Showing posts with label PAM4. Show all posts
Showing posts with label PAM4. Show all posts

Thursday, November 11, 2021

Credo pushes LP SWITCH Active Electrical Cable to 200G

Credo announced the 200G HiWire LP SWITCH Active Electrical Cable (AEC) for connecting servers to to two Top-of-Rack (TOR) switches for hitless failover. The solution architecture was jointly announced in July 2021 by Credo and Microsoft, whose SONIC Dual TOR Management Container controls the SWITCH AEC.

The HiWire LP SWITCH AEC 200 has QSFP56 (Quad Small Form Factor Pluggable) connectors with integrated Credo PCS termination. The cables support 50G, 100G, and 200G with optional speed-shifting between 56G PAM4 and 28G NRZ lanes on both the NIC and TOR ends. The new 200G AECs join Credo’s diverse HiWire family for 100G, 200G, 400G, and 800G systems.

“Thanks to Credo’s advanced purpose-built SerDes architecture, our 200G LP SWITCH AEC has doubled its speed in the last six months while staying inside the same power envelope.”

Data processing and storage power can be monetized but not the power consumed for data transport. Credo’s low-power LP SWITCH AECs help minimize data transport power and enable data center architectures that eliminate redundant failover server racks.

“Power is the most important and most difficult parameter to control in hyperscale networking,” said Don Barnetson, Vice President of Product, AECs at Credo. “Thanks to Credo’s advanced purpose-built SerDes architecture, our 200G LP SWITCH AEC has doubled its speed in the last six months while staying inside the same power envelope.”

“As NIC speeds increase rapidly in the hyperscale datacenter, reliability must not be compromised,” said Lihua Yuan, Partner Development Manager at Microsoft. “Credo’s 50G and 100G HiWire LP SWITCH AECs are already proven and up-streamed in SONiC with the 200G LP SWITCH AEC creating a path for next-generation NIC speeds in 2022.”

“Emerging trends such as AI and 5G are driving exponential growth in the performance demands of the modern data center,” said David Iles, Senior Director of Ethernet Switches at NVIDIA. “The NVIDIA Networking platform equips innovators as Credo with the network bandwidth and low latency required to supercharge the modern data center with breakthroughs such as the HiWire LP SWITCH AECs.”

"Reliability is more critical for telecommunication service providers than for hyperscalers," said Keyur Patel, Founder and CTO, Arrcus. “Credo’s HiWire LP SWITCH AECs provide 5x9s (99.999%) rack reliability and enable us to ensure autonomous high availability (HA) from the Arrcus Connected Edge (ACE) platform with a sub-microsecond failover."

https://www.credosemi.com/credo-hiwire-lp-switch-aec-active-electrical-cable

Tuesday, September 14, 2021

Spectra7 and MultiLane demo 112Gbps PAM4 Active Copper Cable

Spectra7 Microsystems and MultiLane will be demonstrating Spectra7's new 112G PAM4 GaugeChanger chip intended for next generation 800Gbps data center interconnects at this year's annual China International Optoelectronic Expo (CIOE) 2021 show at the Shenzhen Convention & Exhibition Center in Shenzhen from September 16-18.

As the industry moves to 800Gbps it will adopt 112Gbps PAM4 per lane signaling over 8 lanes. At these ultra-high signal rates, traditional passive copper cables will struggle to reach beyond 1.5 meters. This creates a huge problem for Hyperscalers that require longer lengths to serve both switch-to-switch and switch-to-server connections, but do not want to incur the power and cost penalty of optics. 

ACCs enabled with Spectra7's GC1122 solution will extend copper cable reach 2.5 times, up to 4 meters at a fraction of the cost of optics while consuming only 200mW of power per channel, which is up to 12 times lower power than optical solutions.

The GC1122 is the latest addition to Spectra7's GaugeChanger product line and extends the data rate from 56Gbps PAM4 to 112Gbps PAM4 per lane. Since the GC1122 is analog and highly linear, dynamics such as line rate adjustment, multi-level signaling, intermittent line silence, transmit pre-emphasis or amplitude adjustment and receiver adaptivity are fully preserved. The GC1122 is packaged in an ultra-small 2.7mm x 4.2mm chip scale package making it easily embeddable in even the smallest of connectors.

The CIOE demonstration highlights Spectra7's new GC1122 device as well as MultiLane's latest high speed test equipment including the ML4015D DSO and the ML4079E 800G BERT.

"Spectra7's new GC1122 is set to fill a big need in the data center interconnect market," said MultiLane CEO Fadi Daou. "We are delighted to be working with Spectra7 and their cable partners as they anticipate bringing their 112Gbps products to mass production in 2022."

