Showing posts with label #OFC2018. Show all posts
Showing posts with label #OFC2018. Show all posts

Sunday, March 25, 2018

Foxconn Interconnect Technology advances 400G, 100G BiDi, CXP2

Foxconn Interconnect Technology showcased its latest 400 Gbps Interconnect solutions at the recent Optical Fiber Communications (OFC) Conference & Exhibition in San Diego.

QSFP-DD product and technology demonstrations:

  • Live traffic up to 400 Gbps will be run over interconnects utilizing FIT QSFP-DD cables, cages and connectors.
  • 400G QSFP-DD SMF DR4 technology demonstration.
  • QSFP-DD products: FIT will be showcasing its growing line of QSFP-DD cage, connector and interconnect products.

"FIT is committed to the development of 50G, 100G and 400G PAM4 based products and technologies that will add to one of the broadest portfolios of transceivers, cages/connectors, direct attach copper (DAC), and active optical cables (AOC) on the market," said Steve Shultis, Senior Director of Product Marketing at Foxconn Interconnect Technology.

FIT also announced the general availability of its 100 Gbps Bidirectional (100G BiDi) QSFP28 multimode fiber (MMF) transceiver module for 100 Gigabit Ethernet.

A key advantage is that the 100G BiDi module facilitates an easy upgrade path from 10 Gbps or 40 Gbps line rates to 100 Gbps by reusing existing duplex LC MMF fiber cable infrastructure. The 100G BiDi modules support link distances up to 70m OM3, 100m OM4, and 150m OM5 MMF. The company notes that because 40G BiDi QSFP+ transceivers have already been widely adopted in the industry, 100G BiDi QSFP28 optics are a smooth generational upgrade. Both 40G BiDi and 100G BiDi efficiently use 2 laser colors per link, instead of more complex and costly solutions using 4 laser colors. In addition, 40G BiDi and 100G BiDi limit the range of those colors in order to get improved cable performance with existing Enterprise OM3 and OM4 MMF cabling infrastructure. FIT's solution is designed using 50 Gbps PAM4 integrated circuits and optical signaling with mature 2-color (850 and 900nm) VCSEL technology highly leveraged from 40 Gbps to 100 Gbps.

In addition, FIT announced general availability and volume production of its CXP2 optical transceiver module and CXP2 active optical cable (AOC). These 300G (12x25Gbps) pluggable fiber optic solutions can be used to build a high-density, multi-lane interconnect fabric using mature VCSEL technology, which is strongly desirable for applications such as chassis interconnect in high-end switches, routers, server clustering, and high-performance computing.

Key features of FIT's CXP2 optical solutions include:

  • Proven 850 nm technology with high reliability and consistent high quality: Fully-equipped with 12-channel arrays of VCSEL transmitter and PIN receiver technologies. Guaranteed performance over corner conditions at distances up to 100m OM4 multimode fiber.
  • Multi-rate support: Each lane can operate up to 25.78 Gbps NRZ and is compatible with legacy data rates in CDR bypass mode. Suitable for 25GE, InfiniBand EDR, PCI Express, and proprietary data rates.
  • Feature-rich programmability: Individual channel control of Tx&Rx CDR capability, Tx equalization, Rx amplitude and emphasis. Support for in-system firmware upgrade.
  • Digital diagnostics support: Both transceiver module and AOC support temperature and supply voltage monitoring as well as per-channel laser bias current, laser power, and receiver input power monitoring.
  • World 1st in high volume optical CXP2 production shipment: FIT is the first vendor offering CXP2 optical products with demonstrated high volume manufacturing capability.

Tuesday, March 20, 2018

DustPhotonics leverages manufacturing innovation for 400G QSFP-DD transceivers

DustPhotonics, a start-up based in Modi'in, Israel with offices in Cupertino, California, emerged from stealth to discuss its development of a next-generation packaging technology that simplifies the manufacturing of high-performance optical transceiver. The company said its innovations will increase the manufacturing yield of optical transceivers.

