Showing posts with label Molex. Show all posts
Showing posts with label Molex. Show all posts

Sunday, March 24, 2019

Molex joins Networking for Autonomous Vehicles Alliance

Molex has joined the Networking for Autonomous Vehicles (NAV) Alliance, which was created to drive the ecosystem development required for the next generation of Multi-Gig Ethernet networking in vehicles. The NAV Alliance also provides a platform for the automotive industry to create innovative in-vehicle network infrastructure solutions for autonomous vehicles and facilitate wide deployment of networking technologies and products.

NAV was founded in July 2018 by Aquantia, Bosch, Continental, NVIDIA, and the Volkswagen Group of America.

“Molex is pleased to join the NAV Alliance and work closely with our industry peers who share our commitment to shaping the future of driving by creating in-vehicle network infrastructures for automotive OEMs and Tier One manufacturers developing the next-generation of connected vehicles,” stated Mike Gardner, director of advanced technology market development, Molex.

Monday, March 11, 2019

Molex and Innovium to show optimized 12.8T

At OCP Summit 2019 later this week in San Jose, California, Molex and Innovium will host a joint demonstration combining Molex’s BiPass I/O technology with Innovium’s 12.8Tbps TERALYNX Switch ASIC.

The companies say the new switch system design offers better signal integrity, thermal management and simple manufacturability, providing the end customer a highly robust and resilient system.

Molex's low-insertion-loss, BiPass I/O technology serves as a PCB alternative to enable efficient and reliable implementation of 56 and 112 Gbps PAM-4 protocols. The BiPass cable assembly routes signals directly from an ASIC chip in a switch to the server front-panel I/O without having to go through the printed circuit board between them. Because the ASIC can be positioned farther back in the box, the BiPass solution allows for vertical orientation, providing greater port density. For further cost benefits, the BiPass solution reduces the number of board layers and eliminate the power cost and consumption of re-timers. From a thermal management perspective, the BiPass solution uses dual heatsinks, on the top and bottom of module, making cooling of 20W modules possible.

“By leveraging the combined capabilities of Innovium’s TERALYNX 12.8Tbps switch ASIC and Molex’s BiPass I/O technology, we are highlighting better performance and more operational efficiencies for our customer’s evolving data center needs,” said Chris Kapuscinski, global product manager, Molex. “The BiPass and Innovium demo shows that even at 112 Gbps, copper is still a viable and more economical option.”

Wednesday, March 6, 2019

Molex highlights 100G Lambda and Coherent platforms

At this week's OFC, Molex announced the general availability of its 100G Lambda product platform. Volume production starts in Q2 2019. Multiple 100GbE and 400GbE products will be offered such as 100G-DR QSFP28, 100G-FR QSFP28, 100G-LR QSFP28, 400G-DR4 QSFP-DD, 400G-FR4 QSFP-DD and 400G-LR4 QSFP-DD.

In addition, Molex is showcasing the coherent product platform, which supports products such as OIF 400G ZR compliant transceivers in OSFP and QSFP-DD form factors.

Molex is also hosting a joint live demo with Cisco, Innovium and Ixia that shows end-to-end Ethernet traffic through 400G-DR4, 100G-DR, 100G-FR and 100G-LR transceivers. The demo highlights the 100G Lambda Multi-Source Agreement (MSA) compliant technology’s readiness to support next-generation high-speed, high-density networking. Sharing the same optoelectronic technology, the 100G Lambda product platform is scalable to support future serial 100G and 800G products.

https://www.connector.com/solutions/ofc

Sunday, February 10, 2019

Molex showcases Enhanced Automotive Ethernet Network Platform

Molex will showcase the next evolution of its 10 Gbps Automotive Ethernet Network Platform at this week's annual Automotive Ethernet Congress (AEC) in Munich, Germany.

At the system’s core is the Molex gateway, a secure networking hub that aggregates and processes data from all domains and devices, seamlessly integrating multiple hardware and software systems as well as legacy automotive protocols.

