Showing posts with label IDT. Show all posts
Showing posts with label IDT. Show all posts

Tuesday, March 26, 2019

IDT announces ClockMatrix timing devices for 5G

Integrated Device Technology (IDT) introduced its ClockMatrix family of multi-channel clocking devices for a variety of network devices used in both backhaul and fronthaul 5G applications. The devices are already used in 5G base stations, routers, switches and other networking equipment.

The ClockMatrix family is comprised of three lines of devices:

  • System Synchronizers, which generate telecom-compliant clocks for network equipment
  • Port Synchronizers, for extending telecom-compliant clocks to the many ports in network equipment
  • Universal Frequency Translators (UFT), which perform jitter attenuation, clock generation and frequency translation functions for general purpose applications.

"We recognized several years ago that the wireless carriers' impending migration to 5G networks would require more precise time synchronization, and so we designed our ClockMatrix family to both upgrade the time precision of existing network equipment as well as support new equipment designs to enable a smooth migration," said Kris Rausch, vice president and general manager of IDT's Timing Products Division. "ClockMatrix devices are the only timing solutions on the market to combine such performance and features with exceptional flexibility, which not only makes them excellent for 5G networking equipment, but a variety of other applications."

IDT said its new devices can make extremely accurate phase measurements on timing signals using their multiple inputs and precision time-to-digital converters (TDC), with some family members capable of measuring to less than 1 ps. Additionally, they offer precise control of input-to-output phase (as low as 1ps steps) along with excellent close-in phase noise performance.

The pulse width modulation (PWM) capability of the devices eliminates the need for customers to redesign existing backplanes. This allows manufacturers to get new line cards to market quickly and to target an existing installed base with a simple migration path. PWM can transmit and receive clocks, frames pulses and time-of-day (TOD) data in one signal.

The ClockMatrix family of synchronizers meet carriers' constant time error (cTE) and G.8273.2 telecom boundary clock (T-BC) requirements. Their exceptional phase alignment performance makes the devices ideal for T-BC classes C and D, with demonstrated cTE performance better than 5 nanoseconds in customer systems.

https://www.idt.com/products/clocks-timing/clockmatrix-timing-solutions

Thursday, March 7, 2019

IDT launches 80G linear drivers for next-gen coherent

Integrated Device Technology (IDT) introduced its new GX7847x 80G linear driver series, in die form, for next generation coherent optical integrated modules.

IDT said its GX7847x series 80G linear drivers are 4-channel integrated single die solutions that cover all optical modulator technologies in the market. The GX78471, GX78472 and GX78474 are optimized to provide the best performance for Lithium Niobate, Indium Phosphide, and Silicon Photonics modulators, respectively.

The drivers are designed for 400G ZR, Metro, and Data Center Interconnect (DCI) applications, are compliant with the Optical Interconnect Forum (OIF) standard, and are used in highly integrated optical sub-assembly modules such as the High Bandwidth Coherent Driver Modulator (HB-CDM) and Integrated Coherent Transmitter-Receiver Optical Sub-Assembly (IC-TROSA).  The HB-CDM and IC-TORSA using the GX7847x series have higher bandwidth without any degradations in terms of output voltage swing, linearity, power consumption and die size. 

http://www.idt.com

Renesas to acquire Integrated Device Technology for $6.7 billion

Renesas Electronics Corporation of Japan has agreed to acquire Integrated Device Technology (IDT, NASDAQ: IDTI) for approximately US$6.7 billion (approximately 733.0 billion yen at an exchange rate of 110 yen to the dollar), combing two recognized leaders in embedded processors and analog mixed-signal semiconductors. IDT shares are to be acquired at a price of US$49.00 per share.

IDT, which is based in San Jose, California, is a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power. Renesas is the leading global supplier of microcontrollers, and a leader in analog & power and SoC products. The acquisition will provide Renesas with analog mixed-signal capabilities in embedded systems, including RF, advanced timing, memory interface & power management, optical interconnect, wireless power, and smart sensors.

The combination of these product lines with Renesas’ advanced MCUs and SoCs and power management ICs enables Renesas to offer comprehensive solutions that support the increasing demand of high data processing performance.

Tuesday, March 5, 2019

IDT releases Low Power, Multi-rate PAM4 Linear TIA for 200G/400G

Integrated Device Technology (IDT) introduced the first 53 Gbps and 112 Gbps multi-rate Trans-impedance Amplifiers (TIAs) for optical transceivers, active optical cables (AOCs) and On-Board Optics (OBO) applications.

