIMO and Dual-band base stations, supporting the operator’s 4G LTE frequencies, and 5G solutions for both 3.5GHz and 28GHz spectrum.

Videotron anticipates commercial launch in late 2020.

“We have been all over the world to find the best supplier suited to meet the evolving needs of our customers. This partnership will allow us to deliver the most advanced telecommunications solutions to Quebecers. While 4G technology has profoundly transformed telecommunications in the world, LTE Advanced and 5G will undoubtedly revolutionize the way we interact with our loved ones and the environment around us,” said Jean Fran├žois Pruneau, President and Chief Executive Officer of Videotron.

Wednesday, October 23, 2019

Samsung unveils Exynos 990 processor of 5G Exynos modem

Samsung Electronics unveiled its new Exynos 990 premium mobile processor and 5G Exynos Modem 5123, both of which will be fabricated in 7-nanometer (nm) process technology using extreme ultra-violet (EUV) to provide unprecedented performance and accelerated product development options for mobile manufacturers.

“Milestones in technological advancements are imminent all around us. Mobile 5G technology is opening new avenues for communication and connection, while AI is poised to become an everyday tool for people worldwide,” noted Inyup Kang, president of System LSI Business at Samsung Electronics. “Samsung’s Exynos 990 and Exynos Modem 5123 are perfectly adapted for high-volume 5G and AI applications, and are designed to help the world’s most ambitious enterprises, large and small, achieve their goals of bringing new capabilities to their markets.”

The Exynos 990 features an embedded Arm Mali-G77 GPU, the first premium GPU based on the new Valhall architecture, which improves graphic performance or power efficiency by up to 20 percent. This comes in addition to an overall 20-percent performance boost from an extremely powerful and flexible tri-cluster CPU structure that consists of two powerful custom cores, two high-performance Cortex-A76 cores and four power-efficient Cortex-A55 cores.

The Exynos 990 also features a top-class dual-core neural processing unit (NPU) and improved digital signal processor (DSP) that can perform over ten-trillion operations (TOPs) per second. The NPU enables localized AI in a smartphone or other mobile platform, allowing data to be processed on-device, rather than going through a network and a server, for added efficiency and security. This can also help enhance AI features such as facial recognition and scene detection for richer mobile experiences.

The new 5G Exynos Modem 5123 is one of the first 5G modem chips manufactured using a 7nm EUV process. It supports virtually all networks, from 5G’s sub-6GHz and mmWave spectrums to 2G GSM/CDMA, 3G WCDMA, TD-SCDMA, HSPA and 4G LTE, with outstanding downlink speed across the board. In 5G, with up to 8-carrier aggregation (8CA), the modem delivers a maximum downlink speed of up to 5.1 Gbps in sub-6-gigahertz (GHz) and 7.35Gbps in mmWave, or up to 3.0Gbps in 4G networks by supporting higher-order 1024 Quadrature Amplitude Modulation (QAM).

The Exynos 990 and Exynos Modem 5123 are expected to begin mass production by the end of this year.

http://www.samsung.com/exynos

Tuesday, October 22, 2019

Samsung offers 5G NR access unit for 28GHz

Samsung Electronics introduced a new 5G New Radio (NR) Access Unit (AU) supporting 28GHz spectrum and including a radio, antenna and digital unit in one compact box. The product is powered by Samsung’s in-house 5G RF chipset (announced earlier this year here and the company’s first 5G NR system-on-a-chip (SoC) modem (S9100).

Earlier this year, Samsung Networks successfully deployed its first-generation 5G NR radio base stations in the U.S. with separated radio and digital units (RU-DU separated radio). By integrating these RU-DU technologies with 1,024 antenna elements for mmWave spectrum into one compact box, the new AU can be more easily installed on streetlight poles and building walls, providing operators a faster, simplified way to build out 5G networks.

The AU can deliver 10Gbps throughput, enabling operators to deliver higher 5G NR speeds to more users. Additionally, improved cost-efficiency is achieved by eliminating the need for ‘fronthaul’ fiber connections, thanks to the AU’s integration of the digital unit. Samsung is currently shipping the new AU to a leading U.S. Tier One mobile network operator.

“Samsung has a long history of network innovation. Our innovative sprit has led us to introduce next generation technologies and open up a new 5G era,” said Paul Kyungwhoon Cheun, Executive Vice President and Head of Networks Business at Samsung Electronics. “Cultivating mmWave spectrum provides infinite opportunities by unlocking 5G's full potential. We’re excited to advance the industry by offering a new vision and diverse options to our customers around the world.”

Sunday, October 6, 2019

Samsung announces 12-Layer 3D-TSV chip packaging

Samsung Electronics announced the industry's first 12-layer 3D-TSV (Through Silicon Via) technology.

