Showing posts with label Intel. Show all posts
Showing posts with label Intel. Show all posts

Thursday, January 21, 2021

Intel posts Q4 revenue of $20 billion, exceeding guidance

Intel reported Q4 2020 revenue of $20.0 billion, exceeding October guidance by $2.6 billion and down 1 percent year-over-year (YoY). Full-year revenue set an all-time Intel record of $77.9 billion, up 8 percent YoY. Earnings per share (EPS) amounted to $1.42 ($1.52 on a non-GAAP basis, exceeding October guidance by 42 cents).

“We significantly exceeded our expectations for the quarter, capping off our fifth consecutive record year,” said Bob Swan, Intel CEO. “Demand for the computing performance Intel delivers remains very strong and our focus on growth opportunities is paying off. It has been an honor to lead this wonderful company, and I am proud of what we have achieved as a team. Intel is in a strong strategic and financial position as we make this leadership transition and take Intel to the next level.”

Q4'20 Business Highlights

  • Started production of 10nm-based 3rd Gen Intel Xeon Scalable processors (“Ice Lake”), ramping in Q1.
  • Launched 11th Gen Intel Core processors ("Tiger Lake"); announced 11th Gen Intel Core™ S-Series desktop processors ("Rocket Lake"), now shipping.
  • Entered discrete graphics market with Intel Iris Xe MAX graphics, Intel’s first Xe-based discrete GPU.
  • Announced Amazon Web Services selected Intel's Habana Gaudi AI processors for EC2 training.
  • Delivered gold release of Intel oneAPI developer toolkit.
  • Announced expanded network infrastructure solutions portfolio.
  • Introduced new Intel Optane SSD series and 3rd gen Intel Optane persistent memory “Crow Pass” for enterprise and cloud customers.


Wednesday, January 13, 2021

Intel appoints Pat Gelsinger as next CEO

Intel's Board of Directors appointed Pat Gelsinger as the company's new chief executive officer, effective Feb. 15, 2021, replacing Bob Swan.

Gelsinger has served as the CEO of VMware since 2012, where he significantly transformed the company into a recognized global leader in cloud infrastructure, enterprise mobility and cyber security, almost tripling the company’s annual revenues. Prior to joining VMware, Gelsinger was president and chief operating officer of EMC Information Infrastructure Products at EMC, overseeing engineering and operations for information storage, data computing, backup and recovery, RSA security and enterprise solutions. Before joining EMC, he spent 30 years at Intel, becoming the company’s first chief technology officer and driving the creation of key industry technologies such as USB and Wi-Fi. He was the architect of the original 80486 processor, led 14 different microprocessor programs and played key roles in the Core and Xeon families.

“Pat is a proven technology leader with a distinguished track record of innovation, talent development, and a deep knowledge of Intel. He will continue a values-based cultural leadership approach with a hyper focus on operational execution,” said Omar Ishrak, independent chairman of the Intel board. “After careful consideration, the board concluded that now is the right time to make this leadership change to draw on Pat’s technology and engineering expertise during this critical period of transformation at Intel. The board is confident that Pat, together with the rest of the leadership team, will ensure strong execution of Intel’s strategy to build on its product leadership and take advantage of the significant opportunities ahead as it continues to transform from a CPU to a multi-architecture XPU company.”

“I am thrilled to rejoin and lead Intel forward at this important time for the company, our industry and our nation,” said Gelsinger. “Having begun my career at Intel and learned at the feet of Grove, Noyce and Moore, it’s my privilege and honor to return in this leadership capacity. I have tremendous regard for the company’s rich history and powerful technologies that have created the world’s digital infrastructure. I believe Intel has significant potential to continue to reshape the future of technology and look forward to working with the incredibly talented global Intel team to accelerate innovation and create value for our customers and shareholders.”

“My goal over the past two years has been to position Intel for a new era of distributed intelligence, improving execution to strengthen our core CPU franchise and extending our reach to accelerate growth,” said Swan. “With significant progress made across those priorities, we’re now at the right juncture to make this transition to the next leader of Intel. I am fully supportive of the board’s selection of Pat and have great confidence that, under his leadership and the rest of the management team, Intel will continue to lead the market as one of the world’s most influential technology companies.”

Monday, January 11, 2021

Intel leverages silicon photonics for Mobileye's lidar system-on-chip

Mobileye, a division of Intel, unveiled a new silicon photonics processor for frequency-modulated continuous wave (FMCW) lidar. The new device, which was engineered at Intel’s silicon photonics fab in New Mexico, is expected to be in production by 2025. 

