Showing posts with label OIF. Show all posts
Showing posts with label OIF. Show all posts

Tuesday, June 12, 2018

OIF initiates CEI-112G-XSR project

The OIF has launched a CEI-112G-XSR project for Die-to-Die (D2D) and Die-to-Optical Engine (D2OE) Common Electrical Interface, which will enable intra-package interconnects to optical engines or between dies with high throughput density and low normalized power operating in the data rate range of 72-116 Gbps with a reach up to 50 mm.

In addition to the already existing CEI-112G-MCM OIF project, which is dedicated to wide, high bandwidth CMOS-to-CMOS interconnects, the new CEI-112G-XSR project proposes to support technology mix, in particular CMOS-to-SiGe (Silicon Germanium), which is frequently used to build optical engines. System-in-package (SIP) leads to a requirement of supporting up to 50 mm trace length between the multiple chips on a common (organic) package substrate.

The working group for the CEI-112G-XSR project has identified the following benefits for OIF members:

  • allow lower normalized power, double shoreline throughput density and provide a multi-source 72-116 Gbps D2D and D2OE electrical I/O interface. This will enhance the integration, normalized power reduction, and cost reduction for integrated OE, multiple-die SIPs.
  • enable 1 to N lanes of 72-116 Gbps electrical I/Os (e.g. on ASIC/FPGA/OE).

“We jointly designed this project to address the problem of integrating multiple dies, including driver devices for optical engines on non-CMOS technologies, onto a common substrate within a large multi-chip-package design. Supporting this mix of technology allows combining the high logic density of CMOS devices with the high drive strength of analog components,” explained Klaus-Holger Otto of Nokia and OIF Technical Committee Chair.

http://www.oiforum.com/

Tuesday, May 22, 2018

OIF plans SDN Transport API interoperability demo presentations

The OIF (Optical Internetworking Forum) will conduct several public read-out events to present the results of the 2018 Software-Defined Networking (SDN) Transport Application Programming Interface (T-API) interoperability demonstration.

This year’s demo, in collaboration with MEF, is focused on accelerating the commercialization of Transport SDN through validating the industry-leading T-API 2.0 northbound interface (NBI) from the Open Networking Foundation (ONF). The multi-vendor demo includes testing new dynamic behavior use cases and deployment scenarios by CenturyLink, China Telecom, SK Telecom and Telefónica. Participating vendors include ADVA, Coriant, Infinera, NEC/Netcracker, Nokia and SM Optics. Centre Tecnològic Telecomunicacions Catalunya is the participating academic and/or research institution and TELUS Communications is participating as a consulting network operator.

The demo incorporates service provisioning scenarios at the LSO Presto reference point in the MEF LSO architecture, using the MEF NRP Interface Profile Specification (MEF 60), which defines T-API extensions in support of Carrier Ethernet services.

“The OIF multi-vendor interop testing is particularly important to Telefónica’s network transformation. We are anxious to validate T-API as the standard NBI for Transport SDN and announce the results in June,” said Juan Pedro Fernández Palacios, Telefónica.

The results of the demo will be presented during a featured workshop and keynote presentation at NGON & DCI Europe 2018 conference in Nice, France.

Private read-outs will also be conducted by CenturyLink (July 10 in Denver) and China Telecom in Beijing (July 19).

Tuesday, March 13, 2018

OIF hosts Interoperability demos of FlexE, 56G PAM4, 112G per lane

This week at OFC in San Diego, the Optical Internetworking Forum (OIF) is conducting a series of multi-vendor interoperability demonstrations showFlexE), 112 Gbps per lane live electrical signaling and end-to-end optical links using CEI-56G-VSR electrical interfaces.
casing three significant technologies; Flex Ethernet (

There are 14 participating companies including Amphenol, Credo Semiconductor, Fiberhome Telecommunications Technologies Co., Ltd., Finisar, Huawei Technologies Co., Inphi, Keysight Technologies, Molex, TE Connectivity, Tektronix, VIAVI Solutions, Xilinx, Yamaichi Electronics, and ZTE Corporation.

