Showing posts with label MACOM. Show all posts
Showing posts with label MACOM. Show all posts

Wednesday, June 9, 2021

MACOM and MaxLinear pair PAM4 DSPs and 100G/lane TIAs

MACOM and MaxLinear announced a collaboration to assure interoperability of MaxLinear’s PAM4 DSPs and MACOM’s 100G/lane transimpedance amplifiers (TIAs) for 100G/lambda applications. 

The collaboration includes pairing the MxL93516, MaxLinear’s second-generation 100G Snowmass DSP, with MACOM’s low power MATA-05817 100G TIA to achieve exceptional sensitivity and a low BER floor. This configuration is ideal for 100G-DR1/FR1/LR1 QSFP28 applications for Data Center and front haul applications.

“Our customers are requesting proven high-performance solutions,” said Marek Tlalka, Senior Director, High-Performance Analog, at MACOM. “This collaboration offers the industry a compelling performance proof point and a potential path to shorter design cycle times for 100G, 400G and 800G module manufacturers.”

“The market for 100G/lambda transceivers continues to grow and performance and time to market are critical for our customers,” said Drew Guckenberger, Vice President of MaxLinear’s High-Speed Interconnect Group. “The pairing of our second generation power optimized Snowmass 100G DSP with integrated driver with MACOM’s high-performance TIAs is an ideal solution for customers, providing tight integration, proven high-performance and low-power capabilities.”

The companies plan to continue collaborating on 400Gbps and 800Gbps applications utilizing the recently announced MaxLinear 5nm Keystone DSPs and MACOM’s extensive portfolio of four channel 400Gbps TIAs.

https://www.macom.com/products/product-detail/MATA-05817

Tuesday, June 8, 2021

MACOM intros two-chip analog solution for 200G and 400G

MACOM announced the availability of its two-chip analog solution for 200G and 400G short reach modules (QSFP, OSFP, QSFP-DD) and Active Optical Cable (AOC) applications in the Data Center. The chipset delivers better than IEEE standard specified bit error rate (BER) performance and is compliant with Open Eye MSA eye mask specifications.

The chipset consists of two integrated combo devices:

  • MATA-38044, a 4x56Gbps PAM-4 CDR and TIA
  • MALD-38045, a 4x56Gbps PAM-4 CDR and VCSEL driver

The MATA-38044 is a four channel 28 GBaud linear PAM-4/NRZ TIA with automatic gain control and integrated CDRs. The MALD-38045 is a four channel 28 GBaud PAM-4/NRZ VCSEL driver with an integrated CDR designed to directly modulate VCSELs in the transmit path of optical modules. Each of the four channels can operate independently. Both devices consume industry leading low power and can operate at Ethernet, Fibre Channel and InfiniBand PAM-4 and NRZ data rates up to 56Gbps.


This two-chip analog solution provides an alternative to traditional DSP-based technology. It has lower power consumption, lower latency, lower cost and requires a smaller footprint when compared to a DSP-based solution.

https://www.macom.com/

Monday, June 7, 2021

MACOM ships 25Gbps and 50Gbps distributed feedback (DFB) single ridge lasers


MACOM Technology Solutions announced the production release of its new high speed laser portfolio, after the successful completion of Telcordia GR-468 qualification testing. All products in the portfolio incorporate a new single ridge design for enhanced optical performance and utilize MACOM’s patented Etched Facet Technology (EFT) and wafer-scale Indium Phosphide (InP) manufacturing capabilities which can support high volume applications, including 5G wireless infrastructure and Cloud Data Center.

“We are pleased to achieve this milestone,” said Stephen G. Daly, President and Chief Executive Officer. “Customer feedback on our new 25 and 50 gigabit laser performance has been positive and our focus will now turn to gaining market share.”


MACOM is branding the new 25Gbps and 50Gbps distributed feedback (DFB) single ridge laser portfolio as CLEAR DIAMOND LASERS. The portfolio includes over fifty laser products with wavelengths between 1260nm and 1380nm to support multiple global 5G infrastructure applications, including 1310 BiDi, CWDM6, MWDM12, LWDM12, DWDM16 and 50Gbps PAM4. The portfolio also supports 200G FR4, 100G CWDM4 and LR4 applications for Data Center networks.

https://www.macom.com


Monday, March 22, 2021

MACOM announces proposed offering of $400M of convertible senior notes

MACOM Technology Solutions Holdings intends to offer, subject to market and other conditions, $400 million aggregate principal amount of convertible senior notes due 2026. 

