Showing posts with label OIF. Show all posts
Showing posts with label OIF. Show all posts

Monday, September 23, 2019

OIF approves IC-TROSA Implementation Agreement

OIF confirmed the approval of the Integrated Coherent Transmitter-Receiver Optical Subassembly (IC-TROSA) Implementation Agreement (IA).

The IC-TROSA Type-1 is optimized for silicon photonics technology and uses a surface-mount package with Ball Grid Array (BGA) electrical interface. Important advantages include an increased electrical bandwidth and solder reflow capability. The IC-TROSA Type-2 is optimized for Indium Phosphide technology and uses a gold-box package with flex-cable electrical interface. Important advantages include an integrated tunable laser and a duplex LC optical connector.

The IC-TROSA’s low power dissipation and miniature footprint enables small form factor digital coherent optics (DCO) transceivers in a QSFP-DD or OSFP form factor, as well as very high-density coherent line card or daughtercard designs. Devices can support multiple modulation formats, including QPSK, 8QAM, and 16QAM, at symbol rates up to 64Gbaud, enabling data transmission up to 600 Gb/s.

IC-TROSA integration will be demonstrated during this week’s OIF Physical and Link Layer (PLL) Interoperability Demo at ECOC 2019 in Dublin. (OIF booth 441).

“The IC-TROSA project took an aggressive approach to coherent optical component integration and has delivered two new package designs incorporating TX and RX integration, common digital controls and performance monitoring all in a small form factor package,” explained Scott Grindstaff, Director R&D, ADVA, and IC-TROSA IA Technical Editor. “Additionally, package specific features such as fiber-free interface and solder reflow compatibility have been incorporated.”

“The IC-TROSA IA is a solution for density requirements for line cards, front-pluggable and future on-board coherent 400G+ optical modules,” said Karl Gass, OIF PLL Working Group, Optical Vice Chair. “It aims to standardize a photonic package for coherent applications that is easy to use while leaving the internal implementation to the vendor.”

https://www.oiforum.com


OIF readies 400ZR, CEI-112G and IC-TROSA demos

Twelve OIF member companies will stage a multi-vendor interoperability demonstration of 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA at the upcoming ECOC 2019 trade show in Dublin, Ireland later this month.

Participating companies include ADVA, Amphenol, Cadence Design System, Credo, Finisar, Inphi, Keysight Technologies, Marvell, Molex, MultiLane, TE Connectivity and YAMAICHI ELECTRONICS will participate in the demonstration in OIF’s booth, # 441.
400ZR & IC-TROSA Demo

OIF’s 400ZR project aims to reduce cost and complexity reduction for 400GbE over 80 km DWDM networks. The IC-TROSA features all of the optical building blocks for a coherent module in a single package. The demonstrations will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR. In addition, a hardware-based 400ZR installation will show a typical application case.

CEI-112G Demo

OIF is taking a lead role in moving the industry to the next generation with its development of electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability clearly prove the key role OIF provides. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over mated compliance board channels, a full host to module channel and direct attach copper cable channels, all demonstrating the technical viability of 112 Gbps operation, along with multiple industry form factors including OSFP and QSFP-DD.

Monday, September 9, 2019

OIF readies 400ZR, CEI-112G and IC-TROSA demos

Twelve OIF member companies will stage a multi-vendor interoperability demonstration of 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA at the upcoming ECOC 2019 trade show in Dublin, Ireland later this month.

Participating companies include ADVA, Amphenol, Cadence Design System, Credo, Finisar, Inphi, Keysight Technologies, Marvell, Molex, MultiLane, TE Connectivity and YAMAICHI ELECTRONICS will participate in the demonstration in OIF’s booth, # 441.

400ZR & IC-TROSA Demo

OIF’s 400ZR project aims to reduce cost and complexity reduction for 400GbE over 80 km DWDM networks. The IC-TROSA features all of the optical building blocks for a coherent module in a single package. The demonstrations will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR. In addition, a hardware-based 400ZR installation will show a typical application case.

CEI-112G Demo

OIF is taking a lead role in moving the industry to the next generation with its development of electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability clearly prove the key role OIF provides. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over mated compliance board channels, a full host to module channel and direct attach copper cable channels, all demonstrating the technical viability of 112 Gbps operation, along with multiple industry form factors including OSFP and QSFP-DD.