DustPhotonics is currently ramping production of 400Gbps QSFPDD-­‐SR8 and OSFP-­‐SR8 modules.
"We are only at the beginning of ever increasing demand for high speed optical interconnect," said Ben Rubovitch, CEO. "DustPhotonics is pleased to support the world-­‐wide optical design initiative through our commitment to manufacturing open and innovative optical networking products that enable a dynamic, reliable, bandwidth-rich datacenter."

Sunday, March 18, 2018

Credo demos 112G PAM4

Credo, a semiconductor company specializing in Serializer-Deserializer (SerDes) technology, demonstrated its low power, high-performance 112 GbpsPAM4 SerDes technology at OFC 2018.

For 112G per lambda optical connectivity (i.e., DR, DR4, FR4), Credo has delivered product solutions in TSMC 28nm.

For 112G electrical VSR and LR reaches, Credo has delivered the solutions in TSMC 16nm.  The conference starts today at the San Diego Convention Center, with exhibits taking place March 13–15.

“Credo’s ability to deliver leading edge performance at the industry’s lowest power in mature TSMC process nodes enables rapid time-to-market at a cost structure that will accelerate the transition to the 112G connectivity radix,” said Jeff Twombly, vice president of business development at Credo. “hyperscale cloud providers want to move to single lane rate 112G connectivity as soon as possible. We are aggressively working with strategic ecosystem partners for 2019 trials which will enable production scale ramping in 2020.”

Luxtera advances its silicon photonics

AT OFC 2018, Luxterra showcased its latest advances in  100G/λ technology, PAM4 signaling, extended reach, increased operating temperature range, liquid immersion cooling, increased density and photonic integration.

Product demonstrations included:

  • IEEE802.3bs compliant 400G-DR4 technology platform demonstrating increased throughput and performance in Luxtera’s next generation products
  • 30km, 50G-PAM4 single-lambda QSFP link demonstrating Luxtera’s extended reach capabilities with PAM4 signaling over duplex fiber
  • 4x25G-LR QSFP28 modules running error-free at industrial temperature extremes (-40C and +85C) over 10km of SMF demonstrating increased operating temperature range and extended reach
  • 100G-PSM4 QSFP28 module running error-free while fully immersed in liquid immersion coolant demonstrating why Luxtera silicon photonics transceivers are ideally suited for liquid immersion applications
  • Production 3.2Tb 0.5RU switch with 32 x 100G-PSM4 ports using Luxtera’s 2x100G-PSM4 embedded optical module demonstrating Luxtera’s higher density products
  • The evolution of optics: An example high-density integrated photonics+ASIC switch demonstration
  • Advanced photonics wafers from the latest TSMC 300mm CMOS wafer foundry process demonstrating Luxtera’s new technology platform

“Luxtera is excited to showcase its latest technology innovations at OFC 2018. These innovations will further expand our product portfolio to address the growing demands of our data center and mobile infrastructure customers,” said Ron Horan, VP of Marketing for Luxtera. “As the trusted market leader in Silicon Photonics, Luxtera is well positioned to continue its mission of investing and innovating in the industry’s most advanced and integrated optics platform."

Thursday, March 15, 2018

OFC 2018 attracts 15,500 attendees

The Optical Fiber Conference and Exposition (OFC 2018), which was held this week in San Diego, attracted more than 15,500 attendees, 700+ exhibitors from 65 countries, and over 850 peer-reviewed technical sessions. Last year, OFC 2017 recorded 14,500 attendees and 663 exhibitors in Los Angeles.

The organizers said  OFC has been on a steep growth trajectory over the last three years, increasing in overall square footage by 44% and experiencing a 21% growth in exhibitors and attendees.

“Optical advancements in 5G, next-gen optical transport, multi-layer optical internetworking, open transport hardware/software and disaggregation led many discussions this week during OFC–in ground-breaking research presented, technical workshops, product launches and in the plenary addresses from industry visionaries,” said Martin Birk, Lead Member of Technical Staff, AT&T Labs, USA, and a General Chair of OFC 2018. “OFC is the industry’s stage to present, debate, launch and demonstrate the innovations driving applications including AI and connected vehicles that are on the cusp of changing the world in which we live.”