Flex Ethernet Demo -- the FlexE technology from the OIF extends standard Ethernet with bonding, subrating, and channelization features and is defined in the FlexE v1.0 Implementation Agreement. The demo features interoperability among member companies using combinations of these three features over multiple types of 100 GbE.

56 Gbps Demo -- this demo features multiple silicon suppliers operating over a 56 Gbps PAM4 VSR (chip to module) link reflecting the recently published CEI 4.0 document that includes this 56 Gbps PAM4 channel definition. The 56 Gbps demo will electrically drive interoperating optical modules, interconnected with fiber, showing a full multi-vendor electrical-optical-electrical link from host-to-host. The broad range of technologies and suppliers participating in the demo indicates the maturing industry ecosystem around 56 Gbps signaling.

112 Gbps Demo -- the OIF recently began new projects to define 112 Gbps per lane interoperable serial electrical channel definitions. As part of that effort, the OIF will be presenting two 112 Gbps serial electrical demos at OFC 2018. The first demo will include a silicon chip driving a VSR (chip to module) channel and the second will have a silicon chip driving a direct attach copper cable assembly. 112 Gbps electrical signaling is regarded as a necessary technology to enable future signaling bandwidth requirements.

“The OIF continues to test and validate the implementation agreements the forum is working on or has recently completed,” said Steve Sekel of Keysight Technologies, Inc. and the OIF’s Physical and Link Layer Interoperability Working Group Chair. “The OIF recently published both CEI revision 4.0 which includes CEI-56 Gbps requirements and the FlexE revision 1.0 specification. The forum also started work on four CEI-112 Gbps projects so this demo provides important insight into the potential technical solutions.”

Wednesday, January 17, 2018

OIF advances Common Electrical I/O for 56 Gbps

The OIF has published “Common Electrical (I/O) CEI 4.0” with a focus on Serdes standards for 56 Gbps.

The result is a number of carefully optimized channel definitions, paving the way for a range of interoperable solutions at 56 Gbps data rates. Key to this effort was aiming for the lowest possible power dissipation for each application while balancing link budget and latency. At this time the OIF is releasing CEI 4.0 with the following new clauses:


  • CEI-56G-USR-NRZ: Ultra Short Reach, die-to-die inside muti-chip-modules, NRZ modulation
  • CEI-56G-XSR-NRZ: Extra Short Reach, chip-to-driver, NRZ modulation
  • CEI-56G-VSR-PAM4: Very Short Reach, chip-to-module, PAM-4 modulation
  • CEI-56G-MR-PAM4: Medium Reach, chip-to-chip, one connector, PAM-4 modulation
  • CEI-56G-LR-PAM4: Long Reach, chip-to-chip, two connectors over backplane, PAM-4 modulation
  • CEI-56G-LR-ENRZ: Long Reach, chip-to-chip, two connectors over backplane, ENRZ modulation

“The industry continues to face challenges for diverging requirements regarding link latency and concerns with power consumption at the higher data rates,” said Klaus-Holger Otto of Nokia and the OIF Technical Committee Chair.  “Documenting channel definitions in more granular reaches and multiple  modulation schemes allows for the optimization of silicon chip designs, channel architectures and network operator use cases. These parameters for 56 Gbps will be used as building blocks for protocol specifications written by other organizations across the industry so the forum wanted to provide definitions that met their unique needs.”

http://www.oiforum.com/wp-content/uploads/OIF-CEI-04.0.pdf

Thursday, November 30, 2017

OIF starts work on long reach and medium reach CEI-112G

The Optical Internetworking Forum (OIF) has begun work on long reach (LR) and medium reach (MR) CEI-112G. The goal is to define an interface to enable high-loss 112G backplane channels. This project will also facilitate direct attach copper (DAC) cable channel links at 112G. The CEI-112G-MR project will develop specifications for a chip-to-chip (c2c) interface which can also be used to support applications of 112Gx2 (224G), and 112Gx4 (448G) with reduced power, complexity, and enhanced density.

