Showing posts with label Intel. Show all posts
Showing posts with label Intel. Show all posts

Tuesday, March 5, 2019

Intel integrates 58Gbps transceiver on its Stratix 10 TX FPGA

Intel’s Programmable Solutions Group has integrated 58Gbps transceiver technology on its Stratix 10 TX field programmable gate array (FPGA). The 58Gbps PAM4 transceiver technology now shipping in volume production and enabling 400Gb Ethernet deployment.

“As we continue to deliver product innovations and capabilities that allow for higher data ingest and processing speeds critical for networking and data center applications, this is a powerful example of how Intel FPGAs bring real value to our customers,” stated Dan McNamara, Intel senior vice president and general manager of the Programmable Solutions Group.

By supporting dual-mode modulation, 58Gbps PAM4 and 30Gbps NRZ, new infrastructure can reach 58Gbps data rates while staying backward-compatible with existing network infrastructure.

“The 400Gb Ethernet and QSFP-DD market is evolving at a fast pace. And being first to market with a portable solution is instrumental to enable the transition from lab to the field. We were excited to work closely with Intel to deliver our next-generation test module with the only production FPGA technology supporting native 58Gbps PAM4,” says Ildefonso M. Polo, vice president of Product Marketing at VeEX.

Tuesday, February 26, 2019

Fibocom intros 5G module based on Intel XMM 8160 modem

Shenzhen-based FIBOCOM Wireless introduced an Intel-powered 5G module for vertical applications in global markets.

FG100 is a multi-mode 5G module that includes EN-DC (LTE+5G), 5GNR-FDD/TDD, LTE-FDD/TDD and 3G WCDMA, supports 5G Sub-6 GHz internally, and mmW through an external antenna module. The module supports peak downlink speeds of up 6Gbps on mmW and 4Gbps on Sub-6 GHz.

“We at Fibocom are proud to present our first 5G module based on Intel’s XMM 8160 5G modem. 5G allows for enhanced experience in speed and capacity with ultra-low latency”, says Tiger Ying, CEO Fibocom. “Building upon our established M.2 modules portfolio with Intel modems, our FG100 enables our customers the natural migration with easy integration from 4G to 5G.”

Partners including D-Link, Gemtek and VVDN will deliver gateway platforms using the Fibocom L860 gigabit LTE M.2 module with plans to upgrade to the FG100 5G M.2 module when available.
Sampling is expected this year, with commercial availability in 2020.

http://www.fibocom.com

Monday, February 11, 2019

Ericsson and Intel to align 5G infrastructure development

Ericsson and Intel have launched a multi-year collaboration to align ongoing development efforts in software-defined infrastructure (SDI) and Intel Rack Scale Design.

The companies envision a next-generation infrastructure management platform capable of delivering a new level of cloudlike agility, transparency and efficiency required for Network Functions Virtualization (NFV), distributed cloud, and 5G. Specifically, this hardware management platform will extend the agility of the cloud to the hardware infrastructure layer.

As part of the multi-faceted agreement, the companies will align the development efforts of Ericsson SDI Manager software and Intel Rack Scale Design (Intel RSD) and extend these solutions with advanced management capabilities. These unified development efforts will allow operators to leverage multi-vendor hardware options, Ericsson’s end-to-end software solutions, and Intel’s latest architectural innovations.

In addition, the companies will converge Ericsson SDI Manager software and Intel RSD reference software while maintaining full backward compatibility for current customers. Jointly-developed software and hardware innovations resulting from the collaboration will be offered in subsequent Ericsson hardware platforms and may also be offered with Intel’s server products which are sold through other partners and in other industry segments.

Ericsson SDI system is based on Intel RSD and provides a common managed hardware pool for all workloads that dynamically scales and enables fast service rollout, performance optimization and efficient hardware utilization. Intel RSD is an industry-wide architecture for disaggregated, composable infrastructure that fundamentally changes the way a data center is built, managed, and expanded over time.

Lars MÃ¥rtensson, Head of Cloud & NFV infrastructure, Business Area Digital Services, Ericsson, says: “We have long history of successful collaboration with Intel. This new collaboration will focus on software in addition to hardware and we see it to be truly transformative for service providers’ ability to successfully deploy open cloud and NFV infrastructure, from centralized datacenters to the edge. Intel’s and Ericsson’s joint efforts significantly strengthens the competitiveness and roadmap of the Ericsson Software Defined Infrastructure offering.”