Fujitsu unveils T500 and T600 optical transport platforms

Fujitsu introduced its new 1FINITY T500 and T600 series optical transport platform for network service providers and data center operators.

The platforms are powered by the latest 16nm CMOS fin-FET digital signal processor (DSP) developed by NTT Electronics (NEL) in partnership with Fujitsu.

The 1FINITY T500 and T600 enable up to 2.4 Tbps of service transport in a fully compliant, pluggable 1RU design. The products offer available bandwidth-variable transport rates from 200G to 600G, support both C-band and L-band transmission, and full fiber capacity utilization up to 76.8 Tbps per fiber pair.

The advanced DSP enables dozens of operation modes, including leading 64 GBaud, 64QAM transmission for 600Gbps wavelengths; ensuring the 1FINITY platform is able to provide the best transmission performance across a wide range of applications, including data center interconnect (DCI), metro, long-haul and subsea transport.

Fujitsu said its new 1FINITY blades provide network operators with flexible modes of operation, including variability in service and network data rates, baud rates, modulation rates, channel width and forward error correction (FEC).

“1FINITY T500 and T600 blades are designed to deliver the bandwidth capacity, flexibility, programmability and power efficiency that network service providers and data center operators require as they build tomorrow’s self-aware networks, today,” said Christine Podraza, head of the optical business unit at Fujitsu Network Communications, Inc. “This new family of 1FINITY transponders from Fujitsu ushers in next-generation variable optical transport that paves the way for 5G and conscious networking in a more agile, open and fully automated environment.”

NTT Electronics announces 64GBaud coherent DSP

NTT Electronics (NEL) has begun sampling a 64GBaud high-performance coherent DSP for DWDM optical transport systems. The DSP core leverages Broadcom’s 16nm CMOS fin-FET high-speed mixed-signal technologies which enhances per-lambda capacity by two-to-three times up to 600Gbps/λ.

NEL's new DSP supports flexible line capacities by combining multiple Baud-rates and modulation-formats, from 100Gbps/λ by 32GBaud QPSK to industry-first 600Gbps/λ by 64GBaud 64QAM.

The company says it is able to achieve a range of per-fiber DWDM capacity, from 5Tbps for tens of thousands of kilometers Ultra Long Haul (ULH) to over 30Tbps for 120km ZR transmission reaches, and further doubling the capacity by using both C-band and L-band. Real-time coherent processing at 64GBaud enables thousands-of-kilometers LH transport at 200Gbps/λ by Dual-Polarization (DP) QPSK, hundreds-of-kilometers Metro transport at 400Gbps/λ by DP 16QAM, or 120km ZR transport at 600Gbps/λ by DP 64QAM.

“Every Service Provider needs to maximize fiber capacity to meet increasing bandwidth demand,” said Haruhiko Ichino, NEL Executive Vice President and General Manager of Broadband System & Device Business Group. “We are strongly committed to be a pioneer in the coherent DSP innovation and to provide merchant-silicon solutions for cost-effective upgrades in LH, Metro, and shorter-reach data-center-interconnect (DCI) applications.”

Commercial production is expected in the second half of 2018.

Calient doubles capacity of its MEMS-base fiber-optic cross connect

CALIENT Technologies introduced its Edge|640 Optical Circuit Switch (OCS) with 640 fiber-optic cross connections – up to twice the capacity of its current S320 OCS product.

CALIENT uses 3D microelectrical machine (MEMS) optical mirror technology to create protocol agnostic optical connections between ports at speeds up to 400 Gbps. The all-optical nature of the switch results in very low latency connections. The switch features built-in optical signal power monitoring on each link and features low power consumption of 90 Watts typical.

CALIENT said its new Edge|640 is organized into two switching groups of 320 ports each. Devices connected to a switch port on one of the switch groups can be connected to a device on any of the ports in the other switch group. This connectivity is ideal for “wire-once” network applications or for testing applications where devices under test need access to a range of test systems.

