Showing posts with label #OFC2018. Show all posts
Showing posts with label #OFC2018. Show all posts

Sunday, March 11, 2018

IDT develops 64G Linear Driver for Coherent Optical

Integrated Device Technology introduced a 64 Gbaud quad-channel linear optical modulator driver in a 14mm x 9.1mm Surface Mount Technology (SMT) package for 400G/600G coherent applications.

The device can be used in line cards and CFP2 pluggable modules to bring next-generation 400G/600G products to the coherent market.

The IDT GX66473 supports 64Gbaud 16QAM and 64QAM to address the needs of both 400G and 600G systems, and has differential input and single-end output interfaces with a 4.5Vpp output voltage swing, suitable for driving Lithium Niobate Mach-Zehnder Modulators.  The driver features low-power consumption of 1.1W/ch, very high linearity performance with approximately 1.5% Total Harmonic Distortion (THD) and an adequate package size for pluggable modules. A version of the GX66473, the GX66474, operates with two standard supply voltages, making it suitable for the CFP2 form factor modules.

IDT will demonstrate the new device at this week's OFC in San Diego.

Thursday, March 8, 2018

Microsemi's DIGI-G5 powers Terabit OTN switching cards

Microsemi introduced its DIGI-G5 Optical Transport Network (OTN) processor for terabit capacity OTN switching cards.

The company said this newest generation in its DIGI franchise enables packet-optical transport platforms to triple in capacity while slashing power consumption by 50 percent per port.

DIGI-G5 delivers 1.2 terabits per second (Tbps) of combined OTN and client interfaces and is first to market with newly standardized 25 Gigabit Ethernet (GE), 50GE, 200GE, 400GE, Flexible OTN (FlexO) and Flexible Ethernet (FlexE) with integrated security engine enabling flexible encrypted optical connections.

Transporting Ethernet, storage, intellectual property (IP)/ multiprotocol label switching (MPLS) and 4G/5G Common Public Radio Interface (CPRI)/eCPRI services over 100G OTN switched connections has proven to be the most fiber, power and cost-efficient deployment solution for moving bits in today's metro and long-haul networks.

“Our DIGI OTN processor portfolio has been instrumental in transforming service provider networks to mass deploy 100G OTN switched networks,” said Babak Samimi, vice president and business unit manager for Microsemi's Communications Business Unit. “Our DIGI-G5 breaks new ground by enabling the industry’s transition to new OTN 3.0 architectures at terabit scalability by delivering three times the port density while lowering power consumption by 50 percent per port.”

DIGI-G5 highlights

  • Total interface bandwidth of up to 1.2Tbps
  • Comprehensive Ethernet support: 10GE, 25GE, 50GE, 100GE, 200GE, 400GE and the new OIF FlexE specification
  • New OTN 3.0 rates, enabling flexible (FlexO) and fractional 100G+ (OTUCn, OTUCn-m) transmission
  • 56G PAM-4 Serializer/Deserializer (SerDes) allows direct connection to QSFP-DD, OSFP and coherent digital signal processors (DSPs)
  • Integrated packet test set enables remote troubleshooting and debug, driving down capital and operating expenditures
  • Integrated security engine enabling end-to-end AES-256 based encryption and authentication
  • Integrated G.HAO bandwidth-on-demand processing for OTN switching networks
  • Innovative DIGI-Mesh-Connect architecture which enables compact, pay-as-you-grow OTN switching at lowest cost and power by eliminating the need for a centralized switch fabric device.
  • Sampling is expected in Q2



NTT Electronics announces 64GBaud coherent DSP

NTT Electronics (NEL) has begun sampling a 64GBaud high-performance coherent DSP for DWDM optical transport systems. The DSP core leverages Broadcom’s 16nm CMOS fin-FET high-speed mixed-signal technologies which enhances per-lambda capacity by two-to-three times up to 600Gbps/λ.

NEL's new DSP supports flexible line capacities by combining multiple Baud-rates and modulation-formats, from 100Gbps/λ by 32GBaud QPSK to industry-first 600Gbps/λ by 64GBaud 64QAM.

The company says it is able to achieve a range of per-fiber DWDM capacity, from 5Tbps for tens of thousands of kilometers Ultra Long Haul (ULH) to over 30Tbps for 120km ZR transmission reaches, and further doubling the capacity by using both C-band and L-band. Real-time coherent processing at 64GBaud enables thousands-of-kilometers LH transport at 200Gbps/λ by Dual-Polarization (DP) QPSK, hundreds-of-kilometers Metro transport at 400Gbps/λ by DP 16QAM, or 120km ZR transport at 600Gbps/λ by DP 64QAM.

“Every Service Provider needs to maximize fiber capacity to meet increasing bandwidth demand,” said Haruhiko Ichino, NEL Executive Vice President and General Manager of Broadband System & Device Business Group. “We are strongly committed to be a pioneer in the coherent DSP innovation and to provide merchant-silicon solutions for cost-effective upgrades in LH, Metro, and shorter-reach data-center-interconnect (DCI) applications.”

Commercial production is expected in the second half of 2018.

MACOM releases 400G chipset for Short Reach Optical #OFC2018

MACOM Technology Solutions is now sampling a four channel, 56 Gb/s PAM-4 VCSEL driver and companion four channel transimpedance amplifier (TIA) for short reach VCSEL-based optical module and active optical cables (AOC) applications.

