Showing posts with label Samsung. Show all posts
Showing posts with label Samsung. Show all posts

Tuesday, May 26, 2020

Samsung Electronics intros stand-alone security chip for mobiles

Samsung Electronics Co. introduced a Secure Element (SE) chip and enhanced security software for mobile devices that offers protection for tasks such as booting, isolated storage, mobile payment and other applications. The latest security chip is Common Criteria Evaluation Assurance Level (CC EAL) 6+ certified, the highest level acquired by a mobile component.

“In this era of mobility and contact-less interactions, we expect our connected devices, such as smartphones or tablets, to be highly secure so as to protect personal data and enable fintech activities such as mobile banking, stock trading and cryptocurrency transactions,” said Dongho Shin, senior vice president of System LSI marketing at Samsung Electronics. “With the new standalone security element solution (S3FV9RR), Samsung is mounting a powerful deadbolt on smart devices to safeguard private information.”

Samsung’s new security solution supports hardware-based root of trust (RoT), secure boot and device authentication that brings mobile security to the next level. Especially for service providers, manufacturers and organizations, secure device authentication is enhanced with the RoT when running proprietary applications on a mobile device. As a bootloader initiates, a chain of trust is activated through which each and every firmware with approved keys is sequentially validated. This secure booting process is handled by the RoT, guarding the device against any possible malicious attacks or unauthorized software updates.

Wednesday, May 20, 2020

Samsung plans additional 5nm capacity at new fab in Pyeongtaek

Samsung Electronics will boost foundry capacity at the company's new production line in Pyeongtaek, Korea. The new foundry line will focus on EUV-based 5 nanometer (nm) and below process technology. Construction began this month and is expected to be in full operation in the second half of 2021.

Samsung recently added a new EUV-dedicated V1 line to its fab in Hwaseong, Korea. Initial mass production of the EUV-based 7nm process started in early 2019.  The company is on track to start mass production of 5nm EUV process in the Hwaseong fab in the second half of this year.

“This new production facility will expand Samsung’s manufacturing capabilities for sub-5nm process and enable us to rapidly respond to the increasing demand for EUV-based solutions,” said Dr. ES Jung, President and Head of Foundry Business at Samsung Electronics. “We remain committed to addressing the needs of our customers through active investments and recruitment of talents. This will enable us to continue to break new ground while driving robust growth for Samsung’s foundry business.”

With the addition of the Pyeongtaek fab, Samsung will have a total of seven foundry production lines located in South Korea and the United States, comprised of six 12-inch lines and one 8-inch line.

Friday, May 15, 2020

SK Telecom shows 5G phone with quantum random number generator

SK Telecom, together with Samsung Electronics and ID Quantique, demonstrated the first 5G smartphone equipped with a quantum random number generator chipset.

The Samsung Galaxy A Quantum with integrated quantum-enhanced cryptography will allow customers to experience advanced security through two-factor authentication for T-ID, biometric authentication-based payment for SK Pay and mobile e-certification service.

“Securing mobiles phones has become a top priority for mobile operators, who are also looking to generate new revenues,” Says Grégoire Ribordy, co-founder and CEO of ID Quantique. “With its compact size and low power consumption, our latest Quantis QRNG chip can be embedded in any smartphone, to ensure trusted authentication and encryption of sensitive information. It will bring a new level of security to the mobile phone industry.”

  • Last year, SK Telecom and ID Quantique were awarded quantum communication network-building projects in the U.S. and Europe (EU), and applied QRNG to SK Telecom’s 5G authentication center (AuC) for the first time in the world. Going forward, SK Telecom will expand its footprint in the quantum security business by integrating QRNGs to more devices and networks.



Tuesday, May 12, 2020

Samsung unveils "ruler form factor" NVMe SSDs for OCP

Samsung announced a solid state drive with an E1.S form factor and full PCIe Gen 4 support.

The new drive, which leverages the production efficiencies of the company’s sixth-generation (1xx-layer), three-bit V-NAND, uses the new form factor to maximize the number of drives possible in a 1-RU chassis.

“Offering the most 1U server-optimized form-factor, the PM9A3 will improve space utilization, add PCIe Gen4 speeds, enable increased capacity and more,” said Mr. Jongyoul Lee, senior vice president of Samsung’s Memory Software Development Team at the Open Compute Project Virtual Global Summit. “We see it eventually becoming the most sought-after storage solution on the market for tier one and tier two cloud datacenter servers, and one of the more cost-effective,” he added.

