Showing posts with label Intel. Show all posts
Showing posts with label Intel. Show all posts

Friday, June 14, 2019

Intel backs early-stage start-ups in Israel

Intel is launching an incubation program focused on early-stage startup companies in Israel in key segments, including artificial intelligence (AI), autonomous systems and other data-centric technologies and business models.

The Intel Ignite program, which is based in Tel Aviv, will leverage Intel’s global market access and business and technology leadership to provide early-stage startups with unique advantages on their paths to disrupt the future.

Intel will host 10 to 15 top pre-seed to seed startups through a 20-week program where they will receive hands-on mentorship from Intel and industry experts in a variety of product, business, management and technical areas. Intel is committed to accelerate their growth and scale their ideas for greater impact.

“Intel has always worked in concert with open ecosystems to scale new technologies so they can be transformational for our customers, business and society. This process is fueled by the innovation and passion of the startup community,” said Intel CEO Bob Swan. “Israel has the deep skill base in AI, autonomous systems and the underlying technologies critical to these inflections that make it a natural choice to launch our Ignite program.”

Monday, June 10, 2019

Intel to acquire Barefoot Networks for programmable switching silicon

Intel agreed to acquire Barefoot Networks, a start-up developing programmable Ethernet switch silicon and software for use in the data center. Financial terms were not disclosed.

Intel said the acquisition will support its focus on end-to-end cloud networking and infrastructure, enabling it to better compete in the Ethernet switching segment.

Barefoot, which is based in San Jose, California, is shipping the second generation of its P4-programmable Tofino Ethernet switch application-specific integrated circuit (ASIC) family.

Tofino 2 delivers 12.8 Tbps of packet processing capacity for hyperscale data centers, cloud, enterprise and service provider networks. The device leverages 7nm process technology and is designed for full P4-programmability.

Tofino 2 highlights:

  • World’s first 7nm switch ASIC 
  • Supports up 32x400GE on a single chip.
  • Supports up to 256x10/25/50GE ports on a single chip.
  • Fully P4-programmable, enabling various deployment options, from a standard top-of-rack switch to a service provider router, or even a feature-rich switch appliance. 

  • Support for extra large table sizes for routing, tunnels, and access control lists (ACLs).
  • Support for Barefoot SPRINT- Barefoot's enhanced version of the industry-standard In-band Network Telemetry (INT), providing fine-grained per-packet intelligent real-time visibility of network traffic. 
  • Leverages the growing industry-wide P4 Ecosystem supported by multiple switch and network interface controller (NIC) chips.
  • Modular architecture enabling rapid integration of 112G SerDes and silicon photonics.
Tofino 2 was announced in December 2018. Customers cited in the Barefoot press release include Goldman Sachs, Cisco, Alibaba Infrastructure Services, Tencent, Baidu, JD Cloud, and Ucloud. Barefoot has also announced design wins with Arista, Edgecore and others.

https://www.barefootnetworks.com/
https://newsroom.intel.com/editorials/intel-acquire-barefoot-networks/#gs.i7cnfy

Founded in 2013, Barefoot is backed by investors including Andreessen Horowitz, Lightspeed Venture Partners and Sequoia Capital. The company has raised approximately $155 million in five funding rounds, most recently raising $23 million in November 2016 in a round led by Alibaba and Tencent.


Thursday, May 9, 2019

Verizon tests full virtualization of baseband functions

In a trial environment conducted with Nokia and Intel in California, Verizon achieved full virtualization of baseband functions – the heaviest portion of computing on the Radio Access Network (RAN).

Intel provided its Xeon Scalable processor-based platforms and FlexRAN reference architecture while Nokia provided its new AirScale All-in-Cloud Base Station architecture.

Verizon said this virtualization will enable the network to be hardware agnostic, using Common Off-The-Shelf (COTS) hardware, leading to greater flexibility and speed to deployment of products and services.

“Having virtualized the core of the network last year, this significant step forward in virtualizing the RAN edge is a critical piece of providing the next generation of wireless solutions for consumers and enterprises,” said Adam Koeppe, Senior Vice President of Network Planning.  “With a virtualized baseband unit, we will lay the foundation to be able to move computing functionality to the edge of the network and will be able to rapidly respond to customers’ varied latency and computing needs.”

