Monday, September 23, 2019

Inphi announces volume production of 100G and 400G PAM4 platform

Inphi announced volume production of its 100Gbps and 400Gbps Single-Lambda Pulse Amplitude Modulation (PAM4) platform for data center and cloud networking applications.

Inphi’s Porrima PAM4 platform is a 56GBaud solution that includes linear TIA and drivers.

“Production availability of our Porrima PAM4 platform is aligned well with the data center expansion and is critical to meeting the rapidly increasing bandwidth needs in today’s cloud computing and hyper-scale data center environments,” said Eric Hayes, SVP, Networking Interconnect at Inphi. “Inphi continues to expand its technology and market leadership position in PAM4 data center and cloud infrastructure, and as a result are seeing a tremendous amount customer design win momentum supporting our now six generations of DSP developments. Inphi continues to drive next generation optical designs providing an ease of use API-based DSP software suite that achieves quick time-to-market with the right trade-offs in power and performance for data center optical interconnects.”

Porrima PAM4 DSP Product Family:
Porrima PAM4 DSP IC provides a full bi-directional interface with host ASICs that have 28GBaud PAM4and NRZ electrical interfaces, while bridging to 56GBaud optics. The product family can support PAM4 or NRZ signaling, and both Retiming and Gearbox functionality with packaging specifically designed for the following optics modules:

  • Porrima 400G – 8x56Gbps PAM4 <-> 4x100Gbps PAM4 for QSFP-DD/oSFP/COBO
  • Porrima 100G – 4x25Gbps NRZ <-> 1x100Gbps PAM4 for QSFP
  • Porrima 100G – 2x50Gbps PAM4 <-> 1x100Gbps PAM4 for QSFP/uQSFP/SFP-DD

Porrima Linear Drivers:

The IN5630DE/IN5634SE is a 56GBaud low power single/quad linear driver for PAM4 optical modules. Features include:

  • Excellent linearity, high bandwidth, adjustable gain to optimize the PAM4 system performances
  • Low-power modulator driver in small package or in bare die form

Porrima Linear TIA’s:
The IN5661TA/5664TA is a 56GBaud low power single/quad linear TIA for PAM4 optical modules. Features include:

  • Wide dynamic range to meet the different performance and link requirements for optical applications
  • Excellent signal integrity necessary for PAM4 modulation schemes
  • Low-power and small form factor


OIF approves IC-TROSA Implementation Agreement

OIF confirmed the approval of the Integrated Coherent Transmitter-Receiver Optical Subassembly (IC-TROSA) Implementation Agreement (IA).

The IC-TROSA Type-1 is optimized for silicon photonics technology and uses a surface-mount package with Ball Grid Array (BGA) electrical interface. Important advantages include an increased electrical bandwidth and solder reflow capability. The IC-TROSA Type-2 is optimized for Indium Phosphide technology and uses a gold-box package with flex-cable electrical interface. Important advantages include an integrated tunable laser and a duplex LC optical connector.

The IC-TROSA’s low power dissipation and miniature footprint enables small form factor digital coherent optics (DCO) transceivers in a QSFP-DD or OSFP form factor, as well as very high-density coherent line card or daughtercard designs. Devices can support multiple modulation formats, including QPSK, 8QAM, and 16QAM, at symbol rates up to 64Gbaud, enabling data transmission up to 600 Gb/s.

IC-TROSA integration will be demonstrated during this week’s OIF Physical and Link Layer (PLL) Interoperability Demo at ECOC 2019 in Dublin. (OIF booth 441).

“The IC-TROSA project took an aggressive approach to coherent optical component integration and has delivered two new package designs incorporating TX and RX integration, common digital controls and performance monitoring all in a small form factor package,” explained Scott Grindstaff, Director R&D, ADVA, and IC-TROSA IA Technical Editor. “Additionally, package specific features such as fiber-free interface and solder reflow compatibility have been incorporated.”

“The IC-TROSA IA is a solution for density requirements for line cards, front-pluggable and future on-board coherent 400G+ optical modules,” said Karl Gass, OIF PLL Working Group, Optical Vice Chair. “It aims to standardize a photonic package for coherent applications that is easy to use while leaving the internal implementation to the vendor.”

https://www.oiforum.com


OIF readies 400ZR, CEI-112G and IC-TROSA demos

Twelve OIF member companies will stage a multi-vendor interoperability demonstration of 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA at the upcoming ECOC 2019 trade show in Dublin, Ireland later this month.

Participating companies include ADVA, Amphenol, Cadence Design System, Credo, Finisar, Inphi, Keysight Technologies, Marvell, Molex, MultiLane, TE Connectivity and YAMAICHI ELECTRONICS will participate in the demonstration in OIF’s booth, # 441.
400ZR & IC-TROSA Demo

OIF’s 400ZR project aims to reduce cost and complexity reduction for 400GbE over 80 km DWDM networks. The IC-TROSA features all of the optical building blocks for a coherent module in a single package. The demonstrations will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR. In addition, a hardware-based 400ZR installation will show a typical application case.

CEI-112G Demo

OIF is taking a lead role in moving the industry to the next generation with its development of electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability clearly prove the key role OIF provides. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over mated compliance board channels, a full host to module channel and direct attach copper cable channels, all demonstrating the technical viability of 112 Gbps operation, along with multiple industry form factors including OSFP and QSFP-DD.