Sandra Rivera, Senior Vice President, Network Platform Group, Intel, says: “5G will be transformative, accelerating today’s applications and triggering a wave of new usages and edge-based innovation. Our infrastructure manageability collaboration with Ericsson will help communications service providers remove deployment barriers, reduce costs, and deliver new 5G and edge services with cloudlike speed on a flexible, programmable and intelligent network.”

Monday, February 4, 2019

Intel invests in Catalytic, Fortanix, Pliops

Intel Capital announced investments in three startups:

  • Catalytic (Chicago) -- offers a SaaS intelligent automation platform that can remove many of a business’ manual data processing tasks. The platform has more than 200 actions that enable users to rapidly build an intelligent automation layer to process data, documents, emails, websites and systems. In addition to reducing manual effort, Catalytic shortens cycle time and improves accuracy.  Intel led the Series B round of funding, which amounted to $23 million. Other investors include Redline Capital, NEA, Boldstart, and Hyde Park Angels. https://catalytic.com/
  • Fortanix (Mountain View, California) -- allows customers to more securely operate even the most sensitive applications without having to trust the cloud. The company provides unique deterministic security by encrypting applications and data everywhere – at rest, in motion and in use – with its Runtime Encryption technology built upon Intel SGX. Intel led the Series B round of funding, which amounted to $23 million. Other investors include Foundation Capital and Neotribe. https://www.fortanix.com/
  • Pliops (Ramat Gan, Israel) -- a new category of storage processor that enables cloud and enterprise data centers to access data up to 50x faster with 1/10th of the computational load and power consumption. The Pliops storage processor allows cloud databases like MySQL or Cassandra deployed on disaggregated Flash to scale more efficiently via a 90% reduction in compute load, a 20x reduction in network traffic, a 50x improvement to latency and over 10x application throughput. Pliops recently raised $30 million in Series B funding led by Softbank Ventures Asia, with participation from all Series A investors including Intel Capital, State of Mind Ventures (SOMV) and Viola Ventures, along with strategic investors Western Digital Capital and Xilinx.  http://www.pliops.com/

“The cloud has been one of the most transformative trends in enterprise computing – boosting productivity, cutting costs and creating flexible environments. But cloud adoption still faces momentous challenges, including security risks and an exponential rise in computing complexity. That’s why we’re pleased to announce new investments in three exceptional companies that will help overcome these challenges,” stated Mauro D’Amato and Sunil Kurkure, investment directors at Intel Capital.

Thursday, January 31, 2019

Intel appoints Bob Swan as CEO

Intel's board of directors named Robert (Bob) Swan as chief executive officer.

Swan, 58, who has been serving as Intel’s interim CEO for seven months and as chief financial officer since 2016, is the seventh CEO in Intel’s 50-year history. Swan has also been elected to Intel’s board of directors.  Prior to joining Intel, Swan served as an operating partner at General Atlantic LLC and served on Applied Materials’ board of directors. He previously spent nine years as CFO of eBay Inc., where he is currently a director. Earlier in his career, he was CFO of Electronic Data Systems Corp. and TRW Inc.

“As Intel continues to transform its business to capture more of a large and expanding opportunity that includes the data center, artificial intelligence and autonomous driving, while continuing to get value from the PC business, the board concluded after a thorough search that Bob is the right leader to drive Intel into its next era of growth,” said Chairman Andy Bryant. “The search committee conducted a comprehensive evaluation of a wide range of internal and external candidates to identify the right leader at this critical juncture in Intel’s evolution. We considered many outstanding executives and we concluded the best choice is Bob. Important in the board’s decision was the outstanding job Bob did as interim CEO for the past seven months, as reflected in Intel’s outstanding results in 2018. ”


Krzanich resigns as Intel CEO due to inappropriate relationship

Brian Krzanich resigned as Intel's CEO and as a member of its board of directors because of a past consensual relationship with an Intel employee. Intel said it was recently informed of the relationship and that an investigation by internal and external counsel confirmed a violation of Intel’s non-fraternization policy.

Intel's board named Chief Financial Officer Robert Swan as interim CEO, effective immediately.