"Nokia is a leader in driving and commercializing Cloud RAN innovations, and we are excited to be a part of this collaborative work that represents a key milestone for Verizon’s cloud migration,” said Michael Clever, Senior Vice President and Head of Cloud RAN, Nokia. “This successful trial is an important step in offering flexible and scalable capacity, plus continuous software delivery.”

https://www.verizon.com/about/news/verizon-multi-access-edge-compute-network-slicing

Thursday, April 25, 2019

Intel's data centric revenue dips 5%

Intel reported first quarter revenue of $16.1 billion, flat year-over-year (YoY), with GAAP earnings-per-share (EPS) of $0.87, a decline of 6 percent YoY.

Intel's data-centric revenue declined 5 percent while PC-centric revenue grew 4 percent. The company also trimmed its outlook for the rest of the year.

"Results for the first quarter were slightly higher than our January expectations. We shipped a strong mix of high-performance products and continued spending discipline while ramping 10nm and managing a challenging NAND pricing environment. Looking ahead, we're taking a more cautious view of the year, although we expect market conditions to improve in the second half," said Bob Swan, Intel CEO.

Highlights:

  • In the Data Center Group (DCG), the cloud segment grew 5 percent while the communications service provider segment declined 4 percent and enterprise and government revenue declined 21 percent. 
  • First-quarter Internet of Things Group (IOTG) revenue grew 8 percent YoY (19 percent excluding Wind River1), and Mobileye achieved record first-quarter revenue of $209 million, up 38 percent YoY as customer momentum continued. 
  • Intel's memory business (NSG) was down 12 percent YoY in a challenging pricing environment. 
  • Intel's Programmable Solutions Group (PSG) revenue was down 2 percent YoY in the first quarter.

Tuesday, April 16, 2019

Intel acquires Omnitek for FPGA expertise

Intel has acquired Omnitek, a provider of optimized video and vision FPGA IP solutions based in Basingstoke, England. Financial terms were not disclosed.

Omnitek was founded in 1998 and has developed over 220 FPGA IP cores and accompanying software including performance-leading solutions for WARP, ISP processing and video connectivity. Omnitek enables customized high-performance vision and artificial intelligence (AI) inferencing capabilities on FPGAs for customers across a range of end markets.

“Omnitek’s technology is a great complement to our FPGA business. Their deep, system-level FPGA expertise and high-performance video and vision-related technology have made them a trusted partner for many of our most important customers. Together, we will deliver leading FPGA solutions for video, vision and AI inferencing applications on Intel FPGAs and speed time-to-market for our existing customers while winning new ones,” Dan McNamara, Intel senior vice president and general manager of the Programmable Solutions Group.

“From data centers to devices, compute-intensive applications like 8K video and artificial intelligence require a multitude of innovative compute engines. FPGA devices play an increasingly critical role, often complementing other processing architectures, and Intel is at the center of this revolution,” said Roger Fawcett, CEO of Omnitek. “Omnitek is excited and extremely proud to bring our intellectual property and engineers to join the talented team in Intel’s Programmable Solutions Group.”

Wednesday, April 3, 2019

Intel to introduce 100G Ethernet adapter

Intel announced its first Ethernet 800 Series adapter with Application Device Queues (ADQ) technology, which increases application response time predictability while reducing application latency and improving throughput.

The Intel Ethernet 800 series adapter features up to 100Gbps port speeds and is aimed at moving massive amounts of data in cloud, communications, storage and enterprise market segments.

Intel has shipped over 1.3 billion Ethernet ports to date.

https://newsroom.intel.com/news-releases/intel-data-centric-launch/

Tuesday, April 2, 2019

Intel Xeon processors pack up to 56 cores, add capabilities

The 2nd-Gen Intel Xeon Scalable platform will deliver an evolutionary leap in agility and scalability.

