Showing posts with label Intel. Show all posts
Showing posts with label Intel. Show all posts

Wednesday, January 9, 2019

MaxLinear partners with Intel on 10G DOCSIS 3.1 home gateways

MaxLinear is working with Intel on the home gateway designs supporting 10 Gigabit Full Duplex DOCSIS 3.1 (FDX) cable services.

Specifically, MaxLinear is currently developing a new front-end SoC for these platforms based on its patented Full-Spectrum Capture (FSC) technology that includes diagnostic and spectrum management capabilities. The front-end will include high-speed connectivity to Intel’s next-generation gateway SoC. Intel’s SoC will offer powerful computing and networking performance and is architected for a wide range of WAN, LAN and WLAN use cases to help MSOs achieve optimal performance and improve Quality of Service (QoS).

MaxLinear said its IC, along with Intel’s next-generation gateway SoC, will be highly optimized to provide the greatest level of integration while maintaining system design flexibility to support future evolution of implementations. The modular nature of this solution ensures a simple, non-disruptive, path to potential future DOCSIS standards. Samples of the MaxLinear chips and reference designs are expected in the second half of 2019. Mass production is targeted for 2020.

“10 Gigabit and symmetrical performance are the next wave of services needed in broadband and FDX is a significant step forward for home connectivity,” said Will Torgerson, Vice President & General Manager of the MaxLinear Broadband Group.

“The growing number of devices, large amounts of data and immersive experiences in the home are going to require 10 Gigabit connectivity that deliver faster speeds and more capacity,” said WK Tan, Vice President and General Manager, Intel’s Connected Home Division. “That is why Intel, the cable industry, and companies such as MaxLinear, are working together to deliver cutting-edge 10 Gigabit technologies to power tomorrow’s ultra-connected homes.”

Tuesday, December 18, 2018

Dr. Richard Uhlig to serve as Managing Director of Intel Labs

Dr. Richard Uhlig has been named as the new managing director of Intel Labs. Prior to this role, Rich was the director of Systems and Software Research in Intel Labs, where he led research efforts in virtualization, cloud-computing systems, software-defined networking, big-data analytics, machine learning and artificial intelligence. He joined Intel in 1996 and led the definition of multiple generations of virtualization architecture for Intel processors and platforms, known collectively as Intel Virtualization Technology (Intel® VT). Rich earned his Ph.D. in computer science and engineering from the University of Michigan.

“The work we are doing at Intel Labs is pushing the boundaries of technology every day whether that’s our research in quantum and neuromorphic computing or how we’re extending and evolving Moore’s Law. We have some of the brightest minds working together across industry and academia to solve some of the biggest challenges in technology. I am very excited to lead Intel Labs in this data-centric era,” stated Uhlig.

Wednesday, December 12, 2018

Intel Architecture Day highlights - Foveros and Sunny Cove

At Intel “Architecture Day" this week in Santa Clara, California, Intel executives outlined a broad strategy to address "an expanding universe of data-intensive workloads for PCs and other smart consumer devices, high-speed networks, ubiquitous artificial intelligence (AI), specialized cloud data centers and autonomous vehicles."

Intel's overall strategy is anchored on six pillars:

Process: Intel expects advanced packaging solutions to enable continued exponential scaling in computing density by extending transistor density to the third dimension.
Architecture: Intel sees a future with a diverse mix of scalar, vector, matrix and spatial architectures deployed in CPU, GPU, accelerator and FPGA sockets, enabled by a scalable software stack, integrated into systems by advanced packaging technology.
Memory: the company believes its is uniquely positioned to combine in-package memory and Intel Optane technology to fill gaps in the memory hierarchy to provide bandwidth closer to the silicon die.
Interconnect: Intel will offer a complete range of leading interconnect products enables the heterogeneous computing landscape at scale. This includes wireless connections for 5G infrastructure as well as silicon-level package and die interconnects.
Security: the company believes it is uniquely positioned to deliver security technologies that help improve the end-to-end and to make security advancements a key differentiator.
Software: Intel will offer a common set of tools that can address Intel silicon for developers. The company says that for every order of magnitude performance potential of a new hardware architecture there are two orders of magnitude performance enabled by software.