Mobileye envisions that AVs will use both radio- and light-based detection-and-ranging sensing.

The new software-defined imaging radar technology with 2304 channels, 100DB dynamic range and 40 DBc side lobe level that together enable the radar to build a sensing state good enough for driving policy supporting autonomous driving. 

“This is really game-changing. And we call this a photonic integrated circuit, PIC. It has 184 vertical lines, and then those vertical lines are moved through optics. Having fabs that are able to do that, that’s very, very rare. So this gives Intel a significant advantage in building these lidars,” stated Mobileye president and chief executive officer Amnon Shashua.

https://newsroom.intel.com/news-releases/ces-2021-mobileye-avs-on-move/

Intel shows bevy of new processors

Intel introduced four new processors families - a total of more than 50 individual processor designs - for laptops and PCs.

At the high-end, the new 11th Gen Intel Core vPro processors feature hardware security to detect and stop ransomware and crypto-mining attacks. It is also equipped with Intel Control Flow Enforcement Technology, ground-breaking technology to help shut down an entire class of attacks that long evaded software-only solutions. This processor line leverages Intel 10-nanometer (nm) SuperFin technology, Intel Iris Xe graphics, and integrated Intel Wi-Fi 6/6E (Gig+).

Additionally, Intel demonstrated “Alder Lake,” the next-generation in x86 architecture and Intel’s most power-scalable system-on-chip.  Alder Lake will combine high-performance cores and high-efficiency cores into a single product. Alder Lake will also be Intel’s first processor built on a new, enhanced version of 10nm SuperFin. Intel expects to ship Alder Lake in the second half of 2021.

“Only Intel has the breadth of products spanning multiple architectures; the large, open ecosystem; sheer scale of manufacturing footprint; and deep technical expertise customers need to unlock opportunities in this era of distributed intelligence,” said Intel Executive Vice President Gregory Bryant.

Wednesday, January 6, 2021

Intel intros facial authentication solution

Intel introduced an on-device, facial authentication solution that combines an active depth sensor with a specialized neural network. The technology could be used for smart locks, access control, point-of-sale, ATMs, kiosks, etc.

Intel said its RealSense ID technology integrates anti-spoofing features and can adapt to users over time as they change physical features, such as facial hair and glasses. 

"Intel RealSense ID combines purpose-built hardware and software with a dedicated neural network designed to deliver a secure facial authentication platform that users can trust," said Sagi Ben Moshe, Intel corporate vice president and general manager of Emerging Growth and Incubation.

https://newsroom.intel.com/news/introducing-intel-realsense-id-facial-authentication

Thursday, December 17, 2020

Intel and Samsung achieve 5G SA Core capacity of 305 Gbps / server

Samsung and Intel achieved a record 5G SA Core data processing capacity of 305 Gbps per server – equivalent to hosting more than 200,000 users simultaneously live-streaming standard definition videos – as well as latency improvement in a mobile network environment with commercial features enabled. 

To achieve this result, Samsung’s 5G SA Core used the 2nd generation Intel Xeon Scalable processor and the Intel Ethernet Network Adapter E810 with Enhanced Dynamic Device Personalization (DDP). The companies said the Intel Ethernet Network Adapter E810 with Enhanced DDP is capable of optimizing data distribution and transmission functions across the network adapter and the CPU cores, resulting in higher performance. Samsung and Intel were able to implement a simplified system configuration and boost packet processing and overall network performance.

“Through close collaboration with Intel, we were able to achieve an industry-leading performance with our 5G SA Core,” said Sohyong Chong, Senior Vice President and Head of Core Software R&D, Networks Business at Samsung Electronics. “Samsung’s cloud-native 5G SA Core, through its highly flexible and scalable design, will enable our customers to launch 5G services more swiftly and cost-effectively.”

“The transition to 5G Standalone Core is essential to achieve the full potential of 5G,” said Alex Quach, Vice President and General Manager, Wireline and Core Network Division, Intel Corporation. “This milestone achieved with Samsung is a verification of how strong industry collaboration and the use of innovative technologies can enhance performance to accelerate this transition and pave the way to new network and edge services.”

https://news.samsung.com/us/samsung-achieves-305gbps-5g-sa-core/

Monday, December 14, 2020

Intel to start assembly & test operations in Costa Rica

Intel will invest US$350 million over the next three years to start assembly & test operations in Costa Rica. Assembly and test operations will be carried out at the Intel Costa Rica campus in San Antonio de BelĂ©n and will start in the second half of 2021. 