“Network virtualization and software-defined networking (SDN) are driving demand for fully automated networks on a massive scale, and the Edge|640 supports this trend through its high port density and very low latency connectivity,” said David Altstaetter, CALIENT Vice President of Product Line Management. “Some of the largest networks in the world trust CALIENT Optical Circuit Switch technology. The proven nature of technology sets the stage for the Edge|640 to be used in very high-density mission-critical applications.”

CALIENT acquired by Suzhou Chunxing Precision Mechanical Co.

Suzhou Chunxing Precision Mechanical Co., Ltd. has agreed to acquire a controlling stake in CALIENT Technologies, a supplier of optical switching solutions based on proprietary 3D microelectromechanical systems (MEMS) technology. Financial terms were not disclosed. CALIENT is based in Goleta, California (near Santa Barbara).

CALIENT’s S-Series Optical Circuit Switches are used in data center, compute cluster and communication service provider applications.

In a joint statement, Carvin Chen, EVP of Chunxing and Atiq Raza, CEO of CALIENT, said: “Chunxing and CALIENT share very similar management philosophies, cultures and values. This lays a very profound and solid foundation for our two companies to join together at a perfect time and with a perfect match to cope with the demands and challenges of keeping pace with a fast-growing new generation of optical switching technology. With our most cutting-edge optical switching technology, products and systems, and by exploring and leveraging both companies’ strengths and synergies, our common vision is to create a great world-leading company to explore, develop and deliver the most innovative optical switching value propositions and solutions to our most valuable customers and the market.”

The company will continue to operate from its Goleta, CA, headquarters under the CALIENT brand.

http://www.calient.net

Sedona introduces Hierarchical Network Controller

Sedona Systems, a start-up offering multi-layer IP/optical network automation and control solutions, introduced a Hierarchical Network Controller that automatically discovers, provisions and optimizes L0-L3 services across multilayer, multivendor, multidomain networks.

The company said the role of its Hierarchical Network Controller is to present a single interface and simplified view of the network to service orchestrators and OSS products, and then to provide end-end network control and policy management by interacting with domain controllers from multiple IP and transport vendors.

In initial implementations, service providers are using the new NetFusion product as a single “pane of glass” for provisioning L0-3 services, without having to configure every layer, domain and vendor separately, and allowing services to be provisioned in minutes. By contrast, manual multilayer provisioning processes that are used in current networks can take weeks to complete.

“Service-aware networks are becoming particularly important as new consumer and enterprise applications require transport networks to efficiently support a range of different service types with widely varying bandwidth, performance, and availability requirements. They will become even more valuable as 5G applications mature.” said Ori Gerstel, CTO at Sedona. “We developed the new NetFusion Hierarchical Network Controller specifically to enable the benefits of service-awareness and we’re very pleased with the performance we’ve seen in recent customer verification testing. ”

Kaiam debuts 400G QSFP-DD

Kaiam unveiled an 8-lane, single-mode 400G transceiver in a QSFP-DD form factor at OFC 2018.

The new device, which is enabled by the company's LightScale2 architecture used in its XQX5000 series of 100GBASE-CWDM4 QSFP28 pluggables, is optimized for high-volume, low-cost manufacturing.

The company said its LightScale2 platform supports both 4-lane and 8-lane 200G and 400G transceiver variants, including 400G-LR8/FR8, 400G-FR4, 2x100G-LR4, 2x100G-CWDM4, 2x100G-4WDM-10, 200G-FR4, and 2x200G-FR4. These can be supported in either QSFP-DD or OSFP packages. The platform can further extend to future 800G solutions, and even beyond pluggables to Kaiam’s Co-Packaged Photonics Interconnect (CoPPhI).

“As capacity and density requirements increase in the data center, our MEMS-based PLC approach further outperforms traditional approaches,” commented Bardia Pezeshki, CEO. “At OFC 2018, we are demonstrating a transceiver that has 4x the bandwidth of the previous generation in roughly the same QSFP form factor, highlighting the bandwidth and density scalability of Kaiam’s technology.”