Key attributes and benefits to 200G/400G Datacenter applications include:
  • Low power consumption for PAM4 linear receivers and COBO optics in QSFP-DD and OSFP modules, for example, as low as < 150mW/channel
  • Excellent flat frequency responses and low group delay with wide bandwidth (up to 43GHz) and AGC, which optimizes PAM4 systems for wide dynamic PMD links
  • Very low input referred noise density as low as 10pA/√Hz
  • Compact die size enabling small optical assembly and On-Board Optics assembly for better port density
  • -40°C to 95°C temperature operation range for 5G wireless front-haul applications
  • I2C interface providing on-chip multiple functions, such as control, monitor and alarms

"We are very excited with the technical performance of the 53G/ch and 112G/ch TIA, which works very well with our PAM4 DML, and EML drivers in both data rates," said Dr. Kevin Zhang, director of marketing for datacom products at IDT. "This new generation of TIAs will very well satisfy the high performance challenges required for 100GBASE-LR and 400GBASE LR4 standards and simultaneously consume very low power and deliver a high sensitivity solution for small form factor modules."

http://www.idt.com

Sunday, September 23, 2018

ECOC 2018: IDT debuts100G Single Lambda EML driver and TIA for 200G/400G

At ECOC 2018, Integrated Device Technology (IDT) is introducing its latest single lambda EML driver and TIA for 200G/400G datacenter applications.

IDT said its 400GbE based on 100G single lambda designs will establish an ecosystem to lower the cost per bit, a key enabler for scalable Switch-to-Switch and Switch-to-Server Optical Links, supported with small form factor modules, such as 200G/400G QSFP-DD, OSFP and 400G OBO. The Electro-Absorption Modulated Laser (EML) and Trans-Impedance Amplifier (TIA) are key analog IC components, and the features of IDT's chip set of high bandwidth, high sensitivity and low power consumption are promising to support those modules.

The IDT 100G single lambda EML Driver is available as a die (HXT45100) and as a packaged driver (HXT45x01) with 1 or 4 channels. The driver family features broad bandwidth, high linearity and low power consumption for the QSFP-DD module form factor. The SMT-type packaged drivers integrate built-in Bias-T, internal high-frequency chokes and input DC blocks, and offers 2Vpp output voltage swing while consuming less than 300mW per channel power.  The bandwidth is over 40GHz with excellent phase flatness and channel isolation.

The 100G single lambda TIA, offered as 1 channel and 4 channel dies (HXR45x00),  provides under 5kohm transimpedance gain, 500mVpp maximum differential output voltage, excellent flat frequency response and low group delay with 3dB bandwidth higher than 36GHz, is very suitable for 100G single lambda applications, with a power dissipation as low as 168mW per channel. The HXR45x00 is configurable by I2C, for 28G applications, with a flat frequency response and 3dB bandwidth of 25GHz and reduced power dissipation down to 135mWper channel.

"We are very excited of the initial results of our single channel and four channel 112G/ch TIA," said Andrea Betti-Berutto, IDT Fellow. "This new generation of TIAs will well satisfy the high performance challenges required for 100G single lambda applications and simultaneously consume very little power and deliver a high sensitivity solution for lower rate applications, such as 28Gbaud-based small form factor modules."

Tuesday, September 11, 2018

Renesas to acquire Integrated Device Technology for $6.7 billion

Renesas Electronics Corporation of Japan has agreed to acquire Integrated Device Technology (IDT, NASDAQ: IDTI) for approximately US$6.7 billion (approximately 733.0 billion yen at an exchange rate of 110 yen to the dollar), combing two recognized leaders in embedded processors and analog mixed-signal semiconductors. IDT shares are to be acquired at a price of US$49.00 per share.

IDT, which is based in San Jose, California, is a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power. Renesas is the leading global supplier of microcontrollers, and a leader in analog & power and SoC products. The acquisition will provide Renesas with analog mixed-signal capabilities in embedded systems, including RF, advanced timing, memory interface & power management, optical interconnect, wireless power, and smart sensors.

The combination of these product lines with Renesas’ advanced MCUs and SoCs and power management ICs enables Renesas to offer comprehensive solutions that support the increasing demand of high data processing performance.