Molex’s multi-layered security approach includes enhanced hypervisor capabilities that allow the platform to run multiple virtual machines and applications simultaneously, giving automakers more flexibility, while also providing powerful encryption and certification technology for a more layered and secure network. Safety enhancements include new multi-zone, fail-functional, and redundancy capabilities. The reliable interface necessary to seamlessly connect the high-bandwidth, data-intensive applications is the Molex HSAutoGig high-speed Ethernet cabling solution designed for greater vehicle autonomy, delivering best-in-class 20 Gbps+ data speeds.

“We are deeply committed to a leadership role addressing increased demand for a high-bandwidth end-to-end Ethernet-based open architecture solution,” stated Alex Bormuth, director of business development for the German market, Molex. “The next evolution of our Ethernet-based platform delivers fast and reliable data transmission, support for IP protocols, network traffic prioritization, and stringent security protocols that are all essential to designing next-generation intelligent, autonomous and connected vehicles.”

Wednesday, January 16, 2019

Molex targets 56 Gbps NRZ and 112 Gbps PAM-4 Signaling

Molex is highlighting its 56 Gbps NRZ and 112 Gbps PAM-4 solutions. The company has a portfolio of five different solutions that are capable of reaching speeds up to 112 Gbps. These product lines include:

  • Quad Small Form Factor Pluggable Double Density (QSFP-DD) System
  • BiPass I/O and Backplane Cable Assemblies
  • NearStack High-Speed Connector System and Cable Jumper Assemblies
  • Mirror Mezz High-Speed System
  • Impulse Backplane Connector and Cabling System

Molex will showcase these product at the upcoming DesignCon 2019 in Santa Clara, California.

“Data centers must evolve to meet the rising demand for faster data rates. Molex delivers highly scalable technologies equipped with advanced features to achieve the speed, signal integrity, EMI containment and thermal efficiencies they need to ramp up to next-generation equipment and networking platforms,” said David Brunker, Molex technical fellow, who serves on the DesignCon 2019 Technical Program Committee.

In addition to the booth demos, Molex will lead a technical session, “Exploring 56/112 Gbps Copper Interconnect Metrics Comparing Classic Methods with COM” on January 30th at 2:00 p.m. in Ballroom C.

Tuesday, January 8, 2019

AWS, Molex, Accenture to co-develop edge computing for vehicles

Molex is working with Accenture and Amazon Web Services (AWS) to bring edge computing and voice assistant capabilities to the Molex Automotive Ethernet Network Platform for autonomous vehicles.

The Molex platform is an Ethernet-based vehicle connectivity system with a multi-zone architecture across hardware, software and interconnect cabling systems, with the flexibility to incorporate legacy automotive protocols and scalability for future upgrades. It utilizes AWS IoT Greengrass machine learning functionality to enhance capabilities such as diagnostics, security and enhanced end-user experience. The future-ready, automotive-grade gateways act as central hubs, providing secure and reliable interconnects and processing data across the vehicle network to functional domains such as ADAS or Autonomous Driving.

“In combination with the groundbreaking features of our Automotive Ethernet Network Platform, AWS and Accenture’s contribution can profoundly help our customers innovate faster, drive down costs and build some of the most advanced vehicles in the automotive industry,” said Joseph Stenger, global product manager for connected mobility solutions, Molex. “We look forward to working together in the development of industry-leading technology solutions that help automotive OEMs design for the cars of tomorrow.”

“Accenture is excited to work with Molex to change the future of human mobility through new network and infrastructure capabilities for autonomous vehicles,” said Mark Pintar, a managing director in Accenture’s Technology Consulting practice. “Our collaboration has resulted in a solution that delivers an engaging customer experience that can adapt to meet the changing needs of users. We look forward to continuing to work together to enhance and expand these automotive solutions.”


Sunday, December 16, 2018

Molex advances its 10 Gbps Automotive Ethernet Network Platform

Molex introduced the next evolution of its award-winning 10 Gbps Automotive Ethernet Network Platform designed to support OEMs in the development and design of autonomous vehicles.