"We are seeing tremendous interest from every Hyperscaler to get sample 800Gbps cables that are enabled by our new GC1122 solution", said Spectra7 CEO Raouf Halim. "Both we and our cable partners believe that 800Gbps will represent a significant acceleration in the growth and adoption of our ACC data center interconnect technology."

Tuesday, August 31, 2021

Semtech ships its 50G PAM4 CDR chipset

Semtech’s newest Tri-Edge clock and data recovery (CDR) chipset, which targets data center interconnectivity over multi-mode fiber, has entered into full production status.

The Semtech GN2538 is a dual-channel 50G PAM4 CDR with integrated VCSEL drivers and the GN2539 is a dual-channel 50G PAM4 CDR with integrated linear transimpedence amplifiers (TIAs). This chipset is the latest addition to the proven Tri-Edge CDR platform, and the low power and ease of implementation of the GN2538 and GN2539 will allow major data centers to upgrade their intra-data center interconnects and enhance overall performance.

The laser driver integrated in the GN2538 includes proprietary VCSEL compensation to enable a wide range of VCSEL options with fully adaptive input equalization and easy startup to streamline system bring up. The integrated linear TIA in the GN2559 provides superior receiver performance with reliable adaptation and includes configurable output de-emphasis enabling robust and compliant electrical interfaces.

“Our customers have fully tested the solutions confirming interoperability with 100G ports of commercial Ethernet switches used in major data centers. The integration offered by the analog PAM4 GN2538 and GN2539 chipset enables reduced cost, and delivers the highly desired low power and low latency performance that meets the needs of high-performance computing (HPC), artificial intelligence (AI) and Cloud data center networks. This chipset is also fully compliant to the 50G per lane multi-mode fiber Open Eye MSA specification,” said Julius Yam, market manager, Data Center Products in Semtech’s Signal Integrity Products Group.

http://www.semtech.com/optical

Tuesday, August 17, 2021

Spectra7 and MultiLane demo 112Gbps PAM4 Active Copper Cable

Spectra7 Microsystems and MultiLane Technologies demonstrated 112Gbps PAM4 Active Copper Cable (ACC) technology at this week's DesignCon event in San Jose, California.

Spectra7 said ACCs enabled by its new 112G PAM4 GaugeChanger chip will extend copper cable reach 2.5 times, up to 4 meters at a fraction of the cost of optics. Critically, at a time when Hyperscale operators are struggling with power consumption and carbon emissions, ACCs using the Spectra7 technology will consume only 200mW of power per channel, which is up to 12 times lower power than optical solutions.

Spectra7's GC1122 solution is the latest addition to the company's GaugeChanger product line and extends the data rate from 56Gbps PAM4 to 112Gbps PAM4 per lane. Since the GC1122 is analog and highly linear, dynamics such as line rate adjustment, multi-level signaling, intermittent line silence, transmit pre-emphasis or amplitude adjustment and receiver adaptivity are fully preserved. The GC1122 is packaged in an ultra-small 2.7mm x 4.2mm chip scale package making it easily embeddable in even the smallest of connectors.

The DesignCon demonstration highlights Spectra7's new GC1122 device as well as MultiLane's latest high speed test equipment including the ML4015D DSO and the ML4039E BERT.

"Spectra7's new GC1122 is set to fill a big need in the data center interconnect market," said MultiLane CEO Fadi Daou. "We are delighted to be working with Spectra7 and their cable partners as they anticipate bringing their 112Gbps products to mass production in 2022."

"We are seeing tremendous interest from every Hyperscaler to get sample 800Gbps cables that are enabled by our new GC1122 solution", said Spectra7 CEO Raouf Halim. "Both we and our cable partners believe that 800Gbps will represent a significant acceleration in the growth and adoption of our ACC data center interconnect technology."

https://www.spectra7.com/spectra7andmultilane-2021

Wednesday, April 7, 2021

Semtech expands 5G front haul portfolio with 50Gbps CDR

Semtech announced sampling of the newest member of its Tri-Edge CDR portfolio, the GN2256, an IC solution to enable 50Gbps PAM4 Fixed-WDM (Wavelength Division Multiplexing), Tunable WDM and Silicon Photonics optical modules.

The device integrates Semtech’s proven Tri-Edge CDR platform with a differential EML (Externally Modulated Laser) driver.