Lumentum demos coherent modules, WSS, PAM4-optimized EMLs

Lumentum is presenting its full-spectrum of optical communications solutions at ECOC 2019 in Dublin, including:

Coherent Network Transmission Products

  • Line-side coherent CFP2 Modules for 100G/200G+ transmission: Lumentum will exhibit both 100G/200G CFP2-ACO and CFP2-DCO coherent pluggable transceiver modules that leverage Lumentum's high-speed InP PIC devices.
  • Coherent building blocks: High-speed coherent components for 100G and beyond including integrated coherent TROSAs with up to 64 GBaud symbol rates, high-bandwidth integrated driver modulators, and micro and dual ITLAs.
  • Line-side direct-detect modules for 10G/25G tunable transmission: With more than 10 years of deployments and billions of device hours in the field, Lumentum is an established leader in tunable transmission for 10G and beyond. A broad range of tunable transmission products will be on display.

TrueFlex ROADM Portfolio

  • Next-generation TrueFlex contentionless twin 8x24 wavelength selective switch (WSS): the newest addition to Lumentum's ROADM portfolio, enables simplified add/drop port scaling to support capacity growth in CDC networks and eliminates the need for EDFA arrays in many network designs. In addition, Lumentum will feature the TrueFlex monitoring portfolio and the TrueFlex Micro WSS platform including the high-port count Micro Twin 1x20 and 1x35, the Micro 1x9, the Micro Twin 1x9, and the Nano 1x9.

High-Speed Datacom Laser Chips

  • DMLs: Lumentum DMLs offer high-reliability and use a pioneering cavity design to operate over the wide temperature ranges demanded by the latest 5G wireless systems.
  • EMLs: Lumentum PAM4-optimized EMLs enable next-generation 400G and single-lambda 100G solutions that reduce the cost per bit. Lumentum laser chips enable a wide variety of standards-compliant modules for high-speed networking.
  • VCSELs: Lumentum VCSELs for short-reach applications utilize Lumentum's experience in high-volume 3D sensing applications to deliver high-performance and cost-effective solutions to data centers and can be supplied as a single bare die, or 1x4 arrays.

Telecom Pump Lasers

  • Next-generation high-power and high-reliability 980 nm pump lasers: The next-generation family of 980 nm pumps offer a range of maximum output powers from 800 mW to 1000 mW in a variety of form factors.

SDN Open Networking Platform

The Open Networking Foundation (ONF) will perform a live open and disaggregated transport network (ODTN) demonstration using Lumentum's optical network elements at Demo 2. The live demo will showcase the use of the ONOS SDN controller for disaggregated transport networks, covering the provisioning of data connectivity services and demonstrating advanced automatic failure recovery and resiliency, at both the data and control plane level.

https://www.lumentum.com

Jabil Photonics demos coherent SiP-based 100G/200G CFP2-DCO

Jabil Photonics (formerly Jabil AOC Technologies) is demonstrating its coherent 100G/200G CFP2-DCO module this week at ECOC 2019 in Dublin.

Jabil’s CFP2-DCO is a hot-pluggable module designed to support single-wavelength data coherent transmission at 100Gbps using DP-QPSK and 200Gbps using DP-16QAM modulations. The CFP2-DCO is designed for DWDM networks ranging from metro and data-center interconnect (DCI) to long-haul applications, as well as 100Gbps point-to-point (P2P) coherent solutions for unamplified links in 5G and cable access networks up to 80km.

Jabil’s CFP2-DCO is powered by Elenion Technologies’ next generation Silicon Photonics (SiP) coherent engine. The module incorporates an ultra-narrow linewidth external cavity micro-ITLA laser with gridless DWDM wavelength capability for tuning across the extended C-Band, and a low power coherent Digital Signal Processor (DSPs) using advanced 16-nm CMOS technology.

“As the pace of optical networking innovation and the surge of bandwidth demand in communication networks continues to accelerate, the ecosystem needs players that can quickly enable volume manufacturing and simplify sourcing models,” said Stefano Schiavoni, vice president and GM of Jabil’s Photonics business unit. “The release of our CFP2-DCO product represents a significant industry milestone by delivering a vertically integrated solution at the lowest cost structure. Unlike traditional build-to-print contract manufacturers, Jabil leverages its advanced design capabilities, operational excellence and world-class supply chain to meet the increasingly competitive requirements of our customers.”

“We are pleased with the opportunity to partner with Jabil Photonics to manufacture our sophisticated SiP coherent optical engines together with the CFP2-DCO in Jabil’s precision optical manufacturing line,” said Larry Schwerin, president and CEO of Elenion Technologies.

The CFP2-DCO will be Jabil’s first product launched under the “Jabil Photonics” brand which replaces the former “Jabil AOC Technologies” brand.  The new branding reflects Jabil’s end-to-end manufacturing and supply chain capabilities in the area of photonics.  In addition to the product line expansion with the Jabil Photonics CFP2-DCO, Jabil is growing its investment in the optical segment with the expansion of its Penang, Malaysia, production facility with a focus on Optical Manufacturing Services (OMS) as well as Jabil Photonics components. 

