Showing posts with label MACOM. Show all posts
Showing posts with label MACOM. Show all posts

Wednesday, December 29, 2021

MACOM sells its equity in Ampere for $127.7M

MACOM has sold its equity interest in Ampere Computingto Denver Acquisition Corp., an affiliate of one of Ampere’s other limited liability company members, for $127.7 million in cash.

Ampere was established in 2017 when MACOM divested its ARM-based compute processor business of Applied Micro Circuits Corporation. In consideration for the divestiture, MACOM received a minority equity interest in Ampere with limited rights. The purchaser exercised its right to purchase all of MACOM’s equity in Ampere for a value that was determined in 2017 at the time Ampere was established.

MACOM to Acquire AppliedMicro for $770 Million

MACOM Technology Solutions Holdings agreed to acquire Applied Micro Circuits Corporation (AppliedMicro") for approximately $8.36 per share, consisting of $3.25 in cash and 0.1089 MACOM shares per share of AppliedMicro. The deal, which represents a 15.4% premium over AppliedMicro's closing price of $7.25 on November 18th, is valued at approximately $770 million. MACOM plans to divest AppliedMicro's non-strategic Compute business within the first 100 days of closing. The company said it is already talking to interested parties.

MACOM said the deal will accelerate its growth in optical technologies for Cloud Service Providers and Enterprise Network customers.

AppliedMicro, which supplies semiconductors for compute and computing in data centers, has approximately $165 million in TTM revenue (including the Compute business) and $82 million of cash and short-term investments. AppliedMicro's leadership PAM4 solutions based on FinFET technology and custom engagements with top-tier Data Center and service provider customers is expected to strengthen MACOM's competitive position with those customers

MACOM and AppliedMicro's pro forma combined TTM revenue was approximately $709 million including AppliedMicro's Compute business, or approximately $644 million excluding the Compute business
AppliedMicro's Connectivity business is highly complementary to MACOM's product portfolio, through the addition of market-leading OTN framers, MACsec Ethernet networking components and the industry's leading single-lambda PAM4 platform

Commenting on the transaction, John Croteau, President and Chief Executive Officer, stated, "This transaction will accelerate and expand MACOM's breakout opportunity in Enterprise and Cloud Data Centers. MACOM will now be able to provide all the requisite semiconductor content for optical networks - analog, photonic and PHY - from the switch to fiber for long haul, metro, access, backhaul and Data Center. AppliedMicro's 100G to 400G single-lambda PAM4 platform should perfectly complement MACOM's leadership in analog and photonic components for Data Centers.

"Notably, the IEEE recently recommended the adoption of AppliedMicro's single lambda PAM4 solution to be an industry standard for enterprise and Data Center connectivity, positioning this technology as the solution of choice going forward. Additionally, AppliedMicro's Connectivity business aligns well with MACOM's differentiated, high-growth business model, offering non-GAAP gross margins well in excess of MACOM's long term target operating model, long product life cycles, and sticky customer relationships."

"This is an exciting day for AppliedMicro, and we are pleased to be joining forces with MACOM. The transaction affirms the value that our employees have created and provides a strong path forward for our Connectivity business while delivering AppliedMicro stockholders a robust premium," said Paramesh Gopi, President and CEO, AppliedMicro. "This transaction will create an industry powerhouse with the scale, deep customer relationships, innovative technology, and enabling products that will help deliver explosive growth in Enterprise and Cloud Data Centers. In addition, this agreement provides a promising path forward for the Compute business, which is in the process of bringing AppliedMicro's highly-competitive third-generation X-Gene processor to market. X-Gene is well-positioned to address the large opportunity for mainstream server processors with its proven high performance cores, scalable interconnect and high per socket memory capabilities."

http://ir.macom.com/releasedetail.cfm?ReleaseID=1000507

  • M/A-COM Technology Solutions acquired Mindspeed in 2013 for $270 million.
  • M/A-COM acquired Bin Optics in 2014 for $230 million for its Indium Phosphide laser technology.