“Understanding and seeing first-hand how key technologies – 400ZR, CEI-112G and IC-TROSA – are each specified to enable interoperable deployment across the ecosystem is critically important to building market confidence and accelerating adoption,” said Steve Sekel, OIF Physical and Link Layer Interoperability Working Group Chair. “This showcase of 12 companies and key technologies is a clear representation of OIF’s leadership in driving electrical, optical and control interoperability.”

https://www.oiforum.com/

Wednesday, August 14, 2019

OIF launches higher baud rate coherent driver modulator project

The OIF has begun a new project to develop a higher baud rate coherent driver modulator.

The “Higher Baud Rate Coherent Driver Modulator” project will define a new version of the Coherent Driver Modulator supporting at least 96 Gbaud for the low modem implementation penalty segment of the coherent market for single optical carrier line rates beyond 400 Gbit/s. Designed for higher data rates and longer reach and optimized for performance, this project is the next generation of the High Bandwidth Coherent Driver Modulator (HB-CDM) Implementation Agreement (IA) published last year.

Following this year’s OIF Q319 Technical and MA&E Committees Meeting in Montreal, OIF also launched work on a white paper detailing low-rate service multiplexing using FlexE and 400ZR. The whitepaper seeks to eliminate ambiguity and provide clarification on how 400ZR should be leveraged in multiplexing applications. Various network operators are looking for a multiplexing scheme to support lower-rate Ethernet clients (e.g. 4x100GE) into a 400ZR coherent line. This technical white paper will educate the market on how FlexE can be used to aggregate low-rate Ethernet services (e.g. 4x100GE) into 400ZR interfaces.

Andrew Schmitt, founder and directing analyst, Cignal AI gave member attendees a brief overview of emerging pluggable coherent technologies and the opportunity this new market presents and had the opportunity to speak with members about current and upcoming OIF work.

“It’s clear that OIF is not resting after a successful effort to standardize 400ZR, proven by the launch of two new projects at the recent Q3 meeting,” said Schmitt. “Also, as interest in pluggable coherent solutions grows, it is good to see OIF soliciting feedback from additional network operators in order to shape requirements for next generation standards.”

https://www.oiforum.com/

Tuesday, May 21, 2019

OIF releases CFP2-DCO and HB-CDM specs

OIF completed two new Implementation Agreements (IAs) — the CFP2-Digital Coherent Optics Module (CFP2-DCO) and High Bandwidth- Coherent Driver Modulator (HB-CDM).

  • CFP2-DCO - defines the additional information needed in order to implement the DCO function in the CFP2 module. The CFP2-DCO module contains all the required functions to perform dual polarization coherent optical signaling. The module can also provide different bitrates such as 100G/200G/300G/400G and support more modulation formats.
  • HB-CDM - targets modulation and data-rate agnostic coherent applications having nominal symbol rates up to 64 Gbaud. It defines a small form factor electro-optic component that integrates the HB-Polarization Multiplexed-Quadrature (HB-PMQ) modulator plus the RF drive functions for the high baud-rate and low modem implementation penalty segment of the coherent market. Additionally, the IA identifies and specifies the common features and properties of coherent transmitters to enable them to broadly meet the needs of current and future coherent systems.

“As a member-driven organization, OIF’s work is based on our members’ needs. The CFP2-DCO IA is in direct response to feedback from a network operator that needed an IA to fill an interoperability gap in their network,” said Karl Gass, OIF, PLL Working Group – Optical Vice Chair. “The HB-CDM IA addresses a performance need by creating a component that can be used for much higher performance links.”

https://www.oiforum.com



Wednesday, March 6, 2019

OIF and Ethernet Alliance run FlexE traffic over 400G

At OFC in San Diego, OIF and the Ethernet Alliance are running Flex Ethernet (FlexE) traffic sent over three bonded and subrated 100 GbE interfaces streaming over the Ethernet Alliance 400 GbE network. The demo, which provides a live interconnection between the OIF and Ethernet Alliance booths on the show floor, is designed to showcase the Ethernet Alliance’s IEEE 802.3bs 400 Gbps network and OIF’s FlexE 2.0 Implementation Agreement (IA).

“The Ethernet Alliance’s 400 GbE network over the OFC exhibit floor is the perfect setting to illustrate the real-world features and capabilities of the OIF FlexE 2.0 IA that allows network operators to tailor their traffic while still leveraging Ethernet,” according to Nathan Tracy, OIF’s President and Technologist at TE Connectivity. “The Ethernet Alliance’s deployment of the 400 GbE network at OFC combined with OIF’s FlexE demonstration illustrates the coincident availability of these new technologies.”