Semtech says the approach to expanding 5G wireless infrastructure bandwidth differs based on geographic region, deployment area considerations and carrier preferences. This often requires different types of optical modules in 5G wireless front haul links. In regions where it is typically difficult to install more fiber or reduce overhead costs, carriers utilize “colored” optical modules that send and receive multiple signals using differing wavelengths on a single fiber. These optical modules are also referred to as WDM optical modules and are critical for the 5G wireless infrastructure, especially for countries like Japan, Korea and the U.S. 

The GN2256 combines Semtech’s proprietary analog Tri-Edge technology with enhanced laser driver compensation to enable IEEE and Open Eye MSA compliant optical modules over industrial temperature ranges. Semtech’s Tri-Edge 5G platform addresses the full range of optical modules needed for all regions by enabling multiple types of SFP56 optical modules operating at 50Gbps PAM4.

“With the introduction of the GN2256 Tri-Edge IC, Semtech has established itself as the leader in 5G wireless front haul deployments with a truly differentiated and comprehensive IC portfolio. Semtech is a one-stop shop for our optical module partners and system vendors to enable worldwide 5G wireless front haul deployments,” said Raza Khan, senior market manager for Semtech’s Signal Integrity Products Group.

http://www.semtech.com/optical

Thursday, February 25, 2021

Credo intros PAM4 Optical DSP

 Credo introduced its Seagull 200 Optical DSP for supporting high-performance QSFP56 optical modules to enable 200GbE SR4, DR4, FR4, and LR4 applications in hyperscale data centers, cloud networks, and 5G wireless mid-haul and back-haul networks.

Seagull 200 accepts four lanes of 53.125Gbps (26.5625Gbaud) PAM4 on the client (host) interface and sends the traffic to four lanes of 53.125Gbps PAM4 signal on the optical (line) interface. The device is designed in Credo’s unique architecture and optimized for die size and mainstream silicon process technology, enabling low cost-of-ownership and accelerating 200GbE market adoption.

Seagull 200 (CFD50502) integrates high-performance digital signal processing (DSP) engine and equalization techniques to compensate for optical impairments while achieving good BER performance and maintaininglow power dissipation. The architecture has minimal and deterministic latency that is needed in the mobile infrastructure. 

Seagull 200 comes with advanced diagnostics and loopback features to reduce time-to-market and aid with rapid system debug. The device footprint is compatible with Credo’s low power Dove 200 Optical DSP, which allows customers to design a common PCB for either component and choose the DSP that best meets the application need.

“Seagull 200 is the ideal high-performance and low power DSP for data centers and for 5G wireless mid-haul and back-haul deploying PAM4 networks,” said Scott Feller, Vice President of Marketing at Credo. “The low power and fixed latency enable 200G upgrades on the next generation wireless networks,” Feller added.

https://www.credosemi.com


Credo intros DSP for 5G front- and mid-haul

Credo introduced a DSP for optical modules used in 5G front- and mid-haul wireless networks. 

The Credo Seagull 50, CFD10101, is a versatile full-duplex product that can be used in next-generation QSFP28, DSFP, and SFP56 pluggable optical transceivers. It supports 50Gbps SR/DR/FR/LR and ER applications based on PAM4 modulation. 

Seagull 50 operates over the full industrial temperature range of -40oC to +85oC module case and is ideal for use in datacenters and 5G wireless/eCPRI front-, mid- and backhaul applications.

The DSP can be used as a gearbox or retimer. In gearbox mode, the IC is configured as two lanes of 24.33-25.78Gbps NRZ on the host side to one lane of 50.135-53.125Gbps PAM4 on the line side. In retimer mode, the DSP is configured as one lane of 50.135-53.125Gbps PAM4 to one lane of 50.135-53.125Gbps PAM4. 


https://www.credosemi.com/releases/2020/9/7/credo-introduces-seagull-50-pam4-dsp-to-drive-front-and-mid-haul-5g-wireless-networks

Wednesday, November 4, 2020

Spectra7 Sets Sights on 56Gbps PAM4 NIC designs


Spectra7 Microsystem announced three new reference designs targeted at new server connectivity needs implementing 56Gbps PAM4 signaling on Ethernet Network Interface Cards (NICs). 

As servers adopt higher bandwidth ports that utilize 56Gbps PAM4 signaling, passive cables cannot serve all lengths needed. Instead of deploying optical interconnects that are much higher power and more costly, operators are looking to Active Copper Cables (ACCs) to serve this growing need. One example is Tencent who demonstrated a Spectra7 enabled ACC for server connectivity in September at China’s Open Data Center Committee (ODCC) conference. The 200Gbps demonstration showed a Spectra7 enabled ACC “splitter cable” connecting from a 200Gbps top-of-rack (ToR) switch port to 2 separate servers with 100Gbps NIC ports. The signaling in the cable was 56Gbps PAM4. This “splitter cable” architecture is being widely planned both in the US and in China for next generation deployments.