Thursday, November 4, 2021

MACOM intros Linear Equalizers support 800G

 MACOM Technology Solutions introduced its new high-performance linear equalizer product line for use in Ethernet, InfiniBand and Fibre Channel high speed data internconnect applications. The new product line supports PAM-4 multi-level signal connectivity and builds upon MACOM’s long-standing expertise in equalizers for broadcast video applications. The product line can support 50 Gbps to 800 Gbps data rate applications.

In addition to backplane applications, a linear equalizer can be used by cable manufactures to create an active copper cable to address short distance and high speed connectivity inside the Data Center. Adding linear equalization to a passive copper cable can enable the same copper cable to carry higher data rates for longer distances. MACOM’s new linear equalizer product line can extend a typical copper cable’s performance to 7.5 meters at 56 Gbps and 5 meters at 112 Gbps data rates. Hyperscale cloud and Internet Service Providers may now consider active copper cables as an alternative to passive copper cables or active optical cables.

MACOM’s linear equalizer product line includes:

  • MAEQ-38902 ­- 56 Gbps per lane, 2-channel equalizer
  • MAEQ-38904 - 56 Gbps per lane, 4-channel equalizer
  • MAEQ-39902 - 112 Gbps per lane, 2-channel equalizer
  • MAEQ-39904 - 112 Gbps per lane, 4-channel equalizer

These products support PAM-4 multilevel and NRZ connectivity. Key benefits include low power consumption from a single 3.3V supply, low latency, hardware and microcontroller management modes. The products are suitable for small SFP, QSFP, QSFP-DD and OSFP connector form factors.

https://www.macom.com/about/news-and-events/press-release-archive/row-col1/news--event-archive/macom-introduces-new--linear-equ

MACOM posts revenue of $155M, up 5.4% yoy

MACOM reported Q4 revenue of $155.2 million for its fiscal fourth quarter and fiscal year ended October 1, 2021, an increase of 5.4% compared to $147.2 million in the previous year fiscal fourth quarter and an increase of 1.7% compared to $152.6 million in the prior fiscal quarter. Gross margin was 58.1%, compared to 52.8% in the previous year fiscal fourth quarter and 57.2% in the prior fiscal quarter. Net income was $17.1 million, or $0.24 per diluted share, compared to net income of $17.5 million, or $0.22 per diluted share, in the previous year fiscal fourth quarter.

“We remain focused on growth and profitability as we enter our next fiscal year,” said Stephen G. Daly, President and Chief Executive Officer.

https://ir.macom.com

Sunday, September 19, 2021

MACOM shows 112 Gbps TIA family

At last week's China International Optoelectronic Exposition (CIOE) 2021 in Shenzhen, China, MACOM showcased:

112 Gbps TIA Family for DR and FR Single Mode Applications

MACOM demonstrated a Gold Box evaluation board which includes MACOM’s 4x100 Gbps MATA-03819 transimpedance amplifier (TIA) and MACOM’s BSP56 photodetector (PD). The display will highlight the MATA-03819 TIA’s leading bit-error-performance.

10 Gbps Components for PON Applications


MACOM demonstrated its 10 Gbps passive optical network (PON) component solution for XGPON and XGSPON spanning its portfolio of TIAs, drivers, photodiodes and lasers. Displaying industry-leading performance, MACOM highlight the MALD-02186 multi-PON combo chip (OLT), MALD-02188 XGPON combo chip (OLT), MALD-02183 XGPON combo chip (ONU), MALD-02181 XGSPON combo chip (ONU), MATA-02239 10Gbps BM TIA (OLT), MATA-02240 10 Gbps TIA (ONU), MAOD-127D02IL1T0 – XGPON laser, MAOD-127D10I-LCT0 – XGSPON laser, MARP-FSAPD10A PD (ONU) and MARP-FSAPD10B/ 32445-02 PD (OLT).

200 Gbps and 400 Gbps Chip-Set for SR Multimode Applications

MACOM demonstrated a two-chip analog solution for short reach 200 Gbps QSFP and 400 Gbps OSFP, as well as QSFP-DD modules and AOC data center applications. The first chip is a 4x53 Gbps PAM-4 CDR and TIA, and the second is a 4x53 Gbps PAM-4 CDR and VCSEL driver. The chipset offers IEEE standard-compliant bit error rate (BER) performance and Open Eye MSA transmit eye compliance, while displaying interoperability with an Ethernet switch.