“We’re pleased to be able to make our 400 GbE network available to the OIF for this demonstration at OFC,” said Ethernet Alliance chairman John D’Ambrosia. “We applaud the OIF for its work in leveraging 100 GbE and 400 GbE in its FlexE 2.0 implementation agreement. Their efforts will increase the capabilities of these solutions to help address the market needs of the Next Ethernet Era.“

The member companies participating in the OIF demo include Amphenol, Cisco, Credo Semiconductor (HK) LTD, Finisar, Inphi, Juniper Networks, Keysight Technologies, Molex, Spirent Communications, TE Connectivity, VIAVI Solutions, Xilinx and YAMAICHI ELECTRONICS.

Rhe Ethernet Alliance’s OFC 2019 demo incorporates equipment and solutions from 21 different companies: Amphenol; Anritsu; Arista Networks; Cisco; Credo Semiconductor; EXFO; Finisar; Intel; Ixia / Keysight Technologies; Juniper Networks; Lumentum; Nexans S.A.; Panduit; Source Photonics; Spectra7 Microsystems; Spirent Communications; TE Connectivity; Tektronix; Teledyne LeCroy; VIAVI and Xilinx, Inc.

Wednesday, January 23, 2019

OIF to provide CEI-112G project update at DesignCon

At next week's DesignCon conference in Santa Clara, California,

The panel, called “112-Gbps Electrical Interface: An OIF Update on CEI-112G,” is scheduled for Thursday, January 31 at 3:45 pm (local).

Since 2000, OIF has defined Interoperability Agreements (IA)s for electrical interconnects known as CEI. CEI is a clause-based document that defines implementation details for interoperable electrical channels initially issued for 6 Gbps, then 11, 28, and 56 and includes definitions for multiple channel implementation topologies and will soon include 112 Gbps clauses. In August of 2016, OIF announced the first CEI-112G project in an overall effort that has now expanded to five projects.

“Previous CEI development has been highly influential and has been adopted, influenced or adapted by many other high-speed interconnect specifications throughout the industry,” said Tracy. “Given that the CEI-112G generation of high-speed transmitters, receivers and channels will be challenging to define, implement and measure, this panel will provide guidance to where the industry is headed and what the key challenge points are likely to be.”

Check the status of OIF’s current work in CEI-112G here: https://www.oiforum.com/technical-work/current-oif-work/#CEI-112G-XSR


Tuesday, December 4, 2018

OIF Launches FlexE 2.1 Project

OIF has launched the FlexE 2.1 project, which covers FlexE over 50Gbe PHY applications. It also adds an extension to the recently released FlexE 2.0 Interoperability Agreement (IA).

FlexE 2.1 will specify a 50G FlexE frame and multiplexing format and will address Flex Ethernet (FlexE) applications with lower bandwidth needs and provide an implementation foundation for applications including the access layer of the future 5G mobile network. This new 50GbE support will extend the existing support for 100, 200 and 400GE in the just published FlexE 2.0 IA.

OIF expects possible large volume applications for channelization (5Gb/s granularity for minimum 10G clients) and bonding of 50GE PHYs in the future access layer/metro edge (based on IPRAN/PTN) of the 5G mobile backhaul network, FlexE implementation logic will be critical.

“There is continued demand by data center and network operators for a solution for flexible deployment and provisioning of Ethernet bandwidth,” said Dave Ofelt, Juniper Networks and OIF Physical and Link Layer (PLL) Working Group – Protocol Vice Chair. “Building on OIF’s great work for FlexE and FlexE 2.0, this new FlexE 2.1 project will ultimately result in a single IA that adds n×50Gb/s support to FlexE 2.0, along with other possible feature enhancements.”

In addition, OIF announced the following election results for its Board of Directors:

  • Nathan Tracy, TE Connectivity, was re-elected to the Board and appointed as President
  • Tad Hofmeister, Google, was appointed as Vice President
  • Martin Bouda, Fujitsu, was re-elected to the Board and appointed as Secretary/Treasurer
  • Mike Li, Intel, was newly elected to the Board
  • Cathy Liu, Broadcom Inc., was re-elected to the Board
  • Gary Nicholl, Cisco, was newly elected to the Board
  • Ian Betty, Ciena, continues to serve on the Board

Officers:

  • Klaus-Holger Otto, Nokia, was re-elected as Technical Committee Chair
  • Ed Frlan, Semtech, was re-elected as Technical Committee Vice Chair
  • Tom Issenhuth, Huawei Technologies, was newly elected Market Awareness & Education Committee Co-Chair, Physical and Link Layer (PLL)
  • Lyndon Ong, Ciena, was re-elected as Market Awareness & Education Committee Co-Chair, Networking
  • Dave Brown, Nokia, was appointed as Communications Director, having termed out as a Board member and Board President
  • Technical Committee – Working Groups:
  • Jia He, Huawei Technologies, was newly elected as Network & Operations Working Group Chair
  • Jeff Maki, Juniper Networks, was re-elected as Physical Layer User Group Working Group Chair


Thursday, November 15, 2018

OIF project tackles Requirements for Integrated Packet Optical SDN

The OIF announced its newest project — “Requirements for Integrated Packet Optical SDN.” The goal is to outline requirements for a multi-layer SDN reference architecture as a use case for packet optical transport networks.

The project will generate functional requirements, a reference architecture and use cases for packet/optical networks guided by the vision to enable agile, open network solutions that simplify operations and optimize resource utilization.

“Most of the existing SDN standards work, including OIF’s recent SDN Transport Application Programming Interface (T-API) multi-vendor interoperability demo, addresses the technical details,” said Junjie Li of China Telecom and OIF Network Operator Working Group Chair. “However, it is critical to also work across layers and build a standardized universal open framework at the solution level that will normalize architecture, interfaces and behaviors to advance the industry as a whole.”

http://www.oiforum.com

Tuesday, October 23, 2018

OIF completes Flex Ethernet and Common ACO Electrical I/O agreements

The OIF announced three Interoperability Agreements (IAs) aimed at expanded interoperability of Flex Ethernet and increased data rates. These include:

FlexE 2.0 -- initiated in 2016, the FlexE 2.0 project enables equipment to support new Ethernet connection types and FlexE allows network providers and operators to utilize optical transport network bandwidth in more flexible ways. FlexE can deterministically utilize the entire aggregated link, creating a more efficient alternative to the traditional IEEE 802.3ad or IEEE 802.1-based Link Aggregation (LAG) solutions which often can only utilize 70-80% of the available bandwidth. Key features of the FlexE 2.0 project include adding support for FlexE groups composed of 200GBASE-R and 400GBASE-R PHYs, in addition to groups composed of 100GBASE-R PHYs, and adding an option for the support of time and frequency synchronization at the FlexE group level.

FlexE Neighbor Discovery -- this project recognizes that FlexE capability discovery is still required to facilitate the setup of FlexE groups and clients. The project introduced some extensions to the Link Layer Discovery Protocol (LLDP) for FlexE capability discovery. It enables remote FlexE PHY and deskew capability discovery, PHY connectivity discovery and verifications, and FlexE Group subgroup integrity verification.

Common ACO Electrical I/O Project -- this implementation agreement follows the success of the CFP2-ACO optical transceiver implementation agreement but is form factor agnostic, so it also benefits analog coherent modules based on such form factors as CFP4, CFP8, QSFP, microQSFP, QSFP-DD and OSFP. The project defines the ACO electrical I/O independent of the choice of form factor and optical carrier count for 45 Gbaud and 64 Gbaud per-carrier applications.

“The completion of these projects reinforces OIF’s commitment to provide the industry with the flexibility and increased bandwidth solutions combined with increased data speeds it requires to keep up with market demands and drive solutions that enable the next generation of networks,” explained Dave Stauffer of Kandou Bus and OIF’s Physical and Link Layer (PLL) Working Group Chair.


Tuesday, August 7, 2018

OIF validates Transport Application Programming Interface (T-API) 2.0

The Optical Internetworking Forum's Transport Application Programming Interface (T-API) 2.0 is market ready, following a six week, multi-vendor interoperability demonstration. The results of the interoperability test are reported in a new whitepaper published by the OIF.

The multi-vendor demo led by four network operator labs included lab-deployed and cloud-deployed systems testing new dynamic behavior use cases and deployment scenarios. The demo also incorporated service provisioning scenarios at the LSO Presto reference point in the MEF LSO architecture, using the MEF NRP Interface Profile Specification (MEF 60), which defines extensions to T-API in support of Carrier Ethernet services.

Participating network operators were CenturyLink, China Telecom, SK Telecom and Telefónica and vendors included ADVA, Coriant, Infinera, NEC/Netcracker, Nokia and SM Optics. Centre Tecnològic de Telecomunicacions de Catalunya (CTTC) was a participating academic institution and TELUS Communications participated as a consulting network operator.