GCS-QSFP Reference Design

Server Connectivity Splitter Cable with 200Gbps QSFP56-CR4 form factor module at switch end and 2 QSFP56-CR2 form factor modules at server ends. A total of 4 GC2502 ICs are used in this reference design.

GCS-DSFP Reference Design

Server Connectivity Splitter Cable with 200Gbps QSFP56-CR4 form factor module at switch end and 2 DSFP-CR2 form factor modules at server ends. A total of 4 GC2502 ICs are used in this reference design.

GCS-SFP-DD Reference Design

Server Connectivity Splitter Cable with 200Gbps QSFP56-CR4 form factor module at switch end and 2 SFP-DD-CR2 form factor modules at server ends. A total of 4 GC2502 ICs are used in this reference design.

http://www.spectra7.com/pam4-referencedesigns

Tuesday, September 8, 2020

MACOM demos optical product set

At this week's China International Optoelectronic Exposition (CIOE) 2020 event in Shenzhen, MACOM is demonstrating its latest optical innovations:

10G Combo Passive Optical Network (PON) OLT Chipset - this demonstration will showcase MACOM’s 10G OLT product performance for XGS-Combo PON OLT applications. Featuring MACOM’s new MALD-02186 Combo Chip, MATA-02239 TIA and APD10B/ES APD, the demonstration will showcase best-in-class burst mode timing and receiver sensitivity.

2km 5G Front Haul Link Demo - this demonstration will showcase MACOM’s new Fabry-Perot (FP) laser along with a MACOM 25 Gbps Multi-Rate Dual CDR with DML laser driver and TIA, for distances up to 2 kilometers. The demonstration highlights the robust performance of the 25Gbps link based on MACOM’s 25G FP laser, laser driver/CDRs and TIA over a wide temperature range.

10km 5G Optical Link Demo -this demonstration showcases MACOM’s new 25G laser technology for 5G front haul and mid haul applications including CWDM6, BiDi, MWDM12 and LWDM12. It includes MACOM’s new 25G laser family with a 25 Gbps Multi-Rate Dual CDR with DML laser driver and TIA.

50G PAM4 5G Mid-Haul Optical Link Demo - this demonstration showcases a 5G wireless mid-haul link over 10 kilometers of fiber with 50Gb/s PAM4 DSP technology, Ethernet security and a DML laser. It features a full suite of MACOM ICs including the PRISM-50 DSP, a high-speed laser, a 56Gbps TIA and a 256Gbps PIN photodetector enabling a complete end-to-end optical link. MACOM’s ES200 MACSec PHY is used to source a 50GE traffic stream, with forward error correction and Ethernet security during the live demonstration.

Datacenter, 200G/400G Analog Chipset Solution - this demonstration highlights MACOM’s high-speed analog ‘4-device chipset’ in end-customer modules that are compliant with the recently released 200/400Gbps Open Eye MSA standards for multimode applications. The chipset will include MACOM’s driver, TIA, and transmit and receive CDRs. It will feature a complete active optical cable solution as well as an evaluation board showcasing performance over 100 meters of multimode fiber.

http://www.macom.com

Thursday, September 3, 2020

Rain Tree Photonics and MaxLinear deliver 400G module for hyperscalers

Singapore-based Rain Tree Photonics (RTP) and MaxLinear announced the availability of a silicon photonics-based solution for 400G-DR4 optical modules for hyperscale data centers.

Rain Tree Photonics’ proprietary photonics engine leverages the company's silicon photonics integration technology and offers high yield and volume scalability. It is also developed to be ready for Co-Packaged Optics (CPO) architectures, while maintaining compatibility with pluggable module architectures.

MaxLinear’s MxL93542 Telluride PAM4 DSP is a key component in the development of high-speed, mega-scale data centers based on 100Gbps single lambda optical interconnects. This SOC and others in the Telluride family are the world’s first DSPs with integrated electro-absorption modulated laser (EA-EML) drivers for 100/400Gbps optical interconnects and breakout mode clocking support for 400Gbps DR4 optical modules.

The RTP1908, RTP’s 400G-DR4 silicon photonic engine, integrates multiple photonic devices allowing all 4 channels to fit into a tiny chip footprint. Each channel also features RTP’s energy-efficient modulator which is directly driven by the MxL93542’s integrated EA-EML driver. The entire photonic circuit is optimized for low optical insertion loss and features large mode-field-diameter fiber couplers that ensure high yield with standard packaging lines.