At Intel’s “Data-Centric Innovation Day” in San Francisco, the company outlined many new Xeon benchmarks and capabilities:

  • Support for Intel Optane DC persistent memory, delivering up-to 36TB of system-level memory capacity when combined with traditional DRAM.
  • Intel Turbo Boost Technology 2.0 ramps up-to 4.4GHz, alongside memory subsystem enhancements with support for DDR4-2933 MT/s and 16 Gb DIMM densities.
  • Built-in Intel Deep Learning Boost delivers up to 14x2 inference throughput improvement, and combined with software optimized Intel Distribution of OpenVINO toolkit
  • Intel Speed Select will enable new Xeon Scalable processors to be configured to performance settings of core counts and frequencies, effectively creating “Three CPUs in One.”
  • Enhanced Intel Infrastructure Management Technologies will enable increased utilization and workload optimization across data center resources.
  • New side-channel protections are directly incorporated into hardware.
  • Intel Security Libraries for Data Center (Intel SecL-DC) is designed to simplify the integration and deployment of hardware-rooted Intel security technologies at cloud scale. Intel SecL-DC brings optimized programming interfaces and management tools for many Intel security technologies together in one easy-to-use set of libraries and tools compatible with cloud environments like OpenStack, Docker and Kubernetes Extensions. 
  • For security-sensitive organizations, Intel engineers have worked with Lockheed Martin to deliver a new hardened virtualization platform. This Intel Select Solution for Hardened Security with Lockheed Martin is a full-stack solution, from hardware through hypervisor that features greater data confidentiality through VM memory encryption and cache isolation. It offers robust platform integrity with trusted boot all the way through to runtime, and improved availability through more deterministic Quality of Service and protections from Noisy Neighbors.
  • The new Intel Xeon Platinum 9200 processors feature up to 56 cores and 12 memory channels to deliver breakthrough levels of performance with the highest Intel architecture FLOPS per rack, along with the highest DDR4 native memory bandwidth support of any Intel Xeon processor platform.
  • The new Intel Xeon Platinum Processor (8200 Series) will offer up to 28 cores and 2, 4 and 8+ socket configurations.
  • The Intel Xeon Gold Processor (6200 Series) is Networking Specialized (NFVi optimized) with Intel Speed Select Technology – Base Frequency. It offers up to 1.76x NFV workload perf improvement and additional flexibility to enable up to 8 high-priority cores that support virtualized workload acceleration for maximum performance and power efficiency. It scales to up to 24 cores.

https://newsroom.intel.com/news/fact-sheet-intel-unveils-new-technologies-accelerate-innovation-data-centric-world/#gs.3lgjeu



Intel's 10nm Agilex FPGA targets embedded, network and data centers

Intel introduced its new  Intel an"Agilex" field programmable gate array (FPGA) family targetted at embedded, network and data center markets.

The Intel Agilex family combines FPGA fabric built on Intel’s 10nm process with innovative heterogeneous 3D SiP technology. This provides the capability to integrate analog, memory, custom computing, custom I/O, and Intel eASIC device tiles into a single package with the FPGA fabric.

Intel delivers a custom logic continuum with reusable IPs through a migration path from FPGA to structured ASIC. One API provides a software-friendly heterogeneous programming environment, enabling software developers to easily access the benefits of FPGA for acceleration.

Intel said the new product is the first FPGA to support Compute Express Link, a cache and memory coherent interconnect to future Intel Xeon Scalable processors.

Agilex also supports 2nd-generation HyperFlex Architecture, which offers up to 40 percent higher performance, or up to 40 percent lower total power compared with Intel Stratix 10 FPGAs. The new Agilex family is also the only FPGA supporting hardened BFLOAT16 and up to 40 teraflops of digital signal processor (DSP) performance (FP16). It also supports Peripheral component interconnect express (PCIe) Gen 5.

The Agilex transceiver supports up to 112 Gbps data rates. Advanced memory support includes DDR5, HBM, and Intel Optane DC persistent memory.

“The race to solve data-centric problems requires agile and flexible solutions that can move, store and process data efficiently. Intel Agilex FPGAs deliver customized connectivity and acceleration while delivering much needed improvements in performance and power1,2 for diverse workloads," stated Dan McNamara, Intel senior vice president, Programmable Solutions Group.

https://newsroom.intel.com/news/intel-driving-data-centric-world-new-10nm-intel-agilex-fpga-family/#gs.3lgdg8

George Davis leaves Qualcomm to join Intel as CFO

Intel announced the appointment of George S. Davis as executive vice president and chief financial officer (CFO).

Davis, 61, joins Intel from Qualcomm Inc., where he served as executive vice president and CFO since March 2013. At Qualcomm, Davis served on the company’s executive committee and was responsible for leading the global finance organization, IT and investor relations. Prior to Qualcomm, Davis served six years as CFO for Applied Materials, with responsibility for finance, IT, strategy and corporate development, as well as government relations.

