Sunday, September 25, 2022

Keysight and Nokia Bell Labs transmit at 260 GBaud over 100 km

Keysight Technologies and Nokia Bell Labs have successfully tested a 260 GBaud ultra-high-speed optical signal transmission over 100 km of standard single-mode fiber (SSMF), exceeding the previous record of 220 GBaud.

The companies combined expertise with other research partners to create the record-breaking demonstration of 260 GBaud Dual Polarization Quadrature Phase Shift Keying (DP-QPSK) coherent transmission over 100 km single mode Fiber. The demonstration consisted of Keysight's new 260 GSa/s arbitrary waveform generator (AWG) (M8199B), which delivers more than 75 GHz bandwidth and a thin-film lithium niobate I/Q modulator with 110 GHz bandwidth. This enables R&D of transmission systems operated with symbol rates up to 260 GBaud and achieving net bitrates greater than 2 Tbps in coherent optical communications.

“Keysight is honored to work with Nokia Bell Labs on achieving 260 GBaud,” said Dr. Joachim Peerlings, vice president of Network and Data Center Solutions at Keysight. “The continued proliferation of AI requires new levels of server and network performance that must scale computing resources within reasonable energy bounds. Higher data rates and new modulation formats will be among the enabling technologies for the industry.”

“We achieved this outstanding record of maximum symbol rate of 260 GBaud by leveraging enabling technologies and the expertise of several partners,” said Haïk Mardoyan, Senior Research Scientist, Nokia Bell Labs. “This result is a first milestone to scale long haul data transport systems beyond 2 Tbit/s per wavelength. Improving the energy efficiency of transponders is a permanent challenge for the industry.”

ECOC22: Keysight's waveform generator speeds well past 160 GBaud

Keysight Technologies introduced its M8199B arbitrary waveform generator (AWG), which provides R&D engineers a high-performance signal source for arbitrary signals that enables development of designs employing multi-level modulation formats (e.g. 64QAM) at well beyond 160 GBaud.Applications beyond 128 GBaud demand a new class of generators that provide high speed, precision and flexibility at the same time. Keysight addressed these challenges...

ECOC22: Keysight announces 224G BERT, paving way for 1.6 Tbps transceivers

Keysight Technologies announced a 224G Ethernet bit error rate test (BERT) solution to enable system-on-a-chip (SoC) makers to validate next generation electrical interface technology, accelerating 1.6 terabit per second (1.6T) transceiver design and pathfinding.“Keysight is pleased to collaborate with Synopsys, and other semiconductor makers, capture early market opportunities associated with the transition from 800 gigabit per second (800G) to...

Lumen acquires fiber pair on Google's Grace Hopper transatlantic cable

Lumen Technologies has acquired a fiber pair on Grace Hopper, a subsea cable system spearheaded by Google, between New York and Bude, Cornwall in the U.K. The Grace Hopper system will use Lumen landing station and infrastructure services at both locations.

Lumen is taking orders now on Grace Hopper which will be active and ready to deliver services in October.

"Data flow and capacity demands don't know boundaries. The bandwidth explosion across continents is real and we're meeting it head on by investing in new subsea cables," said Laurinda Pang, Lumen president of global customer success. "The Grace Hopper system is part of Lumen and Google's long history of collaboration. Together, we're building communications infrastructures for secure and reliable delivery of digital enterprise and consumer services around the world. We are pleased to be using our landing stations at these locations, and excited to add another end-to-end intercontinental connection to the Lumen network – one of the most deeply peered networks in the world."

Lumen now has a transatlantic subsea portfolio with six on-net diverse fiber routes, including Dunant, a Google subsea system. Dunant connects Virginia Beach in the U.S. with Saint-Hilaire-de-Riez on the French Atlantic coast. Lumen has an on-net route utilizing Dunant between Richmond, Virginia and Paris, France.

Google's Grace Hopper subsea cable lands in Cornwall

The Grace Hopper subsea cable has landed in Bude, Cornwall, UK. This follows a successful Bilbao landing earlier in September.Google says Grace Hopper will use a new switching architecture to provide optimum levels of network flexibility and resilience to adjust to unforeseen failures or traffic patterns.'s Grace...

Google's Firmina cable to link North and South America

Google announced plans to build a 12-fiber pair subsea cable linking North and South America via the Atlantic.The Firmina cable system, which will be designed, manufactured and installed by SubCom, will run from the East coast of the United States to Las Toninas, Argentina, with additional landings in Praia Grande, Brazil and Punta del Este, Uruguay. The Firmina system will use SubCom's 18kV power technology, which will enable Firmina to be...

Google's Grace Hopper subsea cable to link US-UK-Spain

Google unveiled plans for a new subsea cable — Grace Hopper — which will run between the United States, the United Kingdom and Spain. The cable is named for computer science pioneer Grace Brewster Murray Hopper (1906–1992), an admiral in the U.S. Navy best known for her work in developing the COBOL programming language. The Grace Hopper cable will be equipped with 16 fiber pairs (32 fibers). Subcom has been selected as the lead contractor. The project...

U.S. DoE offers $42 million for data center cooling innovation

The U.S. Department of Energy (DOE) is offering up to $42 million in funding for the development of high-performance energy efficient cooling solutions for data centers. 