The newly announced PM9A3 drive, to be available in three versions, is expected to feature a PCIe Gen 4 (x4) interface for more than twice the sequential read performance of PCIe Gen 3 (3200MB/s), and include dedicated hardware accelerators for nearly twice the random writes (180,000 IOPs) of the previous generation. Capacities will range from 960 GB to 7.68 TB.


Wednesday, April 15, 2020

Samsung Electronics picks Xilinx ACAP

Samsung Electronics Co. will use the Xilinx Versal adaptive compute acceleration platform (ACAP) for worldwide 5G commercial deployments.

Xilinx Versal ACAPs provide a universal, flexible and scalable platform that can address multiple operator requirements across multiple geographies. The devices can be used to perform the real-time, low-latency signal processing demanded by beamforming algorithms. The AI Engines, which are part of the Versal AI Core series, are comprised of a tiled array of vector processors.

“Samsung has been working closely with Xilinx, paving the way for enhancing our 5G technical leadership and opening up a new era in 5G,” said Jaeho Jeon, executive vice president and head of R&D, Networks business, Samsung Electronics. “Taking a step further by applying Xilinx’s new advanced platform to our solutions, we expect to increase 5G performance and accelerate our leadership position in the global market.”

“Samsung is a trailblazer when it comes to 5G innovation and we are excited to play an essential role in its 5G commercial deployments,” said Liam Madden, executive vice president and general manager, Wired and Wireless Group, Xilinx. “Versal ACAPs will provide Samsung with the superior signal processing performance and adaptability needed to deliver an exceptional 5G experience to its customers now and into the future.”

The first Versal ACAP devices have been shipping to early access customers and will be generally available in the Q4 2020 timeframe.

Tuesday, April 14, 2020

Samsung hits 8.5Gbps with 5G mmWave with MU-MIMO

Samsung Electronics achieved speeds of 8.5 Gbps across its 5G mmWave Access Unit with MU-MIMO (Multi-User, Multiple-Input, Multiple-Output) technology.

Using two test mobile devices, the demonstration achieved approximately 4.3Gbps speeds on each, reaching an industry peak speed of 8.5Gbps across both devices.

Samsung said the demonstration highlights the use of mmWave spectrum to deliver multi-gigabit speeds.

“Samsung will continue to be at the forefront in advancing 5G mmWave technology,” said Hyunho Park, Senior Vice President, Networks Business at Samsung Electronics. “This successful demonstration proves mmWave’s potential to deliver new kinds of business use cases and open up opportunities for mobile operators. We look forward to building on this significant technical breakthrough to fuel our continuous journey towards an innovative and vibrant mmWave ecosystem.”


Wednesday, March 25, 2020

Samsung ramps up module manufacturing with extreme ultraviolet tech

Samsung Electronics has shipped one million of the industry's first 10nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV) technology.

"With the production of our new EUV-based DRAM, we are demonstrating our full commitment toward providing revolutionary DRAM solutions in support of our global IT customers,” said Jung-bae Lee, executive vice president of DRAM Product & Technology at Samsung Electronics. "This major advancement underscores how we will continue contributing to global IT innovation through timely development of leading-edge process technologies and next-generation memory products for the premium memory market."

Samsung said it is the first to adopt EUV in DRAM production to overcome challenges in DRAM scaling. EUV technology reduces repetitive steps in multi-patterning and improves patterning accuracy, enabling enhanced performance and greater yields as well as shortened development time. EUV will be fully deployed in Samsung's future generations of DRAM, starting with its fourth-generation 10nm-class (D1a) or the highly-advanced 14nm-class, DRAM. Samsung expects to begin volume production of D1a-based DDR5 and LPDDR5 next year, which would double manufacturing productivity of the 12-inch D1x wafers.

Monday, March 16, 2020

Samsung Electronics delivers 512 GB flash storage for smartphones

Samsung Electronics has begun mass producing the first 512-gigabyte (GB) eUFS (embedded Universal Flash Storage) 3.1 for use in flagship smartphones.

The Samsung 512GB eUFS 3.1 offers a sequential write speed of over 1,200MB/s, which is more than twice the speed of a SATA-based PC (540MB/s) and over ten times the speed of a UHS-I microSD card (90MB/s). This means consumers can enjoy the speed of an ultra-slim notebook when storing massive files like 8K videos or several hundred large-size photos in their smartphones, without any buffering. Transferring contents from an old phone to a new device will also require considerably less time. Phones with the new eUFS 3.1 will only take about 1.5 minutes to move 100GB of data whereas UFS 3.0-based phones require more than four minutes.