CommScope's new DAA aggregator, Soft EDD, DOCSIS timing protocol

CommScope announced three technology breakthroughs that improve performance at the core, throughout the access layer, and at the edge:


  • DAA Aggregator – This massively scalable new architecture extends fiber deeper into the network, lowers total cost of ownership, and requires relatively minor changes to existing fiber deep networks. The change significantly increases the number of homes passed per RPD serving group – from 20 to 40 to between 150 to 300 – enabling deeper reach into neighborhoods and a simplified path to network upgrades.
  • Extended Soft FDD – This new combination of software-only Frequency Division Duplex (FDD) and Extended Spectrum DOCSIS (ESD) – pushes network interface speeds beyond 1.2 GHz and is already being hailed as a preliminary flavor of DOCSIS 4.0. The advance comes just four months after the company first demonstrated soft FDD.
  • A new DOCSIS timing protocol – Precise timing distribution over the DOCSIS network is now possible. Such precision is imperative for time-critical processing and applications, where a fraction of a second means the difference between success and failure. Current and future applications include mobile backhaul, virtual reality, and autonomous vehicle control.

All will become elements of the company’s Distributed Access Architecture (DAA) and 10G portfolios.

CommScope will discuss and demonstrate the new technologies at the SCTE•ISBE Cable-Tec Expo beginning September 30th in New Orleans.

“It’s no longer enough to have the fastest network,” said Tom Cloonan, CommScope chief technologist for network solutions in the company’s Office of the CTO. “2020 is about efficiency and simplicity. There will be significant changes to architectures over time, and it’s important to work with a company that has both industry-leading technology and the expertise to execute at any point in that transformation.”

http://www.commscope.com

CommScope Advances 10G Broadband Roadmap

CommScope announced several areas of progress on its 10G Broadband roadmap
  • A low-latency DOCSIS system deemed crucial to next-generation broadband performance. The company is demonstrating IP video running alongside traditional QAM video over an EPON channel at 10 Gbps. 
  • A software-configurable Frequency-Division Duplex (Soft FDD) system with the potential to deliver 10G speeds over traditional coaxial wiring. Soft FDD uses FDX technology and provides a foundation for symmetrical services.
  • The E6000 vCore fully virtualized converged cable access platform (CCAP) core. This offers automated provisioning and capacity tools for end-to-end service provisioning and smart capacity additions; and orchestration and intelligence tools to manage multi-access configurations and produce better analytics about network performance.
CommScope notes that these announcements come fewer than six months after it revealed its role in pioneering the core technologies for 10 Gbps broadband (10G), and just four months after it announced a 8.5 Gbps network trial with Virgin Media.

In addition, Vodafone Germany is underway with a nationwide upgrade to support 1Gbps service. Some 12 million customers will enjoy the high-speed Gigabit service through an ARRIS broadband device when the rollout is complete. Swiss provider Sasag last month became the first European operator to announce upgrading its entire network to use DOCSIS 3.1 (D3.1) for both the upstream and downstream channels.
CommScope completed its acquisition of ARRIS International in April.

3M adds partners for Beam Optical Connector system

3M signed Rosenberger OSI and Molex as its first partners in its Expanded Beam Optical (EBO) Connector ecosystem. These companies intend to manufacture and sell expanded beam optical solutions based on the 3M Expanded Beam Optical Connector System, including optical patch cords using this technology.

“The addition of these trusted and experienced assembly solution collaborators to the ecosystem will accelerate our ability to serve data center customers with the experience they need and expect,” states Kris Aman, global marketing manager at 3M. “Our collaboration with Rosenberger OSI and Molex will help us continue to develop and expand this exciting technology to enable next-generation data center optical connectivity.”

Rosenberger OSI and Molex are the first assembly solution collaborators to join 3M’s ecosystem. The ecosystem already includes inspection tool collaborators, EXFO and Sumix, who are developing adapters for their tools, inspection images and pass or fail criteria for 3M connectors.


3M intros Expanded Beam Ferrule and Connector System

Earlier this month, 3M introduced an Expanded Beam Optical Connector System for single mode and multimode interconnects in next-gen data centers.

“We’ve reimagined fiber optic connectors,” said Nick Stacey, Ph.D., global laboratory manager at 3M. “Our ferrule and connector technology is designed to reduce cleaning requirements, to provide design flexibility and to enable the performance necessary for next-generation optical deployment.”

The 3M Expanded Beam Optical Ferrule uses a non-contact optical coupling in contrast to the more traditional physical contact methods. Together with the connector design, this helps to provide reduced sensitivity to dust, helping maintain signal integrity, and reducing the need for, and cost of, maintenance and cleaning.

It is available in single mode (1310 nm) and multimode (850 nm) versions. In single mode, insertion loss specification is <0 .70="" and="" db="" is="" loss="" return="">55 dB. In multimode, insertion loss specification is <0 .30="" and="" db="" is="" loss="" return="">25 dB. The configurable and scalable connector design can accommodate anywhere from 12 fibers to 192 fibers. The simple, but robust hermaphroditic component geometry design, with low part count, can be mated and re-mated reliably with a simple LC-style latch. The performance enables architects and engineers to deploy the technology in multilink data center applications.

http://www.3M.com

HUBER+SUHNER debuts cross-connect fiber management system

HUBER+SUHNER introduced its LISA Double Access solution -- a high-density, modular cross-connect fiber management system solution that provides a maximum of 3600 ports per rack. Alongside the LISA Double Access is the IANOS fiber management system, which provides flexibility for managing high volumes of cables and data rates.

“We realise that the LISA Double Access has long been the technology of choice and is an important aspect of network design for our customers,” said Eduardo Lopes, Head of Product Management Fiber Management Systems (FMS) at HUBER+SUHNER.“ As pioneers in cost-effective cross-connect connectivity solutions, we are convinced that the use of a comprehensive, but simply structured fiber optic management system is crucial for the successful operation of a data center due to the vulnerability of fiber optic cabling.”