Renesas said it is working to expand its analog solution lineup and to strengthen its kit solution offerings that combine its microcontrollers (MCUs), system-on-chips (SoCs) and analog products. The company's focus domains include: the automotive segment, which is expected to see tremendous growth with autonomous driving and EV/HEV; industrial and infrastructure segments, which are expected to advance with Industry 4.0 and 5G wireless communications, as well as the fast-growing IoT segment.

"This acquisition will bring us complementary, market-leading analog mixed-signal assets and an incredibly talented group of professionals to help us boost our embedded solution capabilities," said Bunsei Kure, Representative Director, President and CEO of Renesas. “IDT’s products combined with our MCUs, SoCs and power management ICs will enable Renesas to widen its product offerings as well as to expand its reach into areas such as the growing data economy-related space.”

“The combination of Integrated Device Technology’s analog mixed-signal leadership with Renesas’ world-leading microcontroller and automotive/industrial franchise creates a new global powerhouse,” said Gregory L. Waters, President and CEO of IDT. “The Combined company will possess the key capabilities that customers in the modern data economy demand.”

Renesas to Acquire Intersil for $3.2 Billion

Renesas Electronics Corporation agreed to acquire Intersil for US$22.50 per share in cash, representing an aggregate equity value of approximately US$3.2 billion (approximately 321.9 billion yen at an exchange rate of 100 yen to the dollar).

Renesas supplies microcontroller (MCU) and system-on-chip (SoC) products and technologies.  Intersil specializes in power management and precision analog capabilities.

The acquisition is also expected to expand Renesas’ product portfolio, particularly for analog devices, where the market is expected to increase by approximately US$3.9 billion by 2020.

IDT launches High Baud Rate Linear Driver for 400G/600G


Integrated Device Technology (IDT) introduced its new GX76470 64G linear driver, in die form, for optical integrated modules, for 400G/600G coherent applications. The driver is designed for OIF defined, highly integrated optical sub-assembly modules such as the HB-CDM (High Bandwidth Coherent Driver Modulator) and IC-TROSA (Integrated Coherent Transmitter-Receiver Optical Sub-Assembly) which enable miniaturization of optical transceiver modules...

IDT develops 64G Linear Driver for Coherent Optical


Integrated Device Technology introduced a 64 Gbaud quad-channel linear optical modulator driver in a 14mm x 9.1mm Surface Mount Technology (SMT) package for 400G/600G coherent applications. The device can be used in line cards and CFP2 pluggable modules to bring next-generation 400G/600G products to the coherent market. The IDT GX66473 supports 64Gbaud 16QAM and 64QAM to address the needs of both 400G and 600G systems, and has differential input...

IDT to acquire GigPeak for $250m for Optical Interconnects

Integrated Device Technology (IDT) of San Jose, California and GigPeak, a supplier of semiconductor ICs and software for high-speed connectivity and video compression over the network and in the cloud, announced that they have signed a definitive agreement for IDT to acquire GigPeak for $3.08 per share, or approximately $250 million, in cash, representing a premium of approximately 22% to GigPeak's closing share price on February 10th.

Under the terms of the merger agreement, IDT will launch a tender offer to acquire all of the issued and outstanding common stock of GigPeak for $3.08 per share. The boards of directors of both companies have unanimously approved the terms of the agreement and the GigPeak board has resolved to recommend that stockholders accept the offer.

The combination of IDT and GigPeak is projected to add approximately $16 million of quarterly revenue at a 70% non-GAAP gross margin and to be accretive to earnings in first full quarter following closing of the transaction.

The acquisition of GigPeak will provide IDT with an optical interconnect product line and technology business that is complementary to its established position as a supplier of real-time interconnect products. More specifically, the combination is expected to extend IDT's leading position as a supplier of communications and cloud data centre products

Tuesday, May 1, 2018

IDT launches High Baud Rate Linear Driver for 400G/600G

Integrated Device Technology (IDT) introduced its new GX76470 64G linear driver, in die form, for optical integrated modules, for 400G/600G coherent applications.

The driver is designed for OIF defined, highly integrated optical sub-assembly modules such as the HB-CDM (High Bandwidth Coherent Driver Modulator) and IC-TROSA (Integrated Coherent Transmitter-Receiver Optical Sub-Assembly) which enable miniaturization of optical transceiver modules and lowering the component cost for 400G ZR, metro, Data Center Interconnect (DCI) applications.  As such, the optical sub-assemblies are promising to be applicable to all the key small form factors: QSFP-DD, OSFP, CFP4-ACO, and CFP2-DCO.