In terms of random performance, the 512GB eUFS 3.1 processes up to 60 percent faster than the widely used UFS 3.0 version, offering 100,000 input/output operations per second (IOPS) for reads and 70,000 IOPS for writes.

Along with the 512GB option, Samsung will also have 256GB and 128GB capacities available for flagship smartphones that will be launched later this year.

Wednesday, March 4, 2020

Marvell partners with Samsung on RAN processing

Marvell and Samsung Electronics Co. are extending their collaboration to include additional segments of the Radio Access Network (RAN). The solutions will build on the OCTEON Fusion platform and integrating Samsung’s unique intellectual property.

To date, the companies have worked closely to deliver multiple generations of baseband and transport processing solutions for base stations based on Marvell’s OCTEON and OCTEON Fusion processors.

In addition, the companies are collaborating on innovative radio unit architectures designed to meet the dramatic increase in compute power required for the complex beamforming algorithms inherent to massive MIMO deployments. 

“Samsung is committed to helping mobile operators meet their performance targets,” said Jaeho Jeon, executive vice president and head of R&D, Networks Business at Samsung Electronics.  “Our relentless spirit to find innovative ways to address the next set of 5G market challenges will drive us to enhance our 5G technical capabilities.  Marvell is a valued collaborator in helping us achieve these goals.”

“Marvell believes that close collaboration with Samsung has allowed both companies to excel in the 5G infrastructure market,” said Raghib Hussain, chief strategy officer and executive vice president of the Networking and Processors Group at Marvell.  “It is our goal to ensure that infrastructure equipment suppliers such as Samsung can allow network operators to thrive in the fast-paced world of 5G.”

Wednesday, February 26, 2020

Samsung intros Secure Element chip with with CC EAL 5+ for mobiles

Samsung Electronics introduced a Common Criteria Evaluation Assurance Level (CC EAL) 5+ certified Secure Element (SE) chip for mobile devices.

The new Secure Element solution consists of a security chip and optimized software for protecting private data on an isolated data storage.

“Strong security measures have become a crucial feature in today’s smart devices as they evolve into essential tools that hold the key to our personal data connected to various services such as the cloud and financial transactions,” said Dongho Shin, senior vice president of System LSI marketing at Samsung Electronics. “Samsung has a long and proven history in security solutions such as smart card ICs, IoT processors and other semiconductor products that require robust security. Our new turnkey SE solution for mobile devices will not only keep user data safer on the go but also enable new mobile applications that will broaden and enrich our everyday lives.”

Samsung’s new SE solution is currently in mass production and is featured in Samsung’s recently-announced Galaxy S20 series smartphones.

Tuesday, February 25, 2020

Verizon hits 4.2 Gbps over 5G mmWave with 8-channel carrier aggregation

Verizon demonstrated speeds up to 4.2 Gbps over its live 5G network.

The trial, which took place using a commercial network cell site in Texas, aggregated 800 MHz of 28 GHz band spectrum using Samsung Network’s 5G NR 28 Ghz Access Unit, which has been commercially deployed by Verizon. Motorola Mobility and Qualcomm were also key technology providers.

“We’re continuing to expand our 5G Ultra Wideband network, built to enable unique and transformational experiences for our customers,” said Adam Koeppe, Senior Vice President of Technology Planning at Verizon. “We are only beginning to scratch the surface of what 5G can do, demonstrated by this latest milestone.

“We continue to innovate and introduce advanced technologies on our 5G network that will help us reach never-before seen mobile capabilities and create new and exciting use cases across the consumer and enterprise landscape. Using 5G carrier aggregation, we are able to achieve unprecedented mobile speeds and bring the massive bandwidth available with mmWave spectrum to life,” said Koeppe.

The companies said eight channel carrier aggregation using mmWave will be widely available on the 5G network in 2020.

Monday, February 24, 2020

Samsung ships 16GB LPDDR5 mobile DRAM

Samsung Electronics has begun mass producing the first 16-gigabyte (GB) LPDDR5 mobile DRAM package for next-generation premium smartphones.