Some highlights of Intel Architecture Day:

  • Intel demonstrated a range of 10nm-based systems in development for PCs, data centers and networking.
  • Foveros: Intel demonstrated a new 3D packaging technology, called "Foveros," which for the first time brings 3D stacking to logic-on-logic integration.
  • Foveros will will allow products to be broken up into smaller “chiplets,” where I/O, SRAM and power delivery circuits can be fabricated in a base die and high-performance logic chiplets are stacked on top.
  • Intel expects to launch a range of products using Foveros beginning in the second half of 2019. 
  • The first Foveros product will combine a high-performance 10nm compute-stacked chiplet with a low-power 22FFL base die. 
  • Sunny Cove -- Intel’s next-generation CPU microarchitecture, increases performance per clock and power efficiency for general purpose computing tasks, and includes new features to accelerate special purpose computing tasks like AI and cryptography. 
  • Sunny Cove will be the basis for Intel’s next-generation server (Intel Xeon) and client (Intel Core™) processors later next year. 
  • Next-Generation Graphics: Intel's Gen11 integrated graphics will offer 64 enhanced execution units, more than double previous Intel Gen9 graphics (24 EUs), breaking the 1 TFLOPS barrier. 
  • Intel reaffirmed its plan to introduce a discrete graphics processor by 2020.
  • "One API” Software: a new 0“One API” project aimes to simplify the programming of diverse computing engines across CPU, GPU, FPGA, AI and other accelerators. The project includes a comprehensive and unified portfolio of developer tools for mapping software to the hardware that can best accelerate the code. A public project release is expected to be available in 2019.
  • Memory and Storage: Intel showed how SSDs based on its 1 Terabit QLC NAND die move more bulk data from HDDs to SSDs, allowing faster access to that data.
  • Deep Learning Reference Stack: Intel is releasing the Deep Learning Reference Stack, an integrated, highly-performant open source stack optimized for Intel Xeon® Scalable platforms.

Wednesday, December 5, 2018

Intel and Huawei complete 2.6GHz 5G SA Interoperability Testing

Intel and Huawei 2.6GHz 5G NR Interoperability and Development Testing (IoDT) based on the 3GPP Release 15 global standard September version.

The IoDT test is the world's first 2.6GHz 5G interoperability test under SA network and is a key milestone towards accelerating the maturity of the 2.6GHz 5G NR ecosystem

The testing involved Intel’s 5G Mobile Trial Platform (MTP) and Huawei's latest 5G NR (New Radio) base station supporting 2.6GHz with 160MHz bandwidth.

Thursday, November 15, 2018

Intel adds $15 billion to stock repurchase authorization

Intel's board of directors approved a $15.0 billion increase in its authorized stock repurchase program. The company had $4.7 billion remaining under its existing repurchase authorization as of Sept. 29, 2018.

The company notes that it has returned approximately $177 billion to stockholders through dividends and stock repurchases from 1990 through the third-quarter of 2018.

Monday, November 12, 2018

Intel confirms 5G modem for second half of 2019

Intel confirmed that its upcoming 5G modem chip will ship in the second half of 2019, meaning that 5G phones, PCs and broadband access gateways incorporating the device should hit the market in the first half of 2020. The updated timeline is more than a half-year earlier than previous guidance.

The Intel XMM 8160 5G modem will support the new 5G New Radio (NR) standalone (SA) and non-standalone (NSA) modes as well as 4G, 3G and 2G legacy radios in a single chipset. It will support peak speeds up to 6 Gbps, making it three to six times faster than the latest LTE modems available today.

Intel said its 5G modem is designed for worldwide carrier support.It will support new millimeter wave (mmWave) spectrum as well as sub 6 GHz 5G NR support (including FDD and TDD bands from 600 MHz to 6 GHz).

“Intel’s new XMM 8160 5G modem provides the ideal solution to support large volumes for scaling across multiple device categories to coincide with broad 5G deployments. We are seeing great demand for the advanced feature set of the XMM 8160, such that we made a strategic decision to pull in the launch of this modem by half a year to deliver a leading 5G solution,” stated Dr. Cormac Conroy, Intel corporate vice president and general manager of the Communication and Devices Group.