"IDT's new GX76470 driver is another exciting addition to the expanding portfolio of data center and telecommunication solutions," said Dr. Koichi Murata, marketing director, Telecom, for IDT's Optical Interconnects Division. "Consumer and business demand for new, bandwidth-hungry applications and service like 5G, IoT, Smart City and virtual reality is driving the need for faster, more cost-effective data centers solutions that can be supported by our GX76470 driver and other new devices."

Sunday, March 11, 2018

IDT develops 64G Linear Driver for Coherent Optical

Integrated Device Technology introduced a 64 Gbaud quad-channel linear optical modulator driver in a 14mm x 9.1mm Surface Mount Technology (SMT) package for 400G/600G coherent applications.

The device can be used in line cards and CFP2 pluggable modules to bring next-generation 400G/600G products to the coherent market.

The IDT GX66473 supports 64Gbaud 16QAM and 64QAM to address the needs of both 400G and 600G systems, and has differential input and single-end output interfaces with a 4.5Vpp output voltage swing, suitable for driving Lithium Niobate Mach-Zehnder Modulators.  The driver features low-power consumption of 1.1W/ch, very high linearity performance with approximately 1.5% Total Harmonic Distortion (THD) and an adequate package size for pluggable modules. A version of the GX66473, the GX66474, operates with two standard supply voltages, making it suitable for the CFP2 form factor modules.

IDT will demonstrate the new device at this week's OFC in San Diego.

Friday, July 7, 2017

IDT unveils clock generator/jitter attenuator

Integrated Device Technology (IDT) announced a new highly-programmable clock generator and jitter attenuator IC offering less than 200 fs of phase noise and designed to provide system design margin for 10 Gbit/s interfaces in wireline and wireless communication networks.

IDT noted that the increased phase noise margin can lower system design constraints and help engineers to minimise bit error rates (BER) while also reducing system costs.

The new IDT 8T49N240 product is the latest member of IDT's third-generation Universal Frequency Translator (UFT) family. The clock generator and jitter attenuator device is able to produce most common output frequencies from almost any input frequency and targets 10 Gbit/s or multi-lane 40/100 Gbit/s timing applications where 300 fs of phase noise is typically the maximum acceptable level permitted at physical ports. The device is also suitable for 25/28 Gbit/s interfaces.

The 200 fs phase noise specification of the 8T49N240 product therefore provides noise margin to enable engineers to both simplify their clock tree designs and utilise lower cost PCBs.

The 8T49N240 is complemented by IDT's proven Timing Commander software, a free, intuitive program designed to allow users to configure the device by clicking on blocks, entering desired values and sending the configuration to the device. IDT also offers a web-based tool that allows customers to quickly generate custom part numbers to match their specific configurations.


The 8T49N240 product features a 6 x 6 mm package footprint that requires less PCB area than other comparable solutions. The 8T49N240 and evaluations boards are available immediately.


Tuesday, April 18, 2017

IDT and Epson Introduce Timing Solution

Integrated Device Technology (IDT) and Seiko Epson, a leading supplier of quartz crystal technology, have introduced an ultra-high performance timing solution designed to address phase noise challenges in telecommunication and data centre applications.

For the solution, IDT's new 8V19N474 jitter attenuator and frequency synthesiser is coupled with Epson's VG-4513 voltage-controlled crystal oscillator (VCXO) to provide leading phase noise performance for demanding applications such as 40/100/400 Gigabit Ethernet timing.

The new 8V19N474 jitter attenuator and frequency synthesiser features RMS phase noise of 75 femtoseconds, with the ultra-low performance designed to provide system designers with the clocking requirement to transition from 28 Gbit/s to Ethernet interfaces utilising 56 Gbit/s PAM4 (TX) PHYs and other high-performance SerDes applications with sufficient timing margin.

IDT's 8V19N474 device can generate up to 12 reference clock signals and outputs multiple synchronised clocks, together with an output frequency range from 25 to 2500 MHz, including 125 and 156.25 MHz and LVDS and LVPECL outputs with adjustable amplitudes. The device targets Ethernet and OTN (OTU3, OTU4) in complex applications, as well as for driving ADC/DAC converters, cable TV head-end and DOCSIS 3.1 applications.