"The existing infrastructure, the synergy with operations already in place at the site, our talent, the free-zone regime and the legal environment, have given Intel a favorable option to expand its assembly & test capacity to Costa Rica", said Ileana Rojas, General Manager at Intel Costa Rica.

With the start of operations, Intel Costa Rica joins the Kulim site in Malaysia, the Chengdu plant in China, and the site in Ho Chi Minh City, Vietnam, which are the only Intel sites to perform global assembly & test operations, turning Intel Costa Rica into the first Latin American country site to perform such process.

"The fact that Costa Rica has become stronger as a trustworthy destination for investment amid the pandemic is a very powerful signal. Furthermore, it shows that the country builds long-term relationships with investors, since we have over two decades of history working together with Intel. An investment of this size deepens Intel's footprint and opens very significant job opportunities for people with different work profiles who will be able to join worldwide exports produced by the Costa Rican talent", said Carlos Alvarado, President of Costa Rica.


Thursday, December 3, 2020

Intel shows micro-ring modulators, all-silicon photodetectors, multi-lambda lasers

Intel showcased a number of advancements in the field of optical interconnects, advancing its long-term ambition to bring optical I/O directly into silicon packages. During a virtual Intel Labs day presentatio, the company demonstrated advances in key technology building blocks, including with light generation, amplification, detection, modulation, complementary metal-oxide semiconductor (CMOS) interface circuits and package integration. 

Key technology building blocks showcased:

  • Micro-ring modulators: Conventional silicon modulators take up too much area and are costly to place on IC packages. By developing micro-ring modulators, Intel has miniaturized the modulator by a factor of more than 1,000, thereby eliminating a key barrier to integrating silicon photonics onto a compute package.
  • All-silicon photodetector: For decades, the industry has believed silicon has virtually no light detection capability in the 1.3-1.6um wavelength range. Intel showcased research that proves otherwise. Lower cost is one of the main benefits of this breakthrough.
  • Integrated semiconductor optical amplifier: As the focus turns to reducing total power consumption, integrated semiconductor optical amplifiers are an indispensable technology, made possible with the same material used for the integrated laser.
  • Integrated multi-wavelength lasers: Using a technique called wavelength division multiplexing, separate wavelengths can be used from the same laser to convey more data in the same beam of light. This enables additional data to be transmitted over a single fiber, increasing bandwidth density.
  • Integration: By tightly integrating silicon photonics and CMOS silicon through advanced packaging techniques, we can gain three benefits: lower power, higher bandwidth and reduced pin count. Intel is the only company that has demonstrated integrated multi-wavelength lasers and semiconductor optical amplifiers, all-silicon photodetectors, and micro-ring modulators on a single technology platform tightly integrated with CMOS silicon. This research breakthrough paves the path for scaling integrated photonics.

Intel said these advancements will enable future architectures that are more disaggregated, with multiple functional blocks such as compute, memory, accelerators and peripherals spread throughout the entire network and interconnected via optical and software in high-speed and low-latency links.

“We are approaching an I/O power wall and an I/O bandwidth gap that will dramatically hinder performance scaling. The rapid progress Intel is making in integrated photonics will enable the industry to fully re-imagine data center networks and architectures that are connected by light. We have now demonstrated all of the critical optical technology building blocks on one silicon platform, tightly integrated with CMOS silicon. Our research on tightly integrating photonics with CMOS silicon can systematically eliminate barriers across cost, power and size constraints to bring the transformative power of optical interconnects to server packages,” stated James Jaussi, senior principal engineer and director of PHY Lab, Intel Labs.

Without such advancements, Intel warns the industry will soon reach the practical limits of electrical I/O performance - what it calls an "I/O power wall".



Tuesday, December 1, 2020

AWS to deploy Intel's Gaudi AI accelerators in EC2 instances

AWS will begin offering EC2 instances with up to eight of Intel's Habana Gaudi accelerators for machine learning workloads.

Gaudi accelerators are specifically designed for training deep learning models for workloads that include natural language processing, object detection and machine learning training, classification, recommendation and personalization.

“We are proud that AWS has chosen Habana Gaudi processors for its forthcoming EC2 training instances. The Habana team looks forward to our continued collaboration with AWS to deliver on a roadmap that will provide customers with continuity and advances over time,” states David Dahan, chief executive officer at Habana Labs, an Intel Company.

ntel acquires Habana Labs for $2 billion - AI chipset

Intel has acquired Habana Labs, an Israel-based developer of programmable deep learning accelerators for the data center, for approximately $2 billion.