“We’re seeing market need for 400G QSFP-DD transceivers in 2019, but uncertainty and skepticism about whether transceiver vendors can deliver cost-effective solutions at scale with the high speeds needed per lane and the desired reach. Our ability to offer a simple 8-channel 400G solution in advance of the more complex 4-channel electronics, with the full 10km reach, gives the customers faster and easier access to 400G in the desired compact form factor,” commented Jeremy Dietz, VP of Global Sales & Marketing.

Menara samples Coherent CFP2-DCO transceivers

Menara Networks has begun sampling its Coherent CFP2-DCO transceivers to select customers.

Menara’s Digital CFP2-DCO “system-in-a-module”, which is powered by a 16nm Coherent Processor, provides DWDM coherent transmission for 100G and 200G per wavelength in a CFP2 MSA small form factor. It performs all necessary adaptive PM-QPSK and PM-QAM 16 modulation, digital signal processing for linear and non-linear fiber impairments compensation, G.709 compliant OTN framing, and a multitude of hard and LDPC-based soft decision forward error correction encoders/decoders. Compatible with 100GE, CAUI, OTL4.10, and OTL 4.4 interfaces, Menara’s Coherent CFP2-DCO is full C-band tunable and supports ITU-T G.694.1 6.25 GHz Flexible Grid. With maximum versatility, it enables ZR, Data Center Interconnection, Metro and Long Haul applications.

“Building on a long track record of bringing high-performance optical modules with advanced functionalities to the market, Menara’s engineering team successfully integrated all necessary functions for digital coherent transmission in a CFP2 form factor,” said Salam ElAhmadi, Menara Networks CTO & VP of Engineering. “CFP2 smaller footprint not only doubles the faceplate density but also improves 200G coherent transmission economics.”

Wednesday, March 14, 2018

MACOM intros single- and quad-channel EML drivers

At OFC2018, MACOM Technology Solutions introduced single- and quad-channel linear externally modulated laser (EML) drivers for 53 Gbaud PAM-4 applications. This family of surface mount drivers enables 100 Gbps per lambda with low power and high bandwidth for 100G/400G Data Center applications.

MACOM’s MAOM-005311 and MAOM-005411 feature differential inputs to provide common-mode rejection while the single-ended output voltage can be adjusted up to 1.8Vpp. These devices provide 6 dB of gain control range with integrated peak detector on each channel for closed loop control. Available as a surface mount package, this solution integrates the high frequency chokes and coupling capacitors for bias of the driver and EML.

Tuesday, March 13, 2018

OIF hosts Interoperability demos of FlexE, 56G PAM4, 112G per lane

This week at OFC in San Diego, the Optical Internetworking Forum (OIF) is conducting a series of multi-vendor interoperability demonstrations showFlexE), 112 Gbps per lane live electrical signaling and end-to-end optical links using CEI-56G-VSR electrical interfaces.
casing three significant technologies; Flex Ethernet (

There are 14 participating companies including Amphenol, Credo Semiconductor, Fiberhome Telecommunications Technologies Co., Ltd., Finisar, Huawei Technologies Co., Inphi, Keysight Technologies, Molex, TE Connectivity, Tektronix, VIAVI Solutions, Xilinx, Yamaichi Electronics, and ZTE Corporation.

Flex Ethernet Demo -- the FlexE technology from the OIF extends standard Ethernet with bonding, subrating, and channelization features and is defined in the FlexE v1.0 Implementation Agreement. The demo features interoperability among member companies using combinations of these three features over multiple types of 100 GbE.

56 Gbps Demo -- this demo features multiple silicon suppliers operating over a 56 Gbps PAM4 VSR (chip to module) link reflecting the recently published CEI 4.0 document that includes this 56 Gbps PAM4 channel definition. The 56 Gbps demo will electrically drive interoperating optical modules, interconnected with fiber, showing a full multi-vendor electrical-optical-electrical link from host-to-host. The broad range of technologies and suppliers participating in the demo indicates the maturing industry ecosystem around 56 Gbps signaling.