  • Brian Krzanich was named CEO of Intel in May 2013. He served previously as Intel's chief operating officer. Krzanich joined Intel in 1982.

Thursday, January 24, 2019

Intel grew 13% in 2018 but outlook disappoints

Intel reported Q4 2018 revenue of $18.7 billion, up 9 percent year-over-year (YoY); and full-year revenue set an all-time record of $70.8 billion, up 13 percent YoY. Q4 earnings per share amounted to $1.12 ($1.28 on a non-GAAP basis);

The Q4 results, however, fell short of analyst expectations, as did the company's outlook for 2019. Data center revenues came in below market expectations. The company has not yet appointed a permanent CEO. Intel said it remains on-track to launch 10nm products in volume during 2019.

“2018 was a truly remarkable year for Intel with record revenue in every business segment and record profits as we transform the company to pursue our biggest market opportunity ever,” said Bob Swan, Intel CFO and Interim CEO. “In the fourth quarter, we grew revenue, expanded earnings and previewed new 10nm-based products that position Intel to compete and win going forward. Looking ahead, we are forecasting another record year and raising the dividend based on our view that the explosive growth of data will drive continued demand for Intel products.”


Some highlights:

The PC-centric business (CCG) was up 10 percent in the fourth quarter due to continued strong demand for Intel's higher performance products and strength in commercial and gaming. CCG expanded its product portfolio for 2019 with the recent launch of new 9th Gen Intel® Core™ processors and unveiled "Ice Lake" the upcoming, 10nm-based PC processor, which is expected to be in OEM systems on shelves for holiday, 2019.

Collectively, Intel's data-centric businesses grew 9 percent YoY in the quarter and 20 percent YoY in 2018. In the fourth quarter, DCG achieved 24 percent cloud segment growth and 12 percent communications service provider segment growth while enterprise revenue declined 5 percent. Intel recently announced that the new "Cascade Lake" family of high performance Intel® Xeon® processors with advanced AI and memory capabilities is now shipping.

Fourth-quarter Internet of Things Group (IOTG) revenue declined 7 percent YoY. However, excluding Wind River, which Intel divested in the second quarter, fourth-quarter IOTG revenue was up 4 percent YoY despite supply tightness. Record quarterly revenue in Intel's memory business (NSG) was up 25 percent YoY. Intel's Programmable Solutions Group (PSG) also achieved record quarterly revenue, up 8 percent YoY driven by strength in the data center and communications market segments.

Mobileye fourth-quarter revenue of $183 million was up 43 percent YoY as customer momentum continued. In 2018, Mobileye achieved 28 new design wins and 78 vehicle model launches.

Wednesday, January 23, 2019

Airtel rolls out LTE 900 in Andhra Pradesh and Telangana

Airtel has begun rolling out LTE in the 900 Mhz spectrum band in the states of Andhra Pradesh and Telangana.

In Andhra Pradesh and Telangana, Airtel is already using 2300 Mhz (TD LTE) and 1800 Mhz (FD LTE) for its 4G network. The 900 Mhz deployment boosts in-building penetration. The carrier said it is also working on Massive MIMO and 4G Advanced and Carrier Aggregation to step up high speed network capacity and coverage.     

Recently, the company announced that it will expand its network in the Andhra Pradesh by rolling out 15,000 new sites and 3,000 km of optic fiber during FY 19 under its network transformation program – Project Leap.


Wednesday, January 9, 2019

MaxLinear partners with Intel on 10G DOCSIS 3.1 home gateways

MaxLinear is working with Intel on the home gateway designs supporting 10 Gigabit Full Duplex DOCSIS 3.1 (FDX) cable services.

Specifically, MaxLinear is currently developing a new front-end SoC for these platforms based on its patented Full-Spectrum Capture (FSC) technology that includes diagnostic and spectrum management capabilities. The front-end will include high-speed connectivity to Intel’s next-generation gateway SoC. Intel’s SoC will offer powerful computing and networking performance and is architected for a wide range of WAN, LAN and WLAN use cases to help MSOs achieve optimal performance and improve Quality of Service (QoS).