MACOM intends to use the net proceeds for partial repayment of outstanding term loans.


The notes will be senior unsecured obligations of MACOM and will mature on March 15, 2026, unless earlier repurchased, redeemed or converted. 

Separately, MACOM announced that it will be utilizing $100 million of its available cash and cash equivalents and short-term investments to paydown a portion of its outstanding term loans. The term loans are secured and have an original maturity date of May 2024.


Monday, January 25, 2021

MACOM inks GaN-on-SiC pact with U.S. Air Force Research Lab


MACOM signed a Cooperative Research and Development Agreement with the United States Air Force Research Laboratory (“AFRL”) regarding Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) technology. Specifically, AFRL and MACOM will work together to transfer AFRL’s production ready 0.14 micron GaN-on-SiC semiconductor process to MACOM’s Massachusetts-based U.S. Trusted Foundry. Semiconductor experts from both parties will collaborate to support a rapid process transfer to MACOM.

MACOM said the AFRL GaN-on-SiC process is suitable for monolithic microwave integrated circuit (“MMIC”) products and is capable of achieving industry leading frequency and power density performance. Once the process is transferred, MACOM anticipates that it will expand its standard and custom MMIC product offerings.

“This semiconductor process will enable us to enter the microwave and millimeter wave GaN MMIC market with high-performance products,” said Stephen G. Daly, MACOM’s President and Chief Executive Officer. “Our wafer fabrication facility is already well equipped to support GaN, including installed electron beam lithography capability, so we can bring the process online with minimal capital investment. We intend to service a wide range of commercial and U.S. defense opportunities, including satellite communication systems, as well as land-, air- and sea-based radar systems.”

“We look forward to MACOM supporting critical U.S. Air Force and Department of Defense requirements with an industrialized and best in class GaN semiconductor process,” said Dr. Robert Fitch of AFRL Sensors Directorate. “Expanding domestic advanced semiconductor manufacturing is a national priority.”

Tuesday, December 8, 2020

MACOM showcases transimpedance amplifiers for 400ZR, PAM 100G to 800G

At this week's ECOC 2020 Virtual Conference, MACOM is showcasing the following products 


Flip-Chip Quad Channel Driver and Transimpedance Amplifier (TIA) for 400G ZR:  MACOM's linear modulator driver and TIA are high-performance quad-channel flip-chip devices for operation at symbols rates up to 64GBaud. These products offer the low power consumption and the flexibility required to enable next generation 400G ZR modules.

PAM4 100G to 800G Transimpedance Amplifiers: MACOM's portfolio includes a 4x28GBaud TIA and a 1x28GBaud TIA for 53Gbps applications. These products are aimed at high density optical interconnect solutions and are intended for 50G, 100G, 200G, 400G and 800G receivers using multilevel modulation such as PAM4.

https://www.macom.com/




Tuesday, September 8, 2020

MACOM demos optical product set

At this week's China International Optoelectronic Exposition (CIOE) 2020 event in Shenzhen, MACOM is demonstrating its latest optical innovations:

10G Combo Passive Optical Network (PON) OLT Chipset - this demonstration will showcase MACOM’s 10G OLT product performance for XGS-Combo PON OLT applications. Featuring MACOM’s new MALD-02186 Combo Chip, MATA-02239 TIA and APD10B/ES APD, the demonstration will showcase best-in-class burst mode timing and receiver sensitivity.

2km 5G Front Haul Link Demo - this demonstration will showcase MACOM’s new Fabry-Perot (FP) laser along with a MACOM 25 Gbps Multi-Rate Dual CDR with DML laser driver and TIA, for distances up to 2 kilometers. The demonstration highlights the robust performance of the 25Gbps link based on MACOM’s 25G FP laser, laser driver/CDRs and TIA over a wide temperature range.

10km 5G Optical Link Demo -this demonstration showcases MACOM’s new 25G laser technology for 5G front haul and mid haul applications including CWDM6, BiDi, MWDM12 and LWDM12. It includes MACOM’s new 25G laser family with a 25 Gbps Multi-Rate Dual CDR with DML laser driver and TIA.