Data centers account for approximately 2% of total U.S. electricity production while data center cooling can account for up to 40% of data center energy usage overall. 

DOE’s Advanced Research Projects Agency-Energy (ARPA-E) will fund projects that seek to reduce the amount of energy data centers use for cooling to lower the operational carbon footprint associated with powering and cooling data centers. This funding will support President Biden’s goals to reach net zero carbon emissions economy-wide by no later than 2050.  

ARPA-E's Cooling Operations Optimized for Leaps in Energy, Reliable and Carbon Hyperefficiency for Information Processing Systems (COOLERCHIPS) funding program aims to develop highly efficient and reliable cooling systems that will enable a new class of efficient power-dense computational systems, data centers and modular systems. The program will prioritize four technical categories for cooling system innovation opportunities:  

  • Energy-efficient cooling solutions for next generation high power density servers
  • High power density modular data centers that can be operated anywhere efficiently
  • Software and modeling tool development to design and optimize data centers’ energy use, CO2 footprint, reliability, and cost, simultaneously
  • Facilities and best practices for efficient evaluation and demonstration of transformational technologies developed under the program. 

“Extreme weather events, like the soaring temperatures much of the country experienced this summer, also impact data centers which connect critical computing and network infrastructure and must be kept at certain temperatures to remain operational,” said U.S. Secretary of Energy Jennifer M. Granholm. “Creating solutions to cool data centers efficiently and reduce the associated carbon emissions supports the technological breakthroughs needed to fight climate change and secure our clean energy future.”

Rockley Photonics develops micro-transfer-printed laser PIC

Rockley Photonics unveiled what it believes to be the world’s first micro-transfer-printed (mTP) silicon-photonics-based laser for commercial applications.

With this breakthrough in the mTP of silicon-photonics-based lasers, Rockley has dramatically increased the laser density of its photonics integrated circuits (PICs) for biosensing, creating what it believes to be the world’s highest-density broad-wavelength laser spectrophotometer chip, surpassing its own previous achievements. Moreover, the mTP process is expected to reduce manufacturing costs and enable thinner, smaller footprint and higher-density chip designs. These attributes are powerful benefits for use in consumer and medtech devices and could facilitate the integration of Rockley’s biosensing technology into future tiny wearables.

Leveraging the mTP process, the new PIC technology will integrate a laser-generating “membrane” with a thickness of only 4 microns. The potential applications for this higher-density and smaller-footprint chip technology extend beyond biosensing and health monitoring into other areas, such as ultra-small wearables, clothing, or XR/VR/AR headsets and glasses.

This mTP breakthrough is the direct result of Rockley’s multi-year partnership with the Tyndall National Institute at University College Cork in Ireland, X-Celeprint Limited, and the Irish Photonics Integration Centre (IPIC), with funding support from the Irish government’s Science Foundation Ireland (SFI) and Disruptive Technologies Innovation Fund (DTIF). The project started five years ago with a focus on developing a custom mTP process for Rockley’s silicon photonics platform and has involved a multidisciplinary team of world-class engineers and researchers. This technology, along with many other Rockley innovations, is backed by a robust multidisciplinary patent portfolio of over 200 issued patents and 295 pending patents in total.

“Applying the micro-transfer printing process to the production of integrated lasers is a huge breakthrough that we believe will have a tremendous impact on wearable biosensing and on the photonics industry as a whole,” said Dr. Andrew Rickman, chairman and chief executive officer of Rockley. “We arguably have some of the most sophisticated photonics technology in the world, and this unprecedented level of miniaturization raises the bar even further. By creating biosensing chips that are smaller, lower-cost, and more efficient, we can continually improve our wearable biosensing products and deliver novel, relevant, and more powerful ways to monitor our health.”

“I believe that this next-gen, heterogeneous integration platform will lead to several significant technological advancements, including higher densities of lasers, increasingly smaller chip sizes, and ultra-high-volume manufacturing,” said Aaron Zilkie, chief technology officer of photonics at Rockley. “The team has been working on this project for years, and we are extremely excited to have reached this important milestone. We are grateful for the close collaboration we’ve had with our research partners and for the funding support from the Irish government and its Science Foundation Ireland and Disruptive Technologies Innovation Fund.”

Nextlink picks Tarana for fixed wireless broadband

Nextlink Internet, a rural-focused provider of high-speed internet and phone services in 11 states, has selected Tarana's G1 fixed wireless platform to compete in local markets with fiber providers.

The deployment will focus on under- and unserved communities and rural regions in Illinois, Indiana, Iowa, Kansas, Louisiana, Minnesota, Nebraska, Oklahoma, South Dakota, Texas, and Wisconsin. The team expects to expand service to hundreds of rural counties over the next several years, covering over a quarter million households.

Nextlink said it wil used Tarana’s G1 platform to go above and beyond its regulatory commitments, delivering 500 Mbps service where it was obligated to deliver 100 Mbps service. Finally, Nextlink plans on utilizing a combination of fiber and gigabit fixed wireless to meet its RDOF obligations. 

Tarana’s G1 platform can deliver gigabit services at impressive distances and in non-line of sight (NLoS) paths. 