The CEI-112G-LR project builds upon two existing 100G serial electrical link projects.

“These projects build upon the relevant and foundational 56G and 112G CEI roadmap the OIF has established,” said Nathan Tracy of TE Connectivity and OIF vice president of marketing.  “The industry continues to look to the OIF to deliver interoperable implementation agreements that will drive adoption of both 100 Gb/s serial applications and the interfaces needed to address higher bandwidth.”

Tuesday, September 5, 2017

OIF Updates Micro Intradyne Coherent Receiver IA for 400G

Optical Internetworking Forum (OIF) announced updates to its Micro Intradyne Coherent Receiver implementation agreement. The IA introduces three classes of receivers, distinguished by their RF frequency response, to support Flex Coherent DWDM transmission to 400G and beyond.

The OIF said it continues its efforts to look beyond 100G by selecting a 400G implementation technology option. The newly published Flex Coherent DWDM Transmission framework document specifies a single technical approach for diverse network applications, including long-haul (LH), metro and data center inter-connection (DCI). One of the objectives of this work is to provide direction on the technical developments required by system and component providers.

“Our system vendor members continue to flow down future system requirements so that component suppliers can be ready with products to support their designs,” said Karl Gass of Qorvo and the OIF’s Physical and Link Layer Working Group – Optical Vice Chair.

The OIF is currently planning its next global transport SDN Interop demo and seeking input from the service provider community, including those that have not participated in past interop demonstrations.

In addition, the following officers were re-elected to one-year terms:
Klaus-Holger Otto of Nokia - Technical Committee, Chair; Ed Frlan of Semtech - Technical Committee, Vice Chair; Lyndon Ong of Ciena - MA&E Committee Co-Chair, Networking; Brian Holden of Kandou Bus - MA&E Committee Co-Chair, Physical & Link Layer.

http://www.oiforum.com

Thursday, June 15, 2017

OIF approves virtual transport network service IA

The Optical Internetworking Forum (OIF), which met recently in Ljubljana, Slovenia for a quarterly technical committee conference, announced that it has approved an implementation agreement (IA) for an optical virtual transport network service (VTNS) and also made progress on the 400G-ZR project.

VTNS IA

A virtual transport network service (VTNS) constitutes the creation and delivery of a virtual network (VN) by a provider to a user based on the virtualisation of transport network resources. VNs can be dynamically created, deleted or modified, while users are able to perform connection management, monitoring and protection within the VN.

In specifying the new VTNS IA, OIF aims to identify the requirements and characteristics of different virtual network service types, such as dynamic and static behaviours. The new IA is also intended to define the attributes and parameters required for these service types and the requirements for support of service recovery and OAM.

The OIF noted that different types of VTNS could be associated with operators offering, for example, bandwidth-on-demand (BoD) services, network-as-a-service (NaaS) or network slicing for 5G networking.

400G-ZR update

The OIF's 400G-ZR interoperability project, launched in November 2016, was formed to address both 400 Gbit/s ZR and short-reach DWDM multi-vendor interoperability requirements, such as might be required for cloud-scale data centre interconnect (DCI) applications. It noted that the project has now received 10 technical contributions relating to areas including power consumption of DSP, FEC proposals, and experimental demonstrations.

In addition, it was announced that at the recent quarterly meeting the OIF elected Tad Hofmeister of Google to its board of directors, filling a vacant seat on the board.

Tuesday, February 14, 2017

OIF Completes SDN Transport Application Programming Interface (T-API) Testing

The Optical Internetworking Forum (OIF) conducted a six-week long global testing of the Transport Application Programming Interface (T-API) standard from the Open Networking Foundation (ONF) with intra-lab and inter-lab testing across five carrier labs: China Telecom, China Unicom, SK Telecom, Telefonica and Verizon.

