Showing posts with label Molex. Show all posts
Showing posts with label Molex. Show all posts

Wednesday, October 25, 2017

Molex opens Silicon Valley Technology Center

Molex, a subsidiary of Koch Industries, has opened a technology center in Fremont, California. The facility will be one of the main innovation hubs for Molex Optical Solutions business and home to sales and customer development teams serving all of Molex customers in the region. 

The 108,000-sq. ft. building features over 50 miles of Molex Optical and Copper Cable Assembly Solutions, patch panels, adapter panels, modular office electronics and wire management tools. Advanced building capabilities include an intelligent, low-voltage Molex Transcend Network Connected Lighting System using a Power over Ethernet (PoE) LED lighting network to enable energy savings through sensor feedback.

Wednesday, August 2, 2017

Molex launches zSFP+ for 56 Gbit/s PAM4 channels

Molex announced it has expanded its zSFP+ Interconnect System to support 56 Gbit/s PAM4 channels in a stacked 2 x N port configuration, allowing next-generation Ethernet and Fibre Channel applications to receive improved signal integrity.

Molex claims the product is the first of its kind on the market, enabling OEMs requiring high-density interconnect applications now to utilise channels with individual lane data rates up to 56 Gbit/s PAM4. The updated Molex product also maintains a low insertion loss, crosstalk, thermal and electromagnetic interference (EMI) containment as provided by the previous generation zSFP+ interconnect system.

The updated interconnect system offers multiple features designed to allow greater flexibility and lower costs for users. The 56 Gbit/s PAM4 channel products include EMI ganged cages, available in multiple port configurations from 2 x 1 through 2 x 12, providing flexibility of PCB signal routing of LEDs.

Molex has also developed a next-generation terminal and wafer on the stacked integrated connectors within the zSFP+ interconnect system. The advanced terminal is designed to provide superior signal integrity for 56 Gbit/s PAM4 applications. The system also allows users to merge standard cables and modules with the increased data-rate accepted.

The new zSFP+ interconnect system targets applications in cellular infrastructure, telecom equipment, switches, data networking servers and storage systems.

  • * Recently, the SFP-DD MSA Group, which includes Molex as a founding member, announced plans to develop the specification for a high-speed, double-density small form-factor pluggable (SFP-DD) interface. The MSA plan to develop operating parameters, signal transmission speed goals and protocols for the SFP-DD interface, which expands on the SFP pluggable form factor.

  • The SFP interface's single electrical lane operates at up to 25 Gbit/s NRZ or 56 Gbit/s PAM4, with the new SFP-DD electrical interfaces designed to support 2 lanes operating at up to 25 Gbit/s NRZ or 56 Gbit/s PAM4 per lane to support 50/112 Gbit/s aggregate bandwidth

Tuesday, January 3, 2017

Molex takes 20% Stake in Excelfore for Smart Vehicles

Molex has acquired a 20% equity stake in Excelfore, a start-up based in Silicon Valley developing a cloud platform and connectivity applications for intelligent transportation. Molex’s investment is part of a Series A round of funding in Excelfore, which is geadquartered in Fremont, CA with offices in China, Germany, India, and Japan,

Excelfore specializes in middleware solutions for smart mobility networks that support next-generation smart, autonomous and learning vehicles, fleets and associated infrastructure. Excelfore automotive software products enable communication between automotive components and cloud-based servers, automotive fleet monitoring, and provision of Firmware Over the Air (FOTA) and Software Over the Air (SOTA) updates.

“Smart mobility starts with innovative people and solutions to make intelligent vehicle designs a reality,” according to Bill Fitzer, vice president and general manager of the Molex Connected Mobility Solutions Business Unit. “Together, Molex and Excelfore will provide complete intelligent vehicle systems integrating the hardware, software, and technical services needed to advance adoption of next-generation connected platforms in today’s vehicles.”

Thursday, April 7, 2016

Molex Acquires Interconnect Systems

Molex has acquired Interconnect Systems, which specializes in the design and manufacture of high density silicon packaging with advanced interconnect technologies.

Interconnect Systems, which is based in Camarillo, California, delivers advanced packaging and interconnect solutions to top-tier OEMs in a wide range of industries and technology markets, including aerospace & defense, industrial, data storage and networking, telecom, and high performance computing.

Molex said the acquisition enables it to offer a wider range of fully integrated solutions to customers worldwide.

“We are thrilled to join forces with Molex. By combining respective strengths and leveraging their global manufacturing footprint, we can more efficiently and effectively provide customers with advanced technology platforms and top-notch support services, while scaling up to higher volume production,” said Bill Miller, president, ISI.

Tuesday, March 22, 2016

Molex and Cisco Target Double-Density QSFP Interfaces

Molex and Cisco announced their participation in a multi-supplier agreement (MSA) to create high-speed, double-density quad small form factor pluggable (QSFP-DD), a new high-speed interface. Thirteen industry leaders have joined the MSA to collaborate in developing this new high-speed interface.

The new QSFP-DD interface expands on widely adopted QSFP enabling systems to support backwards compatibility to existing 40 GbE and 100 GbE QSFP interfaces as well as a clear path to future 2x100 GbE and 400 GbE interfaces. By maintaining the same port density per rack unit, customers can speed up networks without redesigning the architecture.

“With a clear trend towards hyper-converged fabrics, customers need an aligned switch silicon and optics roadmap,” said Luca Cafiero, senior vice president and general manager at Cisco. “Global IP traffic is expected to reach 1.4 zettabytes next year, reflecting a CAGR from 2012 to 2017 of 23 percent. All players involved in network architecture will have to step up their game to meet this demand, and the MSA for QSFP DD is a big step in that direction. We are confident that, with industry leaders like Molex, we can help to lead the development of high-speed technology that will be broadly used throughout the industry.”

Wednesday, January 7, 2015

Molex Acquires SDP Telecom for RF Components

Molex has acquired SDP Telecom, a maker of RF/microwave solutions for the wireless communications industry. Financial terms were not disclosed.

SDP, which is based in Montreal, Canada, has manufacturing facilities in China. SDP will be managed by the RF/Microwave Business Unit that is part of Molex’s Global Integrated Products Division.

“Together, Molex and SDP will broaden our RF/Microwave product capabilities and create additional value for our customers in the growing wireless infrastructure market, said Tim Ruff, senior vice president, Molex. “This is a next step towards achieving our vision to offer total integrated solutions to the markets we serve.”