50 Gbps Reference Design for 5G Wireless Mid Haul Applications

MACOM demonstrated its 50 Gbps reference design for 5G wireless mid-haul applications. This demonstration will feature a complete 50 Gbps PAM-4 QSFP28 reference design, using all MACOM components. The demo platform is a 20-kilometer optical link with single-mode fiber using a 1310 nanometer wavelength. The reference design showcases MACOM’s new PRISM-50D DSP with integrated DML driver, a 26 GBaud 1310 I-temp laser, a 26 GBaud PIN photodiode, and a 26 GBaud PAM-4 TIA.

http://www.macom.com

Wednesday, September 15, 2021

MACOM demos TIA interoperability with Broadcom 7nm PAM-4 DSP

 MACOM Technology Solutions has demonstrated interoperability of Broadcom’s PAM-4 DSP and its transimpedance amplifiers (TIAs) for 53 Gbps per lane VCSEL based short reach and 100 Gbps per lane EML based long reach data center applications.

The pairing for single-mode long reach solutions includes Broadcom’s 7nm Centenario DSP (BCM874xx) with MACOM’s four-channel 4x106 Gbps PAM-4 linear transimpedance amplifiers (TIAs) optimized for use in 400G and 800G DR4 and FR4 optical modules. The MATA-03819, MATA-03820 and MATA-03821 are available in flip chip and wire bonding options, respectively, for fast, flexible deployment of QSFP-DD and OSFP optical modules.


The pairing for multi-mode short reach solutions includes Broadcom’s 7nm Estoque DSP (BCM875xx) with MACOM’s two-chip analog solution for 200 Gbps and 400 Gbps short reach SR4 and SR8 modules (QSFP, OSFP, QSFP-DD) and Active Optical Cable (AOC) applications in the data center. 

The MACOM chipset consists of two devices, the MATA-38434 4x53 Gbps PAM-4 TIA and MATA-38435 4x53 Gbps PAM-4 VCSEL driver, that deliver IEEE standard specified performance and are compliant with Open Eye MSA eye mask specifications.

“Our customers require high-performance solutions to enable their data center applications,” said Marek Tlalka, Senior Director, High-Performance Analog, MACOM. “This collaboration offers the industry another proof point towards the interoperability of DSPs to MACOM’s TIA portfolio, and a path to shorter design cycle for 400G and 800G module manufacturers.”

“Broadcom's 7nm DSPs along with MACOM’s TIAs provides industry-leading performance at the lowest power for 200G/400G/800G optical modules,” said Khushrow Machhi, Senior Director of Marketing, Physical Layer Products Division, Broadcom. “Additionally these various modules show the interoperability of Broadcom's DSP with various components needed to develop industry-leading optical modules.”

https://www.macom.com/about/news-and-events/press-release-archive/row-col1/news--event-archive/macom-demonstrates-tia-interoper

Thursday, July 29, 2021

MACOM posts revenue of $153 million, up 11% yoy

MACOM reported revenue of $152.6 million for its third fiscal quarter, an increase of 11.2%, compared to $137.3 million in the previous year fiscal third quarter and an increase of 1.4% compared to $150.6 million in the prior fiscal quarter. Net income was $15.0 million, or $0.21 per diluted share, compared to net loss of $25.0 million, or $0.37 loss per diluted share, in the previous year fiscal third quarter and net income of $14.8 million, or $0.21 per diluted share, in the prior fiscal quarter.


“Our Q3 results demonstrate MACOM’s potential,” said Stephen G. Daly, President and Chief Executive Officer. “We remain focused on engineering excellence and execution.”


Wednesday, June 9, 2021

MACOM and MaxLinear pair PAM4 DSPs and 100G/lane TIAs

MACOM and MaxLinear announced a collaboration to assure interoperability of MaxLinear’s PAM4 DSPs and MACOM’s 100G/lane transimpedance amplifiers (TIAs) for 100G/lambda applications. 

