Showing posts with label Infineon. Show all posts
Showing posts with label Infineon. Show all posts

Tuesday, December 11, 2018

Infineon debuts miniature, industrial-grade eSIM

Infineon Technologies introduced the first industrial-grade embedded SIM (eSIM) in a miniature Wafer-level Chip-scale Package (WLCSP).

The eSIM is designed for embedding in industrial machines and equipment ranging from vending machines to remote sensors to asset trackers.

Infineon's SLM 97 security controller in a Wafer Level Chip Scale Package (WLCSP) measures only 2.5mm x 2.7mm in size, supports an extended temperature range of -40 to 105 degrees Celsius. It provides a high-end feature set fully compliant with the latest GSMA specifications for eSIM.

The SLM 97 security chip in WLCSP is manufactured at Infineon's production site in Dresden and Regensburg and now available in volume quantities.

Monday, July 18, 2016

Infineon to Acquire Wolfspeed for $850 Million

Infineon Technologies AG agreed to acquire the Wolfspeed Power and RF division of Cree for US$850 million in cash (approximately Euro 740 million.  The deal also includes the related SiC wafer substrate business for power and RF power.

Wolfspeed, which is based in Research Triangle Park, North Carolina, is a premier provider of SiC-based power and GaN-on-SiC-based RF power solutions. This also includes the related core competencies in wafer substrate manufacturing for SiC, as well as for SiC with a monocrystalline GaN layer for RF power applications. It has more than 550 highly skilled employees and a strong IP portfolio of approximately 2,000 patents and patent applications.

Infineon said it expects next-generation wireless standards such as 5G, which will use frequencies up to 80 gigahertz, will require advanced compound semiconductors.  GaN-on-Si allows higher levels of integration and offers its advantages at operating frequencies of up to 10 gigahertz. GaN-on-SiC enables maximum efficiency at frequencies of up to 80 gigahertz.

“Wolfspeed’s and Infineon’s businesses and expertise are highly complementary, bringing together industry leading experts for compound semiconductors. This will enable us to create additional value for our customers with the broadest and deepest portfolio of innovative technologies and products in compound semiconductors available in the market. With Wolfspeed we will become number one in SiC-based power semiconductors. We also want to become number one in RF power," stated Dr. Reinhard Ploss, CEO of Infineon Technologies AG.

Tuesday, April 26, 2016

MACOM Files Patent Suit Against Infineon over GaN

MACOM Technology Solutions filed a legal claim against Infineon Technologies and International Rectifier (acquired by Infineon in 2015) concerning its rights to use the pioneering and patented gallium nitride on silicon (GaN) technology developed by Nitronex (acquired by MACOM in 2014) in MACOM’s core markets. GaN has potential applications in 4G/LTE and 5G base stations.

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