The MxL93542 16nm CMOS PAM4 DSP SoC consumes an extremely low 6.7W of power, which includes the integrated EA-EML driver power dissipation. The minimal power consumption of the MxL93542 meets the stringent power constraints of 400Gbps optical module form-factors, including QSFP-DD, OSFP and COBO devices.

“MaxLinear’s MxL93542 PAM4 DSP with integrated quad-channel EML drivers provides outstanding cost benefits for 400G-DR4 optical module customers. Driver integration also simplifies the module design, which together with RTP’s fabless++ approach, improves NPI cycle-time for customer adoption,” said Dr. Huang Ying, Co-founder at Rain Tree Photonics. “The MxL93542’s integrated drivers also work well with the high-efficiency, low-drive silicon photonic modulators in the RTP1908, achieving excellent TDECQ and OMA performance.”

“We are pleased with the successful pairing of the MxL93542 with Rain Tree Photonics’ RTP1908 silicon photonics engine to provide a compelling integrated solution for 400G-DR4 modules,” said Will Torgerson, Vice President and General Manager of MaxLinear’s High-Speed Interconnect Group. “The highly integrated Telluride DSPs offer superior link-margin performance and industry-leading power consumption.”


Tuesday, September 1, 2020

Teledyne LeCroy tests 200GbE PAM4

Teledyne LeCroy announced the support for complete analysis of IEEE 802.3cd based 200GbE Pulse Amplitude Modulation (PAM4) Ethernet links in the SierraNet M648 Ethernet and Fibre Channel Protocol Test System with the latest Net Protocol Suite software version 4.30.

SierraNet M648 offers extensive and deep Ethernet protocol analysis, including InFusion traffic impairment tools for both NRZ and PAM4 signaling and is the only dedicated analysis tool in the market to offer complete test and network validation tools covering the full range of ethernet speeds and protocols available.

"The IEEE 802.3cd signaling and data rates are seeing accelerated adoption, and 200GbE is a key element for achieving the high-speed access to cloud and enterprise data storage.  With a focus on both the transport layer as well as the supporting storage protocols, the SierraNet is essential for maintaining critical networks, and to improve uptime, energy and resources," said David Rodgers, Senior Product Manager with Teledyne LeCroy.

Tuesday, August 25, 2020

Open Eye Consortium announces 53Gbps per lane Multi-Mode SR4

The Open Eye Consortium (Open Eye MSA) announced two new specifications targeted for 53Gbps per lane applications: SR4 for 100 meters reach over a multi-mode fiber and LR for 10 kilometers reach over a single-mode fiber. The new specs target 53Gbps SFP28 Long-Reach (LR) and 200Gbps QSFP Short-Reach (SR) optical module designs for next generation 5G wireless, enterprise and data center networking applications.

The Open Eye MSA said its new specifications will provide an alternative to higher power and higher cost DSP-based solutions.

The new specs complement the Open Eye MSA’s previously released 200Gbps FR4 specification.

In addition, the Open Eye MSA will be hosting two webinars aimed at introducing network planners and optical module developers to this new exciting technology:

Webinar 1

  • Topic: Reduce Cost, Power and Latency with Open Eye MSA based Optical Connectivity
  • Description: This webinar is targeted for Data Center, Enterprise and Telecom network architects. Presenters will overview the benefits of the Open Eye MSA approach enabling low cost, low power and low latency optical modules for 200Gbps and 400Gbps connectivity deployments.
Webinar 2
  • Topic: Reducing the Cost of 200Gbps and 400Gbps Optics using Open Eye MSA compliant Chipset Solutions
  • Description: This webinar is targeted for manufacturers of optical modules. The Open Eye MSA approach is a natural evolution relative to today’s high-volume optical nodes, enabling users to scale to next generation Baud rates. Presenters will overview chip-set and test solutions for implementation of modules based on Open Eye MSA specifications.

The Open Eye MSA is also excited to announce that its membership has grown to 37 members with the addition of Credo Semiconductor, Fuji Xerox and Lumentum to its list of members.

https://www.openeye-msa.org/

Open Eye Consortium specification defines 53Gbps per lane PAM-4

The Open Eye Consortium (Open Eye MSA) published its 53 Gbps single-mode specification defining the requirements for analog PAM-4 solutions for 50G SFP, 100G DSFP, 200G QSFP, and 400G QSFP-DD and OSFP single-mode modules.