The Molex HSAutoGig high-speed Ethernet solution is designed for greater vehicle autonomy, delivering 20 Gbps+ data speeds with a reliable interface necessary to seamlessly connect smart-sensor systems and Ethernet network platforms. The high-speed HFM FAKRA Mini Coaxial Cable Solution is designed to perform up to 20 GHz supporting autonomous and connected vehicle technologies.

Molex said it is investing in the connected mobility ecosystem through internal innovation and ongoing and new collaborations with the automotive industry’s best-in-class technology service and solution providers including Accenture, Allgo, Amazon Web Services (AWS), Aquantia, BlackBerry (QNX and Certicom), Broadcom, Cypress, Excelfore, Laird CVS, Microchip, Texas Instruments, and Rosenberger.

Molex’s multi-layered security approach includes enhanced hypervisor capabilities that allows the platform to run multiple virtual machines and applications simultaneously, giving automakers more flexibility, while also providing powerful encryption and certification technology for a more layered and secure network. Safety enhancements include new multi-zone, fail-functional, and redundancy capabilities.

Molex USB Hubs and Media Modules support wired and wireless device-to-vehicle connectivity needs,including USB Type C. The advanced design considers cascading USB hubs via USB and Ethernet to optimize multiple devices connecting from the front to the back of the car.

“In close collaboration with our OEM customers, we translated the need for a safe, secure, reliable and connected vehicle foundation into a high-performance computing network on wheels. By integrating features such as signal integrity, network traffic prioritization, system scalability and security, we have ensured that our solution addresses the demand for more in-vehicle processing power while helping automakers redefine what’s possible for autonomous vehicle technology,” states Dave Atkinson, director of business development, Molex.

https://www.molex.com

Monday, September 24, 2018

ECOC 2018: Molex demos 100GbE and 400GbE Optical Solutions

Molex is demonstrating its 100G FR QSFP28 and 400G DR4 and FR4 QSFP-DD products in compliance with the 100G Lambda Multi-Source Agreement (MSA).

Both of the offerings are in Molex’s 100Gbps per wavelength PAM-4 product family which share the same optoelectronics technology platform.

The 100G FR QSFP28 supports a 4x25G NRZ host electrical interface. The module transmits and receives 100G PAM-4 modulated optical signals over 2 kilometers of singlemode fiber. The technology variations can support different reaches such as 100G DR (500m) and 100G LR (10km). Aggregating four 100 Gbps per wavelength lanes, the technology platform will also offer 400G versions such as 400G DR4, 400G FR4, and 4x100G for breakout applications.

Sunday, September 23, 2018

Molex acquires Nistica for wavelength selective switching (WSS)

Molex has acquired Nistica, a manufacturer of wavelength selective switching (WSS) products. Financial terms were not disclosed.

Nistica, which was founded in 2005 and is based in Bridgewater, New Jersey, is a supplier of agile optical modules that simplify, automate and make affordable the delivery of high bandwidth applications for the global telecommunication markets. The company specializes in WSS, a signal routing engine for metro/long-haul telecom networks.

Molex said Nistica's wavelength management solutions will enhance its portfolio of solutions for metro and long-haul networks. Nistica’s business will be integrated into the Molex Optical Solutions Group, a global provider of optical solutions, including a wide range of optical connectivity, optoelectronics, and optical transport products.

"With the build-out of 5G wireless networks and the growth in data center traffic, our customers are looking for novel optical solutions at the edge and in the core of optical networks," added Ashish Vengsarkar, CEO of Nistica. "The acquisition by Molex enables us to scale in capacity and bring a comprehensive portfolio of next-generation products to the market.”

“The addition of the highly innovative Nistica team and technology portfolio to our business enables us to continue our mission of helping customers drive innovation in areas where optical technology provides them with a competitive advantage,” said Doug Busch, vice president and general manager, Molex Optical Solutions business unit. “Integrating high-port count WSS capability into our optical transport portfolio will allow us to expand our offering to customers driving the dynamic growth of communications networks.”