Tarana CEO Basil Alwan added “Our mission from the start has been to enable materially faster progress in closing the world’s persistent digital divide — we’re honored and excited by our collaboration with Nextlink to that end.”

T-Mobile US offers free in-flight Wi-Fi on United

T-Mobile US is now offering its customers free in-flight Wi-Fi and streaming, where available, on select domestic and short-haul international United flights. 

Coverage Beyond launches on United’s 737s, MAX8s, MAX9s, select 757-300s and select A319s with Wi-Fi supported by Viasat and Thales InFlyt Experience.

The T-Mobile service is already available in the U.S. on American, Alaska and Delta airlines .

“Now, T-Mobile customers can stay connected from takeoff to landing and beyond on hundreds more flights, now including United Airlines!” said Mike Sievert, CEO of T-Mobile. “This latest expansion of Coverage Beyond is all part of our goal to keep customers connected even outside the signal of our network, and we’re on a nonstop mission to find new ways to make that happen.”

Thursday, September 22, 2022

Tata selects Juniper for 400G Cloud Metro upgrade

Tata Play Fiber, an internet service provider in India, selected Juniper for upgrades to its regional network. 

Tata Play Fiber is implementing a 400G-capable network powered by Juniper’s Cloud Metro solutions, including ACX7100 Cloud Metro Routers and the ACX710 for the access layer. 

In addition, Juniper's Broadband Network Gateway (BNG) subscriber management solution simplifies the delivery of bundled services such as internet connectivity, entertainment content and home security. 

“It is an honor to play a role in Tata Play Fiber's mission to bring blazing internet speeds with unparalleled resiliency to more homes in India. Our experience-first approach and Cloud Metro innovations have laid the foundation for Tata Play Fiber to deliver unparalleled network experiences for its customers. We look forward to supporting Tata Play Fiber with their growth plans and are confident that they will be able to provide game-changing internet experiences for many years to come,” states Sajan Paul, Managing Director & Country Manager, India & SAARC, Juniper Networks.

5G subscriptions top 813 million as of 30-June-2022

There were 813 million 5G subscriptions worldwide by the end of the second quarter of 2022, according to data from Omdia and 5G Americas. The report predicts that global 5G connections will reach 1.1 billion by the end of this year.

Chris Pearson, President of 5G Americas, said, “The progress of 5G continues throughout the Americas with more spectrum, coverage, and usage. We are entering an era of innovation with an expanding 5G ecosystem that is learning how to take advantage of the technical capabilities of this great technology.”

Some additional observations from Omdia:

  • 430 million global 5G connections were added from Q2 2021 to Q2 2022, representing a 1121.1 percent increase from 383 million to 813 million. Those figures represent 16 percent sequential quarterly growth from 703 million in Q1 2022 to 813 million in Q2 2022. 
  • Global 5G connections are forecast to again accelerate in 2023, approaching 2 billion and reaching 5.9 billion by the end of 2027.
  • By region, North America had a total of 99 million 5G and 502 million LTE connections by the end of Q2 2022. This translates into an addition of 17 million 5G connections for the quarter – a gain of 20.7 percent over Q1 2022. Additionally, CTIA notes fast growth in 5G uptake in the United States, which now identifies 315 million Americans covered by 5G and one-third of American adults having an active 5G device. Overall, a total of 137 million 5G connections is projected to come from North America by the end of 2022.
  • In comparison, 4G LTE is expected to remain strong in Latin America and the Caribbean through the end of 2022. In Q2 2022, there were 540 million 4G LTE connections, representing 6.9 percent quarterly growth with the addition of 34.7 million new LTE subscriptions, a number expected to reach 541 million by year end. Latin America and the Caribbean is projected to have 22 million 5G connections by year end of 2022, and 398 million by 2027. 

Orange and Netskope Partner on Carrier-class Connectivity and SSE

Orange Business Services and Orange Cyberdefense are collaborating with Netskope, a leader in secure access service edge (SASE) to deliver a new SSE (Security Service Edge) solution embedded into the Orange Telco Cloud Platform. 

The co-managed solution will reduce complexity for enterprises, providing continuously updated cloud security via the Orange Business Services Telco Cloud Platform. Telco Cloud Platform is a revolution in the way networks are built, run, and managed with enhanced performance. The software-defined approach optimized for telco workloads allows for greater agility and cost reduction.

“Cloud transformation and hybrid work models mean that traditional security architectures are no longer effective or efficient. Plugging our market leading platform into Orange’s network will enable Orange to significantly increase its offering to enterprises looking to secure data without limiting business productivity,” explains Sanjay Beri, CEO, Netskope.

“This innovative partnership is an important part of our Evolution Platform concept designed to simplify connectivity, cloud, and security and support business outcomes from end-to-end, providing real-time protection for our users, their applications, and data, wherever they are. It underscores our position as a trailblazer in SSE and managed services, providing the right balance of performance, speed, and protection to our customers,” adds Aliette Mousnier-Lompré, CEO, Orange Business Services.

ColorChip rolls out 800G optical transceivers and copper cables

ColorChip unveiled 100G PAM4 400G & 800G optical transceiver and copper cable solutions at last week’s ECOC22 in Basel, Switzerland.