Habana’s Gaudi AI Training Processor is currently sampling with select hyperscale customers. Large-node training systems based on Gaudi are expected to deliver up to a 4x increase in throughput versus systems built with the equivalent number of GPUs. Gaudi is designed for efficient and flexible system scale-up and scale-out.

Additionally, Habana’s Goya AI Inference Processor, which is commercially available, has demonstrated excellent inference performance including throughput and real-time latency in a highly competitive power envelope. Gaudi for training and Goya for inference offer a rich, easy-to-program development environment to help customers deploy and differentiate their solutions as AI workloads continue to evolve with growing demands on compute, memory and connectivity.

Habana will remain an independent business unit and will continue to be led by its current management team. Habana will report to Intel’s Data Platforms Group, home to Intel’s broad portfolio of data center class AI technologies.

“This acquisition advances our AI strategy, which is to provide customers with solutions to fit every performance need – from the intelligent edge to the data center,” said Navin Shenoy, executive vice president and general manager of the Data Platforms Group at Intel. “More specifically, Habana turbo-charges our AI offerings for the data center with a high-performance training processor family and a standards-based programming environment to address evolving AI workloads.”

Habana Labs chairman Avigdor Willenz will serve as a senior adviser to the business unit as well as to Intel Corporation after Intel’s purchase of Habana.

“We have been fortunate to get to know and collaborate with Intel given its investment in Habana, and we’re thrilled to be officially joining the team,” said David Dahan, CEO of Habana. “Intel has created a world-class AI team and capability. We are excited to partner with Intel to accelerate and scale our business. Together, we will deliver our customers more AI innovation, faster.”


Interview: Habana Labs targets AI processors



Habana Labs, a start-up based in Israel with offices in Silicon Valley, emerged from stealth to unveil its first AI processor. Habana's deep learning inference processor, named Goya, is >2 orders of magnitude better in throughput & power than commonly deployed CPUs, according to the company. The company will offer a PCIe 4.0 card that incorporates a single Goya HL-1000 processor and designed to accelerate various AI inferencing workloads,...



Wednesday, November 11, 2020

Intel advances its oneAPI initiative across CPUs, GPUs, FPGAs

Intel's oneAPI industry initiative, which was first announced at SuperComputing 2019, marked a major milestone with the gold release of oneAPI toolkits. The oneAPI vision calls for a unified and simplified cross-architecture programming model without proprietary lock-in while enabling the integration of legacy code. This programming model would extend across CPUs, GPUs, FPGAs and other accelerators. 

Intel said its oneAPI toolkits take advantage of hardware capabilities and instructions such as Intel AVX-512 and Intel DL Boost on CPUs, along with features unique to XPUs. 

“Today is a key moment in our ambitious oneAPI and XPU journey. With the gold release of our oneAPI toolkits, we have extended the developer experience from familiar CPU programming libraries and tools to include our vector-matrix-spatial architectures. We are also launching our first data center GPU based on Xe-LP microarchitecture focused on the fast-growing cloud gaming and media streaming segments,” states Raja Koduri, Intel senior vice president, chief architect and general manager of Architecture, Graphics and Software.

Intel also debuted its first discrete graphics processing unit (GPU) for the data center based on the Xe-LP microarchitecture and designed specifically for high-density, low-latency Android cloud gaming and media streaming.

https://newsroom.intel.com/news/intel-xpu-vision-oneapi-server-gpu/#gs.ko621d

Intel shows its Ponte Vecchio GPU and oneAPI programming model

Intel unveiled its new general-purpose "Ponte Vecchio" GPU architecture for HPC/AI acceleration, along with its new oneAPI, a unified and scalable programming model for the era of HPC/AI convergence. The oneAPI industry initiative ains to deliver a unified and simplified programming model for application development across heterogenous processing architectures, including CPUs, GPUs, FPGAs and other accelerators. The oneAPI specification includes...


Monday, November 2, 2020

DISH adds Intel as a 5G infrastructure partner

 DISH will integrate Intel 5G infrastructure technology into its forthcoming virtualized, open Radio Access Network (O-RAN) 5G network deployment. Specifically, DISH has selected the Intel Xeon Scalable Processor, the Intel Ethernet 800 Series network adapter, the Intel vRAN Dedicated Accelerator ACC100 and Intel's FlexRAN software reference architecture for its deployments.

