Monday, July 26, 2021

Intel unveils RibbonFET transistor architecture

Intel unveiled RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, a new backside power delivery method. 

In a webcast presentation highlighting its process and packaging technology roadmaps through 2025, Intel vowed a swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. The company said it is on-track to received the first High NA EUV production tool in the industry.

Intel's roadmap, with new node names, includes:

  • Intel 7 delivers an approximately 10% to 15% performance-per-watt increase versus Intel 10nm SuperFin, based on FinFET transistor optimizations. Intel 7 will be featured in products such as Alder Lake for client in 2021 and Sapphire Rapids for the data center, which is expected to be in production in the first quarter of 2022.
  • Intel 4 fully embraces EUV lithography to print incredibly small features using ultra-short wavelength light. With an approximately 20% performance-per-watt increase, along with area improvements, Intel 4 will be ready for production in the second half of 2022 for products shipping in 2023, including Meteor Lake for client and Granite Rapids for the data center.
  • Intel 3 leverages further FinFET optimizations and increased EUV to deliver an approximately 18% performance-per-watt increase over Intel 4, along with additional area improvements. Intel 3 will be ready to begin manufacturing products in the second half of 2023.
  • Intel 20A ushers in the angstrom era with two breakthrough technologies, RibbonFET and PowerVia. RibbonFET, Intel’s implementation of a gate-all-around transistor, will be the company’s first new transistor architecture since it pioneered FinFET in 2011. The technology delivers faster transistor switching speeds while achieving the same drive current as multiple fins in a smaller footprint. PowerVia is Intel’s unique industry-first implementation of backside power delivery, optimizing signal transmission by eliminating the need for power routing on the front side of the wafer. Intel 20A is expected to ramp in 2024. The company is also excited about the opportunity to partner with Qualcomm using its Intel 20A process technology.
  • 2025 and Beyond: Beyond Intel 20A, Intel 18A is already in development for early 2025 with refinements to RibbonFET that will deliver another major jump in transistor performance. Intel is also working to define, build and deploy next-generation High NA EUV, and expects to receive the first production tool in the industry. Intel is partnering closely with ASML to assure the success of this industry breakthrough beyond the current generation of EUV.

“Intel has a long history of foundational process innovations that have propelled the industry forward by leaps and bounds,” said Dr. Ann Kelleher, senior vice president and general manager of Technology Development. “We led the transition to strained silicon at 90nm, to high-k metal gates at 45nm and to FinFET at 22nm. Intel 20A will be another watershed moment in process technology with two groundbreaking innovations: RibbonFET and PowerVia.”

Regarding its packaging innovations, Intel provided the following updates:

  • Sapphire Rapids will be the first Intel Xeon data center product to ship in volume with EMIB (embedded multi-die interconnect bridge). It will also be the first dual-reticle-sized device in the industry, delivering nearly the same performance as a monolithic design. Beyond Sapphire Rapids, the next generation of EMIB will move from a 55-micron bump pitch to 45 microns.
  • Foveros leverages wafer-level packaging capabilities to provide a first-of-its-kind 3D stacking solution. Meteor Lake will be the second-generation implementation of Foveros in a client product and features a bump pitch of 36 microns, tiles spanning multiple technology nodes and a thermal design power range from 5 to 125W.
  • Foveros Omni ushers in the next generation of Foveros technology by providing unbounded flexibility with performance 3D stacking technology for die-to-die interconnect and modular designs. Foveros Omni allows die disaggregation, mixing multiple top die tiles with multiple base tiles across mixed fab nodes and is expected to be ready for volume manufacturing in 2023.
  • Foveros Direct moves to direct copper-to-copper bonding for low-resistance interconnects and blurs the boundary between where the wafer ends and where the package begins. Foveros Direct enables sub-10-micron bump pitches, providing an order of magnitude increase in the interconnect density for 3D stacking, opening new concepts for functional die partitioning that were previously unachievable. Foveros Direct is complementary to Foveros Omni and is also expected to be ready in 2023.

https://www.intc.com/news-events/press-releases/detail/1486/intel-accelerates-process-and-packaging-innovations


Rogers looks to Ribbon for DWDM 400G ZR+


Rogers Communications selected Ribbon's DWDM 400G ZR+ technology to upgrade its transport network, which supports multiple 400G connections for increased capacity across its national footprint.

The deployment is powered by Ribbon's Apollo optical networking and MUSE SDN platforms. The MUSE Software Defined Networking (SDN) Domain Orchestrator enables Rogers to design and analyze their optical network deployment, rapidly automate the creation of new services, and ensure the network is optimized, available, and running at peak efficiency. 

"Rogers is demonstrating their foresight, leadership and innovation by being one of the first major service providers in North America to introduce 400G ZR+ technology, which will allow them to modernize their transport network," said Sam Bucci, Executive Vice President and General Manager of Ribbon's IP Optical Networks Business Unit. "We are delighted that Rogers saw the differentiation in our solutions and entrusted Ribbon with this strategic rollout. Our Optical Transport solution enables Rogers to help future-proof their network and extend their leadership in 5G services deployment across Canada."