Key findings detailed in the whitepaper:

  • Open Networking Foundation (ONF) T-API 2.0 specifications have addressed the main issues identified in the OIF’s 2016 testing and provide a basis for real-time orchestration of on-demand connectivity setup, control and monitoring across diverse multi-layer, multi-vendor, multi-domain carrier networks
  • Additional scaling and performance enhancements will need to be addressed as T-API is deployed in real networks, such as refinements to the model, greater detail in error codes to improve debugging properties, and potential implementation options such as a separate server for notifications of network events
  • The API allows for some variability in the use of topology abstraction depending on business requirements and technology; documentation of supplementary examples for topology abstraction will help application and orchestration software developers.

http://www.oiforum.com/documents/oif-2018-sdn-t-api-interop-demo-white-paper/



“Standardized and open SDN APIs reduce complexity in intra and inter-domain operations, allowing us to provide more diverse services to our customers in less time,” said Park Jin-hyo, EVP of ICT R&D Center at SK Telecom. “After successfully completing the test trial, SK Telecom will keep engaging in 5G transport network and service development by opening APIs and transforming the current infrastructure into Network-as-a-Service (NaaS) Platform.”

Layer 1 Transport API interoperability demo -- MEF, ONF, and OIF



The recently concluded MEF-ONF-OIF interoperability demo that focused on the Software-Defined Networking (SDN) Transport Application Programming Interface (T-API).

NEC's Karthik Sethuraman and Centurylink's Jack Pugaczewski provide an overview of the demo. A proof-of-concept (PoC) on this topic will be presented at #MEF18.

See video: https://youtu.be/kahW_dxoBSk

Tuesday, June 26, 2018

Optical Internetworking Forum tests SDN transport API

Optical Internetworking Forum (OIF), in collaboration with MEF, successfully concluded its 2018 Software-Defined Networking (SDN) Transport Application Programming Interface (T-API) multi-vendor interoperability demonstration.


The multi-vendor demo led by four network operator labs included lab deployed and cloud deployed systems testing new dynamic behavior use cases and deployment scenarios. The demo also incorporated service provisioning scenarios at the LSO Presto reference point in the MEF LSO architecture, using the MEF NRP Interface Profile Specification (MEF 60), which defines extensions to T-API in support of Carrier Ethernet services.

“The OIF SDN Interoperability demonstration has successfully brought together carriers, vendors and integrators with a common goal of moving to an open API (TAPI),” said Jack Pugaczewski, Distinguished Architect, CenturyLink. “T-API is a key enabler for providing automated service fulfillment and assurance. We have tested the Connectivity, Topology and Notification software patterns that T-API provides. Common APIs reduce design, development and deployment cycles for all involved, thus getting to market faster and realizing the financial benefits of automation.”

Participating network operators were CenturyLink, China Telecom, SK Telecom and Telefónica and vendors included ADVA, Coriant, Infinera, NEC/Netcracker, Nokia and SM Optics. Centre Tecnològic de Telecomunicacions de Catalunya (CTTC) was a participating academic institution and TELUS Communications participated as a consulting network operator.

“The OIF’s goal for interop events is to improve the quality and clarity of specifications being tested,” explained Jonathan Sadler, OIF VP and Networking & Operations Interoperability Working Group Chair. “As the tests were performed, we noted possible points for misunderstanding and places where the specifications may be enhanced. These results will be liaised to ONF and MEF for review at future meetings.”

Tuesday, June 12, 2018

OIF initiates CEI-112G-XSR project

The OIF has launched a CEI-112G-XSR project for Die-to-Die (D2D) and Die-to-Optical Engine (D2OE) Common Electrical Interface, which will enable intra-package interconnects to optical engines or between dies with high throughput density and low normalized power operating in the data rate range of 72-116 Gbps with a reach up to 50 mm.

In addition to the already existing CEI-112G-MCM OIF project, which is dedicated to wide, high bandwidth CMOS-to-CMOS interconnects, the new CEI-112G-XSR project proposes to support technology mix, in particular CMOS-to-SiGe (Silicon Germanium), which is frequently used to build optical engines. System-in-package (SIP) leads to a requirement of supporting up to 50 mm trace length between the multiple chips on a common (organic) package substrate.

The working group for the CEI-112G-XSR project has identified the following benefits for OIF members:

  • allow lower normalized power, double shoreline throughput density and provide a multi-source 72-116 Gbps D2D and D2OE electrical I/O interface. This will enhance the integration, normalized power reduction, and cost reduction for integrated OE, multiple-die SIPs.
  • enable 1 to N lanes of 72-116 Gbps electrical I/Os (e.g. on ASIC/FPGA/OE).