50G PAM4 5G Mid-Haul Optical Link Demo - this demonstration showcases a 5G wireless mid-haul link over 10 kilometers of fiber with 50Gb/s PAM4 DSP technology, Ethernet security and a DML laser. It features a full suite of MACOM ICs including the PRISM-50 DSP, a high-speed laser, a 56Gbps TIA and a 256Gbps PIN photodetector enabling a complete end-to-end optical link. MACOM’s ES200 MACSec PHY is used to source a 50GE traffic stream, with forward error correction and Ethernet security during the live demonstration.

Datacenter, 200G/400G Analog Chipset Solution - this demonstration highlights MACOM’s high-speed analog ‘4-device chipset’ in end-customer modules that are compliant with the recently released 200/400Gbps Open Eye MSA standards for multimode applications. The chipset will include MACOM’s driver, TIA, and transmit and receive CDRs. It will feature a complete active optical cable solution as well as an evaluation board showcasing performance over 100 meters of multimode fiber.

http://www.macom.com

Thursday, July 30, 2020

MACOM begins 100G PAM4 DSP production

MACOM announced the production release of its low power CMOS DSP-based PAM4 PHYs for next generation optical transceiver modules.

MACOM’s PAM4 PHYs with integrated DSP, forward error correction (FEC) and multiplexing functionality are designed to enable single-wavelength 50 Gbps and 100 Gbps optical transceivers.

The integrated driver is suitable for direct connection to an optical modulator, avoiding the need for a discrete driver, and, thereby, enabling reduced cost and complexity. The on-board management processor simplifies module implementation, while the flexible DSP-based equalizer supports optical links up to and beyond 10 km over single mode fiber. Optional low latency FEC enables IEEE compliant link performance with both legacy and current generation switch silicon. A full suite of test and diagnostic features enable efficient bring up and fast time to market.

https://www.macom.com/ncs

Wednesday, July 29, 2020

MACOM posts revenue of $137 million, up 27% yoy

MACOM reported revenue of $137.3 million, an increase of 26.7% compared to $108.3 million in the previous year fiscal third quarter and an increase of 8.6% compared to $126.4 million in the prior fiscal quarter. Gross margin was 51.6%, compared to 31.2% in the previous year fiscal third quarter and 50.1% in the prior fiscal quarter. Net loss was $25.0 million, or $0.37 loss per diluted share, compared to net loss of $324.7 million, or $4.95 loss per diluted share, in the previous year fiscal third quarter and net loss of $10.2 million, or $0.28 loss per diluted share, in the prior fiscal quarter.

“We remain focused on engineering excellence, financial performance and execution,” said Stephen G. Daly, President and Chief Executive Officer.\

Wednesday, April 29, 2020

MACOM reports sales of $126.4 million, down 1.6% YoY

MACOM Technology Solutions reported sales of  $126.4 million for its fiscal second quarter ended April 3, 2020, a decrease of 1.6% compared to $128.5 million in the previous year fiscal second quarter and an increase of 6.2% compared to $119.1 million in the prior fiscal quarter. Gross margin was 50.1%, compared to 44.6% in the previous year fiscal second quarter and 48.9% in the prior fiscal quarter. Operating loss was $5.3 million, compared to a loss of $30.2 million in the previous year fiscal second quarter and a loss of $10.5 million in the prior fiscal quarter; and net loss was $10.2 million, or $0.28 loss per diluted share.

"We are focused on the health and safety of our employees, while continuing to deliver on customer commitments and accelerating new product introductions,” said Stephen G. Daly, President and Chief Executive Officer. “Our dedicated employees continue to make steady progress on improving our profitability.”

Wednesday, March 11, 2020

MACOM announces 96 GBaud TIA and driver for 600Gbps and 800Gbps

MACOM released a dual channel 96 GBaud transimpedance amplifier (TIA) and quad-channel modulator driver for coherent optical networking applications.

The company said its new dual-channel TIA MATA-009806 and quad-channel driver MAOM-009408 offer customers the high bandwidth, low noise and low power consumption to enable Integrated Coherent Receivers (ICRs), High Bandwidth Coherent Driver Modulators (HB-CDMs) and Integrated Coherent Transmit-Receive Optical Sub-Assemblies (ICTROSAs) operating at up to 800Gbps in Telecom and DCI applications.