Monday, November 5, 2018

Intel previews Cascade Lake CPUs and Optane DC persistent memory

Intel previewed two new Xeon processors:

  • Cascade Lake advanced performance, which is expected to be released the first half of 2019,  will focus on offering workload-optimized performance leadership by delivering both core CPU performance gains1 and leadership in memory bandwidth constrained workloads. Cascade Lake will offer up to 48 cores per CPU and 12 DDR4 memory channels per socket.
  • Xeon E-2100 offers up to six cores and is aimed at entry-level server and is now commercially shipping. 


In addition, beta testing has begun for Intel Optane DC persistent memory. OEMs and CSPs who have announced beta services and systems for early customer trials and deployments include Alibaba, Cisco, Dell EMC, Fujitsu, Google Cloud, Hewlett Packard Enterprise, Huawei, Lenovo, Oracle and Tencent.

Intel Optane DC persistent memory provides two special operating modes – App Direct mode and Memory mode. App Direct mode enables applications to receive the full value of the product’s native persistence and larger capacity. In Memory mode, applications running in a supported operating system or virtual environment can use the product as volatile memory, taking advantage of the additional system capacity made possible from module sizes up to 512 GB without needing to rewrite software.


Thursday, October 25, 2018

Intel's data-centric revenue grew 22 percent

Intel reported record third-quarter revenue of $19.2 billion, up 19 percent YoY.

“Stronger than expected customer demand across our PC and data-centric businesses continued in the third quarter. This drove record revenue and another raise to our full-year outlook, which is now up more than six billion dollars from our January expectations. We are thrilled that in a highly competitive market, customers continue to choose Intel,” said Bob Swan, Intel CFO and Interim CEO. “In the fourth quarter, we remain focused on the challenge of supplying the incredible market demand for Intel products to support our customers' growth. We expect 2018 will be another record year for Intel, and our transformation positions us to win share in an expanded $300 billion1 total addressable market.”

Highlights:

  • The PC-centric business (CCG) delivered record revenue, up 16 percent. 
  • The data-centric businesses grew 22 percent YoY led by 26 percent growth in the Data Center Group (DCG). DCG achieved record quarterly revenue driven by strong demand from cloud and communications service providers investing to meet the explosive demand for data and to improve the performance of data-intensive workloads like artificial intelligence. In Q3, DCG shipped the first Intel Optane™ DC Persistent Memory for revenue, and Intel® Xeon® Scalable set 95 new performance world records2 as adoption continued.
  • The Internet of Things Group (IOTG) also achieved record revenue. Excluding Wind River, which Intel divested in the second quarter, IOTG revenue was up 19 percent YoY on broad business strength. Record revenue in Intel's memory business (NSG) was up 21 percent YoY.
  • Intel's Programmable Solutions Group (PSG) revenue grew 6 percent YoY with continued strength in the data center and strong organic growth. PSG expanded its product line with the acquisition of eASIC and the introduction of the new Intel® Programmable Acceleration Card (PAC) with Intel® Stratix 10 SX FPGA.
  • Mobileye also achieved record quarterly revenue of $191 million, up approximately 50 percent YoY3 as customer momentum continued. Mobileye won 8 new design at major US and global automakers in Q3, bringing its year-to-date design win total to 20.

Monday, October 22, 2018

Intel intros 10G PON chipset for FTTx and 5G base stations

Intel introduced a new multimode 10G PON chipset designed for small form-factor pluggable optical network termination (SFP+ ONU) and single family unit (SFU) ONUs.

In a blog post, Intel's Dirk Wieberneit writes that SFP+ ONU plays a crucial role in fiber deployments by providing entire ONU (Mac and PHY) connectivity between the 10G PON optical network and any unit it is plugged into, such as residential gateways, MDUs, DPUs, mobile small cells and base-station equipment. This positions the new chipset for a wide range of implementations in both residential and business environments, including SFU, SFP+ ONU, fiber to the distribution point (FTTdp)/multi-dwelling unit (MDU), and 5G base stations, while enabling service providers to reuse their existing fiber infrastructure.

A key feature is an embedded 2.5 Gigabit Ethernet (GbE) PHY, which supports low-power, cost-effective SFUs, providing fast speeds both into and throughout the home.