Also joining HUBER+SUHNER’s line-up at ECOC 2019, is its novel Wavelength Division Multiplexer Coupling Module (WCM) for chip on-board low-cost transceivers assemblies. Featuring between two and eight lambdas based on TFF filters and CUBO’s direct beam bouncing polymer optical bench technology, the WCM provides ultra-low loss performance to couple and (de)mux two-to-eight laser diodes or photo detectors from a PCB board into a fiber receptacle. It enables transceiver or optical board manufacturers to assemble the non-hermetic optical bench in a very low-cost passive way directly on top of the photo detectors or lasers integrated in their PCB board.

Adding to the extensive Fiber Connectivity range already presented, HUBER+SUHNER Cube Optics (CUBO) will also debut its new 400G PAM4 Receiver Optical Sub-Assembly (ROSA) at the event. Designed for use in 400GBase-FR transceivers, the four-channel demultiplexer – which contains four integrated photo detectors with linear transimpedance amplifiers – operates at 56GBaud lane speed and features an optical LC receptacle input and electrical flex foil output. The high sensitivity of -4.6dBm eliminates the need to use additional expensive and power-hungry DSP chips in the transceiver, while still meeting IEEE specifications.

https://www.hubersuhner.com/en

Centera and Credo partner on Single-Lambda 100G PAM4

Centera Photonics and Credo, which specializes in Serializer-Deserializer (SerDes) technology, are partnering on a low power, cost and performance optimized 100G-DR/FR QSFP28 optical module.

Centera and Credo are showcasing the 100G-DR modules at ECOC 2019 in Dublin.

“Credo’s purpose built mixed signal optical DSP solutions provide the precise balance between performance, power, and price to enable mass deployments of 100Gbps Single-Lambda optical modules,” said Jeff Twombly, Vice President of Marketing and Business Development at Credo. “Combined with Centera’s optical engine technology and transceiver-level expertise, we are able to deliver world class solutions to our mutual customers that achieve the best overall system performance, signal integrity, and power efficiency.”

“Centera’s proprietary silicon optical engine sets a new frontier for next-generation of single-wave 100G optical interconnects in datacenter applications,” said Dr. Brian Lan, Centera’s R&D Director. “Credo’s power optimized optical DSP allowed us to quickly develop and deliver best in class 100G production modules for our data center customers.”

http://www.credosemi.com

The OpenTAP Project for Open Source Test Automation builds roster

The OpenTAP Project for Open Source Test Automation welcomed four new members: 5G-VINNI, Page Electronica NV, TandM Solutions and Tokalabs.

The OpenTAP project comprises a growing community of developers dedicated to the idea of effortless automation.The core technology is a test sequencer, with the community continuously adding plugins and solutions that support faster development, new functionality and optimization in test. Through these contributions and the enhanced collaboration possible with its open-core approach, OpenTAP is inspiring developers to innovate automation solutions in testing and measurement, and beyond.

Jason Hicks, director at TandM Solutions noted, “Test automation platforms have been at the core of my work for the last twenty years, but never before has a framework armed the developer with such a complete and flexible tool chain – and even better, it is open source”. Other companies, like Page Electronica, have noticed bottlenecks in many of their automated manufacturing processes. “We are excited to join OpenTAP,” said Luc Page, CEO of Page Electronica. “It allows us to start with a proven foundation of automation capability eliminating the need to build something wholly custom and use our resources and people in more effective ways.”

Infinera's XR Optics delivers coherent optical subcarrier aggregation

Infinera introduced a point-to-multipoint coherent optical subcarrier aggregation technology with the potential to significantly reduce the number of transceivers required in an access network while eliminating intermediate aggregation.

Infinera's XR optics technology, which is optimized for hub-and-spoke traffic patterns, is powered by independently routable Nyquist subcarriers and coherent optical aggregation capabilities. With coherent subcarrier aggregation (CSA) capabilities, XR optics technology enables a single high-speed transceiver to simultaneously send and receive independent data streams to/from numerous low-speed transceivers.



Subcarriers can be flexibly sized. For example, 4 X 25G subcarriers defined in a 100G QSFP-28 transcrivers; or 16 X 25G subcarriers defined in a 400G QSFP-DD transceiver.

The company says that by leveraging these capabilities, network operators will be positioned to significantly reduce the number of transceivers in the network, eliminate the need for costly intermediate aggregation devices, and more efficiently optimize transport infrastructure for hub-and-spoke end-user traffic flows.

Initial areas of focus include DAA fiber deep networks, 5G X-haul, DSL/PON backhaul, and fiber-enabled business services.

XR optics is designed to be integrated into a variety of form factors, including industry-standard pluggables, from low-speed interfaces with a single subcarrier to high-speed (400G+) interfaces with numerous subcarriers.

“We’re excited to introduce the revolutionary concept of coherent subcarrier aggregation, one that will redefine the cost structure of next-generation transport networks,” said Dr. Dave Welch, Founder and Chief Innovation Officer. “XR optics addresses a fundamental deficiency in optical communications technology and is expected to have a significant impact on any network that implements an aggregation function.”