The Open Eye MSA aims to accelerate the adoption of PAM-4 optical interconnects scaling to 50Gbps, 100Gbps, 200Gbps, and 400Gbps by expanding upon existing standards to enable optical module implementations using less complex, lower cost, lower power, and optimized analog clock and data recovery (CDR) based architectures in addition to existing digital signal processing (DSP) architectures.

A whitepaper is available to view and download.

In addition, the Open Eye MSA announced the draft of its multi-mode specification available to its members for comments, with general availability targeted for release in Fall 2020.

http://www.openeye-msa.org

Sunday, August 23, 2020

Tektronix debuts optical transceiver test platform

Tektronix introduced its new 8 Series sampling platform, a disaggregated modular instrument series boasting parallel acquisition, with up to 4 channels per mainframe and the highest measurement accuracy for PAM4 optical signals on multiple inputs simultaneously.

The 8 Series consists of the TSO820 Sampling Oscilloscope Mainframe, optical sampling modules, and TSOVu, a new software platform that runs independent of the mainframe on host PC for both live and offline processing of acquired data. Tektronix also introduces the TCR801, an external optical clock recovery module which covers dual band ranges around both 26GBd and 53GBd. These instruments and software provide a platform solution for fast acquisition and analysis.

"Our customers are facing new challenges with the increased demand for bandwidth and network capacity," says Matt Ochs, General Manager of the Performance Portfolio at Tektronix. "The 8 Series helps solve critical problems by delivering a scalable platform that reduces test times, while also providing fast, accurate and repeatable test results."

http://news.tektronix.com/2020-08-20-Tektronix-Introduces-the-8-Series-Sampling-Oscilloscope-Platform-with-Support-for-56GBd-and-28GBd-applications

Tuesday, August 4, 2020

Inphi reports record Q2 revenue of $175M, strong data center sales

Inphi reported Q2 rvenue of $175.3 million, up 103.2% year-over-year, compared with $86.3 million in the second quarter of 2019. The increase was due to higher demand for Cloud and Telecommunications products as well as the inclusion of eSilicon revenues as a result of the acquisition that closed on January 10, 2020.

Gross margin under GAAP in the second quarter of 2020 was 53.0%, compared with 56.9% in the second quarter of 2019. GAAP operating loss in the second quarter of 2020 was $4.3 million or (2.4%) of revenue, compared to GAAP operating loss in the second quarter of 2019 of $14.2 million or (16.5%) of revenue. Non-GAAP net income in the second quarter of 2020 was $50.9 million, or $0.95 per diluted common share. This includes the one-time tax benefit referred to above which represents approximately $0.10 per diluted share as part of the $0.95 per diluted common share for the second quarter of 2020. 

“In Q2 our product offerings were firing on all cylinders.  On a year-over-year basis, our Cloud revenue grew 92% driven by our PAM4 products inside data centers and our COLORZ solution between data centers.  Our Telecom revenue grew 119% driven by both our new ASIC and PAM4 for 5G and our coherent solutions for long haul and metro,”  said Ford Tamer, President and CEO of Inphi Corporation. “We continue to invest in resources both organically and through strategic acquisitions that can scale Inphi to larger opportunities ahead. Although we are cautious with regard to the macro uncertainties, we believe our continued success and breadth of product cycles will drive sequential growth in the third quarter.”

Thursday, July 30, 2020

MACOM begins 100G PAM4 DSP production

MACOM announced the production release of its low power CMOS DSP-based PAM4 PHYs for next generation optical transceiver modules.

MACOM’s PAM4 PHYs with integrated DSP, forward error correction (FEC) and multiplexing functionality are designed to enable single-wavelength 50 Gbps and 100 Gbps optical transceivers.

The integrated driver is suitable for direct connection to an optical modulator, avoiding the need for a discrete driver, and, thereby, enabling reduced cost and complexity. The on-board management processor simplifies module implementation, while the flexible DSP-based equalizer supports optical links up to and beyond 10 km over single mode fiber. Optional low latency FEC enables IEEE compliant link performance with both legacy and current generation switch silicon. A full suite of test and diagnostic features enable efficient bring up and fast time to market.

https://www.macom.com/ncs

Monday, June 29, 2020

Kyoto Semi intros InGaAs photodiode for 400G

Kyoto Semiconductor Co. introduced a high-speed, InGaAs photodiode to support 400Gbps transmission systems that use PAM4.