“We jointly designed this project to address the problem of integrating multiple dies, including driver devices for optical engines on non-CMOS technologies, onto a common substrate within a large multi-chip-package design. Supporting this mix of technology allows combining the high logic density of CMOS devices with the high drive strength of analog components,” explained Klaus-Holger Otto of Nokia and OIF Technical Committee Chair.

http://www.oiforum.com/

Tuesday, May 22, 2018

OIF plans SDN Transport API interoperability demo presentations

The OIF (Optical Internetworking Forum) will conduct several public read-out events to present the results of the 2018 Software-Defined Networking (SDN) Transport Application Programming Interface (T-API) interoperability demonstration.

This year’s demo, in collaboration with MEF, is focused on accelerating the commercialization of Transport SDN through validating the industry-leading T-API 2.0 northbound interface (NBI) from the Open Networking Foundation (ONF). The multi-vendor demo includes testing new dynamic behavior use cases and deployment scenarios by CenturyLink, China Telecom, SK Telecom and Telefónica. Participating vendors include ADVA, Coriant, Infinera, NEC/Netcracker, Nokia and SM Optics. Centre Tecnològic Telecomunicacions Catalunya is the participating academic and/or research institution and TELUS Communications is participating as a consulting network operator.

The demo incorporates service provisioning scenarios at the LSO Presto reference point in the MEF LSO architecture, using the MEF NRP Interface Profile Specification (MEF 60), which defines T-API extensions in support of Carrier Ethernet services.

“The OIF multi-vendor interop testing is particularly important to Telefónica’s network transformation. We are anxious to validate T-API as the standard NBI for Transport SDN and announce the results in June,” said Juan Pedro Fernández Palacios, Telefónica.

The results of the demo will be presented during a featured workshop and keynote presentation at NGON & DCI Europe 2018 conference in Nice, France.

Private read-outs will also be conducted by CenturyLink (July 10 in Denver) and China Telecom in Beijing (July 19).

Tuesday, March 13, 2018

OIF hosts Interoperability demos of FlexE, 56G PAM4, 112G per lane

This week at OFC in San Diego, the Optical Internetworking Forum (OIF) is conducting a series of multi-vendor interoperability demonstrations showFlexE), 112 Gbps per lane live electrical signaling and end-to-end optical links using CEI-56G-VSR electrical interfaces.
casing three significant technologies; Flex Ethernet (

There are 14 participating companies including Amphenol, Credo Semiconductor, Fiberhome Telecommunications Technologies Co., Ltd., Finisar, Huawei Technologies Co., Inphi, Keysight Technologies, Molex, TE Connectivity, Tektronix, VIAVI Solutions, Xilinx, Yamaichi Electronics, and ZTE Corporation.

Flex Ethernet Demo -- the FlexE technology from the OIF extends standard Ethernet with bonding, subrating, and channelization features and is defined in the FlexE v1.0 Implementation Agreement. The demo features interoperability among member companies using combinations of these three features over multiple types of 100 GbE.

56 Gbps Demo -- this demo features multiple silicon suppliers operating over a 56 Gbps PAM4 VSR (chip to module) link reflecting the recently published CEI 4.0 document that includes this 56 Gbps PAM4 channel definition. The 56 Gbps demo will electrically drive interoperating optical modules, interconnected with fiber, showing a full multi-vendor electrical-optical-electrical link from host-to-host. The broad range of technologies and suppliers participating in the demo indicates the maturing industry ecosystem around 56 Gbps signaling.

112 Gbps Demo -- the OIF recently began new projects to define 112 Gbps per lane interoperable serial electrical channel definitions. As part of that effort, the OIF will be presenting two 112 Gbps serial electrical demos at OFC 2018. The first demo will include a silicon chip driving a VSR (chip to module) channel and the second will have a silicon chip driving a direct attach copper cable assembly. 112 Gbps electrical signaling is regarded as a necessary technology to enable future signaling bandwidth requirements.

“The OIF continues to test and validate the implementation agreements the forum is working on or has recently completed,” said Steve Sekel of Keysight Technologies, Inc. and the OIF’s Physical and Link Layer Interoperability Working Group Chair. “The OIF recently published both CEI revision 4.0 which includes CEI-56 Gbps requirements and the FlexE revision 1.0 specification. The forum also started work on four CEI-112 Gbps projects so this demo provides important insight into the potential technical solutions.”