112 Gbps Demo -- the OIF recently began new projects to define 112 Gbps per lane interoperable serial electrical channel definitions. As part of that effort, the OIF will be presenting two 112 Gbps serial electrical demos at OFC 2018. The first demo will include a silicon chip driving a VSR (chip to module) channel and the second will have a silicon chip driving a direct attach copper cable assembly. 112 Gbps electrical signaling is regarded as a necessary technology to enable future signaling bandwidth requirements.

“The OIF continues to test and validate the implementation agreements the forum is working on or has recently completed,” said Steve Sekel of Keysight Technologies, Inc. and the OIF’s Physical and Link Layer Interoperability Working Group Chair. “The OIF recently published both CEI revision 4.0 which includes CEI-56 Gbps requirements and the FlexE revision 1.0 specification. The forum also started work on four CEI-112 Gbps projects so this demo provides important insight into the potential technical solutions.”

Ciena debuts packet aggregation switch and reconfigurable line system

At this week's OFC in San Diego, Ciena introduced a new 8180 Coherent Networking Platform and a 6500 Reconfigurable Line System (RLS).


The 8180 Coherent Networking Platform is a high-density stackable packet aggregation switch that combines the density, openness, and programmability of a data center switch with the industry-leading capacity and embedded optical intelligence of Ciena’s WaveLogic coherent optics. The 8180 offers powerful optical and packet capabilities with support for 400G wavelengths and scales to 6.4 Tb/s of packet switching.

The 6500 Reconfigurable Line System is a programmable, open and modular line system that scales to support the highest bandwidth requirements of metro and long-haul DCI as well as cable access applications. Designed to provide choice in how providers deploy their line systems (integrated or disaggregated), it also reduces footprint and expands fiber capacity with L-Band.

Ciena said both the 8180 and the 6500 RLS are designed for ease-of-use with an IT-operational model, and include common open APIs for software programmability, automated provisioning and streaming telemetry as well as simpler integration with back-office systems. With these new products, Ciena is further expanding choice for customers and addressing the diverse technology consumption models present in today’s on-demand environment.
Both products will be generally available in the second half of 2018.

“We live in a fast-paced, ‘app-driven’ world where users have insatiable bandwidth needs and want on-demand services. Survival means offering an incredible customer experience that can only be delivered through more adaptive networks that deliver content and services with on-demand agility. Ciena’s new 8180 and 6500 RLS help operators satisfy this need by focusing programmable and highly scalable resources at fiber dense points in the network,” stated Steve Alexander, Chief Technology Officer, Ciena.

Monday, March 12, 2018

Lumentum to acquire Oclaro for $1.8 billion

Lumentum agreed to acquire Oclaro for approximately $1.8 billion in cash and stock.

Under the deal, Oclaro stockholders will be entitled to receive $5.60 in cash and 0.0636 of a share of Lumentum common stock for each share of Oclaro stock, representing a premium of 27% to Oclaro's closing price on March 9, 2018 and a premium of 40% to Oclaro's 30 day average closing price.  Oclaro stockholders are expected to own approximately 16% of the combined company at closing.

The combined company is expected to have annual revenue of $1.733 billion and an operating margin of 19%, prior to synergies from the combination.

Lumentum, which is based in Milpitas, California, supplies a range of optical components and subsystems for telecom, enterprise, and data center networking equipment. The company was created in 2015 as a split off from JDSU.

Oclaro supplies optical components and modules for the long-haul, metro and data center markets. The company is based in San Jose, California.

"Joining forces with Oclaro strengthens our product portfolio, broadens our revenue mix, and positions us strongly for the future needs of our customers.  Oclaro brings its leading Indium Phosphide laser and Photonic Integrated Circuit and coherent component and module capabilities to Lumentum.  The combined company will drive innovation faster and accelerate the development of products to enable our customers to win," said Alan Lowe, Lumentum's President and CEO.  "We are delighted to welcome the talented Oclaro team to Lumentum and look forward to a swift completion of the transaction with a focus on supporting our customers and delivering shareholder value."

"I am very pleased that two of the optical industry leaders, Oclaro and Lumentum, will join forces.  Together, we will be an even stronger player in fiber optic components and modules for high-speed communications and a market leader in 3D sensing.  This is a fantastic combination for all of our stakeholders, including stockholders, employees, customers and partners," said Greg Dougherty, Oclaro's CEO, "I am extremely proud of what the Oclaro team has accomplished over the last five years. We have enjoyed tremendous success and this combination will create even more exciting opportunities for the team."