The companies are collaborating on the fully virtualized RAN, including radio reference designs, fronthaul optimization, hardware-based security, and blueprints for servers. The two companies are also collaborating to enable edge applications for enterprises and driving O-RAN standards, and are cooperating in the areas of data optimization and Machine Learning for future phases of the network buildout. 

"Intel has been a trusted advisor throughout the design of our O-RAN network, working in concert with our software vendors Mavenir, Altiostar, and many OEM hardware providers. We have tested several commercial off-the-shelf (COTS) designs from a large number of server vendors using Intel's O-RAN compliant FlexRAN architecture and are pleased by the maturity and power of the solutions, together with the cost benefits of COTS solutions," said Marc Rouanne, executive vice president and chief network officer, DISH. "We are using the power of the VMware abstraction solution and the ubiquity of Intel-based servers to load and mix different types of cloud-native workloads like distributed unit (DU), centralized unit (CU), virtual routers, mobile edge computing applications, and 5G Core containerized network functions."

"Fully-virtualized, cloud-native networks like the one DISH is building bring the same server economics that transformed the data center," said Dan Rodriguez, Intel corporate vice president and general manager of the Network Platforms Group. "We are excited to partner with DISH to lay the foundation for a truly agile network and have already begun working with our OEM partners who have designed FlexRAN-based servers to enable a variety of new innovative use cases and services."

http://www.newsroom.intel.com

ISH selects Blue Planet automation software for its 5G network

 DISH selected inventory and service order management software from Ciena's Blue Planet division to automate its 5G network.Blue Planet's software automation delivers real-time management of all inventory, enabling on-demand provisioning and faster rollout of customer network slices. “Blue Planet is a key component within our 5G platform, allowing us to dynamically manage all of our network inventory and service orders in real-time,” said...

DISH picks Nokia for cloud-native, 5G standalone core

DISH Network selected Nokia’s cloud-native, standalone Core software products to help it build the most advanced, disruptive, fully-automated, cloud-native 5G network in the U.S..The deal, which follows months of joint testing, includes subscriber data management, device management, packet core, voice and data core, as well as integration services. Nokia will also deliver additional cloud-native products that will provide 4G, 5G standalone and Voice...

VMware introduced its 5G Telco Cloud Platform, featuring Tanzu Kubernetes Grid - an embedded Kubernetes distribution - that will allow Communication Service Providers (CSPs) to reliably build, manage and run containerized workloads across private, telco, edge and public clouds. VMware said its new solution provides a cloud-first network architecture to accelerate 5G and edge innovation while delivering service agility, operational consistency and...

DISH selected VMware's Telco Cloud solution for its 5G, cloud-native Open Radio Access Network (O-RAN). VMware said its Telco Cloud will enable DISH to utilize software from leading vendors to optimize and accelerate its 5G network deployment. Additionally, it will provide DISH with enhanced automation, resiliency, security and flexibility. The VMware Telco Cloud provides an abstraction layer across multiple network domains and enables DISH to leverage...

DISH takes over Boost Mobile and its 9.3 million subscribers

T-Mobile US completed its previously announced divestiture of Sprint’s prepaid wireless business to DISH Network Corporation, fulfilling a commitment that T-Mobile and Sprint made to the Department of Justice and to the Federal Communications Commission as part of their merger process.' DISH paid $1.4 billion for the acquisition of Boost Mobile and its 9.3 million customers. DISH said it will continue to invest in the Boost Mobile brand. John Swieringa,...

DISH picks Fujitsu for 5G radio units and Altiostar for virtualized RAN

DISH confirmed a large purchase of 5G radio units (RUs) from Fujitsu and a multi-year agreement with Altiostar to deliver a cloud-native Open vRAN software solution. DISH, which is committed to use O-RAN architecture in its 5G network, will be utilizing Fujitsu's Low Band Tri-Band RU and Mid Band Dual-Band RU, both industry firsts for O-RAN radios, across the company's spectrum portfolio. In addition to radio units, Fujitsu will provide support...


Sunday, November 1, 2020

Intel to acquire SigOpt for AI model optimization software

Intel agreed to acquire SigOpt, a start-up based in San Francisco that is focusing on the optimization of artificial intelligence (AI) software models at scale. Financial terms were not disclosed.

SigOpt is a standardized, scalable, enterprise-grade optimization platform and API. The company was founded by Patrick Hayes and Scott Clark, who is credited with building an open source the Metric Optimization Engine at Yelp.