Wednesday, January 17, 2018

OIF advances Common Electrical I/O for 56 Gbps

The OIF has published “Common Electrical (I/O) CEI 4.0” with a focus on Serdes standards for 56 Gbps.

The result is a number of carefully optimized channel definitions, paving the way for a range of interoperable solutions at 56 Gbps data rates. Key to this effort was aiming for the lowest possible power dissipation for each application while balancing link budget and latency. At this time the OIF is releasing CEI 4.0 with the following new clauses:


  • CEI-56G-USR-NRZ: Ultra Short Reach, die-to-die inside muti-chip-modules, NRZ modulation
  • CEI-56G-XSR-NRZ: Extra Short Reach, chip-to-driver, NRZ modulation
  • CEI-56G-VSR-PAM4: Very Short Reach, chip-to-module, PAM-4 modulation
  • CEI-56G-MR-PAM4: Medium Reach, chip-to-chip, one connector, PAM-4 modulation
  • CEI-56G-LR-PAM4: Long Reach, chip-to-chip, two connectors over backplane, PAM-4 modulation
  • CEI-56G-LR-ENRZ: Long Reach, chip-to-chip, two connectors over backplane, ENRZ modulation

“The industry continues to face challenges for diverging requirements regarding link latency and concerns with power consumption at the higher data rates,” said Klaus-Holger Otto of Nokia and the OIF Technical Committee Chair.  “Documenting channel definitions in more granular reaches and multiple  modulation schemes allows for the optimization of silicon chip designs, channel architectures and network operator use cases. These parameters for 56 Gbps will be used as building blocks for protocol specifications written by other organizations across the industry so the forum wanted to provide definitions that met their unique needs.”

http://www.oiforum.com/wp-content/uploads/OIF-CEI-04.0.pdf

Thursday, November 30, 2017

OIF starts work on long reach and medium reach CEI-112G

The Optical Internetworking Forum (OIF) has begun work on long reach (LR) and medium reach (MR) CEI-112G. The goal is to define an interface to enable high-loss 112G backplane channels. This project will also facilitate direct attach copper (DAC) cable channel links at 112G. The CEI-112G-MR project will develop specifications for a chip-to-chip (c2c) interface which can also be used to support applications of 112Gx2 (224G), and 112Gx4 (448G) with reduced power, complexity, and enhanced density.

The CEI-112G-LR project builds upon two existing 100G serial electrical link projects.

“These projects build upon the relevant and foundational 56G and 112G CEI roadmap the OIF has established,” said Nathan Tracy of TE Connectivity and OIF vice president of marketing.  “The industry continues to look to the OIF to deliver interoperable implementation agreements that will drive adoption of both 100 Gb/s serial applications and the interfaces needed to address higher bandwidth.”

Tuesday, September 5, 2017

OIF Updates Micro Intradyne Coherent Receiver IA for 400G

Optical Internetworking Forum (OIF) announced updates to its Micro Intradyne Coherent Receiver implementation agreement. The IA introduces three classes of receivers, distinguished by their RF frequency response, to support Flex Coherent DWDM transmission to 400G and beyond.

The OIF said it continues its efforts to look beyond 100G by selecting a 400G implementation technology option. The newly published Flex Coherent DWDM Transmission framework document specifies a single technical approach for diverse network applications, including long-haul (LH), metro and data center inter-connection (DCI). One of the objectives of this work is to provide direction on the technical developments required by system and component providers.

“Our system vendor members continue to flow down future system requirements so that component suppliers can be ready with products to support their designs,” said Karl Gass of Qorvo and the OIF’s Physical and Link Layer Working Group – Optical Vice Chair.

The OIF is currently planning its next global transport SDN Interop demo and seeking input from the service provider community, including those that have not participated in past interop demonstrations.

In addition, the following officers were re-elected to one-year terms:
Klaus-Holger Otto of Nokia - Technical Committee, Chair; Ed Frlan of Semtech - Technical Committee, Vice Chair; Lyndon Ong of Ciena - MA&E Committee Co-Chair, Networking; Brian Holden of Kandou Bus - MA&E Committee Co-Chair, Physical & Link Layer.

http://www.oiforum.com

Thursday, June 15, 2017

OIF approves virtual transport network service IA

The Optical Internetworking Forum (OIF), which met recently in Ljubljana, Slovenia for a quarterly technical committee conference, announced that it has approved an implementation agreement (IA) for an optical virtual transport network service (VTNS) and also made progress on the 400G-ZR project.