The collaboration includes pairing the MxL93516, MaxLinear’s second-generation 100G Snowmass DSP, with MACOM’s low power MATA-05817 100G TIA to achieve exceptional sensitivity and a low BER floor. This configuration is ideal for 100G-DR1/FR1/LR1 QSFP28 applications for Data Center and front haul applications.

“Our customers are requesting proven high-performance solutions,” said Marek Tlalka, Senior Director, High-Performance Analog, at MACOM. “This collaboration offers the industry a compelling performance proof point and a potential path to shorter design cycle times for 100G, 400G and 800G module manufacturers.”

“The market for 100G/lambda transceivers continues to grow and performance and time to market are critical for our customers,” said Drew Guckenberger, Vice President of MaxLinear’s High-Speed Interconnect Group. “The pairing of our second generation power optimized Snowmass 100G DSP with integrated driver with MACOM’s high-performance TIAs is an ideal solution for customers, providing tight integration, proven high-performance and low-power capabilities.”

The companies plan to continue collaborating on 400Gbps and 800Gbps applications utilizing the recently announced MaxLinear 5nm Keystone DSPs and MACOM’s extensive portfolio of four channel 400Gbps TIAs.

https://www.macom.com/products/product-detail/MATA-05817

Tuesday, June 8, 2021

MACOM intros two-chip analog solution for 200G and 400G

MACOM announced the availability of its two-chip analog solution for 200G and 400G short reach modules (QSFP, OSFP, QSFP-DD) and Active Optical Cable (AOC) applications in the Data Center. The chipset delivers better than IEEE standard specified bit error rate (BER) performance and is compliant with Open Eye MSA eye mask specifications.

The chipset consists of two integrated combo devices:

  • MATA-38044, a 4x56Gbps PAM-4 CDR and TIA
  • MALD-38045, a 4x56Gbps PAM-4 CDR and VCSEL driver

The MATA-38044 is a four channel 28 GBaud linear PAM-4/NRZ TIA with automatic gain control and integrated CDRs. The MALD-38045 is a four channel 28 GBaud PAM-4/NRZ VCSEL driver with an integrated CDR designed to directly modulate VCSELs in the transmit path of optical modules. Each of the four channels can operate independently. Both devices consume industry leading low power and can operate at Ethernet, Fibre Channel and InfiniBand PAM-4 and NRZ data rates up to 56Gbps.


This two-chip analog solution provides an alternative to traditional DSP-based technology. It has lower power consumption, lower latency, lower cost and requires a smaller footprint when compared to a DSP-based solution.

https://www.macom.com/

Monday, June 7, 2021

MACOM ships 25Gbps and 50Gbps distributed feedback (DFB) single ridge lasers


MACOM Technology Solutions announced the production release of its new high speed laser portfolio, after the successful completion of Telcordia GR-468 qualification testing. All products in the portfolio incorporate a new single ridge design for enhanced optical performance and utilize MACOM’s patented Etched Facet Technology (EFT) and wafer-scale Indium Phosphide (InP) manufacturing capabilities which can support high volume applications, including 5G wireless infrastructure and Cloud Data Center.

“We are pleased to achieve this milestone,” said Stephen G. Daly, President and Chief Executive Officer. “Customer feedback on our new 25 and 50 gigabit laser performance has been positive and our focus will now turn to gaining market share.”


MACOM is branding the new 25Gbps and 50Gbps distributed feedback (DFB) single ridge laser portfolio as CLEAR DIAMOND LASERS. The portfolio includes over fifty laser products with wavelengths between 1260nm and 1380nm to support multiple global 5G infrastructure applications, including 1310 BiDi, CWDM6, MWDM12, LWDM12, DWDM16 and 50Gbps PAM4. The portfolio also supports 200G FR4, 100G CWDM4 and LR4 applications for Data Center networks.

https://www.macom.com


Monday, March 22, 2021

MACOM announces proposed offering of $400M of convertible senior notes

MACOM Technology Solutions Holdings intends to offer, subject to market and other conditions, $400 million aggregate principal amount of convertible senior notes due 2026. 