Intel plans to use SigOpt’s software technologies across Intel’s AI hardware products to help accelerate, amplify and scale Intel’s AI software solution offerings to developers.

https://sigopt.com/ 

Thursday, October 22, 2020

Intel posts a 7% drop in Q3 data center group revenue

Citing COVID-19 effects in enterprise and government, Intel reported third-quarter revenue of $18.3 billion, down 4 percent year-over-year (YoY). Data-centric revenue declined 10 percent while PC-centric revenue was better than expected, up 1 percent YoY. Third-quarter GAAP earnings-per-share (EPS) was $1.02, down 25 percent YoY; non-GAAP EPS of $1.11 was down 22 percent YoY, above July expectations.

"Our teams delivered solid third-quarter results that exceeded our expectations despite pandemic-related impacts in significant portions of the business,” said Bob Swan, Intel CEO. “Nine months into 2020, we’re forecasting growth and another record year, even as we manage through massive demand shifts and economic uncertainty. We remain confident in our strategy and the long-term value we’ll create as we deliver leadership products and aim to win share in a diversified market fueled by data and the rise of AI, 5G networks and edge computing.”

Some highlights

  • In the Data Center Group (DCG), Cloud revenue grew 15 percent YoY on continued demand.
  • DCG's Enterprise & Government market segment was down 47 percent YoY following two quarters of more than 30 percent growth.
  • The pandemic also weighed on third-quarter data-centric results in the Internet of Things Group and the memory business (NSG). 
  • Mobileye revenue returned to growth in the third quarter as global vehicle production improved. The business also launched its new Mobileye SuperVision surround-view ADAS solution.
  • The PC-centric business (CCG) was up 1 percent YoY in the third quarter on continued notebook strength to support the work- and learn-at-home dynamics of COVID-19. 
  • Intel's third 10nm manufacturing facility, which is located in Arizona, is now fully operational and the company now expects to ship 30% higher 10nm product volumes in 2020 compared to January expectations.

http://www.intc.com/results.cfm

Monday, October 19, 2020

SK hynix to acquire Intel's NAND business for $9 billion



SK hynix agreed to acquire Intel’s NAND memory and storage business for US$9 billion. The deal includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain its distinct Intel OptaneT business.

“I am pleased to see SK hynix and Intel`s NAND division, which have led the NAND flash technology innovation, work to build the new future together,” said Seok-Hee Lee, Chief Executive Officer (CEO) of SK hynix. “By taking each other`s strengths and technologies, SK hynix will proactively respond to various needs from customers and optimize our business structure, expanding our innovative portfolio in the NAND flash market segment, which will be comparable with what we achieved in DRAM.”

Bob Swan, Intel CEO said, “I am proud of the NAND memory business we have built and believe this combination with SK hynix will grow the memory ecosystem for the benefit of customers, partners and employees. For Intel, this transaction will allow us to further prioritize our investments in differentiated technology where we can play a bigger role in the success of our customers and deliver attractive returns to our stockholders.”

For the first six months ended June 27, 2020, the NAND businesses represented approximately US $2.8 billion of the revenue for Intel`s Non-volatile Memory Solutions Group (NSG) and contributed approximately US$600 million to NSG operating income.


SK hynix developed the world’s first Charge Trap Flash (CTF)-based, 96-layer 4D NAND flash in 2018 and 128-layer 4D NAND flash in 2019. SK hynix will combine Intel`s solutions technology and manufacturing capability in order to establish a higher value-added 3D NAND solutions portfolio including enterprise SSDs.




Sunday, October 4, 2020

Intel expands its telco infrastructure portfolio

 Intel announced an expanded lineup of hardware, software and solutions for network infrastructure, including: enhancements to its FlexRAN software reference architecture; Intel virtualized radio access network (vRAN) dedicated accelerator; network-optimized next-generation Intel Xeon Scalable and D processors (code-named “Ice Lake”); and upgraded Intel Select Solutions for Network Function Virtualization Infrastructure (NFVI).


“When you consider the collective impact of the proliferation of fully virtualized cloud architectures combined with the commercialization of 5G, the rise of AI and the growth of the edge, it truly has a multiplier effect that makes each more impactful than it would be on its own. It’s an enormous opportunity for us and our customers to not only deliver new experiences but transform entire industries,” stated Dan Rodriguez, Intel corporate vice president and general manager of the Network Platforms Group.