“I’m thrilled to be joining the Intel team,” Davis said. “With demand for the analysis, transmission and storage of data growing faster than ever, no company in the world is better positioned to capitalize on that opportunity than Intel. It’s an exciting time for Intel, and I’m looking forward to playing a role in the company’s transformation.”

Monday, April 1, 2019

Intel Capital invests in 14 start-ups

Intel Capital announced new investments totaling $117 million in the following 14 startups:

AI

Cloudpick Limited (Shanghai, China) is a smart retail technology provider. With proprietary computer vision, deep learning, sensor fusion and edge computing technologies, Cloudpick enables highly digitized, intelligent, cashier-free stores with grab-and-go shopping experiences. Cloudpick has collaborated with e-commerce companies, traditional retailers and payment partners worldwide to upgrade many brick-and-mortar stores’ shopping experiences.

SambaNova Systems (Palo Alto, California, U.S.) is a rapidly growing Silicon Valley-based company that is building the industry’s most advanced systems platform to run AI applications from the data center to the edge. Founded by industry pioneers and experts in systems hardware and software design from Oracle, Sun Microsystems and Stanford University, SambaNova Systems’ mission is to bring AI innovations discovered in deep research to enterprises and organizations in all industries around the world, creating AI for everyone, everywhere.

Untether AI (Toronto, Ontario, Canada) is developing ultra-efficient, high-performance AI chips that will be the foundation for the next wave of innovation in AI. Untether AI has invented an entirely new type of chip architecture that is specifically designed for neural net inference by eliminating bottlenecks in data movement. This unique architecture moves data 1,000 times faster than traditional architectures, resulting in extreme performance and efficiency. The company was founded by a team of scientists, engineers and experienced entrepreneurs who have successfully brought to market more than 1 billion chips.

Zhuhai EEasy Technology Co. Ltd. (Zhuhai, China) is an AI system-on-chip (SoC) design house and total solution provider. Its offerings include AI acceleration; image and graphic processing; video encoding and decoding; and mixed-signal ULSI design capabilities. Its AI SoCs targeting video, automotive and smart devices will enter mass-production in late 2019.

Communications

Mighty Networks (Palo Alto, California, U.S.) is designed for brands and businesses to bring people together by offering community, content, online courses and subscription commerce in one place. The company is unique in serving a new breed of digitally native “creators with a purpose” selling experiences, connections and expertise to their followers – an emerging category of digital services called Experiential Commerce.

Pixeom (Santa Clara, California, U.S.) is redefining how enterprises manage hybrid cloud resources with its edge computing software platform that re-creates and orchestrates cloud functionality on-premise. It makes it easy to deploy and manage large-scale, geographically distributed infrastructure and workloads.

Polystream (Guildford, U.K.) is a deep-tech startup fundamentally changing how video games and demanding 3D applications are delivered via the cloud. Polystream’s Software Defined Imaging technology enables interactive graphics content to be streamed at unprecedented scale, with truly global reach.

Tibit Communications (Petaluma, California, U.S.) is developing next-generation devices to provide a broadband onramp to the home, office or cell site, managed virtually from the cloud to the user. Tibit replaces dedicated hardware boxes in carrier and enterprise networks with a small module connected to a standard Ethernet switch – providing significant savings of cost, power and space.

Healthcare

Medical Informatics Corp. (Houston, Texas, U.S.) is a software-based monitoring and analytics company. Its revolutionary Sickbay* platform archives, aggregates and transforms otherwise not-recorded, high-resolution waveform data across disparate devices to enable anywhere, anytime remote monitoring across the continuum of care. The same platform can then be leveraged to use machine learning and AI to deploy real-time, predictive, critical care analytics that get ahead of deterioration and risk and enable data-driven medicine and patient-centered care.

https://www.revealbio.com/Reveal Biosciences, Inc. (San Diego, California, U.S.) is creating a new generation of data-powered pathology to improve global healthcare. ImageDx, a proprietary deep-learning platform, delivers pathologists and scientists a novel class of actionable, quantitative data to accelerate research and enhance patient care.