MACOM intends to use the net proceeds for partial repayment of outstanding term loans.


The notes will be senior unsecured obligations of MACOM and will mature on March 15, 2026, unless earlier repurchased, redeemed or converted. 

Separately, MACOM announced that it will be utilizing $100 million of its available cash and cash equivalents and short-term investments to paydown a portion of its outstanding term loans. The term loans are secured and have an original maturity date of May 2024.


Monday, January 25, 2021

MACOM inks GaN-on-SiC pact with U.S. Air Force Research Lab


MACOM signed a Cooperative Research and Development Agreement with the United States Air Force Research Laboratory (“AFRL”) regarding Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) technology. Specifically, AFRL and MACOM will work together to transfer AFRL’s production ready 0.14 micron GaN-on-SiC semiconductor process to MACOM’s Massachusetts-based U.S. Trusted Foundry. Semiconductor experts from both parties will collaborate to support a rapid process transfer to MACOM.

MACOM said the AFRL GaN-on-SiC process is suitable for monolithic microwave integrated circuit (“MMIC”) products and is capable of achieving industry leading frequency and power density performance. Once the process is transferred, MACOM anticipates that it will expand its standard and custom MMIC product offerings.

“This semiconductor process will enable us to enter the microwave and millimeter wave GaN MMIC market with high-performance products,” said Stephen G. Daly, MACOM’s President and Chief Executive Officer. “Our wafer fabrication facility is already well equipped to support GaN, including installed electron beam lithography capability, so we can bring the process online with minimal capital investment. We intend to service a wide range of commercial and U.S. defense opportunities, including satellite communication systems, as well as land-, air- and sea-based radar systems.”

“We look forward to MACOM supporting critical U.S. Air Force and Department of Defense requirements with an industrialized and best in class GaN semiconductor process,” said Dr. Robert Fitch of AFRL Sensors Directorate. “Expanding domestic advanced semiconductor manufacturing is a national priority.”

Tuesday, December 8, 2020

MACOM showcases transimpedance amplifiers for 400ZR, PAM 100G to 800G

At this week's ECOC 2020 Virtual Conference, MACOM is showcasing the following products 


Flip-Chip Quad Channel Driver and Transimpedance Amplifier (TIA) for 400G ZR:  MACOM's linear modulator driver and TIA are high-performance quad-channel flip-chip devices for operation at symbols rates up to 64GBaud. These products offer the low power consumption and the flexibility required to enable next generation 400G ZR modules.

PAM4 100G to 800G Transimpedance Amplifiers: MACOM's portfolio includes a 4x28GBaud TIA and a 1x28GBaud TIA for 53Gbps applications. These products are aimed at high density optical interconnect solutions and are intended for 50G, 100G, 200G, 400G and 800G receivers using multilevel modulation such as PAM4.

https://www.macom.com/




Tuesday, September 8, 2020

MACOM demos optical product set

At this week's China International Optoelectronic Exposition (CIOE) 2020 event in Shenzhen, MACOM is demonstrating its latest optical innovations:

10G Combo Passive Optical Network (PON) OLT Chipset - this demonstration will showcase MACOM’s 10G OLT product performance for XGS-Combo PON OLT applications. Featuring MACOM’s new MALD-02186 Combo Chip, MATA-02239 TIA and APD10B/ES APD, the demonstration will showcase best-in-class burst mode timing and receiver sensitivity.

2km 5G Front Haul Link Demo - this demonstration will showcase MACOM’s new Fabry-Perot (FP) laser along with a MACOM 25 Gbps Multi-Rate Dual CDR with DML laser driver and TIA, for distances up to 2 kilometers. The demonstration highlights the robust performance of the 25Gbps link based on MACOM’s 25G FP laser, laser driver/CDRs and TIA over a wide temperature range.

10km 5G Optical Link Demo -this demonstration showcases MACOM’s new 25G laser technology for 5G front haul and mid haul applications including CWDM6, BiDi, MWDM12 and LWDM12. It includes MACOM’s new 25G laser family with a 25 Gbps Multi-Rate Dual CDR with DML laser driver and TIA.