“Developing 400ZR solutions demands a large investment, and companies are looking for ways to leverage these investments by broadening their addressable market. Infinera has gone a step further in a big, bold move: it is combining its unique expertise in photonics, silicon, and network
management to yet again create a truly differentiated approach to solve the engineering challenges faced by network operators,” said Andrew Schmitt, Directing Analyst, Cignal AI.

“We are excited about XR optics and its potential to make optical networks more efficient,” said Beck Mason, SVP and General Manager Telecom Transmission, Lumentum. “Our market leading coherent transmission products, based on high-performance indium phosphide photonic integrated circuits, are well proven and deployed in volume in coherent transmission applications, including those employing digital subcarriers, the innovative technology upon which XR optics is based.”

“Optical aggregation with XR optics is a compelling new architecture for aggregating edge nodes such as 5G radios into high-speed 400G router ports without requiring active aggregation devices in the field. We welcome this multi-vendor effort to fundamentally reduce the complexity
and operational cost of aggregation networks,” said Christophe Metivier, VP of Manufacturing and Platform Engineering, Arista Networks.

ECOC 2019 -- a panel discussion, “XR Optics: Point-to-Multipoint Coherent Connectivity and the Future of Transport Network Architectures,” is scheduled for Wednesday, September 25 at 10:30 a.m. in Room Dodder B.

https://www.infinera.com/innovation/xr-optics

Sunday, September 22, 2019

Source Photonics unveils 50G transceivers for 5G mid-haul

Source Photonics unveiled the following portfolio of 5G mid-haul transceivers:

  • 50G QSFP28 LR supporting 50GE link up to 10 km on duplex single mode fiber
  • 50G QSFP28 ER supporting 50GE link up to 40 km on duplex single mode fiber
  • 50G BiDi QSFP28 LR supporting 50GE link up to 10 km on simplex single mode fiber
  • 50G BiDi QSFP28 ER supporting 50GE link up to 40 km on simplex single mode fiber

“We are pleased to announce a comprehensive portfolio of 50Gb/s products, which includes 50G QSFP28 LR & ER and 50G BiDi QSFP28 LR & ER to support 5G mid-haul applications,” said Supriyo Dey, Sr. Director of PLM. “This shows our commitment to support our customers with the growing demand for 50Gb/s products to enable the 5G ramp,” continued Dr. Dey.

Source Photonics will have a live demonstration of the 50G BiDi QSFP28 ER over 40 km fiber at ECOC booth no. 57.

http://www.sourcephotonics.com

Source Photonics showcases 400G at ECOC 2019

At ECOC 2019 this week in Dublin, Source Photonics is demonstrating its complete 400G portfolio with industry partners

Source Photonics’ portfolio of Datacenter and Routing products includes:

  • 400G-DR4 supporting 400GE links over 500m as well as an enhanced reach of up to 2 km (4x100G-FR) with support for breakout into 100G-DR/FR
  • 400G-LR8 supporting 400GE links up to 10 km
  • 400G-ER8 supporting 400GE links up to 40km as technology demonstration

“Successful interoperability between optical transceivers and hosts is crucial to rolling out the next higher data rate connectivity,” said Ed Ulrichs, Director of PLM at Source Photonics. “Together with our partners in the industry, we aim to bring next-generation solutions to our customers and provide the high-speed connectivity they require.”

Source Photonics will show error-free traffic through a link involving Viavi’s ONT 603 unit and QCT’s QuantaMesh BMS T9032-IX9 switch connected with various Source Photonics 400G optical transceivers.

“We take pride as a company in being a part of the faster and more connected cloud scale networks because of our leading-edge portfolio of compute, storage, and networking products,” said Mike Yang, Senior Vice President of Quanta Computer and President of Quanta Cloud Technology (QCT). “QCT is the ideal solutions provider to harness the innovative capabilities of this new switch technology and deliver state-of-the-art 32x400GbE platforms for our web-scale customers worldwide, with best-in-class quality, economics, and time-to-market."

http://www.sourcephotonics.com

OE Solutions announces 50G Bidirectional optical transceiver for 5G

OE Solutions announced a 50G bidirectional SFP28 ER ST optical transceiver.

The new 50G BIDI ER ST transceiver, which is aimed especially at wireless mid-haul applications, operates in the O-band with a standard-temperature (ST) rating in a QSFP28 form factor. It supports a transmission distance of 40km.

The new device joins OE Solutions’ extensive portfolio of 10G, 25G and now 50G optical transceivers for wireless access networks, including front-, mid- and backhaul.

OE Solutions said the ambitious goals of the wide range of performance metrics in the 3GPP release-16 standard, which is expected to be ratified in 2020, will impact the optical access network supporting 5G wireless services dramatically. Much higher capacities need to be delivered to a much larger number of antennas. In addition, compute and storage resources will be required closer to the antennas than was the case for LTE and previous-generation wireless services. As the network architectures evolve to support these changes, new optical transceiver requirements have emerged.

The 50G PAM4 BIDI ER optical transceiver leverages PAM4 encoding to enable 50G duplex connectivity over a single fiber. When considered in conjunction with OE Solutions’ 10G and 25G NRZ BIDI transceivers, service providers can size a single-fiber connection cost-efficiently to match the
bandwidth demand. The 50G PAM4 transceiver employs dual-25G electrical interfaces of a QSFP28 standards-compliant module design. As such, the module offers a simple way to double the bandwidth over a single-fiber link without having to install filters for wavelength multiplexing.