Monday, May 14, 2018

Molex acquires BittWare for FPGA-based platforms

Molex has acquired BittWare, a provider of computing systems featuring field-programmable gate arrays (FPGAs) deployed in data center compute and network packet processing applications. Financial terms were not disclosed.

Bittware, which is based in Concord, NH, provides solutions based on FPGA technology from Intel (formerly Altera) and Xilinx. BittWare FPGA solutions are used in compute and data center, military and aerospace, government, instrumentation and test, financial services, broadcast and video applications. BittWare serves original equipment manufacture (OEM) customers.

“FPGA-based platforms have become a strategically important driver of machine learning, artificial intelligence, cybersecurity, network acceleration, IoT, and other megatrends. As a Molex subsidiary, now working with Nallatech, I believe we will have the critical mass to bring new resources, better processes, and economies of scale to our valued customers and this rapidly growing industry as a whole,” said Jeff Milrod, president and CEO of BittWare.

Monday, April 23, 2018

Molex and Rosenberger sign dual-sourcing agreement for automotive coaxial connectors

Molex and Rosenberger have signed a dual-sourcing agreement allowing Molex to produce High-Speed FAKRA-Mini automotive coaxial connectors based on the Rosenberger HFM design, which support data rates up to 20 Gbps. Rosenberger HFM FAKRA-Mini system is designed for a range of existing and future automotive applications, such as advanced driver assistance systems (ADAS), navigation, infotainment and intelligent connected vehicles.

With the dual sourcing agreement, the companies provide a high-quality, high-speed, cost-optimized intermateable interface with identical mechanical and electrical performance and features. The solution delivers seamless backward compatibility for the automotive market.

“Molex is excited to collaborate with Rosenberger to launch the dual-sourced HFM solution that enables high-speed data transmission fundamental to connected vehicle technology,” said Ryan Price, networking segment director, Molex. “Our shared vision is to deliver a high value, cost effective solution that provides design flexibility and backward compatibility.”

“Ensuring safety is the ultimate priority of ADAS and autonomous driving systems, and HFM connectors play a key role in processing the high data volumes from cameras, sensors, navigation sources and other external objects in real time,” said Dr. Tosja Zywietz, CEO, Rosenberger. “We are pleased to collaborate with Molex on making this next-generation coax connector widely available to the automotive industry as a quasi standard.”

https://www.molex.com/automotive



Aquantia partnership - The Molex 10 Gbps Automotive Ethernet Network incorporates an Aquantia chip optimized for Multi-Gig 

Monday, March 12, 2018

Molex intros 100G PAM-4 Based 25G/50G/100G/400G

Molex introduced a portfolio of 100G and 400G products based on its 100G PAM-4 optical platform, including multi-Rate 25G/50G/100G PAM-4 DWDM QSFP28, 100G FR QSFP28, 400G DR4 and 400G FR4 QSFP-DD and OSFP.

100G PAM-4 platform-based product solutions include:

  • 25G/50G/100G Multi-Rate PAM4 DWDM QSFP28:
    Supports 40x100 Gbps DWDM with a total of 4 Tbps per fiber pair
    Flexible data rate programmability to support 25 Gbps and 50 Gbps applications
  • 100G FR QSFP28:
    Compliant with 100 Gbps Lambda MSA
    Supporting 100G connectivity up to 2km
  • 400G DR4 and 4x100G FR QSFP-DD/OSFP:
    Compliant with 100G Lambda MSA
    Supporting 400 Gbps connectivity up to 500m
    4X100G FR supporting four times of 100G FR up to 2km
  • 400G FR4 QSFP-DD/OSFP:
    Compliant with 100G Lambda MSA
    Supporting 400 Gbps connectivity up to 2km


“Molex is a leader in the development of the foundational building blocks for 100G PAM-4 optoelectronics, and in collaborations for digital signal processing (DSP) integrated circuits. By leveraging these combined capabilities, we support high bandwidth requirements for a wide range of applications across intra-data center, data center interconnect (DCI) and 5G wireless. In addition, 100G PAM-4 technology also lays the foundation for cost-effective and high-density 400G solutions,” said Rang-Chen (Ryan) Yu, vice president of business development, GM of optoelectronic solutions at Oplink, a Molex Company and co-chair of 100G Lambda MSA.