“As operators move from SDN PoCs and lab trials into commercial deployments, lack of interoperability between the SDN controllers and the orchestration layer above has quickly become the biggest technical barrier for many operators,” said Sterling Perrin, principal analyst, Heavy Reading. “Building a standardized northbound interface and successfully testing interoperability across different vendors and different networks – as the OIF has demonstrated – is a major step forward in addressing the northbound interface challenge and bringing SDN architectures to wide-scale commercial use.”

Thes testing included multi-domain orchestration of services delivered through Ethernet, OTN and optical switching. Carriers and vendors demonstrated how Virtual Network Functions (VNF) and SDN configured connectivity are combined to deliver service life cycle management.

Participating vendors include ADVA Optical Networking, Ciena, Coriant, Huawei Technologies Co., Ltd., Infinera, Juniper Networks, NEC Corporation, Sedona Systems, and SM Optics. Consulting carriers include Orange and TELUS. Academic and/or research institution participants include China Academy of Telecommunication Research (CATR) and Centre Tecnològic de Telecomunicacions de Catalunya (CTTC).

Participants also submitted a proof of concept demo proposal to ETSI NFV called “Mapping ETSI-NFV onto Multi-Vendor, Multi-Domain Transport SDN”.

A technical white paper on the demonstration is available to download.

http://www.oiforum.com/meetings-and-events/2016-oif-sdn-t-api-demo/

Thursday, February 2, 2017

OIF Approves Polarized Multiplexed Quadrature Modulator for 400G

The Optical Internetworking Forum (OIF) approved an Implementation Agreement (IA) for an optical integrated Polarization Multiplexed (PM) quadrature modulator for coherent applications with nominal symbol rates up to 64GBaud. The agreement supports the 16QAM modulation format for 400G applications.

“As we go to higher data rates, we need higher performing optical components that maintain a reasonable level of complexity,” said Karl Gass of Qorvo and the OIF’s PLL Working Group – Optical Vice Chair. “These components are targeted for 400G applications. RF bandwidth is the highest priority for this project.”

The forum members also started the CEI-112G in MCM project to support interconnect within Multi-Chip-Modules (MCMs). In addition to the CEI-112G-VSR specification that is being developed, there is a need to support high rate interconnect amongst large logic devices as well as to small driver devices within an MCM.

Members have also started a maintenance project to produce amendments to the User Network Interface (UNI) 2.0 and External Network to Network Interface (E-NNI) 2.0 specification documenting the extensions for support of OTN rates higher than 100G. Adding these extensions to UNI 2.0 and E-NNI 2.0 will facilitate vendor interoperability. The project seeks to assist the IETF as it develops the required routing and signaling extension by providing a description of the Byond100G data-plane and the operations to be controlled by GMPLS.

http://www.oiforum.com

Wednesday, December 7, 2016

OIF Begins Work on Two FlexE Projects

The Optical Internetworking Forum has started work on two new FlexE projects.

“The datacenter and communications industries are demanding a solution for flexible deployment and provisioning of Ethernet bandwidth,” said Scott Irwin of MoSys and the OIF’s Physical and Link Layer (PLL) Working Group protocol vice chair. “Building on its first generation of FlexE, the OIF has started a new project to support the next generation of Ethernet PHY rates currently under development within the IEEE 802.3 Working Group. Because of the large industry interest in FlexE, the OIF is also hosting a workshop on the topic which allows non-members to learn about the work first hand.”

The FlexE 1.0 implementation agreement, completed in March of this year, provides a mechanism to map one or more FlexE clients over a group of 100 Gb/s Ethernet PHYs. The client rates supported are 10G, 40G, and n×25G. The new FlexE 2.0 project will add the ability to create FlexE groups of 200 Gb/s and 400 Gb/s Ethernet PHYs and to consider several other feature additions.

FlexE 1.0 and ongoing revision enable 802.1 LLDP over management channels for FlexE Connectivity Verification. However, FlexE capabilities discovery is still required to facilitate the setup of FlexE Group(s) and Clients. The new FlexE Neighbor Discovery project will introduce some OIF organizational specific FlexE Extension to LLDP for FlexE capabilities discovery.