Manufacturing

Landing AI (Palo Alto, California, U.S.) provides AI-powered SaaS solutions and corporate-level AI transformation programs to turn enterprises into AI companies. Founded by Dr. Andrew Ng, the Landing AI team enables companies in industries, including manufacturing and agriculture, to develop and execute cohesive AI strategies.

OnScale (Cupertino, California, U.S.) offers on-demand scalable engineering simulation software, empowering engineers to accelerate innovation across multiple industries, including next-generation technologies such as MEMS IoT, 5G, biomedicine and autonomous vehicles. OnScale combines powerful multiphysics solver technology, used and validated by Fortune 50 companies for over 30 years, with the speed and flexibility of cloud high-performance computing (HPC). By removing the constraints of legacy simulation tools, OnScale allows engineers to dramatically reduce cost, risk and time to market for cutting-edge technologies.

proteanTecs (Haifa, Israel) develops revolutionary Universal Chip Telemetry for electronic systems throughout their entire lifecycle, increasing their performance and reliability. By applying machine learning to novel data created by embedded agents, proteanTecs provides meaningful insights unattainable until today, leading to new levels of quality, reliability and scale.

Qolibri, Inc. (Roseville, California, U.S.) is a creative technical company developing breakthrough proprietary solutions that address problems in semiconductor subfabs. The Qolibri team has extensive expertise in semiconductor capital equipment technology and renewable energy. Qolibri technologies will change the landscape of the subfab, leading to substantially reduced chip manufacturing costs with positive environmental impact.

“Intel has driven disruption for the last 50 years, changing the way we live by making compute ubiquitous. Intel Capital is continuing that legacy of disruption with these investments,” said Wendell Brooks, Intel senior vice president and president of Intel Capital. “These companies are shifting the way we think about artificial intelligence, communications, manufacturing and health care – areas that will become increasingly essential in coming years as the linchpins of a smarter, more connected society.”

The investments extend Intel Capital’s recent strategy of taking larger, more strategic positions in portfolio startups. Each year, Intel Capital puts $300 million to $500 million into innovative companies across a wide range of emerging technologies making the impossible possible.

Monday, March 25, 2019

Intel's board extends chairman's term to 2020

Intel's board of directors has extended Andy Bryant’s term as Intel chairman for one additional year, to help support Intel’s leadership transition.

If Bryant is re-elected at Intel’s 2019 annual stockholders’ meeting, his term as chairman would continue through the conclusion of Intel’s 2020 annual stockholders’ meeting. Bryant has informed the board that he does not expect to stand for re-election again in 2020.

“I am honored to be nominated to serve as a director and Intel’s chairman for another year,” Bryant said. “If re-elected by the stockholders at our annual meeting in May, I look forward to continuing to work with Bob, the board and the entire executive team to continue Intel’s historic transformation to a data-centric company. I expect this would be my last year of service as a member of Intel’s board.”

Tuesday, March 5, 2019

Intel integrates 58Gbps transceiver on its Stratix 10 TX FPGA

Intel’s Programmable Solutions Group has integrated 58Gbps transceiver technology on its Stratix 10 TX field programmable gate array (FPGA). The 58Gbps PAM4 transceiver technology now shipping in volume production and enabling 400Gb Ethernet deployment.

“As we continue to deliver product innovations and capabilities that allow for higher data ingest and processing speeds critical for networking and data center applications, this is a powerful example of how Intel FPGAs bring real value to our customers,” stated Dan McNamara, Intel senior vice president and general manager of the Programmable Solutions Group.

By supporting dual-mode modulation, 58Gbps PAM4 and 30Gbps NRZ, new infrastructure can reach 58Gbps data rates while staying backward-compatible with existing network infrastructure.

“The 400Gb Ethernet and QSFP-DD market is evolving at a fast pace. And being first to market with a portable solution is instrumental to enable the transition from lab to the field. We were excited to work closely with Intel to deliver our next-generation test module with the only production FPGA technology supporting native 58Gbps PAM4,” says Ildefonso M. Polo, vice president of Product Marketing at VeEX.

Tuesday, February 26, 2019

Fibocom intros 5G module based on Intel XMM 8160 modem

Shenzhen-based FIBOCOM Wireless introduced an Intel-powered 5G module for vertical applications in global markets.