Samsung's new packaging technology vertically interconnects 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair. The thickness of the package (720㎛) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, which is a substantial advancement in component design. In addition, the 3D packaging technology also features a shorter data transmission time between chips than the currently existing wire bonding technology, resulting in significantly faster speed and lower power consumption.

Samsung says that by increasing the number of stacked layers from eight to 12, it will be able to mass produce 24-gigabyte (GB) High Bandwidth Memory, which provides three times the capacity of 8GB high bandwidth memory on the market today.

“Packaging technology that secures all of the intricacies of ultra-performance memory is becoming tremendously important, with the wide variety of new-age applications, such as artificial intelligence (AI) and High Power Computing (HPC)," said Hong-Joo Baek, executive vice president of TSP (Test & System Package) at Samsung Electronics. "As Moore's law scaling reaches its limit, the role of 3D-TSV technology is expected to become even more critical. We want to be at the forefront of this state-of-the-art chip packaging technology."

Tuesday, October 1, 2019

KDDI picks Ericsson, Nokia and Samsung for 5G

KDDI named Ericsson, Nokia and Samsung as its primary 5G vendors for next-generation network deployment in Japan.

KDDI expects the first commercial live 5G services to be available from March 2020, with more than 93 percent coverage of 5G base station areas specified by Japan’s telecom regulation body by the end of March 2025.

Ericsson confirmed that it will supply KDDI with Radio Access Network equipment, including products and solutions from the Ericsson Radio System portfolio. The equipment will allow KDDI to roll out commercial 5G services in several parts of Japan on their sub-6GHz and 28GHz bands for 5G New Radio (NR). KDDI’s selection of Ericsson as a 5G vendor follows nearly four years of close collaboration on 5G between the companies.

Nokia also confirmed its selection as a primary partner to upgrade KDDI's 4G network to 5G using its AirScale platform, which supports both 4G and 5G operations. This will allow KDDI to modernize its 4G network and meet the growing consumer and industrial demands for 5G. The contract for 5G radio re-enforces the strong relationship between the two companies, which dates back over two decades.

Nokia is an existing supplier to KDDI across multiple technologies, including radio, fixed networks, mobile core network and multiple software solutions. The 5G network will support KDDI across both cmWave and mmWave 5G frequency bands and can be deployed in both distributed and centralized architectures.

Samsung Networks said it will provide KDDI with its latest 5G network solutions, including various radio base stations supporting mid-band (3.7~3.8GHz and 4.0~4.1GHz) and mmWave (28GHz) spectrum, as well as virtualized RAN. In preparation for the arrival of 5G, the two companies have carried out several successful trials on real-world use cases and achieved world-first 5G milestones. This includes Japan’s first mmWave outdoor 5G handover test success in 2017, 5G handovers for high-speed racing cars and trains in 2017, a real-time free-viewpoint video stream at baseball stadium in 2018, a 5G-powered education showcase in an elementary school in 2019, and a demonstration of the power of real-time 4K video communication at Haneda Airport, Tokyo in 2019.

John Harrington, Head of Nokia Japan, said: “This deal will allow KDDI to get ready for the 5G era and we are honoured and excited to continue our long-term relationship. As an end-to-end supplier of multiple technologies to KDDI, we look forward to transforming the network and launching 5G for consumers and industries.”

Chris Houghton, Senior Vice President, Head of Market Area North East Asia, Ericsson, says: “Having established our important partnership with KDDI in 2013, we have now expanded our collaboration efforts. We are excited about our involvement in KDDI’s 5G network buildout, which will provide a sound basis for our future collaboration as well as allowing our partner to offer users a whole new generation of mobile services.”

Monday, September 9, 2019

Samsung and Amdocs partner on 5G Open Cloud networking

Samsung Electronics  and Amdocs are collaborating on multiple joint initiatives around open cloud 5G networks.

Specifically, Amdocs and Samsung Networks will collaborate to onboard and integrate Virtual Network Functions (VNFs) so that service provider can better take advantage of Samsung’s 5G network solutions with Open Network Automation Platform (ONAP). The collaboration will start with Samsung’s Virtualized Central Unit (vCU) function and will expand to cover additional areas through execution of a comprehensive program, including components of the 5G core, to help CSPs realize a full end-to-end 5G cloud network.

The two companies will also explore the possibility of delivering relevant network services, such as vRAN rollout and integration, and related Network Function Virtualization (NFV) enablement solutions. Virtualized network functions that are managed by a comprehensive automation and orchestration platform will provide CSPs with a rich set of innovative new services that can be deployed, discovered and scaled on demand, providing new ways to monetize the network.