MaxLinear said its IC, along with Intel’s next-generation gateway SoC, will be highly optimized to provide the greatest level of integration while maintaining system design flexibility to support future evolution of implementations. The modular nature of this solution ensures a simple, non-disruptive, path to potential future DOCSIS standards. Samples of the MaxLinear chips and reference designs are expected in the second half of 2019. Mass production is targeted for 2020.

“10 Gigabit and symmetrical performance are the next wave of services needed in broadband and FDX is a significant step forward for home connectivity,” said Will Torgerson, Vice President & General Manager of the MaxLinear Broadband Group.

“The growing number of devices, large amounts of data and immersive experiences in the home are going to require 10 Gigabit connectivity that deliver faster speeds and more capacity,” said WK Tan, Vice President and General Manager, Intel’s Connected Home Division. “That is why Intel, the cable industry, and companies such as MaxLinear, are working together to deliver cutting-edge 10 Gigabit technologies to power tomorrow’s ultra-connected homes.”

Tuesday, December 18, 2018

Dr. Richard Uhlig to serve as Managing Director of Intel Labs

Dr. Richard Uhlig has been named as the new managing director of Intel Labs. Prior to this role, Rich was the director of Systems and Software Research in Intel Labs, where he led research efforts in virtualization, cloud-computing systems, software-defined networking, big-data analytics, machine learning and artificial intelligence. He joined Intel in 1996 and led the definition of multiple generations of virtualization architecture for Intel processors and platforms, known collectively as Intel Virtualization Technology (Intel® VT). Rich earned his Ph.D. in computer science and engineering from the University of Michigan.

“The work we are doing at Intel Labs is pushing the boundaries of technology every day whether that’s our research in quantum and neuromorphic computing or how we’re extending and evolving Moore’s Law. We have some of the brightest minds working together across industry and academia to solve some of the biggest challenges in technology. I am very excited to lead Intel Labs in this data-centric era,” stated Uhlig.

Wednesday, December 12, 2018

Intel Architecture Day highlights - Foveros and Sunny Cove

At Intel “Architecture Day" this week in Santa Clara, California, Intel executives outlined a broad strategy to address "an expanding universe of data-intensive workloads for PCs and other smart consumer devices, high-speed networks, ubiquitous artificial intelligence (AI), specialized cloud data centers and autonomous vehicles."

Intel's overall strategy is anchored on six pillars:

Process: Intel expects advanced packaging solutions to enable continued exponential scaling in computing density by extending transistor density to the third dimension.
Architecture: Intel sees a future with a diverse mix of scalar, vector, matrix and spatial architectures deployed in CPU, GPU, accelerator and FPGA sockets, enabled by a scalable software stack, integrated into systems by advanced packaging technology.
Memory: the company believes its is uniquely positioned to combine in-package memory and Intel Optane technology to fill gaps in the memory hierarchy to provide bandwidth closer to the silicon die.
Interconnect: Intel will offer a complete range of leading interconnect products enables the heterogeneous computing landscape at scale. This includes wireless connections for 5G infrastructure as well as silicon-level package and die interconnects.
Security: the company believes it is uniquely positioned to deliver security technologies that help improve the end-to-end and to make security advancements a key differentiator.
Software: Intel will offer a common set of tools that can address Intel silicon for developers. The company says that for every order of magnitude performance potential of a new hardware architecture there are two orders of magnitude performance enabled by software.



Some highlights of Intel Architecture Day:

  • Intel demonstrated a range of 10nm-based systems in development for PCs, data centers and networking.
  • Foveros: Intel demonstrated a new 3D packaging technology, called "Foveros," which for the first time brings 3D stacking to logic-on-logic integration.
  • Foveros will will allow products to be broken up into smaller “chiplets,” where I/O, SRAM and power delivery circuits can be fabricated in a base die and high-performance logic chiplets are stacked on top.
  • Intel expects to launch a range of products using Foveros beginning in the second half of 2019. 
  • The first Foveros product will combine a high-performance 10nm compute-stacked chiplet with a low-power 22FFL base die. 
  • Sunny Cove -- Intel’s next-generation CPU microarchitecture, increases performance per clock and power efficiency for general purpose computing tasks, and includes new features to accelerate special purpose computing tasks like AI and cryptography. 
  • Sunny Cove will be the basis for Intel’s next-generation server (Intel Xeon) and client (Intel Core™) processors later next year. 
  • Next-Generation Graphics: Intel's Gen11 integrated graphics will offer 64 enhanced execution units, more than double previous Intel Gen9 graphics (24 EUs), breaking the 1 TFLOPS barrier. 
  • Intel reaffirmed its plan to introduce a discrete graphics processor by 2020.
  • "One API” Software: a new 0“One API” project aimes to simplify the programming of diverse computing engines across CPU, GPU, FPGA, AI and other accelerators. The project includes a comprehensive and unified portfolio of developer tools for mapping software to the hardware that can best accelerate the code. A public project release is expected to be available in 2019.
  • Memory and Storage: Intel showed how SSDs based on its 1 Terabit QLC NAND die move more bulk data from HDDs to SSDs, allowing faster access to that data.
  • Deep Learning Reference Stack: Intel is releasing the Deep Learning Reference Stack, an integrated, highly-performant open source stack optimized for Intel Xeon® Scalable platforms.