For wired communications, the IDT solution enables compliance with physical layer specifications of phase noise, bit error rate and signal-to-noise ratio without the need for external filtering. Additionally, the product's integrated low drop out regulator enables cost savings through enabling the use of an inexpensive DC/DC voltage supply.

Epson's VG-4513 VCXO device constitutes a proven component in the joint solution. Employing an HFF (high-frequency fundamental) crystal, the VG-4513 VCXO delivers very low close-in phase noise which, combined with the integrated VCO within IDT's 8V19N474, enables low phase noise at higher offset frequencies.


IDT's 8V19N474 product, which is available immediately, is supplied in an 8 x 8 mm 81-CABGA package; the Epson VG-4513 is also available now, provided in a 7 x 5 x 1.6 mm or a 5 x 3.2 x 1.3 mm ceramic package.

Wednesday, February 15, 2017

IDT to acquire GigPeak for $250m for Optical Interconnects

Integrated Device Technology (IDT) of San Jose, California and GigPeak, a supplier of semiconductor ICs and software for high-speed connectivity and video compression over the network and in the cloud, announced that they have signed a definitive agreement for IDT to acquire GigPeak for $3.08 per share, or approximately $250 million, in cash, representing a premium of approximately 22% to GigPeak's closing share price on February 10th.

Under the terms of the merger agreement, IDT will launch a tender offer to acquire all of the issued and outstanding common stock of GigPeak for $3.08 per share. The boards of directors of both companies have unanimously approved the terms of the agreement and the GigPeak board has resolved to recommend that stockholders accept the offer.

The combination of IDT and GigPeak is projected to add approximately $16 million of quarterly revenue at a 70% non-GAAP gross margin and to be accretive to earnings in first full quarter following closing of the transaction.

The acquisition of GigPeak will provide IDT with an optical interconnect product line and technology business that is complementary to its established position as a supplier of real-time interconnect products. More specifically, the combination is expected to extend IDT's leading position as a supplier of communications and cloud data centre products

IDT noted that GigPeak's optical interface products have been widely adopted by major companies in the communications, cloud data centre, and military/aviation markets. With the acquisition, IDT will be able to provide ultra-high speed data connectivity products featuring electrical, RF and optical technologies.

The transaction is not subject to a financing condition, although it is subject to customary conditions including the tender of the majority of the outstanding GigPeak shares; it is anticipated that the acquisition will close the second calendar quarter of 2017.

Separately, GigPeak reported financial results for its fourth quarter and fiscal year 2016, ended December 31, 2016, including fourth quarter revenue of $16.2 million, compared with $15.8 million in the third quarter and $11.1 million in the fourth quarter 2015. GAAP net income in the fourth quarter was $1.5 million, compared with net income of $0.7 million in the third quarter and net income of $0.3 million for the 2015 fourth quarter.

Full year 2016 revenue was $58.7 million, versus $40.4 million in 2015, with GAAP net income of $2.2 million, compared with net income of $1.2 million in 2015.

For its most recent third quarter ended January 1, 2017, IDT reported revenue of $176.36 million, versus $184.06 million in the second quarter and $177.61 million in the prior year third quarter. Net income for the third quarter was $34.74 million, compared with net income of $24.59 million in the second quarter and net income of $32.54 million in the prior year third quarter.

http://ir.gigpeak.com/phoenix.zhtml?c=225697&p=irol-newsArticle&ID=2245665

Tuesday, March 8, 2016

IDT Comments on U.S. Department of Commerce Ruling on ZTE

Integrated Device Technology (IDT) said the U.S. Department of Commerce ruling on ZTE is expected to have minimal impact on its financial performance.

IDT confirmed that ZTE is one of its customers and that ZTE-related revenue has historically ranged between approximately $3 million and $4 million per quarter.

http://www.idt.com

Wednesday, February 24, 2016

#MWC16: IDT Partners with 5G Lab Germany on Autonomous Cars

Integrated Device Technology announced a multi-year collaboration with 5G Lab Germany on 5G tactile networks, including the application of IDT technology to enable network-connected autonomous vehicles.

The project extends the Dresden-based lab's focus on combining 5G technologies with system-transforming applications.