50G PAM4 5G Mid-Haul Optical Link Demo - this demonstration showcases a 5G wireless mid-haul link over 10 kilometers of fiber with 50Gb/s PAM4 DSP technology, Ethernet security and a DML laser. It features a full suite of MACOM ICs including the PRISM-50 DSP, a high-speed laser, a 56Gbps TIA and a 256Gbps PIN photodetector enabling a complete end-to-end optical link. MACOM’s ES200 MACSec PHY is used to source a 50GE traffic stream, with forward error correction and Ethernet security during the live demonstration.

Datacenter, 200G/400G Analog Chipset Solution - this demonstration highlights MACOM’s high-speed analog ‘4-device chipset’ in end-customer modules that are compliant with the recently released 200/400Gbps Open Eye MSA standards for multimode applications. The chipset will include MACOM’s driver, TIA, and transmit and receive CDRs. It will feature a complete active optical cable solution as well as an evaluation board showcasing performance over 100 meters of multimode fiber.

http://www.macom.com

Thursday, July 30, 2020

MACOM begins 100G PAM4 DSP production

MACOM announced the production release of its low power CMOS DSP-based PAM4 PHYs for next generation optical transceiver modules.

MACOM’s PAM4 PHYs with integrated DSP, forward error correction (FEC) and multiplexing functionality are designed to enable single-wavelength 50 Gbps and 100 Gbps optical transceivers.

The integrated driver is suitable for direct connection to an optical modulator, avoiding the need for a discrete driver, and, thereby, enabling reduced cost and complexity. The on-board management processor simplifies module implementation, while the flexible DSP-based equalizer supports optical links up to and beyond 10 km over single mode fiber. Optional low latency FEC enables IEEE compliant link performance with both legacy and current generation switch silicon. A full suite of test and diagnostic features enable efficient bring up and fast time to market.

https://www.macom.com/ncs

Wednesday, July 29, 2020

MACOM posts revenue of $137 million, up 27% yoy

MACOM reported revenue of $137.3 million, an increase of 26.7% compared to $108.3 million in the previous year fiscal third quarter and an increase of 8.6% compared to $126.4 million in the prior fiscal quarter. Gross margin was 51.6%, compared to 31.2% in the previous year fiscal third quarter and 50.1% in the prior fiscal quarter. Net loss was $25.0 million, or $0.37 loss per diluted share, compared to net loss of $324.7 million, or $4.95 loss per diluted share, in the previous year fiscal third quarter and net loss of $10.2 million, or $0.28 loss per diluted share, in the prior fiscal quarter.

“We remain focused on engineering excellence, financial performance and execution,” said Stephen G. Daly, President and Chief Executive Officer.\

Wednesday, April 29, 2020

MACOM reports sales of $126.4 million, down 1.6% YoY

MACOM Technology Solutions reported sales of  $126.4 million for its fiscal second quarter ended April 3, 2020, a decrease of 1.6% compared to $128.5 million in the previous year fiscal second quarter and an increase of 6.2% compared to $119.1 million in the prior fiscal quarter. Gross margin was 50.1%, compared to 44.6% in the previous year fiscal second quarter and 48.9% in the prior fiscal quarter. Operating loss was $5.3 million, compared to a loss of $30.2 million in the previous year fiscal second quarter and a loss of $10.5 million in the prior fiscal quarter; and net loss was $10.2 million, or $0.28 loss per diluted share.

"We are focused on the health and safety of our employees, while continuing to deliver on customer commitments and accelerating new product introductions,” said Stephen G. Daly, President and Chief Executive Officer. “Our dedicated employees continue to make steady progress on improving our profitability.”

Wednesday, March 11, 2020

MACOM announces 96 GBaud TIA and driver for 600Gbps and 800Gbps

MACOM released a dual channel 96 GBaud transimpedance amplifier (TIA) and quad-channel modulator driver for coherent optical networking applications.

The company said its new dual-channel TIA MATA-009806 and quad-channel driver MAOM-009408 offer customers the high bandwidth, low noise and low power consumption to enable Integrated Coherent Receivers (ICRs), High Bandwidth Coherent Driver Modulators (HB-CDMs) and Integrated Coherent Transmit-Receive Optical Sub-Assemblies (ICTROSAs) operating at up to 800Gbps in Telecom and DCI applications.