FG100 is a multi-mode 5G module that includes EN-DC (LTE+5G), 5GNR-FDD/TDD, LTE-FDD/TDD and 3G WCDMA, supports 5G Sub-6 GHz internally, and mmW through an external antenna module. The module supports peak downlink speeds of up 6Gbps on mmW and 4Gbps on Sub-6 GHz.

“We at Fibocom are proud to present our first 5G module based on Intel’s XMM 8160 5G modem. 5G allows for enhanced experience in speed and capacity with ultra-low latency”, says Tiger Ying, CEO Fibocom. “Building upon our established M.2 modules portfolio with Intel modems, our FG100 enables our customers the natural migration with easy integration from 4G to 5G.”

Partners including D-Link, Gemtek and VVDN will deliver gateway platforms using the Fibocom L860 gigabit LTE M.2 module with plans to upgrade to the FG100 5G M.2 module when available.
Sampling is expected this year, with commercial availability in 2020.

http://www.fibocom.com

Monday, February 11, 2019

Ericsson and Intel to align 5G infrastructure development

Ericsson and Intel have launched a multi-year collaboration to align ongoing development efforts in software-defined infrastructure (SDI) and Intel Rack Scale Design.

The companies envision a next-generation infrastructure management platform capable of delivering a new level of cloudlike agility, transparency and efficiency required for Network Functions Virtualization (NFV), distributed cloud, and 5G. Specifically, this hardware management platform will extend the agility of the cloud to the hardware infrastructure layer.

As part of the multi-faceted agreement, the companies will align the development efforts of Ericsson SDI Manager software and Intel Rack Scale Design (Intel RSD) and extend these solutions with advanced management capabilities. These unified development efforts will allow operators to leverage multi-vendor hardware options, Ericsson’s end-to-end software solutions, and Intel’s latest architectural innovations.

In addition, the companies will converge Ericsson SDI Manager software and Intel RSD reference software while maintaining full backward compatibility for current customers. Jointly-developed software and hardware innovations resulting from the collaboration will be offered in subsequent Ericsson hardware platforms and may also be offered with Intel’s server products which are sold through other partners and in other industry segments.

Ericsson SDI system is based on Intel RSD and provides a common managed hardware pool for all workloads that dynamically scales and enables fast service rollout, performance optimization and efficient hardware utilization. Intel RSD is an industry-wide architecture for disaggregated, composable infrastructure that fundamentally changes the way a data center is built, managed, and expanded over time.

Lars MÃ¥rtensson, Head of Cloud & NFV infrastructure, Business Area Digital Services, Ericsson, says: “We have long history of successful collaboration with Intel. This new collaboration will focus on software in addition to hardware and we see it to be truly transformative for service providers’ ability to successfully deploy open cloud and NFV infrastructure, from centralized datacenters to the edge. Intel’s and Ericsson’s joint efforts significantly strengthens the competitiveness and roadmap of the Ericsson Software Defined Infrastructure offering.”

Sandra Rivera, Senior Vice President, Network Platform Group, Intel, says: “5G will be transformative, accelerating today’s applications and triggering a wave of new usages and edge-based innovation. Our infrastructure manageability collaboration with Ericsson will help communications service providers remove deployment barriers, reduce costs, and deliver new 5G and edge services with cloudlike speed on a flexible, programmable and intelligent network.”

Monday, February 4, 2019

Intel invests in Catalytic, Fortanix, Pliops

Intel Capital announced investments in three startups:

  • Catalytic (Chicago) -- offers a SaaS intelligent automation platform that can remove many of a business’ manual data processing tasks. The platform has more than 200 actions that enable users to rapidly build an intelligent automation layer to process data, documents, emails, websites and systems. In addition to reducing manual effort, Catalytic shortens cycle time and improves accuracy.  Intel led the Series B round of funding, which amounted to $23 million. Other investors include Redline Capital, NEA, Boldstart, and Hyde Park Angels. https://catalytic.com/
  • Fortanix (Mountain View, California) -- allows customers to more securely operate even the most sensitive applications without having to trust the cloud. The company provides unique deterministic security by encrypting applications and data everywhere – at rest, in motion and in use – with its Runtime Encryption technology built upon Intel SGX. Intel led the Series B round of funding, which amounted to $23 million. Other investors include Foundation Capital and Neotribe. https://www.fortanix.com/
  • Pliops (Ramat Gan, Israel) -- a new category of storage processor that enables cloud and enterprise data centers to access data up to 50x faster with 1/10th of the computational load and power consumption. The Pliops storage processor allows cloud databases like MySQL or Cassandra deployed on disaggregated Flash to scale more efficiently via a 90% reduction in compute load, a 20x reduction in network traffic, a 50x improvement to latency and over 10x application throughput. Pliops recently raised $30 million in Series B funding led by Softbank Ventures Asia, with participation from all Series A investors including Intel Capital, State of Mind Ventures (SOMV) and Viola Ventures, along with strategic investors Western Digital Capital and Xilinx.  http://www.pliops.com/

