Showing posts with label Co-packaged Optics. Show all posts
Showing posts with label Co-packaged Optics. Show all posts

Tuesday, November 10, 2020

OIF begins co-packaging framework IA project

OIF has kicked off a Co-Packaging Framework Implementation Agreement (IA) umbrella project to study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. 


A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.

“It is critical that the industry be aligned on the solutions needed to move co-packaged interoperability forward,” said Jeff Hutchins, Ranovus and OIF Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “With its member-driven focus, OIF is the ideal forum to facilitate industry conversation and drive interoperability of co-packaging with ASICs.”

The scope of the Co-Packaging Framework project is to:

  • Identify the key co-packaged applications and their requirements
  • Study and identify key issues associated with co-packaged optics
  • Identify opportunities and develop industry consensus to pursue interoperability standards
  • Document the study in the Framework IA (a technical whitepaper)
  • Launch follow-on standardization activities at the OIF or other appropriate standard bodies

http://www.oiforum.com


Thursday, March 12, 2020

Ranovus, IBM, TE Connectivity and Senko team on Co-Packaged Optics

Ranovus has formed a strategic collaboration with IBM, TE Connectivity, and Senko Advanced Components to create an ecosystem to design and manufacture multi-vendor solutions for Co-Packaged Optics applications in data center.

RANOVUS will provide its Odin silicon photonics engine, which incorporates the company’s multi-wavelength Quantum Dot Laser (QDL), 100Gbps Silicon Photonics based Micro Ring Resonator modulators and photodetectors, 100Gbps Driver, 100Gbps TIA and control Integrated Circuits in a power efficient and cost-effective EPIC in a single chip.

IBM will provide optical interconnect technologies that enable automated and scalable assembly for co-packaged optics. IBM’s fiber V-groove interconnect packaging technology is a robust and reliable assembly technique to interface optical fibers to silicon photonics devices. This process makes use of passive alignment techniques and achieves low insertion loss across a wide spectral range in both the O-band and C-band regimes. The solution is scalable in physical channel count and the automated process provides a path to high-volume manufacturing of co-packaged optics.

TE will demonstrate its CP fine pitch socket technology combined with thermal management using Thermal Bridge technology to illustrate integrated co-packaging solutions. TE’s co-packaged (CP) fine pitch socket interposer technology enables integration of small chipset and optical engine component technologies into high-value co-package assemblies with reworkable and interoperable interfaces.  The signal integrity performance of the CP fine pitch socket interposer technology can be critical to 100 Gbps high density electrical packaging requirements.  The integration of TE’s thermal bridge technology completes the assembly by providing an innovative solution for thermal management of the switch, serializer/deserializer (SerDes), and optics necessary for high reliability and long operating life.

SENKO will demonstrate its fiber optic connectivity solutions for optical coupling, on-board/mid-board, and faceplate. SENKO’s fiber optic connectivity solutions for optical coupling, on-board/mid-board, and faceplate support 100Gbps/lane and beyond Co-Packaged Optics equipment designs. These include low profile and precision Fiber coupler assemblies, micro sized on-/mid-board connectors, reflow compatible connector assemblies, and space saving connector options for faceplate. These will provide more efficiency, scalability, and flexibility in designs for Co-Packaged Optics equipment.

The companies said the co-packaging of optics and Ethernet switch ICs is a natural next step to reduce the power consumption burden of the electrical I/Os in the data center networking equipment.  The transition of the Ethernet switch IC SER/DES from 50Gbps to 100Gbps, in 25.6Tbps and 51.2Tbps switch configurations, presents a unique inflection point in the architecture of the Ethernet switch systems.