“This partnership with Amdocs on ONAP enablement helps us accelerate an important shift towards a dynamic software-driven architecture that will empower networks to adjust themselves to meet ever-changing user demands and network conditions,” said Jaeho Jeon, Executive Vice President and Head of R&D, Networks Business at Samsung Electronics. “As we move 5G business forward, we continue to drive the adoption of ONAP and 5G network deployment to enrich the 5G ecosystem.”

“As the deployment of 5G networks accelerates, CSPs are taking the opportunity to rearchitect their network to be open, virtualized, cloud-based and AI-infused,” said Anthony Goonetilleke, group president of Media, Network and Technology, Amdocs. “By teaming with Samsung, Amdocs combines its expertise in enterprise-grade ONAP and software-defined systems with Samsung’s advanced 5G network solutions portfolio to better enable CSPs to launch innovative new services at speed.”

Wednesday, September 4, 2019

Samsung's prototype Key Value SSD offloads processing from server

Samsung Electronics announced the first standards-based prototype of a new type of SSD that moves the storage workload from the server CPUs into the SSD.

Samsung’s KV SSD prototype is based on a new open standard for a Key Value Application Programming Interface (KV API) that was recently approved by SNIA.

Samsung says there are numerous benefits of KV storage technology. Rather than operating as a block device, the KV SSD moves resource-draining storage operations from the host CPU to the SSD itself. This results in:

  • Much-improved system-level performance
  • Freeing the CPU from computational work, such as block operations and storage-level garbage collection
  • Substantially greater scalability in the number of linked SSDs by reducing CPU overload
  • Greatly reduced write amplification (WAF)
  • Much less wear on each SSD
  • Greater software efficiency

SNIA’s KV API standard was developed in response to growing concern that as the speed of SSDs further increases, system-level performance was reaching the point of saturation, allowing relatively few SSDs to be optimally interlinked. As the performance of SSDs continues to improve, the situation is expected to worsen when ever-increasing loads are placed on the CPU to manage block operations.

While there are other approaches to this now under development, KV SSD technology is likely to be the most cost-efficient for use with many storage appliances and IT systems.

“The SNIA KV API specification, which provides an industry-wide interface between an application and a Key Value SSD, paves the way for widespread industry adoption of a standardized KV API protocol,” said Michael Oros, SNIA Executive Director.

Tuesday, September 3, 2019

Samsung intros 5G-integrated processor in 8nm

Samsung Electronics introduced its latest mobile processor, the Exynos 980, combining an integrated 5G modem and intelligent processing performance in a single chip. Mass production is expected by the end of this year.

Samsung describes its Exynos 980, which is based on 8-nanometer (nm) FinFET process technology, as artificial intelligence (AI) mobile processor with an integrated 5G modem.

The modem supports 5G to 2G networks, providing a fast gigabit downlink speed in 4G LTE and up to 2.55 Gbps in sub-6-gigahertz (GHz) 5G.  It also supports E-UTRA-NR Dual Connectivity (EN-DC), which combines 2CC LTE and 5G connectivity to maximize mobile downlink speed of up to 3.55Gbps. In addition, the processor supports Wi-Fi 6.

The chip packs two of the latest high-performance Cortex-A77 CPU cores and four efficient Cortex-A55 cores, enabling it to run multiple apps, intricate UX designs, and high-resolution graphic games.

The neural processing unit (NPU) features elevated performances of up to 2.7 times compared to its predecessor and is built into the Exynos 980 to provide new levels of on-device intelligence. With the NPU readily available on-chip, AI tasks are processed right from the device rather than off-loaded to a server, thereby providing better data privacy and security. The NPU adds enhancements to applications such as secure user authentication, content filtering, mixed reality, intelligent camera, and more.

For advanced photography, the Exynos 980 delivers compelling camera performances with resolution support for up to 108-megapixels (Mp). The advanced image signal processor (ISP) supports up to five individual sensors and is able to process three concurrently for richer multi-camera experiences.

In addition, the Exynos 980’s multi-format codec (MFC) supports encoding and decoding of 4K UHD video at 120 frames per second (fps). HDR10+ support with dynamic mapping also offers more detailed and illuminant colors in video content.

http://www.samsung.com/exynos

Monday, July 1, 2019

Samsung and SK Telecom test 5G standalone commercialization

Samsung Electronics and SK Telecom completed Korea’s first interoperability assessment between 5G Standalone (SA) Core and other commercial network systems over a 5G network, marking the final stage for verifying the validity of 5G SA data transmission and signifying that the SA system is ready to be launched for commercial service.

The 5G SA Core, jointly developed by Samsung Electronics and SK Telecom supports network slicing and function modularization based on 3GPP standards. It also offers additional functions that operators have been using since LTE, include billing, subscriber management and operational convenience system.