“The cloud has been one of the most transformative trends in enterprise computing – boosting productivity, cutting costs and creating flexible environments. But cloud adoption still faces momentous challenges, including security risks and an exponential rise in computing complexity. That’s why we’re pleased to announce new investments in three exceptional companies that will help overcome these challenges,” stated Mauro D’Amato and Sunil Kurkure, investment directors at Intel Capital.

Thursday, January 31, 2019

Intel appoints Bob Swan as CEO

Intel's board of directors named Robert (Bob) Swan as chief executive officer.

Swan, 58, who has been serving as Intel’s interim CEO for seven months and as chief financial officer since 2016, is the seventh CEO in Intel’s 50-year history. Swan has also been elected to Intel’s board of directors.  Prior to joining Intel, Swan served as an operating partner at General Atlantic LLC and served on Applied Materials’ board of directors. He previously spent nine years as CFO of eBay Inc., where he is currently a director. Earlier in his career, he was CFO of Electronic Data Systems Corp. and TRW Inc.

“As Intel continues to transform its business to capture more of a large and expanding opportunity that includes the data center, artificial intelligence and autonomous driving, while continuing to get value from the PC business, the board concluded after a thorough search that Bob is the right leader to drive Intel into its next era of growth,” said Chairman Andy Bryant. “The search committee conducted a comprehensive evaluation of a wide range of internal and external candidates to identify the right leader at this critical juncture in Intel’s evolution. We considered many outstanding executives and we concluded the best choice is Bob. Important in the board’s decision was the outstanding job Bob did as interim CEO for the past seven months, as reflected in Intel’s outstanding results in 2018. ”


Krzanich resigns as Intel CEO due to inappropriate relationship

Brian Krzanich resigned as Intel's CEO and as a member of its board of directors because of a past consensual relationship with an Intel employee. Intel said it was recently informed of the relationship and that an investigation by internal and external counsel confirmed a violation of Intel’s non-fraternization policy.

Intel's board named Chief Financial Officer Robert Swan as interim CEO, effective immediately.


  • Brian Krzanich was named CEO of Intel in May 2013. He served previously as Intel's chief operating officer. Krzanich joined Intel in 1982.

Thursday, January 24, 2019

Intel grew 13% in 2018 but outlook disappoints

Intel reported Q4 2018 revenue of $18.7 billion, up 9 percent year-over-year (YoY); and full-year revenue set an all-time record of $70.8 billion, up 13 percent YoY. Q4 earnings per share amounted to $1.12 ($1.28 on a non-GAAP basis);

The Q4 results, however, fell short of analyst expectations, as did the company's outlook for 2019. Data center revenues came in below market expectations. The company has not yet appointed a permanent CEO. Intel said it remains on-track to launch 10nm products in volume during 2019.

“2018 was a truly remarkable year for Intel with record revenue in every business segment and record profits as we transform the company to pursue our biggest market opportunity ever,” said Bob Swan, Intel CFO and Interim CEO. “In the fourth quarter, we grew revenue, expanded earnings and previewed new 10nm-based products that position Intel to compete and win going forward. Looking ahead, we are forecasting another record year and raising the dividend based on our view that the explosive growth of data will drive continued demand for Intel products.”


Some highlights:

The PC-centric business (CCG) was up 10 percent in the fourth quarter due to continued strong demand for Intel's higher performance products and strength in commercial and gaming. CCG expanded its product portfolio for 2019 with the recent launch of new 9th Gen Intel® Core™ processors and unveiled "Ice Lake" the upcoming, 10nm-based PC processor, which is expected to be in OEM systems on shelves for holiday, 2019.