ColorChip will also introduced AV hybrid and pure fiber USB/HDMI/DisplayPort optical cable product lines for high-performance Audio/Video, AR/VR devices, and medical market where longer reach, minimum RFI/EMI impact, and higher bandwidth is highly preferred. A live demo of the 100G PAM4 technology in the form factors of QSFP112, QSFP-DD800, and OSFP will be shown at Booth 129. 

"The introduction of these products places ColorChip as a front runner in data center transceivers" said Yigal Erza, ColorChip CEO. "ColorChip's advanced technology and world class manufacturing enabled the company to deliver volume production with the capability to expand and scale our offering to partners who are looking for a company with the right capability and global operation scale to strengthen their supply chain security moving forward in the post-pandemic globalization."

Marvell and OE Solutions offer 100G QSFP-DD modules for industrial temperature

Marvell and OE Solutions collaborated to develop a 100G QSFP-DD optical modules supporting industrial temperature (I-Temp) for 5G backhaul and aggregation applications. 

The OE Solutions Coherent Transceiver, which is now in commercial production, leverages the Marvell Deneb Coherent DSP (CDSP).

"Through our strategic collaboration with OE Solutions, we have brought to market an optimized coherent pluggable DSP solution for carriers transitioning to 100G networks that scales with their emerging 5G infrastructure needs while also providing industrial temperature support," said Samuel Liu, Sr. Director, Product Line Management at Marvell. "Marvell's Deneb coherent DSP offers technology innovation to global carriers supported by a large ecosystem for flexibility and ease of implementation." 

"Global 5G momentum has accentuated the need for expanded fiber optic connectivity in the wireless infrastructure and the critical need for optical pluggable modules to operate reliably in outdoor conditions at fast data speeds," said Kyu Kim, CTO Coherent Technology at OE Solutions. "Through our collaboration with Marvell, we have provided the market with a new 100G coherent transceiver that addresses the fast growing access/aggregation network requirements."

Marvell and InnoLight develop 100G QSFP-DD modules

Marvell and InnoLight have collaborated to launch a 100G QSFP-DD optical module portfolio for 5G backhaul and aggregation applications. 

The InnoLight coherent module family is powered by the Marvell Deneb Coherent DSP (CDSP).

"InnoLight's Deneb-based module offers the ability for carrier customers to seamlessly upgrade their networks to meet increasing bandwidth requirements while expanding their market with minimal investment," said Samuel Liu, Sr. Director, Product Line Management at Marvell. "Through our strategic collaboration with InnoLight, this latest production milestone of the 100G QSFP-DD optical module is accelerating the 10G to 100G transition in aggregation networks to enable performance and flexibility advantages across the ecosystem."

"The launch of our 100G QSFP-DD coherent optics product line with Marvell's Deneb CDSP is exciting in that it will drive a whole new ecosystem of standards-based small form factor coherent pluggable modules," said Osa Mok, Chief Marketing Officer, InnoLight. "Our collaboration with Marvell will help enable massively scalable bandwidth for carriers transitioning to 100G networks."

Ethernity lands $4.6M follow-on contract for Fiber-to-the-Room devices

Ethernity Networks has signed a new $4.6 million follow-on contract with its existing customer, a Chinese broadband network OEM.

Under the contract, Ethernity will supply system-on-chip (SoC) devices with support for Gigabit Passive Optical Networking (GPON) Optical Line Termination (OLT), adapted to enable Fiber-to-the-Room (FTTR) deployments. The Ethernity solution offers GPON OLT over an extremely low-cost FPGA to serve residential and small-office Customer Premises Equipment for FTTR deployments.

Fiber-to-the-Room uses passive optical fiber to reach residential, retail, and enterprise deployments. Passive fiber-optic deployments provide greater reliability and performance than Wi-Fi and a greener and more power-efficient solution than traditional copper cabling. By bringing fiber into the individual rooms of an apartment or small office, end-users can benefit from higher throughput with an unmatched level of service to enable today's most data-hungry applications without experiencing lags.

This is the second major contract with this customer, following an original $3M GPON/XGS-PON OLT SoC order in October 2021. Given the success of that initial project, the customer proposed a follow-on project to address the larger FTTR market, targeting residential deployments and expanding Ethernity's reach into a new mass-volume market.  

This is the largest single FPGA volume-based contract that Ethernity has entered into to-date. With the device being a major enabler within a next-generation home gateway and considering the significant estimated volumes indicated by the customer beyond the committed volume per the contract, this may justify porting the design integrated on the FPGA to an Application Specific Integrated Circuit (ASIC) to allow long-term competitive pricing.

David Levi, CEO, Ethernity Networks said: "This deal confirms our prior expectations that Ethernity's contract wins would lead to follow-on business. We are extremely pleased with the advances we have made on a deployable PON product with this OEM customer, and we are excited to begin work on this extended offering for the new FTTR market. This is a totally untapped market for Ethernity that utilizes our existing 5G infrastructure technology to serve a major connected residential market. I believe this is the tip of the iceberg in this growing market for Ethernity with further potential to generate significant additional revenue flows." 