  • The MATA-009806 is a dual-channel linear TIA for coherent receivers supporting baud rates up to 96 GBaud and complex modulation formats such as 64QAM. With built-in automatic gain control (AGC) and transimpedance gain of up to 5KΩ, the TIA has 60GHz of bandwidth and ultra-low noise to support applications from long haul to DCI. The device is available to customers in bare die form.
  • The MAOM-009408 is a high-performance quad channel modulator driver also supporting 96 GBaud symbol rates. The part has up to 19 dB of gain with 15 dB of gain range and a maximum output voltage of 3 Vpp differential. The device is designed to be directly DC coupled to an optical modulator for maximum bandwidth, minimum size and minimum power dissipation. The device is available to customers in bare die form.


http://www.macom.com/applications/optical-networking

Tuesday, March 10, 2020

MACOM extends Transimpedance Amplifier line for 100G to 800G

MACOM Technology Solutions released two new transimpedance amplifiers (TIAs) optimized for use in optical networking applications ranging from 100Gbps DR1 to 800Gbps DR8 and FR8.
 The new TIAs are available today in flip chip and wire bonding packaging options for fast, flexible deployment in QSFP, QSFP-DD and OSFP optical modules.

MACOM says the rapid evolution to single lane 100G and multiple lanes 200G, 400G and 800G connectivity is increasing the demand for high-performance, power-efficient optical components needed to maximize bandwidth density in the Cloud Data Center.

  • The MATA-05817 delivers low noise performance less than 2 uA RMS typical and supports bandwidth up to 35 GHz. The TIA supports high throughput optical data links in a very low power profile, optimal for use in high density Optical Data Center interconnects. The device is intended for 50G, 100G, 200G and 400G receivers using multilevel modulation such as PAM4.
  • The MATA-38134 is a quad 26/53 GBaud linear PAM4 TIA with automatic gain and integrated AGC loop. The TIA consumes very low power and is primarily targeted for single-mode fiber applications. The TIA has 500um anode to anode spacing which allows customers to place two devices within the QSFP-DD form factor enabling 800Gbps applications.


Both devices include RSSI for photo-alignment and power monitoring and I2C control of bandwidth, output amplitude, peaking, LOS, gain and other parameters.

http://www.macom.com/applications/optical-networking

Tuesday, January 28, 2020

MACOM posts quarterly revenue of $119 million

MACOM Technology Solutions reported quarterly revenue of $119.1 million, a decrease of 21.0% compared to $150.7 million in the previous year fiscal first quarter and an increase of 6.1% compared to $112.2 million in the prior fiscal quarter. Gross margin was 48.9%, compared to 50.8% in the previous year fiscal first quarter and 47.2% in the prior fiscal quarter. Net loss was $28.4 million, or $0.43 loss per diluted share, compared to net loss of $23.4 million, or $0.44 loss per diluted share, in the previous year fiscal first quarter and net income of $10.5 million, or $0.16 per diluted share, in the prior fiscal quarter.

“Q1 was a solid start to our fiscal year,” said Stephen G. Daly, President and Chief Executive Officer. “Our new organization and engineering leadership is having a positive impact on product development.”

Tuesday, November 12, 2019

MACOM posts sales of $112 million

MACOM reported revenue of $112.2 million for its fiscal fourth quarter ended September 27, 2019, a decrease of 25.8% compared to $151.2 million in the previous year fiscal fourth quarter and an increase of 3.6% compared to $108.3 million in the prior fiscal quarter;

Gross margin was 47.2%, compared to 46.9% in the previous year fiscal fourth quarter and 31.2% in the prior fiscal quarter;

Operating loss was $12.0 million, compared to a loss of $17.5 million in the previous year fiscal fourth quarter and a loss of $323.8 million in the prior fiscal quarter; and net income from continuing operations was $8.1 million, or $0.12 per diluted share.

"We are making progress on all fronts," said Stephen G. Daly, President and Chief Executive Officer. "We are focused on profitability."

Thursday, September 5, 2019

MACOM shows Open Eye MSA compliant analog chipset

MACOM Technology Solutions demonstrated a 200G optical module designed in collaboration with an industry leading optical manufacturer, leveraging MACOM’s Open Eye MSA compliant analog chipset. The chipset is optimized for volume-scale deployment in high-density Cloud Data Center links.

MACOM said its chipset will provide a clear pathway to 200G throughput speeds utilizing industry-leading analog components. MACOM’s fully analog transmit and receive chipset is comprised of the MAOM-38053 four-channel transmit CDR with integrated laser driver and, on the receive side, features MACOM BSP56B photodetectors, a MATA-03819 quad TIA and the MASC-38040 four-channel receive CDR.