Infinera’s ICE5 optical engine to drive 2.4 Tb/s capacity, 600G wavelengths

Infinera unveiled its ICE5 Infinite Capacity Engine for powering its next generation of optical transmission systems.

The company said its ICE5 unlocks unprecedented capacity, reach, spectral and power efficiency for internet content providers (ICPs) who are scaling connections between data centers and for communications service providers (CSPs) who are planning fiber-deep architectures including distributed access architecture (DAA) and 5G mobile backhaul.

ICE5 integrates Infinera’s fifth-generation photonic integrated circuit with a FlexCoherent digital signal processor (DSP) and fine-grain software control to deliver 100 to 600 gigabits per second per wavelength in the industry’s first 2.4 Tb/s optical engine. ICE5 is designed for over 40 Tb/s on a single fiber within a fraction of a data center rack, increasing capacity up to 65 percent over currently deployed networks while reducing power by 60 percent.

Infinera Intelligent Transport Network platforms with ICE5 are planned for availability in early 2019.

“Innovation is on fast forward at Infinera as we build on our success with ICE4 to introduce ICE5 - the industry’s first 2.4 Tb/s optical engine,” said Dr. Dave Welch, Infinera Founder, Chief Strategy and Technology Officer. “With ICE5 we are bringing our leading-edge technologies to market faster than ever, enabling our ICP and CSP customers to respond quickly to explosive bandwidth growth and ultimately win in their markets.”

Source Photonics debuts 400G client transceivers #OFC2018

Source Photonics introduced a range of 400G client transceivers including the 400G QSFP-DD FR8/LR8 module for data center applications and the 400G CFP8 FR8/LR8 module for telecom applications. Sampling is expected in Q2.

  • The 400G QSFP-DD is designed to be compliant with the IEEE 802.3bs 400GBASE- LR8/FR8 and QSFP-DD MSA specifications for links up to 10 km. 
  • The 400G CFP8 FR8/LR8 is designed to be compliant with the IEEE 802.3bs 400GBASE- LR8/FR8 and CFP MSA specifications for links up to 10 km.

“We are proving to the market that multiple 400G offerings will be available in the short term to support connectivity between transport, routing and switching equipment.  Operators can now believe a strong foundation exists to plan network upgrades,” says Ed Ulrichs, Director of PLM at Source Photonics.

At this week's OFC in San Diego, Source Photonics is demonstrating an error-free link between their 400G QSFP-DD LR8 and 400G CFP8 LR8, proving that links up to 10km can soon upgrade from 100G to 400G, therefore significantly reducing total cost of ownership in the aggregation layer.

“We have successfully integrated our industry-leading signal integrity work with novel optical coupling concepts to demonstrate the highest density optical transceiver ever.  Since we use a common manufacturing platform with our 100G products, we are confident we will be the first in the market to scale this platform,” says Sheng Zhang, Chief Scientist at Source Photonics.

OFC booth number 3921

MACOM's silicon photonics enables CWDM4, DR1 and FR4 L-PICs

MACOM introduced a CWDM4 transmitter optical sub-assembly as a part of its L-PIC (Laser-integrated Silicon Photonic Integrated Circuit) solution for 100Gbps CWDM4.

The combined solution integrates four high-performance 25Gbps CWDM wavelengths in a single silicon photonic integrated circuit (PIC) to communicate 100Gbps over duplex single mode fiber.

MACOM said its L-PIC platform provides a highly integrated silicon photonic solution targeting specific data center applications that includes four CW lasers, monitor photodiodes, high bandwidth waveguides, modulators and multiplexers. Utilizing MACOM’s patented self-aligning etched facet technology (SAEFTTM) for precision attachment of the lasers to the silicon chip, the L-PIC platform removes the need for active laser alignment and offers a significant cost reduction to the customer, enabling mainstream deployment.