The companies also noted their use of data parallel processing technology for performing QoS and transmission control simultaneously; data acceleration technology for classifying and distributing similar traffic types; and path pptimization technology which automatically delivers data traffic to Mobile Edge Computing (MEC) platform.

“The fundamental structure of 5G SA is built on a completely new configuration, successfully delivering the most optimized 5G service to customers and enterprises across numerous industries,” said Jaeho Jeon, Executive Vice President and Head of R&D, Networks Business at Samsung Electronics. “Maintaining Korea’s leadership in network innovations through continuous investments in next-generation technologies is important to Samsung and SK Telecom, and the companies will continue to collaborate on developing and commercializing 5G SA.”

https://news.samsung.com/global/samsung-electronics-and-sk-telecom-advance-in-bringing-korea-closer-to-5g-standalone-commercialization

Tuesday, May 14, 2019

Samsung charts progress from 10nm to 3mm Gate-All-Around

Samsung Electronics is making rapid progress in 3nm Gate-All-Around (GAA) process technology, which could see first tape out in 2021 and mass market production as early as 2022.

Compared to 7nm technology, Samsung’s 3GAE process aims to deliver a 45% reduction in chip area with 50% percent lower power consumption, and 35% higher performance, potentially benefiting applications as diverse as mobile, network, automotive, Artificial Intelligence (AI) and IoT.   Samsung's GAA MBCFET (Multi-Bridge-Channel FET) uses a nanosheet architecture, enabling greater current per stack. WhileFinFET structures must modulate the number of fins in a discrete way, MBCFET™provides greater design flexibility by controlling the nanosheet width.

At Samsung Foundry Forum event in Santa Clara California, company executives outlined the fabrication roadmap from today's 10nm down to 3nm. Some highlights:
  • 14/10nm - these are in high volume manufacturing. These will remain long-lasting technologies into the future
  • 8nm - the most advanced non-EUV technology
  • 7nm FinFET - currently under mass production for mobile applications. The first tape out was in 2018. IP re-use is supported.
  • 6nm FinFET -- mass production of 6nm process devices in the second half of 2019
  • 5nm FinFET - the product design of Samsung’s 5nm FinFET process, which was developed in April, is expected to be completed in the second half of this year and go under mass production in the first half of 2020
  • 4nm FinFET - will represent the maximum scaling of the 7nm family, and development will be completed later this year - 
  • 3nm Gate-All-Around (GAA) process development is on track and will leverage MBCFET (Multi-Bridge-Channel FET) based on nanosheet technology. A Process Design Kit (PDK) version 0.1 for 3GAE was released in April. This will be the future beyond FinFET.
“We stand at the verge of the Fourth Industrial Revolution, a new era of high-performance computing and connectivity that will advance the daily lives of everyone on the planet,” said Dr. ES Jung, President and head of Foundry Business at Samsung Electronics. “Samsung Electronics fully understands that achieving powerful and reliable silicon solutions requires not only the most advanced manufacturing and packaging processes as well as design solutions, but also collaborative foundry-customer relationships grounded on trust and shared vision. This year’s Foundry Forum is filled with compelling evidence of our commitment to progress in all those areas, and we’re honored to host and converse with our industry’s best and brightest,” Dr. Jung added.

Monday, April 15, 2019

Samsung Electronics' 5nm EUV tech is ready for sampling

Samsung Electronics confirmed that its 5-nanometer (nm) FinFET process technology is complete in its development and ready for customers’ samples.

Compared to 7nm, Samsung’s 5nm FinFET process technology provides up to a 25 percent increase in logic area efficiency with 20 percent lower power consumption or 10 percent higher performance as a result of process improvement to enable us to have more innovative standard cell architecture.

In addition to power performance area (PPA) improvements from 7nm to 5nm, customers can fully leverage Samsung's highly sophisticated EUV technology. Like its predecessor, 5nm uses EUV lithography in metal layer patterning and reduces mask layers while providing better fidelity.

Another key benefit of 5nm is that we can reuse all the 7nm intellectual property (IP) to 5nm. Thereby 7nm customers' transitioning to 5nm will greatly benefit from reduced migration costs, pre-verified design ecosystem, and consequently, shorten their 5nm product development.

“In successful completion of our 5nm development, we’ve proven our capabilities in EUV-based nodes,” said Charlie Bae, Executive Vice President of Foundry Business at Samsung Electronics. “In response to customers' surging demand for advanced process technologies to differentiate their next-generation products, we continue our commitment to accelerating the volume production of EUV-based technologies.”


  • In October 2018, Samsung announced the readiness and its initial production of 7nm process, its first process node with EUV lithography technology. The company has provided commercial samples of the industry’s first EUV-based new products and has started mass production of 7nm process early this year.


See also