MACOM is applying its expertise and market leadership in 25Gbps and 100Gbps solutions to 50Gbps PAM-4 applications and specifically to 200G QSFP and 2 x 200G OSFP/QSFP-DD modules to bring the benefits of low power and low latency solutions in addition to existing digital signal processing (DSP) architectures, to Cloud Data Centers.

MACOM’s chipset is sampling for both single mode and multimode fiber applications.

Thursday, August 1, 2019

MACOM posts sales of $108.3m,

MACOM Technology Solutions reported quarterly revenue of $108.3 million for its fiscal third quarter ended June 28, 2019, a decrease of 21.4% compared to $137.9 million in the previous year fiscal third quarter and a decrease of 15.7% compared to $128.5 million in the prior fiscal quarter;
Gross profit was $33.8 million, a decrease of 29.8% compared to $48.2 million in the previous year fiscal third quarter and a decrease of 41.0% compared to $57.3 million in the prior fiscal quarter.

"This was a pivotal quarter for MACOM," said Stephen G. Daly, President and Chief Executive Officer. "Our priority is to return the Company to profitability and to improve performance on key development projects so that we can achieve our growth objectives."

On a conference call, MACOM execs confirmed that shipments to Huawei were suspended after Huawei was added to the Entity list. After carefully reviewing the export regulations, MACOM determined that it could resume the shipment of certain products not covered by the restrictions. Other products, however, are not being shipped to Huawei.

https://www.macom.com

MACOM restructures citing Huawei-effect and exits optical module business for data centers

MACOM announced a significant corporate restructuring that includes the closure of seven product development facilities, including locations in France, Japan, the Netherlands, Florida, Massachusetts, New Jersey and Rhode Island. This incurs a workforce of approximately 250 employees, or 20% of the total workforce. These changes will result in approximately $14 million in restructuring charges including $7 million for employee severance obligations, a majority of which are expected to be incurred during the third fiscal quarter of 2019.

MACOM also announced that it will no longer invest in the design and development of optical modules and subsystems for data center applications. Going forward, MACOM will be a merchant supplier of semiconductor integrated circuits (ICs) and photonic devices and will support optical module manufacturers at the semiconductor component level.

MACOM cut its financial outlook citing the discontinuation of shipments to Huawei Technologies and certain of its subsidiaries and affiliates as a result of the U.S. Department of Commerce action of adding Huawei to its “Entity List.” In addition, the updated guidance also reflects reduced shipments to certain of MACOM’s distribution channel partners.

MACOM now expects revenue in the quarter to be between $107 million and $109 million, compared to prior guidance of $120 million to $124 million.  Non-GAAP gross margin is now expected to be between 39% and 41%, which includes approximately $14 million in inventory reserves, or 1,300 basis points of gross margin impact. These inventory reserves are primarily associated with certain Data Center products and products that would otherwise be shipped to Huawei. This compares to prior non-GAAP gross margin guidance of 53% to 55%.

“We do not make these decisions lightly, however, these actions are necessary in order to strengthen our strategic plan,” said Stephen Daly, President and Chief Executive Officer.

Wednesday, June 19, 2019

MACOM restructures citing Huawei-effect and exits optical module business for data centers

MACOM announced a significant corporate restructuring that includes the closure of seven product development facilities, including locations in France, Japan, the Netherlands, Florida, Massachusetts, New Jersey and Rhode Island. This incurs a workforce of approximately 250 employees, or 20% of the total workforce. These changes will result in approximately $14 million in restructuring charges including $7 million for employee severance obligations, a majority of which are expected to be incurred during the third fiscal quarter of 2019.

MACOM also announced that it will no longer invest in the design and development of optical modules and subsystems for data center applications. Going forward, MACOM will be a merchant supplier of semiconductor integrated circuits (ICs) and photonic devices and will support optical module manufacturers at the semiconductor component level.

MACOM cut its financial outlook citing the discontinuation of shipments to Huawei Technologies and certain of its subsidiaries and affiliates as a result of the U.S. Department of Commerce action of adding Huawei to its “Entity List.” In addition, the updated guidance also reflects reduced shipments to certain of MACOM’s distribution channel partners.

MACOM now expects revenue in the quarter to be between $107 million and $109 million, compared to prior guidance of $120 million to $124 million.  Non-GAAP gross margin is now expected to be between 39% and 41%, which includes approximately $14 million in inventory reserves, or 1,300 basis points of gross margin impact. These inventory reserves are primarily associated with certain Data Center products and products that would otherwise be shipped to Huawei. This compares to prior non-GAAP gross margin guidance of 53% to 55%.