Wednesday, December 5, 2018

Intel and Huawei complete 2.6GHz 5G SA Interoperability Testing

Intel and Huawei 2.6GHz 5G NR Interoperability and Development Testing (IoDT) based on the 3GPP Release 15 global standard September version.

The IoDT test is the world's first 2.6GHz 5G interoperability test under SA network and is a key milestone towards accelerating the maturity of the 2.6GHz 5G NR ecosystem

The testing involved Intel’s 5G Mobile Trial Platform (MTP) and Huawei's latest 5G NR (New Radio) base station supporting 2.6GHz with 160MHz bandwidth.

Thursday, November 15, 2018

Intel adds $15 billion to stock repurchase authorization

Intel's board of directors approved a $15.0 billion increase in its authorized stock repurchase program. The company had $4.7 billion remaining under its existing repurchase authorization as of Sept. 29, 2018.

The company notes that it has returned approximately $177 billion to stockholders through dividends and stock repurchases from 1990 through the third-quarter of 2018.

Monday, November 12, 2018

Intel confirms 5G modem for second half of 2019

Intel confirmed that its upcoming 5G modem chip will ship in the second half of 2019, meaning that 5G phones, PCs and broadband access gateways incorporating the device should hit the market in the first half of 2020. The updated timeline is more than a half-year earlier than previous guidance.

The Intel XMM 8160 5G modem will support the new 5G New Radio (NR) standalone (SA) and non-standalone (NSA) modes as well as 4G, 3G and 2G legacy radios in a single chipset. It will support peak speeds up to 6 Gbps, making it three to six times faster than the latest LTE modems available today.

Intel said its 5G modem is designed for worldwide carrier support.It will support new millimeter wave (mmWave) spectrum as well as sub 6 GHz 5G NR support (including FDD and TDD bands from 600 MHz to 6 GHz).

“Intel’s new XMM 8160 5G modem provides the ideal solution to support large volumes for scaling across multiple device categories to coincide with broad 5G deployments. We are seeing great demand for the advanced feature set of the XMM 8160, such that we made a strategic decision to pull in the launch of this modem by half a year to deliver a leading 5G solution,” stated Dr. Cormac Conroy, Intel corporate vice president and general manager of the Communication and Devices Group.



Monday, November 5, 2018

Intel previews Cascade Lake CPUs and Optane DC persistent memory

Intel previewed two new Xeon processors:

  • Cascade Lake advanced performance, which is expected to be released the first half of 2019,  will focus on offering workload-optimized performance leadership by delivering both core CPU performance gains1 and leadership in memory bandwidth constrained workloads. Cascade Lake will offer up to 48 cores per CPU and 12 DDR4 memory channels per socket.
  • Xeon E-2100 offers up to six cores and is aimed at entry-level server and is now commercially shipping. 


In addition, beta testing has begun for Intel Optane DC persistent memory. OEMs and CSPs who have announced beta services and systems for early customer trials and deployments include Alibaba, Cisco, Dell EMC, Fujitsu, Google Cloud, Hewlett Packard Enterprise, Huawei, Lenovo, Oracle and Tencent.

Intel Optane DC persistent memory provides two special operating modes – App Direct mode and Memory mode. App Direct mode enables applications to receive the full value of the product’s native persistence and larger capacity. In Memory mode, applications running in a supported operating system or virtual environment can use the product as volatile memory, taking advantage of the additional system capacity made possible from module sizes up to 512 GB without needing to rewrite software.