Ethernity notes $3m order for FPGA-based 1G/10G PON OLT SoCs

Ethernity Networks reported a $3m order from a Chinese broadband network OEM for its ENET 4820 and ENET 5200 FPGA System-on-Chip (SoC) devices.Ethernity's SoC's support four GPON Optical Line Termination (OLT) ports and four 10Gbps XGS-PON OLT MAC ports, respectively, or for different combinations thereof. The SoCs will enable the two types of PON for use in the OEM's 5G fronthaul products, as well as other fiber access deployments.The total initial...

Jabil releases Coherent Optical based Nokia’s Silicon Photonics Optical Engine

Jabil announced sampling of its CFP2 DCO ECO coherent transceiver based on Nokia’s CSTAR200+ silicon photonics optical engine.

“We are pleased to integrate Nokia’s CSTAR-200+ optical engine as part of our complete coherent transceiver solution,” said KW Hoo, GM of Jabil Photonics. “Together, we can accelerate the pace of technology advancements while bringing industry-leading optical products to market faster on behalf of customers worldwide.”

Wednesday, September 21, 2022

euNetworks deploys Lumenisity's hollowcore fibre

euNetworks Fiber UK has deployed a new ultra low latency route between Basildon and London that connects the ICE data centre to Interxion LON1 and LON2 and then onwards to Slough. 

The new route is over 45km long and includes 14 km of Lumenisity's CoreSmart hollowcore cable, which is compatible with regular single mode fibre.

The route is the longest commercial deployment of hollowcore fibre technology to date and its use is exclusive to euNetworks and its customers. It is also the first commercial construction of a long distance hybrid route of hollowcore fibre and regular single mode fibre.

Lumenisity says data travels 50% faster in hollowcore cable, reducing latency by 33%, and providing a round trip saving of 3μs (three microseconds) per kilometre. These latency savings are hugely significant in financial trading applications. They can also be scaled to increase the separation of data centres by 50%, whilst maintaining the latency envelope, more than doubling the area of land in which these data centres can be located.

“We have successfully delivered increasingly longer deployments of hollowcore fibre in our network, becoming the first fibre provider in the world to utilise the benefits of this new fibre technology in commercial markets,” said Paula Cogan, President of euNetworks. “From the initial 1km pilot, the teams have gone on to deploy hollowcore cable lengths of 7km and 14km on our network, as well as successfully blending hollowcore fibre with regular single mode fibre on this latest route. We continue to be focused on delivering the best possible bandwidth solutions for our customers and look forward to deploying longer routes with Lumenisity in the coming quarters. Leading the market in fibre-based ultra low latency services throughout Europe remains a key focus for euNetworks.”

“We are pleased to partner with euNetworks again, successfully deploying this new route and achieving this hollowcore cable link length”, said Tony Pearson, VP Sales & Marketing at Lumenisity. “We are excited to reach this milestone with euNetworks, and will continue to deliver a unique cable solution offering longer reach and lower latency for their customers.”

Comcast tests Lumenisity's hollowcore fiber

Comcast confirmed its first deployment of advanced hollowcore fiber optics.Comcast connected two locations in Philadelphia, which enables network engineers to continue to test and observe the performance and physical compatibility of hollowcore fiber in a real-world deployment. Comcast successfully tested bidirectional transmission (upstream and downstream traffic traveling on a single fiber), used coherent and direct-detect systems (allowing for...

Comcast looks to Samsung for 5G RAN

Comcast is working with Samsung to deliver 5G Radio Access Network (RAN) solutions tfor Xfinity Mobile and Comcast Business Mobile customers in Comcast service areas. 

Specifically, Samsung will supply 5G RAN solutions to deliver 5G access to consumer and business customers in the United States using Citizens Broadband Radio Service (CBRS) and 600MHz spectrum.

Samsung 5G RAN products to be provided include radios for CBRS and 600MHz, baseband units, and a newly developed 5G CBRS Strand Small Cell that can be deployed on Comcast’s aerial cable lines (i.e. strand). Using the new compact and lightweight small cell product, Comcast can leverage its existing DOCSIS infrastructure without having to build or acquire additional cell sites.

“Our capital-light approach to providing enhanced 5G connectivity in service areas where we have a high concentration of traffic and cable infrastructure is smart for our business and even better for customers who will benefit from broader coverage and industry-leading speeds and prices,” said Tom Nagel, SVP of Wireless Strategy at Comcast. “Partnering with Samsung and leveraging their leadership in 5G network innovation will help us seamlessly deliver more next-generation applications and services to our consumer and business mobile customers.”

“We are excited to collaborate with Comcast on their journey to deliver the most enhanced 5G experiences available to their customers,” said Mark Louison, Executive Vice President and Head of Networks Business, Samsung Electronics America. “With this partnership, Samsung continues to build on its wireless technology leadership in commercial 5G rollouts. We look forward to helping Comcast advance its goals in delivering best-in-class 5G mobile services for their Xfinity Mobile and Comcast Business customers.”

Brazil's Forte Telecom upgrades to 800G transponders with Padtec

Forte Telecom, a carrier of carriers in Rio de Janeiro, is upgrading its backbone with 800 Gbps transponders from Padtec. 

The upgraded infrastructure will cover  thousands of kilometers in the stretches between the capitals of Rio de Janeiro and Espírito Santo and in the metropolitan region of Rio, reaching a total transmission capacity of 8 Tbps.