KP-H KPDEH12L-CC1C main features:

  • High-speed -- The size of the carrier on which the PD is mounted, and the width and length of the high frequency electrode pattern placed on the carrier are optimized using an electromagnetic simulation (Note 2). As a result, we have achieved the world’s top class 400Gbps and 40GHz as a frequency band with an integrated transimpedance amplifier. The KP-H photodiode has passed Telcordia GR-468-Core, which is the standard reliability test for communication equipment.
  • Easy implementation -- the photodiode is mounted on a carrier that is optimally designed to achieve high frequency. A condenser lens is integrated on the backside of the photodiode (Note 3), allowing the incoming light to collect in the light absorption area, and makes it easy to align the optical fiber with PD. The PD chip is mounted on a carrier twice as big as the chip itself.

Mass production is expected to begin in November 2020.

https://www.kyosemi.co.jp/en/lp/kpdeh12l-cc1c

Monday, May 18, 2020

Cadence offers 56G Long-Reach PAM4 SerDes IP

Cadence Design Systems released 56G long-reach SerDes IP on TSMC’s N7 and N6 process technologies.

The company expects 56G connectivity to be particularly important for 5G infrastructure deployment, both in baseband and remote radio head systems. To address this broader market, Cadence has expanded its PAM4 SerDes portfolio with 56G long-reach SerDes IP on the TSMC N7 and N6 processes delivering optimized power, performance and area (PPA).

The Cadence 56G long-reach SerDes IP highlights:

  • Best-in-class 36db+ insertion loss using Cadence’s multi-rate DSP technology
  • Industrial temperature range, CPRI data rate support and per-lane PLL are ideal for 5G applications
  • 56G long-reach performance has been achieved on N7 test silicon and is compatible with the N6 process
  • Fully compliant with the IEEE standard specification
  • Programmable power configurations via a unique firmware-controlled adaptive power optimizer, which provides optimal power and performance tradeoffs and more efficient system designs based on platform requirements
  • Optimal data recovery through the programmable DSP-based architecture, which allows optimal power delivery for a given reach and provides superior data recovery under lossy and noisy channel conditions
  • Improved flexibility enabled by the extended reach capability lets customers use lower cost PCBs and achieve greater flexibility in PCB and system design

“We are pleased to see Cadence expand its PAM4 offerings to include 56G and extend support to TSMC N7 and N6 process technologies,” said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. “This joint effort combining Cadence’s leading edge SerDes IP and TSMC’s advanced process technologies will help our customers unleash their silicon innovations for emerging 5G and hyperscale data center applications.”

“After being first to market in 2019 with silicon-proven 112G-LR SerDes on TSMC 7nm technology, we have now expanded our offering to include PPA-optimized 56G-LR to address the connectivity needs of the 5G infrastructure and AI/ML market. This new PAM4-based 56G-LR SerDes is based on Cadence’s well-proven multi-rate DSP technology,” said Rishi Chugh, vice president of product marketing, IP Group at Cadence. “The availability of Cadence’s 56G long-reach SerDes IP on the TSMC N7 and N6 processes accelerates the adoption and deployment of cost-effective 100G and 400G networks.”

http://www.cadence.com/go/56GSerDes

Keysight and Credo collaborate on PAM-4-to-NRZ

Keysight Technologies introduced a test solution that enables data center operators to leverage 400 Gigabit Ethernet (GE) capable test ports to link with and test legacy 100GE network equipment.

The new test solution is comprised of Keysight’s Ixia AresONE 400GE High Performance Layer 1 through 3 test system based on Pulse Amplitude Modulation level-4 (PAM4) signaling interconnected to legacy 100GE non-return-to-zero (NRZ) networking equipment ports using Credo’s HiWire Active Electrical Cable (AEC) technology. This collaboration provides speed-shifting of the signaling rates and forward error correction (FEC) conversion.

The companies said their combined test solution bridges the signaling gap between incompatible PAM4- and NRZ-encoded signaling. It removes potential compromises in testing configurations to improve overall performance validation and quality. The AEC cable technology performs the necessary conversions to allow a PAM4-encoded port to interoperate with an NRZ-encoded port. The solution provides support for testing four ports of 100GE NRZ from a single port of 400GE QSFP-DD PAM4 in 4x100GE speed mode.

“Data center operators are faced with a complex environment and need to leverage their existing investments for the future,” said Ram Periakaruppan, vice president, product development, Keysight’s Network Applications & Security group. “The Ixia AresONE 400GE test system supports Credo’s interconnect technology in high density 100GE test beds, enabling data center operators to accelerate validation of 100GE NRZ devices and network infrastructure while leveraging 400GE-capable PAM-4 ports to support demand in the future.”

Thursday, April 2, 2020

uSenlight employs MaxLinear's PAM4 DSPs for 400G modules

uSenlight Corporation, a key OEM developing high speed, high performance, reliable integrated optical modules for datacenter, FTTx, optical networking and CPRI/LTE applications, has selected MaxLinear’s MxL93542, Telluride PAM4 DSP, to develop its next-generation 400G-DR4 and FR4 optical modules.