“We are very excited to launch our first 50G transceiver product for wireless access network applications”, said Per Hansen, VP of Marketing and Sales at OE Solutions, and continued “We have a long history of working closely with the leading equipment manufacturers and service providers to
deploy new generations of wireless infrastructure. As 5G increases the bandwidth requirements for the optical part of the access network and new network architectures are being deployed, the industry demands new optical transceivers solutions such as this 50G device, which leverages PAM4
modulation to provide the needed bandwidth, reach and cost-efficiency.”

Visit OE Solutions at ECOC, Booth 226.

https://oesolutions.com/

Scintil Photonics raises EUR 4 million for 800G transceiver prototype

Scintil Photonics, a start-up based in Grenoble, France, announced EUR 4 million in first-round funding for its work in silicon photonic fully integrated circuits.

The company said the funding will be used to develop prototypes (800 Gbps transceiver photonic circuits) in commercial semiconductor foundries in order to sample strategic customers in the data center market. The team and development partnerships, including those with CEA-Leti in France and the University of Toronto in Canada, will be strengthened.

Scintil’s technology enables higher-speed optical communication through the integration of multi-wavelength lasers with silicon photonics standard technology. It also reduces implementation costs by avoiding several packaging steps. Besides developing solutions for high-speed data transmission, Scintil Photonics also targets sensing applications, such as Lidar, an enabling technology for autonomous detection and mobility.

The success of this first tranche of funding reflects investor interest and confidence in the technology and the company founded less than a year ago. Prior to its establishment, in November 2018, by CEO Sylvie Menezo, previously with CEA-Leti, and chairman Pascal Langlois, former CEO of Tronics Microsystems, the start-up project, incubated at CEA-Leti, received initial start-up funding as a winner of i-Lab 2018, a French government-sponsored innovation competition hosted by Bpifrance.

“We are very pleased to have the support of leading French investors to further develop to an industrial level our innovative silicon photonic integrated circuits,” said Sylvie Menezo,CEO of Scintil Photonics. “Integrating lasers onto silicon photonic circuits, mass-produced in commercial silicon photonics foundries using standard manufacturing processes, is a key technology asset of Scintil. ”

https://www.scintil-photonics.com

CIG announces 400G, 200G and 100G optical mModules

Cambridge Industries Group (CIG) announced a full line-up of 400G, 200G and 100G optical modules for datacenter applications at ECOC 2019, Dublin, Ireland. The line of products consists of the following:

  • 400G QSFP56-DD FR4/LR4 and DR4
  • 200G QSFP56-FR4, both digital (DSP) and analog (CDR) versions
  • Next generation 100G QSFP28-DR1/FR1/LR1, CWDM4, LR4


“Adding a full line of 400G, 200G and 100G optical modules into our product offering reaffirms our commitment to bring innovative high-quality, low-cost and low-power technologies into the industry,” said Gerry Wong, CEO of CIG. “Specifically, CIG was one of the first companies to introduce 400G QSFP56-DD FR4 module into the market. Earlier this year, CIG announced the world’s first 200G analog CDR based optical module for datacenter interconnect application which, together with our large scale, high quality automated manufacturing capabilities, allows CIG to quickly meet the needs of the telecom and datacom markets.”

Vladimir Kozlov, Ph.D., Founder and CEO of LightCounting Market Research, added, “Sales of next generation Ethernet transceivers are on track to exceed $200 million in 2019 and reach $4 billion by 2024. Our market forecast report assumes that suppliers will be able to scale up production volumes and reduce cost to enable rapid adoption of next generation Ethernet transceivers.”

CIG’s 400G FR4, 100G single wavelength (100G DR1 and FR1), and legacy 100G (100G LR4 and CWDM4) modules are generally available (GA). 400G DR4 modules will be available in 4Q 2019. 200G FR4 modules based on analog CDR or DSP are under development and expected to sample in early 4Q 2019. GA is expected in late 4Q 2019.

Lumentum to divest certain transceiver product lines to CIG

Lumentum announced plans to sell certain optical transceiver product lines developed and manufactured by its subsidiary Oclaro Japan to Cambridge Industries Group (CIG). The sale is not expected to impact the guidance ranges provided on February 5, 2019 for Lumentum's third fiscal quarter, ending March 30, 2019. Revenue attributable to the products to be sold in the proposed transaction is approximately $20 million of the $50 million to $55 million of datacom revenues previously included in Lumentum's guidance for the third fiscal quarter of 2019.

CIG also entered into a long-term strategic supply agreement for Lumentum's photonic chips.

AWS activates NVIDIA T4 Tensor Core GPUs

Amazon Web Services announced the general availability of G4 instances, a new GPU-powered Amazon Elastic Compute Cloud (Amazon EC2) instance featuring the latest generation NVIDIA T4 GPUs, custom 2nd Generation Intel Xeon Scalable (Cascade Lake) processors, up to 100 Gbps of networking throughput, and up to 1.8 TB of local NVMe storage.

AWS says these are the most cost-effective GPU instances for machine learning inference to date.

The G4 instances deliver up to 65 TFLOPs of mixed-precision performance, but could also be used cost-effectively for small-scale and entry-level machine learning training jobs that are less sensitive to time-to-train. G4 instances also provide a compute engine for graphics-intensive workloads, offering up to a 1.8x increase in graphics performance and up to 2x video transcoding capability over the previous generation G3 instances. These performance enhancements enable customers to use remote workstations in the cloud for running graphics-intensive applications like Autodesk Maya or 3D Studio Max, as well as efficiently create photo-realistic and high-resolution 3D content for movies and games.