OFC booth 2512

Wednesday, January 10, 2018

Molex intros 10G Automotive Ethernet Network

Molex introduced its 10G Automotive Ethernet Network for connected and autonomous vehicles.

The Molex 10 Gbps Automotive Ethernet Network connects Electronic Control Units (ECUs) throughout a vehicle. It offers secure over-the-air software and firmware updates and diagnostics over IP (DoIP) to help avoid the need for vehicle recalls and enabling in-vehicle security and diagnostics over IP.  Molex said its platform is compatible with existing network components provides OEMs the design flexibility to accommodate different vehicle profiles and integrate evolving new technologies.

Aquantia partnership - The Molex 10 Gbps Automotive Ethernet Network incorporates an Aquantia chip optimized for Multi-Gig Ethernet to support data transfers between Electronic Control Units (ECU).

“The collaboration with Aquantia supports fast, reliable connectivity to keep data flowing smoothly and securely within a vehicle and beyond to the cloud,” said Bill Fitzer, vice president and general manager, connected mobility solutions, ‎Molex. “Our 10 Gbps Ethernet platform delivers seamless end-to-end V2X connectivity and superior signal integrity in intelligent vehicles and autonomous driving.”

Excelfore partnership - Molex is working with Silicon Valley-based Excelfore, which provides innovative middleware solutions for in-vehicle and vehicle-to-cloud smart mobility networks. A demonstration at CES shows how Excelfore solutions integrated with the Molex 10 Gbps Ethernet Automotive Network enable over-the-air (OTA) diagnostics, firmware and software updates to different automotive devices, from different vendors, running different operating systems, across multiple networks.

AllGo Systems partnership - Molex and AllGo Systems have teamed up to develop advanced infotainment systems for intelligent connected vehicles. AllGo's OTG and Media Solutions support iPhones and Android phones, and distributed media playback to other smart devices within the car. At CES 2018, Molex and AllGo are demonstrating OTG Hubs and Media Modules incorporating AllGo solutions for wired and wireless infotainment in automotive cockpit systems. Demonstrations will include an OTG Hub running Apple CarPlay over USB, and Android Auto 8.0 and QNX on the head unit and digital instrument cluster. An OTG Hub and Adaptor enable the head unit to support CarPlay in either USB Device or Host mode. An AllGo Video Streaming Solution enables seamless media sharing between cluster, head unit and network storage device. High-resolution navigation data is streamed from the head unit running Android to a digital instrument cluster running QNX. Running in parallel, 4K high-resolution content is streamed from a network storage device to the head unit and played back on a secondary display.

Microchip partnership - Molex and Microchip Technology Inc. are collaborating on the development of integrated USB Media Modules and USB Power Delivery Solutions for automotive infotainment systems. The work focuses on the increasing number of USB ports in vehicles, and how USB can deliver more power and bring driver assistance applications to the head unit display.

Blackberry partnerhip - Molex is working to integrate BlackBerry's security solutions with its 10 Gbps Ethernet Automotive Networking platform. The collaboration leverages:

  • BlackBerry QNX Neutrino SDP 7.0 RTOS, which provides high performance and enhanced kernel-level security through an array of features including microkernel architecture, file encryption, adaptive time partitioning, a high-availability framework, anomaly detection, and multi-level policy-based access control. 
  • BlackBerry Certicom's Managed PKI (Public Key Infrastructure) Service, to securely provision, authenticate, and communicate between modules and other vehicle ECUs and peripheral devices connected to the network. In-vehicle connections can be made via Ethernet IP-based devices or LIN, CAN, USB, and other supported legacy communication protocols. As part of the PKI, BlackBerry Certicom is providing an efficient and powerful Elliptic-Curve Cryptography (ECC) solution that can also be extended to communications between the vehicle systems and the cloud.