“MACOM is leveraging our L-PIC platforms to enable leading scalability that meets the rapidly increasing CWDM4 module demand,” said Vivek Rajgarhia, Senior Vice President and General Manager, Lightwave, at MACOM. “The platform’s automated self-aligning calibration and firmware control is anticipated to deliver the requisite combination of scale and cost for mainstream Cloud Data Center deployment.”

Molex intros 100G PAM-4 Based 25G/50G/100G/400G

Molex introduced a portfolio of 100G and 400G products based on its 100G PAM-4 optical platform, including multi-Rate 25G/50G/100G PAM-4 DWDM QSFP28, 100G FR QSFP28, 400G DR4 and 400G FR4 QSFP-DD and OSFP.

100G PAM-4 platform-based product solutions include:

  • 25G/50G/100G Multi-Rate PAM4 DWDM QSFP28:
    Supports 40x100 Gbps DWDM with a total of 4 Tbps per fiber pair
    Flexible data rate programmability to support 25 Gbps and 50 Gbps applications
  • 100G FR QSFP28:
    Compliant with 100 Gbps Lambda MSA
    Supporting 100G connectivity up to 2km
  • 400G DR4 and 4x100G FR QSFP-DD/OSFP:
    Compliant with 100G Lambda MSA
    Supporting 400 Gbps connectivity up to 500m
    4X100G FR supporting four times of 100G FR up to 2km
  • 400G FR4 QSFP-DD/OSFP:
    Compliant with 100G Lambda MSA
    Supporting 400 Gbps connectivity up to 2km


“Molex is a leader in the development of the foundational building blocks for 100G PAM-4 optoelectronics, and in collaborations for digital signal processing (DSP) integrated circuits. By leveraging these combined capabilities, we support high bandwidth requirements for a wide range of applications across intra-data center, data center interconnect (DCI) and 5G wireless. In addition, 100G PAM-4 technology also lays the foundation for cost-effective and high-density 400G solutions,” said Rang-Chen (Ryan) Yu, vice president of business development, GM of optoelectronic solutions at Oplink, a Molex Company and co-chair of 100G Lambda MSA.

OFC booth 2512

Sunday, March 11, 2018

Corning's RocketRibbon cable packs 3,456 fibers

Corning unveiled a new "RocketRibbon" extreme-density fiber cable for data center and carrier environments.

RocketRibbon cables deliver up to 3,456 fibers in the same diameter as existing central and stranded tube cables. Corning is using a proprietary manufacturing process to create as many as 12 individually protected sub-units, each with 288 closely packed fibers. An extruded color-coded jacket protects and identifies each bundle and allows for direct and easy routing to splice trays, without the need for additional materials, ribboning processes, or furcation kits.

Corning said its new RocketRibbon cable allows operators to quickly install more capacity in the same duct space to accommodate increased bandwidth demand.

“Corning’s industry leadership and unique co-innovation approach mean our customers come to us to help solve their most important problems. RocketRibbon extreme-density cable demonstrates how we work hand-in-hand with our customers, listening to their challenges. In this case, we developed an entirely new system of ribbon protection and sub-units that provide our customers with easier, faster cable access for ribbon identification and splicing,” said Bernhard Deutsch, division vice president and general manager, Corning Optical Fiber and Cable.

VPIphotonics updates Design Suite for coherent M-QAM and PAM-M

VPIphotonics announced the latest release of its VPIphotonics Design Suite for optical components and transmission systems.

Version 9.9 comes with enhancements of the user interface and tools operation, as well as advances in simulation capabilities, such as new design and analysis tools for coherent M-QAM and direct-detection PAM-M systems, new and enhanced DSP and coding functionalities, extended library of PIC elements and instrumentations, to continuously support VPIphotonics’ existing and addressing new applications and markets.

The company said its simulation tool suite provides access to over 850 ready-to-run demonstrations, including new ones
such as probabilistic shaping, PAM-4 for interconnects, multimode VCSEL transmission, nonlinear Volterra filtering.

VPIphotonics Design Suite Version 9.9 is on show at OFC 2018, booth 4513.

See also