Thursday, October 25, 2018

Intel's data-centric revenue grew 22 percent

Intel reported record third-quarter revenue of $19.2 billion, up 19 percent YoY.

“Stronger than expected customer demand across our PC and data-centric businesses continued in the third quarter. This drove record revenue and another raise to our full-year outlook, which is now up more than six billion dollars from our January expectations. We are thrilled that in a highly competitive market, customers continue to choose Intel,” said Bob Swan, Intel CFO and Interim CEO. “In the fourth quarter, we remain focused on the challenge of supplying the incredible market demand for Intel products to support our customers' growth. We expect 2018 will be another record year for Intel, and our transformation positions us to win share in an expanded $300 billion1 total addressable market.”

Highlights:

  • The PC-centric business (CCG) delivered record revenue, up 16 percent. 
  • The data-centric businesses grew 22 percent YoY led by 26 percent growth in the Data Center Group (DCG). DCG achieved record quarterly revenue driven by strong demand from cloud and communications service providers investing to meet the explosive demand for data and to improve the performance of data-intensive workloads like artificial intelligence. In Q3, DCG shipped the first Intel Optane™ DC Persistent Memory for revenue, and Intel® Xeon® Scalable set 95 new performance world records2 as adoption continued.
  • The Internet of Things Group (IOTG) also achieved record revenue. Excluding Wind River, which Intel divested in the second quarter, IOTG revenue was up 19 percent YoY on broad business strength. Record revenue in Intel's memory business (NSG) was up 21 percent YoY.
  • Intel's Programmable Solutions Group (PSG) revenue grew 6 percent YoY with continued strength in the data center and strong organic growth. PSG expanded its product line with the acquisition of eASIC and the introduction of the new Intel® Programmable Acceleration Card (PAC) with Intel® Stratix 10 SX FPGA.
  • Mobileye also achieved record quarterly revenue of $191 million, up approximately 50 percent YoY3 as customer momentum continued. Mobileye won 8 new design at major US and global automakers in Q3, bringing its year-to-date design win total to 20.

Monday, October 22, 2018

Intel intros 10G PON chipset for FTTx and 5G base stations

Intel introduced a new multimode 10G PON chipset designed for small form-factor pluggable optical network termination (SFP+ ONU) and single family unit (SFU) ONUs.

In a blog post, Intel's Dirk Wieberneit writes that SFP+ ONU plays a crucial role in fiber deployments by providing entire ONU (Mac and PHY) connectivity between the 10G PON optical network and any unit it is plugged into, such as residential gateways, MDUs, DPUs, mobile small cells and base-station equipment. This positions the new chipset for a wide range of implementations in both residential and business environments, including SFU, SFP+ ONU, fiber to the distribution point (FTTdp)/multi-dwelling unit (MDU), and 5G base stations, while enabling service providers to reuse their existing fiber infrastructure.

A key feature is an embedded 2.5 Gigabit Ethernet (GbE) PHY, which supports low-power, cost-effective SFUs, providing fast speeds both into and throughout the home.

Other features of the chipset:

  • It can be used in both ITU and IEEE PON environments (EPON, 10G-EPON, GPON, XGPON1, XGS-PON, NG-PON2 and active optical Ethernet.)  
  • It is prepared for bidirectional optical subassemblies (BOSA), allowing cost-effective BOSA on board (BoB) ONU designs. 
  • It supports network timing synchronization protocols, such as IEEE 1588v2, synchronous Ethernet or time of day (ToD), providing clock accuracy for 5G/LTE mobile base stations.
  • It offers embedded VoIP supporting FXS voice ports. 
  • It delivers the necessary quality of service (QoS) and power management, carrier-grade features and hardware OAM, including Y1731, with the highest accuracy.  
  • It includes a dual-core, multithread processor and dedicated packet processing engine so you get both service application flexibility and benchmark performance. 


https://itpeernetwork.intel.com/fiber-networks-upgrade-10g-pon-chipset/


Sunday, October 14, 2018

Intel + Ovum: How big is the 5G opportunity?

How big is the 5G opportunity?