Data transfer rate for the 16GB LPDDR5 comes in at 5,500 megabits per second (Mb/s), approximately 1.3 times faster than the previous mobile memory (LPDDR4X, 4266Mb/s). Compared to an 8GB LPDDR4X package, the new mobile DRAM delivers more than 20-percent energy savings while providing up to twice the capacity.

The first 12GB LPDDR5 DRAM began shipping in July 2019.

“Samsung has been committed to bringing memory technologies to the cutting edge in allowing consumers to enjoy amazing experiences through their mobile devices. We are excited to stay true to that commitment with our new, top-of-the-line mobile solution for global device manufacturers,” said Cheol Choi, senior vice president of memory sales & marketing, Samsung Electronics. “With the introduction of a new product lineup based on our next-generation process technology later this year, Samsung will be able to fully address future memory demands from global customers.”

Saturday, February 22, 2020

U.S. Cellular awards 5G contract to Samsung

U.S. Cellular awarded a contract for 5G and 4G LTE network solutions to Samsung Electronics. Financial terms were not disclosed.

“We are excited at the prospect of working with Samsung to extend groundbreaking 4G LTE and 5G technology to our customers, expanding what is possible in consumer experiences and business applications,” said Mike Irizarry, Executive Vice President and Chief Technology Officer, U.S. Cellular.

“We look forward to this new collaboration with U.S. Cellular, a key provider of mobile services to millions of customers across the U.S.,” said Mark Louison, Senior Vice President and General Manager, Networks Division, Samsung Electronics America. “As our latest network solutions become a larger part of the U.S. market, we are excited to advance Samsung’s 5G innovation and leadership, and continue our journey in delivering new communications technologies, including 4G LTE and 5G.”

Monday, February 3, 2020

Samsung launches 3rd gen High Bandwidth Memory 2E

Samsung Electronics launched its 'Flashbolt' third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is targeted at high performance computing (HPC) systems and help system manufacturers to advance their supercomputers, AI-driven data analytics and state-of-the-art graphics systems in a timely manner.

The 16GB capacity is achieved by vertically stacking eight layers of 10nm-class (1y) 16-gigabit (Gb) DRAM dies on top of a buffer chip. This HBM2E package is then interconnected in a precise arrangement of more than 40,000 ‘through silicon via’ (TSV) microbumps, with each 16Gb die containing over 5,600 of these microscopic holes.

The data transfer speed is 3.2 Gbps by leveraging a proprietary optimized circuit design for signal transmission, while offering a memory bandwidth of 410GB/s per stack. Samsung’s HBM2E can also attain a transfer speed of 4.2Gbps, the maximum tested data rate to date, enabling up to a 538GB/s bandwidth per stack in certain future applications. This would represent a 1.75x enhancement over Aquabolt's 307GB/s.

"With the introduction of the highest performing DRAM available today, we are taking a critical step to enhance our role as the leading innovator in the fast-growing premium memory market," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "Samsung will continue to deliver on its commitment to bring truly differentiated solutions as we reinforce our edge in the global memory marketplace."

Monday, January 13, 2020

Samsung to acquire TWS, a network integrator in U.S. market

Samsung Electronics Co. agreed to acquire TeleWorld Solutions (TWS), a privately-owned network services provider headquartered in Chantilly, VA.

TWS provides network design, testing and optimization services to mobile service and cable operators, equipment OEMs and other companies across the U.S. The company has network builds associated with 5G and 4G LTE underway in the U.S.

Samsung Electronics said the service offerings and customers of TWS complement its own growth among networks infrastructure clients. Key competencies include radio frequency (RF) and network design service—as well as installation, testing, and optimization services—TWS will continue to serve its existing customers and clients they currently support with Samsung. The TWS leadership team will continue to manage the business and, together with Samsung, address the network upgrade cycle occurring in the U.S.

“The acquisition of TWS will enable us to meet mobile carriers’ growing needs for improving their 4G and 5G networks, and eventually create new opportunities to enhance our service capabilities to our customers,” said Paul Kyungwhoon Cheun, Executive Vice President and Head of Networks Business at Samsung Electronics. “Samsung will continue to drive innovation in communications technology, while providing optimization services for network deployments that accelerate U.S. 5G network expansion.”

“Everyone at TeleWorld Solutions is excited to be part of the Samsung family,” said Shervin Gerami, CEO of TeleWorld Solutions. “The advent of 5G and the amount of new spectrum coming into the U.S. market requires scale and innovation for the next generation of wireless technologies. Joining forces with Samsung will accelerate innovation to help our customers fulfill their needs for network strategy, deployment, and automation.”

http://www.teleworldsolutions.com

Sunday, December 15, 2019

Videotron picks Samsung for 4G/5G in Quebec

Videotron has selected Samsung Electronics to provide 4G LTE-Advanced (LTE-A) and 5G radio access networks solutions.