For the expansion, the provider used a credit line from the credit rights investment fund (FIDC) launched by Padtec together with BNDES Participações (BNDESPar) in 2021, which uses resources from the Fund for the Technological Development of Telecommunications (FUNTTEL)  from the Ministry of Communications. The objective, in this case, is to facilitate access to capital resources by small and medium-sized Brazilian industries operating in the telecommunications sector.

For Sérgio Simas, Forte Telecom’s CEO, one of the main advantages of this generation of transponders is to combine high data transmission capacity and less equipment, reducing the cost per transmitted bit – as well as energy and space consumption, which are scarce in telecommunications environments. “This meets our objective of building a high-performance network to evolve our service offering and respond quickly and flexibly to the constant changes in the data traffic profile resulting from the growing demand for broadband”, he says.

Carlos Raimar, Padtec’s CEO, emphasizes that the offer of different credit options reinforces the company’s commitment to the success and growth of its customers. “For some years now, Padtec has been dedicating efforts to make the expansion of the networks of regional operators financially viable”, he says. “The lines of credit bring new options of resources for investments in the expansion of its operations, as well as in the increase of the capacity and quality of its networks, in order to support the growth of demand in the time that its business and its customers demand”, adds Raimar.

Napatech to showcase 5G UPF Offload with AMD and Advantech

Napatech will showcase its SmartNIC-based offload solution for 5G User Plane Function (UPF) in collaboration with AMD and Advantech at next week's MWC Americas in Las Vegas.

Unlike in most 4G networks based on purpose-built appliances, the 5G packet core is implemented as virtualized or cloud-native software running on servers located within edge and core data centers. As Communications Service Providers (CSPs) and enterprises scale up the deployments of their 5G networks, they face strong financial pressure to maximize the number of users that can be supported on each server, whether individual subscribers or IoT devices, thereby minimizing the net cost-per-user.

Within 5G packet core software, the subsystem that represents the highest compute workload is the User Plane Function (UPF), which performs critical packet inspection, routing and forwarding functions associated with connecting user and device traffic from the Radio Access Network (RAN) to the Data Network (DN). Since general-purpose server CPUs are not well suited to the performance and latency requirements of real-time packet processing, network operators and 5G core software vendors increasingly adopt solutions for offloading the UPF to accelerator cards which are optimized for executing such workloads.

Napatech addresses the key business challenges around packet core deployments through its new, integrated hardware/software solution that leverages an AMD Xilinx Virtex field programmable gate array (FPGA) to deliver industry-leading UPF performance. The solution comprises a fully-offloaded UPF fast path implemented within Napatech’s Link-Inline software stack, running on an NT200 programmable PCI-Express (PCIe) SmartNIC based on an AMD Virtex UltraScale+ VU9P FPGA. The UPF data path is implemented as a port-to-port inline or “hairpinned” architecture, which ensures that following initial setup all flows are processed on the SmartNIC with no need to pass traffic to and from the server CPU, maximizing the overall performance of the system.

Using a single 200Gbps NT200 SmartNIC to sustain 100Gbps of full duplex traffic, the Napatech UPF Offload solution processes up to 140 million concurrent flows, with a flow learning rate greater than 1.5 million flows per second, achieving a total throughput of up to 85 million packets per second on stateful connections and ensuring full wire speed operation for typical packet sizes. In a representative use case analyzed by the company, the Napatech UPF offload solution enables network operators to support 75x more users per server than with a software-based UPF and 7x more users per server than with a competing ASIC-based SmartNIC.

SmartNIC Offload for 5G User Plane Function

 Optimizing the utilization of servers is important to carriers as they look to maximize the ROI for their network infrastructure. In this video, Charlie Ashton, Senior Director of Business Development at Napatech, discusses the business benefits of offloading the 5G user plane function (UPF) to dedicated accelerators like SmartNICs and details Napatech’s UPF offload solution.Download the 2022 SmartNICs and Infrastructure Acceleration Report:...

HEAVY.AI offers digital twin for network planning based on NVIDIA

HEAVY.AI, a start-up based in San Francisco, introduced an extension of the company’s deep analytics platform that uses NVIDIA Omniverse to create digital twins that help telco network operators speed deployments of wireless networks.

The company describes its HeavyRF solution as the industry’s first radio frequency (RF) digital twin. This can help telcos to simulate potential city-scale deployments as a faster, more efficient way of optimizing cellular-tower and base-station placements for best coverage.

“5G infrastructure is fundamentally very different from 4G infrastructure: It requires far more towers and antennas to provide the highest level of coverage and hence customer satisfaction. Because of that heightened demand, telcos can’t spend the same amount of time planning and locating each piece of 5G infrastructure,” said Jon Kondo, CEO of HEAVY.AI.

HeavyRF allows telcos to review historic and current network-performance data as they test site-configuration scenarios against physical impediments, such as trees and dense buildings. It uses GPU-accelerated analytics to seamlessly combine customer-demographic and behavioral data with real-time geophysical mapping.