The OIF will host a workshop titled, FlexE Today and Tomorrow, in San Jose on January 20th.

http://www.oiforum.com/oif-announces-new-flex-ethernet-projects-and-workshop/

Thursday, November 17, 2016

OIF Commences Work on Four New Project

Following its Q4 meeting this month in Auckland, New Zealand, The Optical Internetworking Forum announced four new projects:

  • 400ZR Interoperability Project -- will develop an implementation agreement for 400G ZR and short-reach DWDM multi-vendor interoperability.  It is relevant for router-to-router interconnect use cases and is targeted at (passive) single channel and amplified DWDM applications with distances up to 120 km. This project should ensure a cost-effective and long-term relevant implementation using single-carrier 400G, coherent detection and advanced DSP/FEC algorithms.  
  • Common ACO Electrical I/O Project -- will define the ACO electrical I/O independent of the choice of form factor and optical carrier count for 45 Gbaud and 64 Gbaud per-carrier applications. This project would build upon the success of the CFP2-ACO but is form factor agnostic so that it could be applied to multiple applications such as  CFP4, CFP8, QSFP, micro QSFP and OFSP.
  • Coherent Modem Management Interface Project -- members have requested that the industry combine the coherent modem management interface specifications [4"x5" LH MSA, CFP2-ACO, CFP2-DCO, Flex-Coherent, etc.] into a standalone document.  OIF leadership, working in conjunction with the CFP MSA group, is inviting companies to participate in creating a complementary Normative document.
  • High Baud Rate Coherent Modulation Function Project -- will define a small form factor component implementation agreement that combines the high baud-rate PMQ (HB-PMQ) modulator plus the RF drive functions into a single component. This new component will be used in conjunction with a high baud Integrated Coherent Receiver (ICR), a micro Integrable Tunable Laser Assembly (ITLA) and a coherent DSP, to implement a high performance coherent modem.

“The OIF continues to work with other standards bodies and the industry to identify a wide range of technology needs that cross the entire optical and electrical ecosystem,” said Karl Gass of Qorvo and the OIF’s Physical Link Layer working group optical vice-chair.  “The OIF remains committed to providing technology direction that provides a path to interoperability in a pre-competitive environment. The projects started during the Q4 meeting demonstrate the OIF’s  commitment to work with other standards bodies in the industry.”

In addition, OIF announced the following election results: Dave Brown of Nokia was re-elected to the Board for a two-year term and appointed as president.  Re-elected to one-year terms were Junjie Li of China Telecom and Dave Stauffer of Kandou Bus. Stauffer will continue to serve as secretary/treasurer. Jonathan Sadler of Coriant and Nathan Tracy of TE Connectivity were elected to the board for two-year terms.  Tracy was appointed as vice president of marketing. Tom Issenhuth of Microsoft was appointed as vice president and Ian Betty of Ciena continues to serve on the Board.

Newly elected were Klaus-Holger Otto of Nokia as Technical Committee chair, Ed Frlan of Semtech as Technical Committee vice chair and Jeffery Maki of Juniper Networks as chair of Physical Layer User Group Working Group.

Brian Holden of Kandou Bus, Market Awareness and Education Committee co-chair, Physical and Link Layer; and Lyndon Ong of Ciena, MA&E Committee co-chair, Networking were both re-elected.

http://www.oiforum.com/


Wednesday, September 28, 2016

OIF Begis Work on IC-TROSA and CFP2-Digital Coherent Optics Project

The Optical Internetworking Forum’s (OIF) has begun work on two optical interface projects:

the IC-TROSA project would enable manufacturers to have a higher level of integration for transmit and receive optical components. Integrated Coherent Transmitter-Receiver Optical Subassembly (IC-TROSA) is the evolutionary step that combines Polarization Multiplexed Quadrature (PMQ) Transmitter (Tx) and Integrated Coherent Receiver (ICR) components to create a single integrated optics package.  The optical sub-assembly that supports high-bandwidth and high-order QAM operations is suited for data center interconnect, metro and long-haul applications. As module sizes decrease, current coherent optics components need similar size reductions to enable next generation multi-terabit switches, line cards, and transport. Density requirements for next-gen line cards, front-pluggable and future on-board 400G+ optical modules are driving the need for further integration and miniaturization.