Well, according to a newly released “5G Economics of Entertainment Report” commissioned by Intel and conducted by Ovum, it is forecast that over the next decade (2019-2028) media and entertainment companies will be competing to win a share of a near $3 trillion cumulative wireless revenue opportunity.

Experiences enabled by 5G networks will account for nearly half of this revenue opportunity (close to $1.3 trillion).

“5G will inevitably shake up the media and entertainment landscape. It will be a major competitive asset if companies adapt. If not, they risk failure or even extinction. This wave of 5G transformation will not be the purview of any singular industry, and now is certainly the time for all business decision-makers to ask: Is your business 5G-ready?” stated  Jonathan Wood, general manager of Business Development & Partnerships, 5G Next Generation and Standards at Intel

Some highlights:

  • 2022: 5G accounts for nearly 20 percent of total telecom revenues – $47 billion of $253 billion
  • 2025: more than 55 percent of total revenues – $183 billion of $321 billion
  • 2028: nearly 80 percent of total revenues – $335 billion of $420 billion. The average monthly traffic per 5G subscriber will grow from 11.7GB in 2019 to 84.4GB per month in 2028, at which point video will account for 90 percent of all 5G traffic.




Wednesday, October 10, 2018

Intel Vision Accelerator targets AI inference on edge devices

Intel unveiled its family of Intel Vision Accelerator Design Products targeted at artificial intelligence (AI) inference and analytics performance on edge devices. Two acceleration solutions are being introduced: one that features an array of Intel Movidius vision processors and one built on the high-performance Intel Arria 10 FPGA.

The devices could be used to build vision-based AI accelerator cards that collect and analyze data right on edge devices for real-time decision-making. AI workloads are offloaded from the system CPU.

“Until recently, businesses have been struggling to implement deep learning technology. For transportation, smart cities, healthcare, retail and manufacturing industries, it takes specialized expertise, a broad range of form factors and scalable solutions to make this happen. Intel’s Vision Accelerator Design Products now offer businesses choice and flexibility to easily and affordably accelerate AI at the edge to drive real-time insights,” stated Jonathan Ballon, Intel vice president and general manager, Internet of Things Group

Intel said developers it is working with have achieved up to 9.6X times using accelerator cards powered by these devices.

Monday, October 1, 2018

Intel touts new Xeon server performance benchmarks

Intel reported 95 new performance world records for its Xeon Scalable processors as achieved in servers from major original equipment manufacturers, ranging from single-socket systems up to eight-socket systems.

The new performance benchmarks were achieved in a variety of server platforms, ranging from general computing workloads running on single-socket systems to advanced technical computing and big data analytics workloads running on eight-socket systems. All systems tested include mitigations for Spectre and Meltdown.

“I’m extremely proud of the 95 world record performance benchmarks that our partners have delivered, but even more delighted to see the real-world performance that our customers are achieving on the fastest ramping Intel Xeon processor family in history,”
stated Lisa Spelman, vice president and general manager of Intel Xeon products and data center marketing.

Last week, Intel CFO and Interim CEO, Bob Swan, disclosed that its data-centric businesses grew 25 percent through June, and cloud revenue grew a whopping 43 percent in the first six months of the year. Responding to increasing demand for server and PC processors, Intel updated its CAPEX guidance for the year, saying it now plans to invest a record $15 billion in capital expenditures in 2018, up approximately $1 billion from the beginning of the year. Intel is investing $1 billion into its 14nm manufacturing sites in Oregon, Arizona, Ireland and Israel. Swan also cited progress with 10nm, stating that volume production will begin in 2019.

https://www.intel.com/content/www/us/en/benchmarks/server/xeon-scalable/1st-gen-xeon-world-record.html

Tuesday, September 25, 2018

Intel adds to portfolio of FPGA programmable acceleration cards

Intel is expanding its line of field programmable gate array (FPGA) acceleration cards with a new model based on its most powerful Stratix 10 SX FPGA.

The card leverages the Acceleration Stack for Intel Xeon CPU with FPGAs, providing data center developers a robust platform to deploy FPGA-based accelerated workloads. Hewlett Packard Enterprise* will be the first OEM to incorporate the Intel PAC with Stratix 10 SX FPGA along with the Intel Acceleration Stack for Intel Xeon Scalable processor with FPGAs into its servers.


See also