Other features of the chipset:

  • It can be used in both ITU and IEEE PON environments (EPON, 10G-EPON, GPON, XGPON1, XGS-PON, NG-PON2 and active optical Ethernet.)  
  • It is prepared for bidirectional optical subassemblies (BOSA), allowing cost-effective BOSA on board (BoB) ONU designs. 
  • It supports network timing synchronization protocols, such as IEEE 1588v2, synchronous Ethernet or time of day (ToD), providing clock accuracy for 5G/LTE mobile base stations.
  • It offers embedded VoIP supporting FXS voice ports. 
  • It delivers the necessary quality of service (QoS) and power management, carrier-grade features and hardware OAM, including Y1731, with the highest accuracy.  
  • It includes a dual-core, multithread processor and dedicated packet processing engine so you get both service application flexibility and benchmark performance. 


https://itpeernetwork.intel.com/fiber-networks-upgrade-10g-pon-chipset/


Sunday, October 14, 2018

Intel + Ovum: How big is the 5G opportunity?

How big is the 5G opportunity?

Well, according to a newly released “5G Economics of Entertainment Report” commissioned by Intel and conducted by Ovum, it is forecast that over the next decade (2019-2028) media and entertainment companies will be competing to win a share of a near $3 trillion cumulative wireless revenue opportunity.

Experiences enabled by 5G networks will account for nearly half of this revenue opportunity (close to $1.3 trillion).

“5G will inevitably shake up the media and entertainment landscape. It will be a major competitive asset if companies adapt. If not, they risk failure or even extinction. This wave of 5G transformation will not be the purview of any singular industry, and now is certainly the time for all business decision-makers to ask: Is your business 5G-ready?” stated  Jonathan Wood, general manager of Business Development & Partnerships, 5G Next Generation and Standards at Intel

Some highlights:

  • 2022: 5G accounts for nearly 20 percent of total telecom revenues – $47 billion of $253 billion
  • 2025: more than 55 percent of total revenues – $183 billion of $321 billion
  • 2028: nearly 80 percent of total revenues – $335 billion of $420 billion. The average monthly traffic per 5G subscriber will grow from 11.7GB in 2019 to 84.4GB per month in 2028, at which point video will account for 90 percent of all 5G traffic.




Wednesday, October 10, 2018

Intel Vision Accelerator targets AI inference on edge devices

Intel unveiled its family of Intel Vision Accelerator Design Products targeted at artificial intelligence (AI) inference and analytics performance on edge devices. Two acceleration solutions are being introduced: one that features an array of Intel Movidius vision processors and one built on the high-performance Intel Arria 10 FPGA.

The devices could be used to build vision-based AI accelerator cards that collect and analyze data right on edge devices for real-time decision-making. AI workloads are offloaded from the system CPU.

“Until recently, businesses have been struggling to implement deep learning technology. For transportation, smart cities, healthcare, retail and manufacturing industries, it takes specialized expertise, a broad range of form factors and scalable solutions to make this happen. Intel’s Vision Accelerator Design Products now offer businesses choice and flexibility to easily and affordably accelerate AI at the edge to drive real-time insights,” stated Jonathan Ballon, Intel vice president and general manager, Internet of Things Group

Intel said developers it is working with have achieved up to 9.6X times using accelerator cards powered by these devices.

Monday, October 1, 2018

Intel touts new Xeon server performance benchmarks

Intel reported 95 new performance world records for its Xeon Scalable processors as achieved in servers from major original equipment manufacturers, ranging from single-socket systems up to eight-socket systems.

The new performance benchmarks were achieved in a variety of server platforms, ranging from general computing workloads running on single-socket systems to advanced technical computing and big data analytics workloads running on eight-socket systems. All systems tested include mitigations for Spectre and Meltdown.

“I’m extremely proud of the 95 world record performance benchmarks that our partners have delivered, but even more delighted to see the real-world performance that our customers are achieving on the fastest ramping Intel Xeon processor family in history,”
stated Lisa Spelman, vice president and general manager of Intel Xeon products and data center marketing.