the CFP2-Digital Coherent Optics (DCO) project will work with other standards bodies to implement coherent modulations formats in CFP modules. The OIF’s CFP2-DCO project includes a way to build address management interface and identify registers necessary to talk to the DSP located in the module, specific to coherent modulation techniques. The CFP2-DCO is intended to be used for 100G, 200G or 400G applications for metro, long-haul and data center interconnections and it can support different formats such as DP-QPSK and DP-xQAM.

“The IC-TROSA project tackles much more than just a simple size reduction,” said Karl Gass of Qorvo and the OIF’s Physical and Link Layer (PLL) Working Group – Optical vice chair.  “It addresses optical packaging in a way that isn’t done in high volumes today. We want to come to industry consensus in this pre-competitive environment.”

http://www.oiforum.com.

Thursday, September 8, 2016

OIF Plans SDN Transport API Interoperability Demo

The Optical Internetworking Forum (OIF), in partnership with the Open Networking Foundation (ONF), will host a global Software-Defined Networking (SDN) Transport Application Programming Interface (T-API) interoperability demonstration in the fall of 2016.

OIF said that one main focus of the global demonstration is the notification interface – the means for notifying applications that congestion is being observed, triggering moving around of traffic and addition of capacity. Additional use cases based upon the API standards will be clarified during the testing and defined through OIF implementation agreements to provide a common set of requirements.

Host carriers for the demonstration include China Telecom, China Unicom, SK Telecom, Telefónica and Verizon.

Participating vendors include ADVA Optical Networking, Ciena, Coriant, Fiberhome, Huawei Technologies Co., Ltd., Juniper Networks, NEC Corporation, Sedona Systems, SM Optics and ZTE.

Consulting carriers include Orange and TELUS. Academic and/or research institution participants include China Academy of Telecommunication Research (CATR) and Centre Tecnològic de Telecomunicacions de Catalunya (CTTC).

“In the modern operating environment, carriers need to dynamically move capacity to handle quickly changing traffic demands,” said Jonathan Sadler of Coriant and the OIF’s technical committee vice chair and acting networking interoperability chair. “The APIs that are being tested create a new breed of applications. Like so many of the interoperability agreements developed by the OIF, demand from carriers continues to drive the technical direction of the Forum.”

“ONF and the OIF are united in our goal of moving these technical advances into the market for the benefit of network operators and their users,” said Dan Pitt, executive director of the Open Networking Foundation. “We are pleased to extend our longstanding collaboration with the OIF on T-API, leveraging OIF’s specialized optical expertise, and these demonstrations inspire operators and vendors alike to accelerate development and deployment.”

http://www.oiforum.com/meetings-and-events/2016-oif-sdn-t-api-demo

Tuesday, August 30, 2016

OIF Launches 100G Serial Electrical Links

The Optical Internetworking Forum (OIF) has begun work on a 100G Serial Electrical Link project.

The very short reach (VSR) CEI-112G chip-to-module interface project will support a nominal lane rate of 112 Gb/s, enabling narrower interfaces to optical modules and is expected to be more energy efficient than previous interfaces. The CEI-112G-VSR specification doubles data rates over the current generation CEI-56G-VSR interfaces.

The OIF said this work will be followed by both shorter and longer reach projects.