“We do not make these decisions lightly, however, these actions are necessary in order to strengthen our strategic plan,” said Stephen Daly, President and Chief Executive Officer.


MACOM appoints Stephen G. Daly as CEO

MACOM Technology Solutions Holdings appointed Stephen G. Daly as its new President and CEO, effective immediately, following the resignation of John Croteau.

Croteau had served as President and Chief Executive Officer since December 2012. Mr. Croteau will be available to MACOM in an advisory capacity for the next two months to ensure a smooth transition.

Daly has served on MACOM’s Board of Directors since March 2015 and has over 25 years of experience in the semiconductor industry. Prior to joining MACOM’s Board of Directors, Mr. Daly had served for almost ten years as Chairman, President and Chief Executive Officer of Hittite Microwave, a provider of analog and mixed signal integrated circuits, modules and subsystems for commercial and military radio frequency, microwave and millimeterwave applications.

Monday, June 3, 2019

MACOM introduces wideband amplifier for 5G testing

MACOM introduced a new wideband distributed amplifier suited for use in 5G test and measurement (T&M) equipment spanning sub-6 GHz to mmW frequencies.

The new MAAM-011238 amplifier supports wideband operation from 100 kHz up to 50 GHz (67.5 GHz for the Bare-DIE version) with typical gain of 14 dB at 30 GHz.

The amplifier is offered in both bare-DIE and Surface Mount packaged formats.

https://www.macom.com/about/news-and-events/press-release-archive/row-col1/news--event-archive/macom-announces-new-wideband-amp

Thursday, May 16, 2019

MACOM appoints Stephen G. Daly as CEO

MACOM Technology Solutions Holdings appointed Stephen G. Daly as its new President and CEO, effective immediately, following the resignation of John Croteau.

Croteau had served as President and Chief Executive Officer since December 2012. Mr. Croteau will be available to MACOM in an advisory capacity for the next two months to ensure a smooth transition.

Daly has served on MACOM’s Board of Directors since March 2015 and has over 25 years of experience in the semiconductor industry. Prior to joining MACOM’s Board of Directors, Mr. Daly had served for almost ten years as Chairman, President and Chief Executive Officer of Hittite Microwave, a provider of analog and mixed signal integrated circuits, modules and subsystems for commercial and military radio frequency, microwave and millimeterwave applications.

Tuesday, May 7, 2019

MACOM announces analog CDR-Based PAM-4 portfolio

MACOM announced an analog and silicon photonics portfolio for seamless integration in 50Gbps, 100Gbps, 200Gbps and 400Gbps optical modules targeted for compliance with the newly formed Open Eye Multi-Source Agreement (MSA).

MACOM’s end-to-end transmit and receive portfolio features low-cost, low-power extensions to its existing lineup of Clock and Data Recovery (CDRs), drivers and (Transimpedance Amplifiers (TIAs), adding a companion integrated 200G FR4 L-PIC optimized to reduce customers’ module costs through dramatically improved ease of assembly, calibration and test. These components are designed to eliminate the need for expensive, power-hungry signal processing and 53Gbps EMLs, enabling streamlined optical module architectures targeted for 200G and 400G connectivity.

MACOM’s full CDR-based and L-PIC-based portfolio comprises the MAOM-38053 four-channel transmit PAM-4 CDR with an integrated driver, and an L-PIC transmitter and on the receive side, features a MATA-03819 quad TIA, MACOM BSP56B photodetectors and the MASC-38040 four-channel receive PAM-4 CDR. This approach is anticipated to deliver over 25% reduction in power consumption while simultaneously driving the cost per gigabit down as compared to today’s CWDM4 and digital signal processing (DSP)-based PAM-4 solutions. Cloud customers can now double their link rate with only minor, incremental power and cost.

“MACOM is proud to be part of an ecosystem that enables seamless component interoperability among a broad group of industry-leading technology providers, including providers of electronics, lasers and optical components,” said Preet Virk, Senior Vice President and General Manager, Networks, MACOM. “MACOM is committed to enabling the Open Eye MSA’s charter, in part by leveraging our comprehensive portfolio of high-performance analog components and L-PICs to help customers achieve optimal performance, power efficiency and cost structures. We believe that our extensive application expertise and industry leadership in PAM-4 enabling technologies will help to ensure a seamless migration from 100G CWDM4 to industry-standard 200G and 400G PAM-4 module architectures.”

https://www.macom.com/data-center