VTNS IA

A virtual transport network service (VTNS) constitutes the creation and delivery of a virtual network (VN) by a provider to a user based on the virtualisation of transport network resources. VNs can be dynamically created, deleted or modified, while users are able to perform connection management, monitoring and protection within the VN.

In specifying the new VTNS IA, OIF aims to identify the requirements and characteristics of different virtual network service types, such as dynamic and static behaviours. The new IA is also intended to define the attributes and parameters required for these service types and the requirements for support of service recovery and OAM.

The OIF noted that different types of VTNS could be associated with operators offering, for example, bandwidth-on-demand (BoD) services, network-as-a-service (NaaS) or network slicing for 5G networking.

400G-ZR update

The OIF's 400G-ZR interoperability project, launched in November 2016, was formed to address both 400 Gbit/s ZR and short-reach DWDM multi-vendor interoperability requirements, such as might be required for cloud-scale data centre interconnect (DCI) applications. It noted that the project has now received 10 technical contributions relating to areas including power consumption of DSP, FEC proposals, and experimental demonstrations.

In addition, it was announced that at the recent quarterly meeting the OIF elected Tad Hofmeister of Google to its board of directors, filling a vacant seat on the board.

Tuesday, February 14, 2017

OIF Completes SDN Transport Application Programming Interface (T-API) Testing

The Optical Internetworking Forum (OIF) conducted a six-week long global testing of the Transport Application Programming Interface (T-API) standard from the Open Networking Foundation (ONF) with intra-lab and inter-lab testing across five carrier labs: China Telecom, China Unicom, SK Telecom, Telefonica and Verizon.

“As operators move from SDN PoCs and lab trials into commercial deployments, lack of interoperability between the SDN controllers and the orchestration layer above has quickly become the biggest technical barrier for many operators,” said Sterling Perrin, principal analyst, Heavy Reading. “Building a standardized northbound interface and successfully testing interoperability across different vendors and different networks – as the OIF has demonstrated – is a major step forward in addressing the northbound interface challenge and bringing SDN architectures to wide-scale commercial use.”

Thes testing included multi-domain orchestration of services delivered through Ethernet, OTN and optical switching. Carriers and vendors demonstrated how Virtual Network Functions (VNF) and SDN configured connectivity are combined to deliver service life cycle management.

Participating vendors include ADVA Optical Networking, Ciena, Coriant, Huawei Technologies Co., Ltd., Infinera, Juniper Networks, NEC Corporation, Sedona Systems, and SM Optics. Consulting carriers include Orange and TELUS. Academic and/or research institution participants include China Academy of Telecommunication Research (CATR) and Centre Tecnològic de Telecomunicacions de Catalunya (CTTC).

Participants also submitted a proof of concept demo proposal to ETSI NFV called “Mapping ETSI-NFV onto Multi-Vendor, Multi-Domain Transport SDN”.

A technical white paper on the demonstration is available to download.

http://www.oiforum.com/meetings-and-events/2016-oif-sdn-t-api-demo/

Thursday, February 2, 2017

OIF Approves Polarized Multiplexed Quadrature Modulator for 400G

The Optical Internetworking Forum (OIF) approved an Implementation Agreement (IA) for an optical integrated Polarization Multiplexed (PM) quadrature modulator for coherent applications with nominal symbol rates up to 64GBaud. The agreement supports the 16QAM modulation format for 400G applications.

“As we go to higher data rates, we need higher performing optical components that maintain a reasonable level of complexity,” said Karl Gass of Qorvo and the OIF’s PLL Working Group – Optical Vice Chair. “These components are targeted for 400G applications. RF bandwidth is the highest priority for this project.”

The forum members also started the CEI-112G in MCM project to support interconnect within Multi-Chip-Modules (MCMs). In addition to the CEI-112G-VSR specification that is being developed, there is a need to support high rate interconnect amongst large logic devices as well as to small driver devices within an MCM.

Members have also started a maintenance project to produce amendments to the User Network Interface (UNI) 2.0 and External Network to Network Interface (E-NNI) 2.0 specification documenting the extensions for support of OTN rates higher than 100G. Adding these extensions to UNI 2.0 and E-NNI 2.0 will facilitate vendor interoperability. The project seeks to assist the IETF as it develops the required routing and signaling extension by providing a description of the Byond100G data-plane and the operations to be controlled by GMPLS.

http://www.oiforum.com

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