Expanded portfolio offerings include:

  • FlexRAN: Intel’s software reference architecture grew to nearly 100 licensees and added enhancements including optimizations to its massive multiple input, multiple output (MIMO) mid-band pipeline for increased bandwidth and support for ultra-reliable low-latency communication (URLLC.) Amdocs, a licensee, today announced FlexRAN integration with its SmartRAN analytics solution.
  • Intel vRAN Dedicated Accelerator ACC100: The low-power and low-cost acceleration solution for vRAN deployments is based on Intel eASIC technology and is sampling to customers. It offloads and accelerates the computing-intensive process of forward error correction. This frees up more processing power within Intel Xeon processors for channel capacity and edge-based services and applications. To bring the product to market, Intel works with leading service providers including Telefonica and various partners, including Altiostar, ASTRI, Baicells, Comba, H3C, HPE, Mavenir, Nokia, QCT, Radisys, Ruijie, Silicom, Supermicro, and ZT Systems.
  • Next Generation Intel Xeon processors for network infrastructure: With these processors, customers can use a common architecture across the network for various workloads and performance requirements. Network-optimized 3rd Generation Intel Xeon Scalable processors (code-named “Ice Lake-SP”) are designed for infrastructure use cases that require higher performance per watt, including wireless core, wireless access and network edge workloads and security appliances. 3rd Generation Intel Xeon Scalable processors will ship to customers at the end of the year.  Next-generation Intel Xeon D processors (code-named “Ice Lake-D”) are designed for form factor-constrained environments at the edge and will offer greater levels of integration like built-in networking IP. Intel expects to start shipping these processors to customers in mid-2021.
  • Enhanced Intel Select Solutions for network: To improve application efficiency and network performance for high-performance network workloads, Intel Select Solutions for NFVI Red Hat, NFVI Ubuntu and NFVI Forwarding Platform have been upgraded to support the new Intel® Ethernet 800 Series Network Adapter (code-named “Columbiaville”), which delivers increased performance and Dynamic Device Personalization (DDP) to maximize platform performance. These upgraded solutions are coming soon.

https://newsroom.intel.com/news/intel-expands-5g-network-infrastructure-offerings-25b-market


U.S. DoD backs Intel for semiconductor packaging tech

The U.S. Department of Defense awarded a contract to Intel to enable the U.S. government to access Intel’s state-of-the-art semiconductor packaging capabilities in Arizona and Oregon.

The project, which is supported by the DoD's State-of-the-Art Heterogeneous Integration Prototype (SHIP) program,  is executed by the Naval Surface Warfare Center, Crane Division, and administered by the National Security Technology Accelerator.

The second phase of SHIP will develop prototypes of multichip packages and accelerate advancement of interface standards, protocols and security for heterogeneous systems. SHIP prototypes will integrate special-purpose government chips with Intel’s advanced, commercially available silicon products, including field programmable gate arrays, application-specific integrated circuits and CPUs. This combination of technologies provides new paths for the U.S. government’s industry partners to develop and modernize the government’s mission-critical systems while taking advantage of Intel’s U.S. manufacturing capabilities.

Heterogeneous packaging allows the assembly of multiple, separately manufactured integrated circuit dies (chips) onto a single package to increase performance while reducing power, size and weight. SHIP provides the U.S. government access to Intel’s advanced heterogeneous packaging technologies, including embedded multi-die interconnect bridge (EMIB), 3D Foveros and Co-EMIB (combining both EMIB and Foveros).

“Intel and the U.S. government share a priority to advance domestic semiconductor manufacturing technology. The SHIP program will enable the Department of Defense to take advantage of Intel’s advanced semiconductor packaging capabilities, diversifying their supply chain and protecting their intellectual property while also supporting ongoing semiconductor R&D in the U.S. and preserving critical capabilities onshore,” stated Jim Brinker, president and general manager of Intel Federal LLC.

“To ensure that the U.S. defense industry base can continue to deliver state-of-the-art electronics for national security, it is imperative that the Department of Defense (DoD) partners with leading U.S. semiconductor companies," Nicole Petta, principal director of microelectronics, Office of the Under Secretary of Defense for Research and Engineering. "The DoD microelectronics roadmap recognizes the importance of strategic partnerships with industry. The roadmap also prioritizes and recognizes that as process scaling slows, heterogeneous assembly technology is a critical investment for both the DoD and our nation. SHIP directly contributes to advancing the objectives outlined in the DoD roadmap and the DoD looks forward to working with Intel, a world leader in this technology.”

http://www.intel.com




In 2018, Intel demonstrated a new 3D packaging technology, called "Foveros," which for the first time brings 3D stacking to logic-on-logic integration. Foveros will will allow products to be broken up into smaller “chiplets,” where I/O, SRAM and power delivery circuits can be fabricated in a base die and high-performance logic chiplets are stacked on top. The first Foveros product will combine a high-performance 10nm compute-stacked chiplet with a low-power 22FFL base die. 