IDT said its RapidIO technology will be used to explore two key elements of the network. First, the 100ns latency RapidIO switching and interconnect technology will be used to realize 5G Lab Germany's vision of transforming the vehicle into a connected appliance by networking it with a 5G base station's "edge computing" server. Second, it is planned for RapidIO technology to be evaluated to connect multiple vehicle sensors in real time for the mission-critical sensor fusion network essential for the self-driving or computer-assisted driving experience. A RapidIO-connected heterogeneous computer network will run real-time analytics to assist various network devices, including vehicles.

"With Germany's leadership in the global automotive industry, our lab's focus on the tactile Internet of Things, and IDT's low-latency interconnect and market-leading timing portfolio, the key elements are in place to tackle the real-time mission-critical challenges of platforms for the tactile Internet, including autonomous vehicles," said Gerhard Fettweis, 5G Lab chair and Vodafone chair professor for Mobile Communications Systems. "With the 1 millisecond round trip constraints in 5G deployments, we need low-latency computing platforms for vehicles, base station and edge computing servers. This project will explore connecting the requisite high-performance computing nodes through the deployment of IDT RapidIO technology and associated timing products."

The collaboration will build on IDT's recently announced RXS family of 50 Gbps RapidIO products, as well as computing appliances under development by IDT partners in the Open Compute Project's (OCP) High-Performance Computing group. The OCP's projects support heterogeneous computing between x86, ARM, Power Architecture, GPU and FPGAs.

http://www.idt.com/

Wednesday, February 25, 2015

IDT, NVIDIA and Orange Silicon Valley Develop

Integrated Device Technology (IDT), NVIDIA and Orange Silicon Valley are developing a supercomputing platform that uses clusters of low-power NVIDIA Tegra K1 mobile processors with IDT’s RapidIO interconnect and timing technology to analyze 4G to 5G base station bandwidth data in real time.

Specifically, the Supercomputing at the Edge platform uses IDT’s 20 Gbps interconnect technology to connect a low-latency cluster of NVIDIA Tegra K1 mobile processors. It’s suitable for micro base station deployment along with larger computing clusters in the C-RAN, a new cellular network architecture. Each computing card is based on connecting up to 4 GPU units per processing card connected with RapidIO low-latency NIC and switching products on board.  The companies said the platform can support up to 12 teraflops per IU RapidIO server blade.

http://www.idt.com/about/press-room/idt-nvidia-and-orange-silicon-valley-drive-supercomputing-edge-wireless-network-real-time-analysis-a

Saturday, November 22, 2014

RapidIO Delivers 16 Gbps Interconnect for NVIDIA-based Clusters

Integrated Device Technology (IDT) and Orange Silicon Valley have co-developed a new compute architecture that leverages massive, highly scalable, low-latency clusters of low-power NVIDIA Tegra K1 mobile processors along with using IDT’s RapidIO technology which can interconnect multiple nodes at up to 16 Gbps. The architecture can scale to more than 2,000 nodes in a rack and enables ultra-high Gflop density and energy efficiency not achievable with PCI Express or Ethernet technologies.

The design essentially interconnects a large number of low-power GPUs in a server rack, enableing tremendous computing horsepower with low latency and low energy consumption. It yields up to 23 Tflops per 1U server, or greater than 800 Tflops of computing per rack.

IDT said its new architecture matches computing cores with 16 Gbps data rate to each node for better computing-to-throughput balance, one of the key limitations in the industry today. The compute to I/O ratio will continue to improve with 40 Gbps IDT RapidIO 10xN technology.

The architecture allows for 60 nodes on a 19-inch 1U board, with more than 2,000 nodes in a rack. Any node can communicate with another node with only 400 ns of fabric latency. Memory-to-memory latency is less than two microseconds. Each node consists of a Tsi721 PCIe to RapidIO NIC and a Tegra K1 Mobile Processor with 384 Gflops per 16 Gbps of data rate, or 24 floating point operations per bit of I/O. This will be valuable at the rack level in data centers and at the individual analytics server level for wireless access networks.

The cluster was achieved with NVIDIA’s Jetson TK1 development kit, which is powered by the NVIDIA Tegra K1 mobile processor.

“Leading innovators in the ‘Big Data’ arena are increasingly discovering the benefits RapidIO interconnect can bring to their applications,” said Sean Fan, vice president and general manager of IDT’s Interface and Connectivity Division. “Our work with Orange Silicon Valley—connecting massive numbers of low-power NVIDIA mobile processors via RapidIO—demonstrates a breakthrough approach to addressing the tradeoffs between total computing, power and balanced networking interconnect to feed the processors.”

http://www.IDT.com

See also