Showing posts with label MEMS. Show all posts
Showing posts with label MEMS. Show all posts

Wednesday, July 24, 2013

CALIENT Raises $27 Million for MEMS-based Optical Switch

CALIENT Technologies announced a $27 million round of venture financing for its optical switching technology, which is based on its patented deep-silicon plasma etch process that is used to make 3D MEMS mirrors.

Calient's 320-port (full duplex) S320 is a MEMS-based optical switch that connects top-of-rack switches in a data center. The OpenFlow API runs on the S320’s MEMS Switching Module (MSM), a high-availability switching and control subsystem with redundant control processors and a Linux-based operating system.

The funding came from a combination of new and existing investors, and will be used to enhance tCALIENT’s portfolio of 3D MEMS Optical Circuit Switching systems, extend its IP portfolio and provide working capital for its rapid production growth driven by new applications in software defined datacenter networking.

The company also named Jag Setlur, a 20-year finance professional, as its Chief Financial Officer (CFO).

"This round of financing will support the exciting opportunities ahead at CALIENT as we work to meet rapidly growing demands for Optical Circuit Switching in software-defined datacenters and metro networks,” said Atiq Raza, CALIENT's CEO."With this funding and our recent growth, I believe now is the time for an experienced CFO like Jag to join the senior management team. I am pleased to have him on board and look forward to leveraging his expertise as we continue to develop and optimize the CALIENT product portfolio and expand our market footprint."

http://www.calient.net/

Sunday, April 7, 2013

STMicroelectronics Builds Next Gen MEMs Pilot Line

STMicroelectronics is working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging. The project was launched by the European Nanoelectronics Initiative Advisory Council (ENIAC) Joint Undertaking (JU), a public-private partnership in nanoelectronics.

ST said this project will also develop advanced packaging technologies and vertical interconnections using flip-chip, through-silicon vias and through-mold vias, enabling 3D-integrated devices for applications such as body area sensors and remote monitoring. A key target is to perfect a PZT deposition process compatible with mass production, and integrate it into complex MEMS processes to enable innovative actuators and sensors on System-On-Chip industrial products.

http://www.st.com