Wednesday, September 30, 2020

Intel and Lightbits Labs targets NVMe over Fabrics TCP

 Intel announced a partnership with Lightbits Labs focused on disaggregated storage solutions. The partnership includes technical co-engineering, go-to-market collaboration and an Intel Capital investment in Lightbits Labs. 

Lightbits, which is based in Israel, delivers high-performance shared storage across servers while providing high availability and read-and-write management designed to maximize the value of flash-based storage. 

Lightbits Labs has demonstrated LightOS NVMe over Fabrics TCP (NVMe-oF/TCP) storage with remote direct memory access-class performance when accelerated with the Intel Ethernet 800 Series Network Adapter with ADQ technology. (Credit: Lightbits Labs)




Lightbits Labs will enhance its composable disaggregated software-defined storage solution, LightOS, for Intel technologies, creating an optimized software and hardware solution. The system will utilize Intel Optane persistent memory and Intel® 3D NAND SSDs based on Intel® QLC Technology, Intel Xeon Scalable processors with unique built-in artificial intelligence (AI) acceleration capabilities and Intel Ethernet 800 Series Network Adapters with Application Device Queues (ADQ) technology. Intel’s leadership FPGAs for next-generation performance, flexibility and programmability will complement the solution.

In addition to the technical collaboration between the two companies, Lightbits and Intel are collaborating to provide complete solutions to customers and develop the ecosystem to drive broad adoption of these innovations. 

As a first example of the potential performance benefit this collaboration offers, Lightbits Labs demonstrated LightOS NVMe over Fabrics TCP (NVMe-oF/TCP) storage with remote direct memory access (RDMA)-class performance when accelerated with the Intel Ethernet 800 Series Network Adapter with ADQ technology. ADQ enables NVMe-oF/TCP to achieve distributed storage performance in the same range as RDMA-based protocols, while NVMe-oF/TCP enables broad adoption because of its ease of deployment and scalability.

Tuesday, September 22, 2020

Intel appoints Saf Yeboah-Amankwah as Chief Strategy Officer


 Intel appointed Safroadu (Saf) Yeboah-Amankwah as senior vice president and chief strategy officer, where he will be responsible for the global strategy office, including Intel Capital, and will work with the executive team on developing and driving growth-oriented strategies. Yeboah-Amankwah will report to CEO Bob Swan.

Yeboah-Amankwah joins Intel from McKinsey & Company, where he was most recently a senior partner and global head of the Transformation Practice for the Telecom, Media and Technology (TMT) practice, based in Washington, D.C. He is also the global lead of Client Capabilities for the TMT practice. Previously he served as managing partner for South Africa and head of McKinsey’s TMT and Digital practice for Africa, among other roles.

Yeboah-Amankwah received both his bachelor’s and master’s degrees in electrical engineering and computer science from the Massachusetts Institute of Technology. He is a former board member of the United Negro College Fund.

Wednesday, August 19, 2020

Nutanix and Intel build a joint innovation lab

Nutanix and Intel agreed to establish physical labs – with both on-site and remote access – to enable and accelerate the adoption of new Intel Technologies on Nutanix architecture,  leveraging tools and expertise to optimize joint solutions, and generating compelling proof-points for stronger marketing efforts by Nutanix and Intel. The idea is to productize Intel’s latest innovations in compute, networking, and storage with the Nutanix software stack.

“The Innovation Lab launch with Nutanix is an exciting foundation to integrate Intel’s latest and most innovative technology on the Nutanix stack,” said Jason Grebe, Corporate Vice President of Cloud & Enterprise Solutions Group at Intel. “We’re looking forward to delivering continued product performance and agility for our customers with this collaboration.”

Intel announces $10 billion stock buyback

Intel plans to repurchase an aggregate of $10 billion of its common stock.

Once this tranche is completed, Intel will have repurchased a total of approximately $17.6 billion in shares as part of the planned $20 billion share repurchases announced in October 2019.

“We achieved record financial results in the first half of 2020 and raised our full-year outlook as customers rely on Intel technology for delivering critical services and enabling people to work, learn and stay connected. As the ongoing growth of data fuels demand for Intel products to process, move and store, we are confident in our multiyear plan to deliver leadership products,” said Intel CEO Bob Swan. “While the macro-economic environment remains uncertain, Intel shares are currently trading well below our intrinsic valuation, and we believe these repurchases are prudent at this time.”