Last week, Intel CFO and Interim CEO, Bob Swan, disclosed that its data-centric businesses grew 25 percent through June, and cloud revenue grew a whopping 43 percent in the first six months of the year. Responding to increasing demand for server and PC processors, Intel updated its CAPEX guidance for the year, saying it now plans to invest a record $15 billion in capital expenditures in 2018, up approximately $1 billion from the beginning of the year. Intel is investing $1 billion into its 14nm manufacturing sites in Oregon, Arizona, Ireland and Israel. Swan also cited progress with 10nm, stating that volume production will begin in 2019.

https://www.intel.com/content/www/us/en/benchmarks/server/xeon-scalable/1st-gen-xeon-world-record.html

Tuesday, September 25, 2018

Intel adds to portfolio of FPGA programmable acceleration cards

Intel is expanding its line of field programmable gate array (FPGA) acceleration cards with a new model based on its most powerful Stratix 10 SX FPGA.

The card leverages the Acceleration Stack for Intel Xeon CPU with FPGAs, providing data center developers a robust platform to deploy FPGA-based accelerated workloads. Hewlett Packard Enterprise* will be the first OEM to incorporate the Intel PAC with Stratix 10 SX FPGA along with the Intel Acceleration Stack for Intel Xeon Scalable processor with FPGAs into its servers.


Monday, September 24, 2018

ECOC 2018: Intel announces 100G silicon photonics transceivers for 5G

At ECOC 2018, Intel announced new 100G silicon photonics transceivers targetted at 5G wireless fronthaul applications. The new transceivers are designed to meet the harsh outdoor conditions of cellular towers with the capability to support optical transport to the nearest baseband unit or central office (up to 10 km). Commercial availability is expected in Q1 2019.

“Our hyperscale cloud customers are currently using Intel’s 100G silicon photonics transceivers to deliver high-performance data center infrastructure at scale. By extending this technology outside the data center and into 5G infrastructure at the edge of the network, we can provide the same benefits to communications service providers while supporting 5G fronthaul bandwidth needs,” stated Dr. Hong Hou, vice president and general manager of Intel’s Silicon Photonics Product Division.

Intel's first 100G silicon photonics product was introduced in 2016. The company says its 100G data center products are now shipping at a run rate of more than a million units per year.

Intel projects the total market opportunity for its connectivity business, which includes silicon photonics, to grow from $4 billion today to an estimated $11 billion total addressable market by 2022.

From this year's Intel Data Center Innovation Summit in August


Monday, September 10, 2018

Intel acquires NetSpeed Systems for interconnect fabric expertise

Intel has acquired NetSpeed Systems, a start-up based in San Jose, California, for its system-on-chip (SoC) design tools and interconnect fabric intellectual property (IP). Financial terms were not disclosed.

Intel said NetSpeed’s highly configurable and synthesizable offerings will help it more quickly and cost-effectively design, develop and test new SoCs with an ever-increasing set of IP.

NetSpeed provides scalable, coherent, network-on-chip (NoC) IP to SoC designers. NetSpeed’s NoC tool automates SoC front-end design and generates programmable, synthesizable high-performance and efficient interconnect fabrics. The company was founded in 2011.

The NetSpeed team is joining Intel’s Silicon Engineering Group (SEG) led by Jim Keller. NetSpeed co-founder and CEO, Sundari Mitra, will continue to lead her team as an Intel vice president reporting to Keller.

“Intel is designing more products with more specialized features than ever before, which is incredibly exciting for Intel architects and for our customers. The challenge is synthesizing a broader set of IP blocks for optimal performance while reining in design time and cost. NetSpeed’s proven network-on-chip technology addresses this challenge, and we’re excited to now have their IP and expertise in-house,” stated Jim Keller, senior vice president and general manager of the Silicon Engineering Group at Intel.

Tuesday, September 4, 2018

Intel announces AI collaboration with Baidu Cloud

Baidu and Intel outlined new artificial intelligence (AI) collaborations showcasing applications ranging from financial services and shipping to video content detection.

Specifically, Baidu Cloud is leveraging Intel Xeon Scalable processors and the Intel Math Kernel Library-Deep Neural Network (Intel® MKL-DNN) as part of a new financial services solution for leading China banks; the Intel OpenVINO toolkit in new AI edge distribution and video solutions; and Intel Optane™ technology and Intel QLC NAND SSD technology for enhanced object storage.

“Intel is collaborating with Baidu Cloud to deliver end-to-end AI solutions. Adopting a new chip or optimizing a single framework is not enough to meet the demands of new AI workloads. What’s required is sysatems-level integration with software optimization, and Intel is enabling this through our expertise and extensive portfolio of AI technologies – all in the name of helping our customers achieve their AI goals,” stated Raejeanne Skillern, Intel vice president, Data Center Group, and general manager, Cloud Service Provider. Platform Group.