These new devices complement previously announced transmit and receive clock data recovery (CDR) devices for a complete transmit and receive solution. MACOM’s chipset solution operates at up to 56 Gb/s PAM-4 (28GBbaud PAM-4)data rate per channel, enabling short reach (up to 100m) optical modules for 200G QSFP and 400G QSFP-DD and OSFP applications.

MACOM said its fully analog chipset solution delivers the high performance, low power, and low cost needed for 400G in cloud data centers.

“MACOM is excited to follow our successful 100Gbps chipset for short reach applications with the new generation of devices targeted for 400Gbps QSFP-DD and OSFP modules,” said Marek Tlalka, Senior Director of Marketing, High-Performance Analog, at MACOM. “By utilizing our analog circuit technology, we are delivering a complete chipset for high-performance, short reach optical interconnect at low power, low cost and low latency critical for cloud computing and HPC applications.”

MACOM will demonstrate the new chipset solution at OFC 2018 with a QSFP-DD module from Dust Photonics.

Monday, February 26, 2018

Ranovus ships its On-Board Optics and CFP2 Direct Detect Transceivers

Ranovus announced the general availability of its 200G On-Board Optics and CFP2 optical transceiver solutions.

The devices are based on the company’s multi-wavelength Quantum Dot Laser (QDL), Ring Resonator based Silicon Photonic (SiP) modulators, Driver ICs as well as Receiver building blocks. 

Highlights of Ranovus’ 200G CFP2 and Optical Engine product features are:

  • Supporting DCI, metro access, 5G Mobility and multi-access edge computing applications
  • Supporting transmission distance of 15km, 40km and 80km+
  • Platform capable of supporting Industrial Temperature Range
  • Offering 96 DWDM channels in the C-band now and L-band in the future
  • Supporting 1.6 Tb/s 1RU Shelf Density
  •  Form factor and compatible electrical interface with CFP2-DCO
  • 56Gb/s PAM4 PHY with multiple programmable FEC options to optimize link performance
  • Full diagnostics and self-monitoring capabilities to enable high-reliability networks
Ranovus said these products are now in lab trials with multiple optical networking equipment vendors for 5G mobility and cloud infrastructure markets. A demonstration with ADVA is planned for the upcoming OFC show in San Diego.

“Our demonstration will feature transmission of 400Gb/s in an FSP 3000 CloudConnect™ terminal and over 80km of standard single mode fiber utilizing our open line system,” said Christoph Glingener, CTO/COO at ADVA. “In partnership with Ranovus, we have made impressive progress to validate direct detect technology as an effective way for data center operators to lower their cost per bit and improve energy efficiency.”

Thursday, February 22, 2018

NeoPhotonics ships 64 GBaud Coherent for 600G and 1.2T

NeoPhotonics announced the commercial shipment of its suite of 64 GBaud optical components for coherent systems operating at 600G and 1.2T.   The suite consists of three critical optical components:  a 64 GBaud CDM (Coherent Driver Modulator), plus a 64 GBaud ICR (Coherent Intradyne Receiver) and finally an ultra-narrow linewidth tunable laser.

NeoPhotonics said these components could be used for single channel 600G or dual channel 1.2T data transmission over data center interconnect (DCI) distances of 80 km. The components also support 400G over metro distances of 400-600 km using 64 GBaud and 16 QAM or 200G over long-haul distances of greater than 1000 km using 64 GBaud and QPSK.

“All three elements of our suite of optical components for 600G and 1.2T are now available and shipping to customers, allowing them to take advantage of the performance of all three elements to optimize their system performance,” said Tim Jenks, Chairman and CEO of NeoPhotonics.  “We ensure that each element is designed to work seamlessly with the others and offer our customers a complete optical solution, both increasing performance and reducing development time.”

Product highlights:

  • 64 GBaud CDM: NeoPhotonics 64 GBaud, polarization multiplexed, quadrature coherent driver modulator (CDM) is shipping in limited availability and features a co-packaged InP modulator with a linear, high bandwidth, differential driver in a compact package designed to be compliant with the anticipated OIF Implementation Agreement. Co-packaging the InP IQ modulator with the driver enables an 85% reduction in line card board space compared to equivalent lithium niobate solutions. Furthermore, this facilitates transceiver applications up to 600 GBps on a single wavelength for next-generation transport modules..
  • 64 GBaud Micro-ICR: NeoPhotonics Class 40 High Bandwidth Micro-Intradyne Coherent Receiver (Micro-ICR) is in volume production and is designed for 64 GBaud symbol rates, doubling the RF bandwidth of standard 100G ICRs. The 64 GBaud Micro-ICR supports higher order modulation such as 64 QAM. The compact package is designed to be compliant with the OIF Implementation Agreement OIF-DPC-MRX-02.0.
  • Low Profile Micro-TL: NeoPhotonics ultra-narrow linewidth external cavity tunable laser has been proven in volume production and is now configured in a smaller, lower profile package, which is designed to meet the stringent requirements for packaging density in pluggable modules. The external cavity laser design has a significantly narrower linewidth than competing designs, which is especially advantageous for higher order modulation formats. The laser is available in a compact package Integrable Tunable Laser Assembly form factor designed to be compliant with the OIF Implementation Agreements OIF-MicroITLA-01.1 and OIF-ITLA-MSA-01.3.

See also