Thursday, December 14, 2017

Molex launches venture funding initiative

Molex Electronic Technologies has formed a subsidiary dedicated to investing in emerging technologies and companies.

Molex Ventures specializes in investments and collaborations with startup companies that can leverage Molex design and manufacturing capabilities across a range of industry sectors, including Medical and Pharmaceutical sensors, connected health and point of care diagnostics; Automotive connected mobility, electrification and autonomous driving; Industry 4.0 sensors, robotics and data analytics platforms; and Electronics Packaging Technologies.

The Molex Ventures portfolio includes recent investments and collaborations with:

  • NuCurrent – Embedding innovative antenna technologies into mobile device platforms
  • Ossia – Expanding market access to the Cota Real Wireless Power Platform
  • Excelfore – Creating integrated in-vehicle connected platforms

“Fostering the cross-pollination of ideas and capabilities can serve as a catalyst for transformational innovation. As a technology leader, Molex welcomes opportunities to forge strategic relationships with startups at key stages in their development,” said Lily Yeung, vice president, Molex Ventures. “We are proactively seeking collaborations with startups that have developed a successful solution or concept and are ready to take their innovation and commercial growth to the next level.”

Wednesday, October 25, 2017

Molex opens Silicon Valley Technology Center

Molex, a subsidiary of Koch Industries, has opened a technology center in Fremont, California. The facility will be one of the main innovation hubs for Molex Optical Solutions business and home to sales and customer development teams serving all of Molex customers in the region. 

The 108,000-sq. ft. building features over 50 miles of Molex Optical and Copper Cable Assembly Solutions, patch panels, adapter panels, modular office electronics and wire management tools. Advanced building capabilities include an intelligent, low-voltage Molex Transcend Network Connected Lighting System using a Power over Ethernet (PoE) LED lighting network to enable energy savings through sensor feedback.

Wednesday, August 2, 2017

Molex launches zSFP+ for 56 Gbit/s PAM4 channels

Molex announced it has expanded its zSFP+ Interconnect System to support 56 Gbit/s PAM4 channels in a stacked 2 x N port configuration, allowing next-generation Ethernet and Fibre Channel applications to receive improved signal integrity.

Molex claims the product is the first of its kind on the market, enabling OEMs requiring high-density interconnect applications now to utilise channels with individual lane data rates up to 56 Gbit/s PAM4. The updated Molex product also maintains a low insertion loss, crosstalk, thermal and electromagnetic interference (EMI) containment as provided by the previous generation zSFP+ interconnect system.

The updated interconnect system offers multiple features designed to allow greater flexibility and lower costs for users. The 56 Gbit/s PAM4 channel products include EMI ganged cages, available in multiple port configurations from 2 x 1 through 2 x 12, providing flexibility of PCB signal routing of LEDs.

Molex has also developed a next-generation terminal and wafer on the stacked integrated connectors within the zSFP+ interconnect system. The advanced terminal is designed to provide superior signal integrity for 56 Gbit/s PAM4 applications. The system also allows users to merge standard cables and modules with the increased data-rate accepted.

The new zSFP+ interconnect system targets applications in cellular infrastructure, telecom equipment, switches, data networking servers and storage systems.



  • * Recently, the SFP-DD MSA Group, which includes Molex as a founding member, announced plans to develop the specification for a high-speed, double-density small form-factor pluggable (SFP-DD) interface. The MSA plan to develop operating parameters, signal transmission speed goals and protocols for the SFP-DD interface, which expands on the SFP pluggable form factor.