The new optical modules build upon the success of uSenlight’s current product offerings of 100G QSFP28 PSM4 and 100G QSFP28 CWDM4 modules for data center connectivity. uSenlight’s experience in data center transceiver design and its manufacturing capabilities enable them to meet the growing demands of hyperscale data center customers.

MaxLinear’s MxL935xx Telluride PAM4 DSPs are key components in the development of high-speed, mega-scale data centers based on 100Gbps single lambda optical interconnects. MaxLinear’s SOCs offer integrated electro-absorption modulated laser (EA-EML) drivers for 100/400Gbps optical interconnects and breakout mode clocking support for 400Gbps DR4 optical modules. The MxL93542 400G PAM4 DSP allows companies like uSenlight to develop a 400Gbps optical interconnect module in a compact form factor for intra-datacenter applications with a transmission distance up to 2 kilometers.

“Telluride DSPs offer industry leading integration, power consumption, and link-margin performance,” said Will Torgerson, Vice President and General Manager of MaxLinear’s High-Speed Interconnect Group. "We are pleased to see that these features will enable uSenlight to develop next-generation 400G-DR4 and FR4 optical modules to address the massive demand to deploy higher speed networks in next-generation hyperscale data centers.”

“MaxLinear’s MxL93542 PAM4 DSP with integrated EML driver offers the highest level of integration compared with other DSPs on the market,” said Dr. Charles Wu, President of uSenlight Corporation. “The integration and performance of the MxL93542 PAM4 DSP is enabling us to expand our portfolio by developing 400Gbps optical interconnects for hyperscale datacenters.”

http://www.maxlinear.com/MxL93542

Thursday, January 9, 2020

Inphi milestone: 100,000 COLORZ silicon photonics PAM4 units shipped

Inphi noted a company milestone -- the shipment of more than 100,000 COLORZ units, its Silicon Photonics PAM4 platform solution for 80km DWDM connectivity in a QSFP28 form factor.

Inphi said its unique approach in integrating PAM4 CMOS with silicon photonics enables the platform to achieve a 60% in cost and a 75% in power savings. Accomplishing the COLORZ ramp to 100k within a span of only three years also validates the network inflection point in the adoption of switch pluggable DWDM optics.

Initially developed for the requirements of Microsoft, the COLORZ platform solution has now been deployed by more than 40 network operators, ranging from wireless carriers to military and educational networks. The operational simplicity combined with the economic value proposition continues to drive the adoption of COLORZ in the market place.

“We are excited to announce this milestone as its both an extraordinary achievement for the DCI market and for Inphi,” said Dr. Ford Tamer, Chief Executive Officer at Inphi. “This significant accomplishment underscores Inphi’s commitment to delivering technological innovations that dramatically increase the speed of data movement between data centers and help reduce total cost of ownership for cloud network operators.”

Yousef Khalidi, Corporate Vice President, Azure Networking, Microsoft Corp. said, “Inphi shares our vision for DCI connectivity and we applaud their achievement of a significant milestone. Inphi’s COLORZ platform has been an important contributor to Microsoft’s high bandwidth metro design, to help enable greater cloud performance in a highly scalable solution.”

http://www.inphi.com

Tuesday, January 7, 2020

Anritsu intros Oscilloscope 53-Gbaud Clock Recovery Unit

Anritsu introduced a Clock Recovery Unit (CRU) option for its BERTWave MP2110A oscilloscope that supports trigger clock generation from a 53-Gbaud PAM4 optical signal.

When combined with existing oscilloscope functionality, the new 53-Gbaud CRU can evaluate various PAM4 optical modules during development and manufacturing compared to solutions requiring external sampling oscilloscopes.

Anritsu said it developed the 53-Gbaud CRU for the BERTWave MP2110A sampling oscilloscope to address expanding PAM4 signal analysis requirements. The solution is more economical than a sampling oscilloscope that requires a separate trigger clock signal synchronized with the data signal to conduct PAM4 measurements. This is due to the fact that optical modules outputting PAM4 signals typically do not have a trigger signal. The BERTWave MP2110A can be used by engineers to more efficiently evaluate the physical layer of 25G to 400G optical transceiver modules and equipment components, such as optical cables, used by data centers, Core/Metro networks, 4G/5G mobile backhaul, and 5G mobile fronthaul.

https://www.anritsu.com/en-US/test-measurement/news/news-releases/2019/2019-12-20-us01