Saturday, September 1, 2018

Intel and Ericsson complete 5G-NR call over 39 GHz

Intel and Ericsson completed the first 5G-NR compliant live data call over the 39 GHz band using Intel’s RF mm-Wave chip with Ericsson Radio System commercial equipment, including the 5G NR radio AIR 5331, baseband and Intel 5G Mobile Trial Platform.

The 5G trial was completed in labs in Kista, Sweden, and Santa Clara, California.

“This live 5G demonstration on the 39 GHz band signifies how close 5G commercial services are to reality in North America. Using the Intel 5G Mobile Trial Platform configured with a 39 GHz RF chip/antenna, we successfully demonstrated a 3GPP-compliant data call performed connecting to an Ericsson commercial 5G g-NB base station, an important step in ensuring our commercial platforms are field ready for deployment in 2019,” stated Asha Keddy, vice president Next Generation and Standards at Intel.

“Completing this end-to-end data call on 39 GHz with Intel shows our commitment to realizing 5G in different spectrum bands,” said Fredrik Jejdling, executive vice president and head of Business Area Networks at Ericsson. “In July we did it on 3.5 GHz and now on 39 GHz, which will smoothen the path to 5G for our customers. Using commercial 5G radios for this multivendor interoperability milestone shows our progress towards making 5G a commercial reality.”

Tuesday, August 28, 2018

Intel brings 802.11ac and LTE to its latest mobile CPUs

New additions to the 8th Gen Intel Core processor family offer integrated Wi-Fi and LTE capabilities

The new U-series (formerly code-named Whiskey Lake) and Y-series (formerly code-named Amber Lake) are optimized for connectivity in thin, light laptops and 2 in 1s.

The U-series processors bring integrated Gigabit Wi-Fi (with 2x2 160MHz channels), while delivering up to 2-times better performance, compared with a 5-year-old PC, and double-digit gains in office productivity for everyday web browsing and light content creation over the previous generation.

The Y-series processors also deliver fast connectivity options, including fast Wi-Fi and LTE capabilities, while offering double-digit gains in performance compared with the previous generation, enabling fresh innovations in sleek and compact form factor designs with extended battery life.

Thursday, August 9, 2018

Intel packs 32TB into its ruler SSD for data centers

Intel announced a 32 terabyte "ruler" SSD for data centers.

Instead of the traditional, 2.5" or 3.5" rectangular box for disk drives, Intel's ruler is a long, thin box designed to slide into a 1" server chassis, plugging in via a PCIe interface at the end of the ruler. The long, thin shape dissipates heats better than conventional designs.

The Intel SSD DC P4500 is built on Intel 3D NAND technology, which stacks memory cells atop each other 64 layers deep.

A prototype of the ruler SSD was first shown at last year's Flash Memory Summit.

Thursday, July 26, 2018

Intel reports record Q2 sales - strength in data centers

Intel reported record second quarter revenue of $17.0 billion, up 15 percent YoY and driven by strength across the business and customer demand for Intel platforms.

Intel's data-centric businesses grew 26 percent, approaching 50 percent of total revenue.

PC-centric revenue was up 6 percent on strength in the commercial and enthusiast segments.

“After five decades in tech, Intel is poised to deliver our third record year in a row. We are uniquely positioned to capitalize on the need to process, store and move data, which has never been more pervasive or more valuable,” said Bob Swan, Intel CFO and Interim CEO. “Intel is now competing for a $260 billion market opportunity, and our second quarter results show that we’re winning. As a result of the continued strength we are seeing across the business, we are raising our full year revenue and earnings outlook.”

  • Intel noted the workload optimization trend in the data center is also fueling demand for FPGAs. Intel's Programmable Solutions Group (PSG) revenue grew 18 percent.
  • Intel's memory (NSG), Internet of Things Group (IOTG) and Mobileye businesses each achieved record quarterly revenue. 
  • Mobileye revenue grew 37 percent year-over-year as the adoption of advanced driver-assistance systems (ADAS) increases.


https://www.intc.com/investor-relations/default.aspx

See also