Starting in early 2020, Samsung will deliver 4G LTE-A solutions across Quebec and Ottawa in which the solutions from Samsung include Massive MIMO and Dual-band base stations, supporting the operator’s 4G LTE frequencies, and 5G solutions for both 3.5GHz and 28GHz spectrum.

Videotron anticipates commercial launch in late 2020.

“We have been all over the world to find the best supplier suited to meet the evolving needs of our customers. This partnership will allow us to deliver the most advanced telecommunications solutions to Quebecers. While 4G technology has profoundly transformed telecommunications in the world, LTE Advanced and 5G will undoubtedly revolutionize the way we interact with our loved ones and the environment around us,” said Jean François Pruneau, President and Chief Executive Officer of Videotron.

Wednesday, October 23, 2019

Samsung unveils Exynos 990 processor of 5G Exynos modem

Samsung Electronics unveiled its new Exynos 990 premium mobile processor and 5G Exynos Modem 5123, both of which will be fabricated in 7-nanometer (nm) process technology using extreme ultra-violet (EUV) to provide unprecedented performance and accelerated product development options for mobile manufacturers.

“Milestones in technological advancements are imminent all around us. Mobile 5G technology is opening new avenues for communication and connection, while AI is poised to become an everyday tool for people worldwide,” noted Inyup Kang, president of System LSI Business at Samsung Electronics. “Samsung’s Exynos 990 and Exynos Modem 5123 are perfectly adapted for high-volume 5G and AI applications, and are designed to help the world’s most ambitious enterprises, large and small, achieve their goals of bringing new capabilities to their markets.”

The Exynos 990 features an embedded Arm Mali-G77 GPU, the first premium GPU based on the new Valhall architecture, which improves graphic performance or power efficiency by up to 20 percent. This comes in addition to an overall 20-percent performance boost from an extremely powerful and flexible tri-cluster CPU structure that consists of two powerful custom cores, two high-performance Cortex-A76 cores and four power-efficient Cortex-A55 cores.

The Exynos 990 also features a top-class dual-core neural processing unit (NPU) and improved digital signal processor (DSP) that can perform over ten-trillion operations (TOPs) per second. The NPU enables localized AI in a smartphone or other mobile platform, allowing data to be processed on-device, rather than going through a network and a server, for added efficiency and security. This can also help enhance AI features such as facial recognition and scene detection for richer mobile experiences.

The new 5G Exynos Modem 5123 is one of the first 5G modem chips manufactured using a 7nm EUV process. It supports virtually all networks, from 5G’s sub-6GHz and mmWave spectrums to 2G GSM/CDMA, 3G WCDMA, TD-SCDMA, HSPA and 4G LTE, with outstanding downlink speed across the board. In 5G, with up to 8-carrier aggregation (8CA), the modem delivers a maximum downlink speed of up to 5.1 Gbps in sub-6-gigahertz (GHz) and 7.35Gbps in mmWave, or up to 3.0Gbps in 4G networks by supporting higher-order 1024 Quadrature Amplitude Modulation (QAM).

The Exynos 990 and Exynos Modem 5123 are expected to begin mass production by the end of this year.

http://www.samsung.com/exynos

Tuesday, October 22, 2019

Samsung offers 5G NR access unit for 28GHz

Samsung Electronics introduced a new 5G New Radio (NR) Access Unit (AU) supporting 28GHz spectrum and including a radio, antenna and digital unit in one compact box. The product is powered by Samsung’s in-house 5G RF chipset (announced earlier this year here and the company’s first 5G NR system-on-a-chip (SoC) modem (S9100).

Earlier this year, Samsung Networks successfully deployed its first-generation 5G NR radio base stations in the U.S. with separated radio and digital units (RU-DU separated radio). By integrating these RU-DU technologies with 1,024 antenna elements for mmWave spectrum into one compact box, the new AU can be more easily installed on streetlight poles and building walls, providing operators a faster, simplified way to build out 5G networks.