“We focus on solving the toughest challenges that hold our customers back from taking advantage of compute intensive applications,” said Matt Garman, Vice President, Compute Services, AWS. “AWS offers the most comprehensive portfolio to build, train, and deploy machine learning models powered by Amazon EC2’s broad selection of instance types optimized for different machine learning use cases. With new G4 instances, we’re making it more affordable to put machine learning in the hands of every developer. And with support for the latest video decode protocols, customers running graphics applications on G4 instances get superior graphics performance over G3 instances at the same cost.”

AT&T signs new renewable energy purchases

AT&T announced new Virtual Power Purchase Agreements (VPPAs) with Invenergy and Duke Energy Renewables for new wind and solar projects. These purchases push AT&T to over 1.5 gigawatts (GW) of clean energy commitments.

The new purchases will support wind and solar projects, developed by Invenergy, delivering 800 megawatts (MW) of sustainable energy, as well as 160 MWs of wind energy generated by the Frontier Windpower II project, developed by Duke Energy Renewables.

“AT&T is investing in renewable energy because it is good for our planet and our business,” said Charlene Lake, Chief Sustainability Officer & Senior Vice President, Corporate Social Responsibility. “AT&T’s new renewable energy purchases are a milestone in our company-wide efforts to help address climate change, and they will deliver important benefits to our bottom line.”

Telecom's $490 Billion Open Source Network Opportunity



“This huge $490B equipment spending opportunity over the next 5 years in communications service provider networks is large but is also complex; and the impact of next-generation SDN is making broadband and 5G deployment easier,” said Chris DePuy, founding analyst for 650 Group. “Operators are now moving to open source on a project and a technology basis gradually. Operators expect to achieve considerable Opex savings while also improving service agility.”


CORD TAM Research Update - Keynote by Chris DePuy, Founding Analyst, 650 Group - ONF Connect 19 from Open Networking Foundation on Vimeo.

Thursday, September 19, 2019

QSFP-DD800 MSA gets underway

A new QSFP-DD800 Multi-Source Agreement (MSA) Group has been formed with the goal of advancing the development of high-speed, double-density quad small form factor pluggable (QSFP-DD800) modules to support 800 Gbps connectivity.

The MSA founder-promoters include Broadcom, Cisco, Finisar, Intel, Juniper Networks, Marvell, Molex and Samtec.

The new QSFP-DD800 interface expands on the QSFP-DD, a pluggable form factor with an eight-lane electrical interface widely adopted by the latest Ethernet switches. This MSA will enable QSFP-DD800’s eight electrical lanes to operate at 100 Gbps each, by providing technical solutions for 800 Gbps module and connector systems. It will also define a module, connector, stacked connector and a hybrid connector that is a BiPass/Flyover variant which can eliminate the signal losses on a traditional PCB. The primary objective of the MSA Group is to define the specifications and promote industry adoption of the QSFP-DD800. The new QSFP-DD800 specification is intended to be backward compatible with QSFP-DD, QSFP28 and QSFP+ modules and cables in order to address the upcoming industry demands of 25.6 Tb/s scale systems supporting dense 100 GbE or dense 400 GbE interfaces.

“Through continued strategic collaborations with our MSA Promoters, we are developing the physical specifications that will enable the interoperability of optical transceiver modules, connectors, cages and DAC cables from multiple vendors to assure a robust ecosystem,” said Scott Sommers, founding member and MSA co-chair. “We are thrilled to collaborate together as a group and further develop and provide next-generation designs that evolve with the changing technology landscape.’’

“Leveraging the technical innovations from QSFP-DD, the time is right to collaborate with our MSA partners to lay the foundations for the next generation systems and modules,” said Mark Nowell, founding member and MSA co-chair. “The QSFP-DD form factor continues to be the cornerstone for the next step in pluggable module performance and density, while extending the industry’s investment, experience, cost structure and backward compatibility from prior generations.”

http://www.qsfp-dd800.com

Vertical Systems: Mid-2019 Global Provider Ethernet LEADERBOARD

AT&T has topped Vertical Systems Group's Mid-Year 2019 Global Provider Ethernet LEADERBOARD. Results are as follows (in rank order based on retail port share): AT&T (U.S.), Colt (U.K.), CenturyLink (U.S.), BT Global Services (U.K.), Orange Business Services (France), Verizon (U.S.) and NTT (Japan).

"Network providers serving multinational enterprises continue to actively expand their Ethernet coverage globally," said Rick Malone, principal of Vertical Systems Group. "Customer demand for T1/E1 conversions and new Ethernet DIA connections are igniting growth in both existing and emerging markets. In response, providers are seeking more local partnerships to broaden their service delivery footprints."

Mid-Year 2019 Global Provider Highlights:

  • AT&T retains the top position on the Global Provider LEADERBOARD for the second consecutive year.
  • Share margins are tightening among the top four LEADERBOARD ranked companies - AT&T, Colt, CenturyLink and BT Global Services.
  • Eight companies attained a Challenge Tier citation, up from seven at the end of 2018, as Global Cloud Xchange advances from the Market Player tier.
  • Four of the seven LEADERBOARD providers and six of the eight Challenge Tier providers have MEF CE 2.0 certification. 