HEAVY.AI also announced it is extending its collaboration with Charter Communications, the nation’s second largest cable provider. “With the advent of 5G and an expanding user base, Charter needed a solution to help us map increasingly complex RF scenarios. HEAVY.AI’s new digital twin capabilities enable us to explore and fine-tune our expanding 5G networks in ways that weren’t possible before,” said Jared Ritter, Senior Director, Analytics & Automation at Charter Communications.

“NVIDIA Omniverse is the ideal foundation for HEAVY.AI’s new HeavyRF module and digital twin application framework,” said Ronnie Vasishta, Senior Vice President of Telecom at NVIDIA. “Omniverse is a development platform designed to help customers solve real-world problems with custom-built 3D and simulation pipelines — and with HEAVY.AI’s massive data analytics platform, telcos can virtually place 4G and 5G towers long before trucks roll in for installation.”

  • HEAVY.AI originated from research at Harvard and MIT Computer Science and Artificial Intelligence Laboratory (CSAIL) and is funded by GV, In-Q-Tel, New Enterprise Associates (NEA), NVIDIA, Tiger Global Management, Vanedge Capital and Verizon Ventures. 

SoftBank demos 5G slicing and MEC powered by Arrcus

SoftBank Corp. demonstrated automated network slicing over 5G mobile networks and Multi-access Edge Computing (MEC) applications, running with ArcOS – a key component of Arrcus’ ACE networking software stack. 

In this demonstration, SRv6 MUP with SRv6 Flex-Algo from Arrcus provided advanced traffic engineering capability to extend a 5G network slice to MEC applications with seamless automation, without the need for additional 5G equipment. SoftBank also verified SRv6 MUP interoperability with 5G equipment in its laboratory. The yearlong trial will now proceed to the next step, preparing SRv6 MUP technology for commercial deployment.

SoftBank’s introduction of SRv6 MUP to standards-based 5G will allow mobile traffic to be forwarded flexibly across the transport network and into the cloud – bridging the gap between mobile and native technologies and helping to establish a simplified, cost-effective solution to high-speed connectivity between the mobile networks and applications.

“Arrcus is excited to work with industry leader SoftBank on this innovative approach, leveraging our ACE platform that is highly programmable with advanced traffic engineering features, to realize the vision of 5G services with a simplified approach,” said Shekar Ayyar, CEO and chairman at Arrcus.

3 forces driving innovation in enterprise Networks are the 3 biggest forces driving innovation in enterprise networks today? Cost, Cloud, and Connectivity, answered Shekar Ayar, CEO of Arrcus. Here’s a perspective from ONUG Spring 2022 on how a modernized routing stacking can drive transformation across all three of these forces.Arrcus cites 80% growth in bookings in Q1Thursday, April 07, 2022  Arrcus  Arrcus, a privately-held company that...

Tuesday, September 20, 2022

ECOC22: OIF demonstrates 400ZR, Co-Packaging, CEI 112G, 224G, CMIS

At this week's ECOC 2022 exhibition in Basel, Switzerland, OIF is hosting nearly 30 member companies in demonstrations in four critical areas: 400ZR optics, Co-Packaging architectures, Common Electrical I/O (CEI) architectures and Common Management Interface Specification (CMIS) implementations.

400ZR Demo

OIF’s 400ZR project is proving successful in facilitating new and simplified architectures for high bandwidth inter-data center interconnects and promoting interoperability among coherent optical module manufacturers. This 400ZR interop demo shows a full implementation across an 80km DWDM ecosystem using multiple form-factor pluggable modules, 400GbE routers, a 75 GHz C-band open line system, and test equipment solutions from multiple vendors. The demo provides evidence of widescale 400ZR deployment readiness based on a broad ecosystem of interoperable solutions.

Co-Packaging Demo

While individual companies consider options to optimize power and density, OIF has seen the need to lead industry standardization discussions for co-packaging architectures that promise to reduce power consumption and increase bandwidth edge density. OIF is leading the industry’s interoperability discussions for co-packaging solutions and will showcase its progress with multi-party demonstrations of its 3.2T Module project and External Laser Small Form Factor Pluggable project (ELSFP). A variety of interoperable components that enable co-packaging will be shown, along with a system implementation.

Common Electrical I/O (CEI) Demo

OIF played a lead role in moving the industry to the next generation by developing electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability amongst 14 participating members prove the critical role OIF serves as well as the developing supplier ecosystem. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over various channels, including mated compliance boards, PCB channels, direct attach copper cable channels, a cabled backplane and even fiber. Each configuration demonstrates the technical viability of 112 Gbps operation, along with multiple industry form factors, including OSFP and QSFP-DD. The demo also shows a measured far-end eye diagram on an oscilloscope with analysis to show an example of the silicon signal integrity that is typically required going through the large variety of channels on display.

As the industry looks forward to higher data rates and increased throughput for the next generation of systems based on 224 Gbps per lane, new specifications and technologies will be required. OIF, where the optical networking industry’s interoperability work gets done, is leading the charge on 224G hardware interconnection application spaces and definitions, unveiling publicly at ECOC the first live 224G demo.

Common Management Interface Specification (CMIS) Implementations Demo

CMIS is now established as the management interface of choice for next-generation pluggable modules, capable of managing both simple and advanced modules. CMIS provides a well-defined common mechanism to initialize and manage optical and copper modules while still providing the ability to support custom functionality. This commonality makes integration into different host platforms easier for both the host vendor and the module vendor. The CMIS demo consists of four separate demonstrations that show how modules can be managed and initialized, how modules can support multiple independent services (breakout) and how module firmware can be easily upgraded.