The AU can deliver 10Gbps throughput, enabling operators to deliver higher 5G NR speeds to more users. Additionally, improved cost-efficiency is achieved by eliminating the need for ‘fronthaul’ fiber connections, thanks to the AU’s integration of the digital unit. Samsung is currently shipping the new AU to a leading U.S. Tier One mobile network operator.

“Samsung has a long history of network innovation. Our innovative sprit has led us to introduce next generation technologies and open up a new 5G era,” said Paul Kyungwhoon Cheun, Executive Vice President and Head of Networks Business at Samsung Electronics. “Cultivating mmWave spectrum provides infinite opportunities by unlocking 5G's full potential. We’re excited to advance the industry by offering a new vision and diverse options to our customers around the world.”

Sunday, October 6, 2019

Samsung announces 12-Layer 3D-TSV chip packaging

Samsung Electronics announced the industry's first 12-layer 3D-TSV (Through Silicon Via) technology.

Samsung's new packaging technology vertically interconnects 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair. The thickness of the package (720㎛) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, which is a substantial advancement in component design. In addition, the 3D packaging technology also features a shorter data transmission time between chips than the currently existing wire bonding technology, resulting in significantly faster speed and lower power consumption.

Samsung says that by increasing the number of stacked layers from eight to 12, it will be able to mass produce 24-gigabyte (GB) High Bandwidth Memory, which provides three times the capacity of 8GB high bandwidth memory on the market today.

“Packaging technology that secures all of the intricacies of ultra-performance memory is becoming tremendously important, with the wide variety of new-age applications, such as artificial intelligence (AI) and High Power Computing (HPC)," said Hong-Joo Baek, executive vice president of TSP (Test & System Package) at Samsung Electronics. "As Moore's law scaling reaches its limit, the role of 3D-TSV technology is expected to become even more critical. We want to be at the forefront of this state-of-the-art chip packaging technology."

Tuesday, October 1, 2019

KDDI picks Ericsson, Nokia and Samsung for 5G

KDDI named Ericsson, Nokia and Samsung as its primary 5G vendors for next-generation network deployment in Japan.

KDDI expects the first commercial live 5G services to be available from March 2020, with more than 93 percent coverage of 5G base station areas specified by Japan’s telecom regulation body by the end of March 2025.

Ericsson confirmed that it will supply KDDI with Radio Access Network equipment, including products and solutions from the Ericsson Radio System portfolio. The equipment will allow KDDI to roll out commercial 5G services in several parts of Japan on their sub-6GHz and 28GHz bands for 5G New Radio (NR). KDDI’s selection of Ericsson as a 5G vendor follows nearly four years of close collaboration on 5G between the companies.

Nokia also confirmed its selection as a primary partner to upgrade KDDI's 4G network to 5G using its AirScale platform, which supports both 4G and 5G operations. This will allow KDDI to modernize its 4G network and meet the growing consumer and industrial demands for 5G. The contract for 5G radio re-enforces the strong relationship between the two companies, which dates back over two decades.

Nokia is an existing supplier to KDDI across multiple technologies, including radio, fixed networks, mobile core network and multiple software solutions. The 5G network will support KDDI across both cmWave and mmWave 5G frequency bands and can be deployed in both distributed and centralized architectures.

Samsung Networks said it will provide KDDI with its latest 5G network solutions, including various radio base stations supporting mid-band (3.7~3.8GHz and 4.0~4.1GHz) and mmWave (28GHz) spectrum, as well as virtualized RAN. In preparation for the arrival of 5G, the two companies have carried out several successful trials on real-world use cases and achieved world-first 5G milestones. This includes Japan’s first mmWave outdoor 5G handover test success in 2017, 5G handovers for high-speed racing cars and trains in 2017, a real-time free-viewpoint video stream at baseball stadium in 2018, a 5G-powered education showcase in an elementary school in 2019, and a demonstration of the power of real-time 4K video communication at Haneda Airport, Tokyo in 2019.

John Harrington, Head of Nokia Japan, said: “This deal will allow KDDI to get ready for the 5G era and we are honoured and excited to continue our long-term relationship. As an end-to-end supplier of multiple technologies to KDDI, we look forward to transforming the network and launching 5G for consumers and industries.”

Chris Houghton, Senior Vice President, Head of Market Area North East Asia, Ericsson, says: “Having established our important partnership with KDDI in 2013, we have now expanded our collaboration efforts. We are excited about our involvement in KDDI’s 5G network buildout, which will provide a sound basis for our future collaboration as well as allowing our partner to offer users a whole new generation of mobile services.”