  • The SFP interface's single electrical lane operates at up to 25 Gbit/s NRZ or 56 Gbit/s PAM4, with the new SFP-DD electrical interfaces designed to support 2 lanes operating at up to 25 Gbit/s NRZ or 56 Gbit/s PAM4 per lane to support 50/112 Gbit/s aggregate bandwidth

Tuesday, January 3, 2017

Molex takes 20% Stake in Excelfore for Smart Vehicles

Molex has acquired a 20% equity stake in Excelfore, a start-up based in Silicon Valley developing a cloud platform and connectivity applications for intelligent transportation. Molex’s investment is part of a Series A round of funding in Excelfore, which is geadquartered in Fremont, CA with offices in China, Germany, India, and Japan,

Excelfore specializes in middleware solutions for smart mobility networks that support next-generation smart, autonomous and learning vehicles, fleets and associated infrastructure. Excelfore automotive software products enable communication between automotive components and cloud-based servers, automotive fleet monitoring, and provision of Firmware Over the Air (FOTA) and Software Over the Air (SOTA) updates.

“Smart mobility starts with innovative people and solutions to make intelligent vehicle designs a reality,” according to Bill Fitzer, vice president and general manager of the Molex Connected Mobility Solutions Business Unit. “Together, Molex and Excelfore will provide complete intelligent vehicle systems integrating the hardware, software, and technical services needed to advance adoption of next-generation connected platforms in today’s vehicles.”

http://www.excelfore.com
http://www.molex.com

Thursday, April 7, 2016

Molex Acquires Interconnect Systems

Molex has acquired Interconnect Systems, which specializes in the design and manufacture of high density silicon packaging with advanced interconnect technologies.

Interconnect Systems, which is based in Camarillo, California, delivers advanced packaging and interconnect solutions to top-tier OEMs in a wide range of industries and technology markets, including aerospace & defense, industrial, data storage and networking, telecom, and high performance computing.

Molex said the acquisition enables it to offer a wider range of fully integrated solutions to customers worldwide.

“We are thrilled to join forces with Molex. By combining respective strengths and leveraging their global manufacturing footprint, we can more efficiently and effectively provide customers with advanced technology platforms and top-notch support services, while scaling up to higher volume production,” said Bill Miller, president, ISI.

http://www.molex.com

Tuesday, March 22, 2016

Molex and Cisco Target Double-Density QSFP Interfaces

Molex and Cisco announced their participation in a multi-supplier agreement (MSA) to create high-speed, double-density quad small form factor pluggable (QSFP-DD), a new high-speed interface. Thirteen industry leaders have joined the MSA to collaborate in developing this new high-speed interface.

The new QSFP-DD interface expands on widely adopted QSFP enabling systems to support backwards compatibility to existing 40 GbE and 100 GbE QSFP interfaces as well as a clear path to future 2x100 GbE and 400 GbE interfaces. By maintaining the same port density per rack unit, customers can speed up networks without redesigning the architecture.

“With a clear trend towards hyper-converged fabrics, customers need an aligned switch silicon and optics roadmap,” said Luca Cafiero, senior vice president and general manager at Cisco. “Global IP traffic is expected to reach 1.4 zettabytes next year, reflecting a CAGR from 2012 to 2017 of 23 percent. All players involved in network architecture will have to step up their game to meet this demand, and the MSA for QSFP DD is a big step in that direction. We are confident that, with industry leaders like Molex, we can help to lead the development of high-speed technology that will be broadly used throughout the industry.”

http://www.cisco.com
http://www.molex.com

Wednesday, January 7, 2015

Molex Acquires SDP Telecom for RF Components

Molex has acquired SDP Telecom, a maker of RF/microwave solutions for the wireless communications industry. Financial terms were not disclosed.

SDP, which is based in Montreal, Canada, has manufacturing facilities in China. SDP will be managed by the RF/Microwave Business Unit that is part of Molex’s Global Integrated Products Division.

“Together, Molex and SDP will broaden our RF/Microwave product capabilities and create additional value for our customers in the growing wireless infrastructure market, said Tim Ruff, senior vice president, Molex. “This is a next step towards achieving our vision to offer total integrated solutions to the markets we serve.”

http://www.molex.com/


See also