“The high level of participation in this year’s interoperability demonstration at ECOC demonstrates the global importance of OIF’s work and the collective efforts of its members to showcase how their solutions establish an ecosystem and work together to drive implementation of next-generation capabilities,” said Mike Klempa, Alphawave IP Group, and OIF Physical & Link Layer Interoperability Working Group Chair.

ECOC22: Keysight's waveform generator speeds well past 160 GBaud

Keysight Technologies introduced its M8199B arbitrary waveform generator (AWG), which provides R&D engineers a high-performance signal source for arbitrary signals that enables development of designs employing multi-level modulation formats (e.g. 64QAM) at well beyond 160 GBaud.

Applications beyond 128 GBaud demand a new class of generators that provide high speed, precision and flexibility at the same time. Keysight addressed these challenges with the company’s new M8199B AWG which offers a high performing signal source for arbitrary signals with sampling rate up to 256 GSa/s and analog bandwidth exceeding 80 GHz, including up to eight synchronized channels operating simultaneously.

Keysight’s new M8199B AWG provides research engineers the speed, bandwidth, precision, and flexibility to meet the challenges of next-generation applications, enabling data transmission greater than 400 Gbps per lane in intensity-modulation/direct-detect (IM/DD) and greater than 1.6 Tbps per carrier in coherent optical communications.

"Today’s applications and services generate vast amounts of artificial intelligence workloads in the data center. New electrical and optical designs are required to handle these workloads within reasonable bounds of energy consumption," said Dr. Joachim Peerlings, vice president and general manager of Keysight's Network and Data Center business. "We are pleased with Keysight's continuous efforts to deliver first-to-market solutions that support our customers to connect and sustain our planet and take the next step in the race for higher data transmission rates."

Highlights for the M8199B AWG:

  • Intensity-Modulation/Direct-Detect (IM/DD) and coherent optical applications: provides the flexibility needed for advanced research on new modulation formats to boost transmission rates to the next level. The M8199B AWG matches with high-speed research experimenting using multi-level pulse-amplitude modulation (PAM), quadrature-amplitude modulation (QAM) formats and other proprietary modulation formats at symbol rates approaching 200 GBaud. In addition, it provides stress signals to test next generation electro/optical components, digital signal processor application-specific integrated circuits (DSP-ASICs), and new algorithm concepts for multi-terabit transmissions systems.
  • Wideband radio frequency (RF) signal generation in wireless and aerospace/defense applications: addresses the latest developments in radar and wireless technologies which require generation of high-quality signals with modulation bandwidths well beyond 10 GHz. Generating those signals on an intermediate frequency (IF) rather than on quadrature signals is another important capability to support these applications.
  • Physics, chemistry, and general-purpose electronics research: enables users to generate any arbitrary waveform that can be mathematically described, including ultra-short pulses, wideband RF pulses, and chirps needed to investigate in applications such as chemical reactions, elementary particle excitation and quantum effects.

ECOC22: SABIC intros ultra-high-heat resin for CPO transceivers

SABIC introduced its EXTEM RH1016UCL resin, a new ultra-high-heat, near-infrared (IR)-transparent grade well-suited for injection-molded lenses used in co-packaged optical transceivers and other optical connectors. 

EXTEM RH1016UCL resin is one of the first IR-transparent thermoplastics that can robustly withstand the 260°C peak temperature of printed circuit board (PCB) reflow soldering while maintaining dimensional stability of the molded part. This capability helps enable optical connectors to be mounted with other components in one step, avoiding the separate assembly and alignment processes that are required for lower-temperature lens materials. The new EXTEM resin also provides high-throughput, precision micro-molding capability for enhanced productivity. Together with optical design freedom and breakthrough high-temperature performance, this new resin can help customers transition from pluggable optics to co-packaged optics that support increased data center speed, scale and energy efficiency. EXTEM RH1016UCL resin has been validated by a major technology OEM in the United States.

“Co-packaged optics are a next-generation technology that can help increase data center reliability and reduce power usage and costs by bringing the optics much closer to the main switching ASIC,” said Florian Jung, global business manager, ULTEM and EXTEM, SABIC’s Specialties Business. “Producing complex, miniaturized lenses and arrays for co-packaged optics calls for new materials that can overcome the design, manufacturing scalability and system cost drawbacks of glass. SABIC’s new EXTEM RH1016UCL resin addresses these needs while helping to advance this emerging technology and opening new opportunities to help improve PCB integration density and energy efficiency.”

“Using a special chemistry, we developed a new EXTEM resin with very high heat resistance that now supports the placement of optical interconnects with thermoplastic lenses close to the ASIC chip prior to PCB assembly,” said Gabrie Hoogland. “Co-packaging helps make the electronic signal path as short and seamless as possible to facilitate very high data transmission rates. To assist customers in adopting EXTEM RH1016UCL resin, SABIC’s global technology centers provide micro-molding capabilities, including state-of-the-art equipment to test optical properties and constants, metrology, reflow soldering stability and application (hydro)aging.”