Showing posts with label MaxLinear. Show all posts
Showing posts with label MaxLinear. Show all posts

Wednesday, January 9, 2019

MaxLinear partners with Intel on 10G DOCSIS 3.1 home gateways

MaxLinear is working with Intel on the home gateway designs supporting 10 Gigabit Full Duplex DOCSIS 3.1 (FDX) cable services.

Specifically, MaxLinear is currently developing a new front-end SoC for these platforms based on its patented Full-Spectrum Capture (FSC) technology that includes diagnostic and spectrum management capabilities. The front-end will include high-speed connectivity to Intel’s next-generation gateway SoC. Intel’s SoC will offer powerful computing and networking performance and is architected for a wide range of WAN, LAN and WLAN use cases to help MSOs achieve optimal performance and improve Quality of Service (QoS).

MaxLinear said its IC, along with Intel’s next-generation gateway SoC, will be highly optimized to provide the greatest level of integration while maintaining system design flexibility to support future evolution of implementations. The modular nature of this solution ensures a simple, non-disruptive, path to potential future DOCSIS standards. Samples of the MaxLinear chips and reference designs are expected in the second half of 2019. Mass production is targeted for 2020.

“10 Gigabit and symmetrical performance are the next wave of services needed in broadband and FDX is a significant step forward for home connectivity,” said Will Torgerson, Vice President & General Manager of the MaxLinear Broadband Group.

“The growing number of devices, large amounts of data and immersive experiences in the home are going to require 10 Gigabit connectivity that deliver faster speeds and more capacity,” said WK Tan, Vice President and General Manager, Intel’s Connected Home Division. “That is why Intel, the cable industry, and companies such as MaxLinear, are working together to deliver cutting-edge 10 Gigabit technologies to power tomorrow’s ultra-connected homes.”

Monday, December 10, 2018

MaxLinear employs Cadence for 400Gbps PAM4 chip using 16FF

MaxLinear used Cadence timing signoff tools to deliver its MxL935xx Telluride device, the first 400Gbps PAM4 system on chip (SoC) using 16FF process technology.

Cadence said its Quantus Extraction Solution and Tempus Timing Signoff Solution were key enablers of the on-time delivery of working silicon for MaxLinear.

MaxLinear's Telluride device can be used by system vendors to develop a 400Gbps optical interconnect module in a compact form factor for intra-datacenter applications with a transmission distance up to 2 kilometers.

“Managing heavily congested and high-speed SoC design throughout the design flow with high-target utilization to reduce costs at 16FF node is a challenging task,” said Dr. Paolo Miliozzi, VP of SoC Technology, MaxLinear. “We are able to deploy the full-flow Cadence digital and signoff tool set including their Quantus, Tempus, and Tempus ECO solutions for successful signoff and on-time tapeout. Using these signoff engines, which are consistent with the Cadence Innovus Implementation System for both extraction and static timing analysis, ensured tight correlation and a reduction in design iterations during signoff for quick design convergence.”

Tuesday, March 28, 2017

MaxLinear partners with ZTE on Ethernet over Coax

MaxLinear, a supplier of RF and mixed-signal integrated circuits for the connected home and wired and wireless infrastructure markets, announced it is partnering with ZTE Cable to develop Ethernet-over-Coax (EoC) equipment for Chinese MSOs and that its customer Guangda has been awarded contracts by multiple cable MSOs in China for broadband CPE.

ZTE Cable

MaxLinear noted that China's MSOs are currently transforming from pay TV providers to MSOs offering data and voice services, and that with over 200 million subscribers the Chinese cable TV market is the largest addressable market for c.LINK and MoCA Access equipment. ZTE Cable is now entering the EoC market utilising MaxLinear-based technology and products.

MaxLinear is an established supplier to MSOs offering broadband data services in China and is currently shipping its third generation EoC technology, c.LINK 1.1+, which can deliver up to 800 Mbit/s of usable MAC throughput to up to 128 subscribers.

Based on the EN3681 network coordinator (NC) chip and EN3690 CPE chip, MaxLinear's c.LINK 1.1+ solution is designed to enable MSOs to cost-effectively overlay support for broadband data service without affecting existing TV services or the need to install new cabling.

MoCA Access is a new MoCA initiative designed to extend the performance and reliability of its home networking products to applications targeting FTTB deployments. As with c.LINK, MoCA Access will use an MDU's existing coax cabling to deliver broadband to each residential unit from an optical terminal. MoCA Access is designed to deliver aggregate MAC throughput of up to 2.5 Gbit/s for up to 128 subscribers.

Guangda MSO contracts

MaxLinear also announced that its customer in China Guangda has won contracts with cable MSOs to supply broadband CPE based on its EN3681 and EN3690 c.LINK 1.1+ EoC access technology.

Already supplying MaxLinear's c.LINK 1.0 and 1.1 EoC systems to MSOs in China, Guangda will now begin deploying the third-generation c.LINK 1.1+ EoC system to MSOs serving Chengdu, Ningxia, ZheJiang Rui’An, YueQing and CangNan to meet growing demand for higher broadband speeds.

MaxLinear noted that a c.LINK 1.1+ based network can support 4 x 50 MHz channels, each controlled by its EN3681 network coordinator (NC) SoC, providing up to 800 Mbit/s of usable throughput to 128 CPE modems. The Ethernet modem comprises a single EN3690 CPE SoC plus Ethernet PHY, or the EN3690 can be embedded into a wireless modem to provide in-home WiFi connectivity.


Tuesday, February 21, 2017

MaxLinear Launches 32 Gbaud Linear Coherent TIA for 200G

MaxLinear, a major supplier of RF and mixed-signal integrated circuits for broadband, the connected home, data centre, metro and long-haul fibre networks and wireless infrastructure, has introduced the
MxL9105 dual-channel linear coherent transimpedance amplifier (TIA) targeting 100/200 Gbit/s DWDM coherent transmission systems.

Delivering characteristics including low input referred noise density, total harmonic distortion (THD), power dissipation and channel crosstalk with high channel bandwidth, the new MxL9105 device is designed to meet the performance requirements of next-generation intradyne coherent receiver (ICR) designs for long-haul and metro network applications.

MaxLinear's MxL9105, which is now sampling, is a dual-channel TIA supporting a per-channel data rate of 32 Gbaud, while programmable channel bandwidth capability allows receiver sensitivity to be optimised with photo detectors (PDs) from a range of manufacturers. In addition, low input referred noise density and low power consumption make the solution suitable for a range of 32 Gbaud ICR module designs, including type 1 and 2 and the latest micro-ICR modules.

The MxL9105 also supports low differential output swings required for next-generation low-power coherent DSPs, while high transimpedance gain makes it suitable for metro network applications where high signal loss may be experienced due to the prevalence of older fibre and multiple interconnects.

The pin-out assignment and functionality provided by the MxL9105 are compatible with legacy 32 Gbaud coherent TIAs to help reduce the need for re-design and re-qualification by customers.

http://www.maxlinear.com

  • In September 2016, MaxLinear announced its MxL9207 quad-channel lithium niobate (LiNbO3) Mach-Zehnder (MZ) modulator driver for next-generation 100 Gbit/s optical DWDM coherent systems. Offering support for DP-QPSK/BPSK coherent designs for ultra-long-haul applications, the device provides a per-channel data rate of 32 Gbaud with low jitter and low power dissipation. 

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