“As bandwidth increases, electrical interfaces need to reflect that trend. Given the lead times, development of standards for the next generation of electrical links needs to start now,” said David Stauffer of Kandou Bus and the OIF’s Physical and Link Layer Working Group Chair and board member. “The OIF is continuing its roadmap for 100 Gb/s thru 400 Gb/s and beyond applications, addressing multiple reaches for chip-to-chip and chip-to module interfaces.”

http://www.oiforum.com

Monday, June 27, 2016

OIF Approves Multi-Link Gearbox 3.0

The Optical Internetworking Forum has approved Multi-Link Gearbox (MLG) 3.0, an agreement that supports 100G links and allows independent 10GBASE-R signals to transit physical 20G and 40G lanes for higher bandwidth capability.

The MLG 3.0 specifies a logic layer between the Ethernet MAC and PHY layer hardware that allows the data from multiple MACs to be aggregated onto higher speed data links.  This allows independent 10GBASE-R and 40GBASE-R signals to transit 4x25G and 8x25G gearboxes. The agreement defines three MLG configurations: A 4x25G lane configuration is comprised of 20 MLG lanes. An 8x25G lane configuration is comprised of 40 MLG lanes. A 2x20G/1x40G lane configuration is comprised of 4 MLG lanes (similar to 40GBASE-R) to carry up to four 10GBASE-R signals.

In addition, the OIF has commenced work on a new analog coherent optics project that supports higher baud rate and higher wavelength/ carrier-count applications at higher density than the existing CFP2-ACO. The new project, dubbed CFP8-ACO, utilizes the existing CFP8 definition from the CFP-MSA group and provides up to 4 wavelengths/carriers per module. In addition to a 20w power profile, the new specification includes a 9.5mm module height, allowing for a double-stack line card or belly-to-belly. A 40mm module width will enable a 2 x 8 configuration for a 16 module line card.  This allows for an increased number of modules as well as an increased number of wavelength/carriers.

“The OIF is looking ahead to what is needed in 2018 and we need to get started now to support the market needs for more wavelength/carriers in coherent optics modules,” said Karl Gass of Qorvo and the OIF Physical and Link Layer Working Group optical vice chair.  “Our goal with the CFP8-ACO module is a 4x increase in faceplate density and we expect to complete this next year.”

http://www.oiforum.com/

Thursday, March 10, 2016

OIF Completes FlexE IA for Data Center Interconnections

Members of the OIF have finalized and implementation agreement (IA) covering flexible Ethernet for Data Center and transport interconnect efficiency.

The FlexE Implementation Agreement provides a generic mechanism for supporting a variety of Ethernet MAC rates that may or may not correspond to any existing Ethernet PHY rate. This includes MAC rates that are both greater than (through bonding) and less than (through sub-rate and channelization) the Ethernet PHY rates used to carry FlexE.

“The FlexE IA allows Ethernet to be used more efficiently in response to ever changing technologies, link rates, and bandwidth needs,” said Scott Irwin of MoSys and the OIF’s Physical and Link Layer Working Group – Protocol Vice Chair. “OIF members worked hard to get this IA completed in record time to meet the industry’s need for flexible and scalable bandwidth provisioning.”

Thursday, February 18, 2016

OIF Approves CFP2 Analog Coherent Optic Module IA

The Optical Internetworking Forum (OIF) approved an Implementation Agreement (IA) on pluggable coherent optics modules.

The CFP2 Analog Coherent Optics (CFP2-ACO) IA contains all functions required to perform bi-directional dual polarization coherent optical signaling over a pair of single mode optical fibers. These modules are expected to be applicable across multiple coherent DSP ASIC generations from various DSP vendors.

Faceplate density of optical IO is a key metric for switching and line-side transport applications. The roadmap for reduction in module size is accelerated by moving functions from the traditional CFP-series module to the host board. Moving the high power electronics functions to the line card permits optimal cooling of the electronics, enabling higher performance line-side applications as well as increasing the reliability of the module itself.

“A long life-span for the CFP2-ACO solution is expected by providing optical module vendors a large addressable market,” said Ian Betty of Ciena and OIF board member and IA editor. “Significant innovation and cost reduction in the coherent optics solutions for Metro-to-Regional reach line-side transport is anticipated with the CFP2-ACO solution.”

http://www.oiforum.com

Saturday, November 21, 2015

OIF Launches Flex Coherent DWDM Framework Effort

The Optical Internetworking Forum (OIF) announced its intent to specify a framework for Flex Coherent DWDM Transmission in long haul, metro, and data center inter-connections. The idea is to enable the following flexible transceiver attributes: modulation formats, symbol rates, and number of subcarriers.