  • The MATA-009806 is a dual-channel linear TIA for coherent receivers supporting baud rates up to 96 GBaud and complex modulation formats such as 64QAM. With built-in automatic gain control (AGC) and transimpedance gain of up to 5KΩ, the TIA has 60GHz of bandwidth and ultra-low noise to support applications from long haul to DCI. The device is available to customers in bare die form.
  • The MAOM-009408 is a high-performance quad channel modulator driver also supporting 96 GBaud symbol rates. The part has up to 19 dB of gain with 15 dB of gain range and a maximum output voltage of 3 Vpp differential. The device is designed to be directly DC coupled to an optical modulator for maximum bandwidth, minimum size and minimum power dissipation. The device is available to customers in bare die form.


http://www.macom.com/applications/optical-networking

Tuesday, March 10, 2020

MACOM extends Transimpedance Amplifier line for 100G to 800G

MACOM Technology Solutions released two new transimpedance amplifiers (TIAs) optimized for use in optical networking applications ranging from 100Gbps DR1 to 800Gbps DR8 and FR8.
 The new TIAs are available today in flip chip and wire bonding packaging options for fast, flexible deployment in QSFP, QSFP-DD and OSFP optical modules.

MACOM says the rapid evolution to single lane 100G and multiple lanes 200G, 400G and 800G connectivity is increasing the demand for high-performance, power-efficient optical components needed to maximize bandwidth density in the Cloud Data Center.

  • The MATA-05817 delivers low noise performance less than 2 uA RMS typical and supports bandwidth up to 35 GHz. The TIA supports high throughput optical data links in a very low power profile, optimal for use in high density Optical Data Center interconnects. The device is intended for 50G, 100G, 200G and 400G receivers using multilevel modulation such as PAM4.
  • The MATA-38134 is a quad 26/53 GBaud linear PAM4 TIA with automatic gain and integrated AGC loop. The TIA consumes very low power and is primarily targeted for single-mode fiber applications. The TIA has 500um anode to anode spacing which allows customers to place two devices within the QSFP-DD form factor enabling 800Gbps applications.


Both devices include RSSI for photo-alignment and power monitoring and I2C control of bandwidth, output amplitude, peaking, LOS, gain and other parameters.

http://www.macom.com/applications/optical-networking

Tuesday, January 28, 2020

MACOM posts quarterly revenue of $119 million

MACOM Technology Solutions reported quarterly revenue of $119.1 million, a decrease of 21.0% compared to $150.7 million in the previous year fiscal first quarter and an increase of 6.1% compared to $112.2 million in the prior fiscal quarter. Gross margin was 48.9%, compared to 50.8% in the previous year fiscal first quarter and 47.2% in the prior fiscal quarter. Net loss was $28.4 million, or $0.43 loss per diluted share, compared to net loss of $23.4 million, or $0.44 loss per diluted share, in the previous year fiscal first quarter and net income of $10.5 million, or $0.16 per diluted share, in the prior fiscal quarter.

“Q1 was a solid start to our fiscal year,” said Stephen G. Daly, President and Chief Executive Officer. “Our new organization and engineering leadership is having a positive impact on product development.”

Tuesday, November 12, 2019

MACOM posts sales of $112 million

MACOM reported revenue of $112.2 million for its fiscal fourth quarter ended September 27, 2019, a decrease of 25.8% compared to $151.2 million in the previous year fiscal fourth quarter and an increase of 3.6% compared to $108.3 million in the prior fiscal quarter;

Gross margin was 47.2%, compared to 46.9% in the previous year fiscal fourth quarter and 31.2% in the prior fiscal quarter;

Operating loss was $12.0 million, compared to a loss of $17.5 million in the previous year fiscal fourth quarter and a loss of $323.8 million in the prior fiscal quarter; and net income from continuing operations was $8.1 million, or $0.12 per diluted share.

"We are making progress on all fronts," said Stephen G. Daly, President and Chief Executive Officer. "We are focused on profitability."