"At Rogers, we remain focused on enhancing and expanding our networks to bring our customers the most reliable wireless experience1 in the country," said Kye Prigg, Senior Vice President, Access Networks and Operations. "Our agreement with Ribbon will help us continue to maximize the efficiency and performance of our network, utilizing the latest in software defined network technology to help bolster Canada's most reliable wireless network."

http://www.rbbn.com

Ribbon intros 2-port 400G ZR+ card for metro and long-haul

 Ribbon Communications introduced a 2-port 400G ZR+ line card for its Apollo optical networking portfolio, optimized for metro and long-haul applications.


The TM400_2 delivers 400G optical transmission using standard and interoperable CFP2 DCO (Digital Coherent Optic) pluggables, optimized for transport over CDC (Colorless Directionless Contentionless) ROADM (Reconfigurable Optical Add-Drop Multiplexer) networks, in either independent wavelength or dual carrier modes. Leveraging multiple wavelengths allows for longer transmission distances than what embedded 800G solutions, often reliant on costly proprietary technology, can achieve with a single wavelength.

  • In independent wavelength mode, the TM400_2 uses two 400G wavelengths to provide significant cost efficiencies compared to a single 800G embedded solution for metro applications.
  • In dual carrier mode, the TM400_2 combines two high-performance 200G wavelengths to provide a 400G channel for long haul applications, delivering superior cost performance to current embedded solutions.

Lumen to sell Latin American business for $2.7 billion

Lumen Technologies agreed to sell its Latin American business to Stonepeak, a leading alternative investment firm, for $2.7 billion.

Lumen said the sale enables greater flexibility on capital allocation, allowing for debt reduction and the continued evaluation of share repurchases.

"This transaction unlocks value for our shareholders while allowing us to maintain our global presence through our strategic relationship with the New LATAM Company," said Lumen President and CEO Jeff Storey. "This transaction allows Lumen to focus investments in key areas of the business to drive future growth while providing flexibility for our capital allocation strategy."


"Lumen's Latin American business is a market leader with a strong footprint and exciting potential for expansion," said Brian McMullen, Stonepeak Senior Managing Director. "Stonepeak has been an early and active investor in digital infrastructure globally and we are looking forward to applying our experience and additional capital to Lumen's Latin American business."

AT&T offloads Vrio Operations to Grupo Werthein

 AT&T will sell its Vrio Corp. business unit to Grupo Werthein, a private holding company active in telecommunications, finance, insurance, agribusiness and real estate in Latin America.Vrio is a digital entertainment services company with 10.3 million subscribers across 11 countries in Latin America and the Caribbean. Vrio provides live and on-demand video services via DIRECTV Latin America, SKY Brasil and DIRECTV GO. Vrio’s entertainment...

Corning adds new terminal in its Evolv portfolio

Corning is adding to its Evolv portfolio, including a terminal that supports additional fiber configurations, to enable the fiber-lean distributed tap architectures sometimes used in rural deployments. 

Corning's Evolv portfolio features its Pushlok technology.

"Today, the benefits of a fiber broadband connection are clearer than ever, and network operators are working to bring more connections to more people in more places," said Joe Jensen, director, Americas, fiber-to-the-home market development for Corning. "Our industry-leading products, including our Evolv portfolio, offer network operators enhanced deployment flexibility at a lower cost.”



 

F5 posts revenue of $652 million, up 12% yoy

F5 Networks reported GAAP revenue of $652 million, up 12% yoy, for its fiscal third quarter ended June 30, 2021. Non-GAAP net income for the third quarter of fiscal year 2021 was $169 million, or $2.76 per diluted share, compared to $134 million, or $2.18 per diluted share, in the third quarter of fiscal year 2020.

Our very strong third quarter results demonstrate the powerful alignment of F5’s expanded solution portfolio and our customers’ most important application needs,” said Fran├žois Locoh-Donou, F5’s President and CEO. “Robust software growth and resilient demand for systems drove 12% GAAP revenue growth in our third quarter, and 11% revenue growth versus the prior year’s third quarter non-GAAP revenue.”



Locoh-Donou continued, “Customers’ traditional applications are generating more revenue and more engagement than ever before. At the same time, customers also are accelerating adoption of modern application architectures, like Kubernetes, for new applications. With our expanded application security and delivery portfolio, we are uniquely positioned to solve our customers’ most significant modern and traditional application challenges on premises, in the cloud, and across multiple clouds.”

Clearfield expands manufacturing in Mexico

 Clearfield, which specializes in fiber optic management, protection and delivery products for communications networks, is expanding its manufacturing capacity in Tijuana, Mexico. A new 319,000-square-foot manufacturing and warehouse center  is being built to its specifications and is scheduled to enter into production slightly after the start of calendar year 2022. This move is in support of the anticipated future demand of the business. The facility will augment our growing investments in U.S. production.

"Our Mexican manufacturing facilities fully complement our ongoing operations at our U.S. headquarters,” said Cheri Beranek, Clearfield president and CEO. "In addition, we continue to enhance and strengthen our partnerships with contract manufacturing operations and component suppliers. As part of our value proposition to provide our service provider customers the best total cost of ownership solutions, this strategic investment in manufacturing capacity will position us to build upon our growing momentum throughout the broadband marketplace.”



C