Flex Coherent DWDM will outline a software-defined optics ecosystem that initially leverages past and current OIF projects for tunable lasers, high bandwidth PMQ modulated transmitters and integrated coherent receivers. The Flex Coherent DWDM Transmission will start with the following modulation formats suitable for different scenarios; QPSK, 8QAM, 16QAM for long haul and metro applications and 32QAM, 64QAM for data center inter-connection applications.

The framework will build upon work the OIF completed for 100G LH DWDM and provide guidance for 400G.  

“We’ve discussed the hardware implications of SDN for a couple years now,” said Junjie Li, of China Telecom and OIF board member.  “We need to move away from fixed performance transceivers in order to provide Service Providers with a flexible solution, complete with software “knobs” that can be dialed-in to achieve the desired performance.”

The OIF also announced the results of its recent leadership elections, welcoming Peter Landon, BTI Systems as the chair of the Networking & Operations Working Group committee for 2-year term. Newly elected to the Board of Directors are Ian Betty, of Ciena for a 2-year term, Tom Issenhuth of Microsoft for a 2-year term and Mike Tessaro of Qorvo for a 1-year term. Junjie Li of China Telecom was re-elected to the board for a 1-year term. John McDonough of NEC America will serve as president. Dave Brown of Alcatel-Lucent continues to serve as VP of Marketing and Dave Stauffer of Kandou Bus continues to serve as secretary/treasurer.

http://www.oiforum.com

Thursday, June 11, 2015

OIF Approves Thermal Interface Spec for Pluggable Optics Modules

The Optical Internetworking Forum (OIF) has approved a thermal interface implementation agreement (IA) for pluggable optics modules. The aim is to help optical module suppliers and system designers reduce heat and thermal management issues.

“When optical modules are mated with heatsinks, the goal is to remove over 90% of the heat through the interface area into the airflow stream via the heatsink,” said Torsten Wuth, of Coriant and the OIF Physical Layer User Group Working Group chair. “Nominal ranges of heat flux are defined as Power Density classes. The OIF agreement defines acceptable thermal impedances for the contact area for various pluggable module types and a method of measuring the impedance.”

The agreement summarizes the information to be provided by module suppliers to facilitate thermal integration of the module within the host system. It also defines the requirements and methods for testing a thermal interface between a pluggable optical module and the host-system heatsink.

http://www.oiforum.com/documents/implementation-agreements/

Tuesday, May 19, 2015

OIF Publishes SDN Framework Paper

The Optical Internetworking Forum (OIF) published an SDN Framework whitepaper that paves the way for implementation of SDN in Carrier Networks.

“Framework for Transport SDN: Components and APIs”, documents the SDN framework for multi-domain carrier networks.  It identifies critical open APIs for Transport SDN based on synthesis of the SDN layered architecture and the ITU-T ASON functional element model for optical network control.

“In 2014, the prototype demonstration brought together multiple vendors and carriers to test cloud-bursting services, utilizing SDN principles and interfaces,” said Lyndon Ong of Ciena and co-chair of the OIF Market Awareness & Education Committee.  “The demonstration results factored into the development of a framework that allows SDN to be deployed over a carrier’s network with multiple, diverse domains.”

One of the key findings from the demonstration was that the separation introduced by the NBI and SBI enables SDN to be applied over greenfield (i.e., OpenFlow) and brownfield environments, allowing integration of domains controlled by management systems and domains using existing distributed control planes as well as centralized SDN.  A variety of SBI protocols could coexist in the carrier’s Transport SDN network, including the OpenFlow protocol, with extensions for optical networks.

http://www.oiforum.com/oif-publishes-transport-sdn-framework-document/

See also