Collectively, Intel's data-centric businesses grew 9 percent YoY in the quarter and 20 percent YoY in 2018. In the fourth quarter, DCG achieved 24 percent cloud segment growth and 12 percent communications service provider segment growth while enterprise revenue declined 5 percent. Intel recently announced that the new "Cascade Lake" family of high performance Intel® Xeon® processors with advanced AI and memory capabilities is now shipping.

Fourth-quarter Internet of Things Group (IOTG) revenue declined 7 percent YoY. However, excluding Wind River, which Intel divested in the second quarter, fourth-quarter IOTG revenue was up 4 percent YoY despite supply tightness. Record quarterly revenue in Intel's memory business (NSG) was up 25 percent YoY. Intel's Programmable Solutions Group (PSG) also achieved record quarterly revenue, up 8 percent YoY driven by strength in the data center and communications market segments.

Mobileye fourth-quarter revenue of $183 million was up 43 percent YoY as customer momentum continued. In 2018, Mobileye achieved 28 new design wins and 78 vehicle model launches.

Wednesday, January 23, 2019

Airtel rolls out LTE 900 in Andhra Pradesh and Telangana

Airtel has begun rolling out LTE in the 900 Mhz spectrum band in the states of Andhra Pradesh and Telangana.

In Andhra Pradesh and Telangana, Airtel is already using 2300 Mhz (TD LTE) and 1800 Mhz (FD LTE) for its 4G network. The 900 Mhz deployment boosts in-building penetration. The carrier said it is also working on Massive MIMO and 4G Advanced and Carrier Aggregation to step up high speed network capacity and coverage.     

Recently, the company announced that it will expand its network in the Andhra Pradesh by rolling out 15,000 new sites and 3,000 km of optic fiber during FY 19 under its network transformation program – Project Leap.


Wednesday, January 9, 2019

MaxLinear partners with Intel on 10G DOCSIS 3.1 home gateways

MaxLinear is working with Intel on the home gateway designs supporting 10 Gigabit Full Duplex DOCSIS 3.1 (FDX) cable services.

Specifically, MaxLinear is currently developing a new front-end SoC for these platforms based on its patented Full-Spectrum Capture (FSC) technology that includes diagnostic and spectrum management capabilities. The front-end will include high-speed connectivity to Intel’s next-generation gateway SoC. Intel’s SoC will offer powerful computing and networking performance and is architected for a wide range of WAN, LAN and WLAN use cases to help MSOs achieve optimal performance and improve Quality of Service (QoS).

MaxLinear said its IC, along with Intel’s next-generation gateway SoC, will be highly optimized to provide the greatest level of integration while maintaining system design flexibility to support future evolution of implementations. The modular nature of this solution ensures a simple, non-disruptive, path to potential future DOCSIS standards. Samples of the MaxLinear chips and reference designs are expected in the second half of 2019. Mass production is targeted for 2020.

“10 Gigabit and symmetrical performance are the next wave of services needed in broadband and FDX is a significant step forward for home connectivity,” said Will Torgerson, Vice President & General Manager of the MaxLinear Broadband Group.

“The growing number of devices, large amounts of data and immersive experiences in the home are going to require 10 Gigabit connectivity that deliver faster speeds and more capacity,” said WK Tan, Vice President and General Manager, Intel’s Connected Home Division. “That is why Intel, the cable industry, and companies such as MaxLinear, are working together to deliver cutting-edge 10 Gigabit technologies to power tomorrow’s ultra-connected homes.”

Tuesday, December 18, 2018

Dr. Richard Uhlig to serve as Managing Director of Intel Labs

Dr. Richard Uhlig has been named as the new managing director of Intel Labs. Prior to this role, Rich was the director of Systems and Software Research in Intel Labs, where he led research efforts in virtualization, cloud-computing systems, software-defined networking, big-data analytics, machine learning and artificial intelligence. He joined Intel in 1996 and led the definition of multiple generations of virtualization architecture for Intel processors and platforms, known collectively as Intel Virtualization Technology (Intel® VT). Rich earned his Ph.D. in computer science and engineering from the University of Michigan.

“The work we are doing at Intel Labs is pushing the boundaries of technology every day whether that’s our research in quantum and neuromorphic computing or how we’re extending and evolving Moore’s Law. We have some of the brightest minds working together across industry and academia to solve some of the biggest challenges in technology. I am very excited to lead Intel Labs in this data-centric era,” stated Uhlig.

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