NeoPhotonics ships 30-40 mW CW laser sources for 400G transceivers

NeoPhotonics announced the general availability (GA) of its non-hermetic 30-40 mW DFB laser sources for use in Silicon Photonics 100G per wavelength CWDM4 FR4 and 1310 nm DR1 and DR4 transceivers.  These lasers are available with and without integral Spot Size Converters (SSC).

NeoPhotonics low-loss SSC technology enables direct attachment of the Indium Phosphide laser to a Silicon Photonics waveguide, increasing manufacturing scalability and reducing costs.  These efficient, high power DFB lasers can operate at up to 75 degrees C and are compliant with Telcordia GR-468-CORE, making them well suited for use in non-hermetic Silicon Photonics based small form factor pluggable modules, such as 400G QSFP-DD.

Silicon Photonics (SiPho) has emerged as a promising technology for optical data transmission over intermediate reaches of approximately 500 meters (DR) to 2 kilometers (FR) inside datacenters.  A Silicon Photonics photonic integrated circuit can combine four different high speed modulators on a single chip, but it requires a light source to be modulated.  A separate laser, or laser array, generating sufficient optical power at the specified wavelength(s) to overcome losses in the Silicon modulator and waveguides, must be coupled to the SiPho chip.  NeoPhotonics family of high power DFB lasers are designed to efficiently couple to the SiPho modulator chip and do not require hermetic packaging making them an ideal choice for next generation transceiver modules.

A high-speed SiPho modulator chip, due to its high Vp, generally requires a driver amplifier with a large voltage swing, which is also supplied by NeoPhotonics.  NeoPhotonics Gallium Arsenide based Quad Driver chip combines four separate drivers in a single compact, low power chip designed to support compact pluggable modules such as OSFP and QSFP-DD.

"We are pleased to announce GA of our family of high power DFB lasers for next generation SiPho based 100G to 400G transceivers," said Tim Jenks, Chairman and CEO of NeoPhotonics. "Silicon Photonics is rapidly transforming the data center transceiver marketplace by bringing the scale and cost structure of semiconductor electronics to optics, and our laser sources and drivers are helping to unleash the potential of Silicon Photonics," concluded Mr. Jenks.

TE debuts PCIe Gen 4 card edge connectors supporting 16 Gbps

TE Connectivity (TE) introduced its new PCIe Gen 4 card edge connectors, which meet industry PCI-SIG Card Electromechanical (CEM) specification 4.0 and support Intel and AMD next-generation platforms with up to 16 Gbps of bandwidth.

The new connectors support next-generation CPUs for better system application scaling and higher bandwidth in servers, storage, workstations and desktop PCs.

TE’s new PCIe Gen 4 card edge connectors feature a 1.00mm pitch to enable all generations of PCI Express signaling designs and support speeds of 16 Gbps (PCIe Gen 4), 8.0 Gbps (PCIe Gen 3), 5.0 Gbps (PCIe Gen 2) and 2.5 Gbps (PCIe Gen 1). In addition, the connectors’ footprint and mating interface are backward-compatible with each PCIe generation.

“As manufacturers begin to implement PCIe Gen 4 connectivity inside their data center products, they may require high-performing card edge connectors that offer full backward compatibility,” said Taylor Luo, product manager at TE Connectivity. “TE’s new PCIe Gen 4 adapters fully support new designs for Intel, AMD and IBM platforms and are available in a wide range of configurations to address virtually any need.”

CyrusOne builds largest colo data center in Dublin

CyrusOne commenced construction pf its first data center campus in Dublin, Ireland.

Upon completion, the Dublin I campus will comprise three separate two-story buildings, offering 360,000 square feet of data center space. The facility will be among the first CyrusOne data centers in Europe to deploy closed-loop chilled-water cooling. This highly efficient system uses an air-cooled chiller technology with an integrated compressor and condenser that cools the closed-loop of water, dramatically reducing water consumption during the cooling process.

CyrusOne’s goal is to source 100% renewable power.

“Ireland is an incredibly attractive place to do business, and Dublin, in particular, has established itself as one of the world’s thriving tech hubs,” said Tesh Durvasula, President - Europe, CyrusOne. “The level of demand for spaces from enterprise customers has been great, even in these early stages of construction.”

MEF: SD-WAN + Intelligent Underlay Connectivity + LSO Orchestration = New Revenue



MEF Annual Meeting – July/August 2019, Pascal Menezes, CTO, MEF, shares a summary of the MEF 3.0 strategy to combine standardized SD-WAN services with high speed, intelligent underlay connectivity services to deliver a better customer experience and create new revenue opportunities for service providers. SD-WAN + intelligent underlay connectivity fabric + LSO APIs for service automation = new revenue-generating hybrid networking solutions.

“We believe the industry is ready now for a very high speed underlay fabric that’s highly orchestrated among all the network providers. This is really what we’ve been doing with all our work on our LSO APIs like Sonata – to orchestrate all these various providers so that they connect their underlays at very high speeds.”

“Additionally...we now have the first official industry SW-WAN standard for the overlays. So that’s going to be orchestrated underlays at high speeds with a very agile overlay using SD-WAN.”

Going further, the goal is to add in virtualized functions like security and WAN optimization, and then have all of the services and virtualized functions highly orchestrated using our MEF LSO APIs.

Download the SD-WAN Standard

MEF’s SD-WAN Service Attributes and Services (MEF 70) standard describes requirements for an application-aware, over-the-top WAN connectivity service that uses policies to determine how application flows are directed over multiple underlay networks irrespective of the underlay technologies or service providers who deliver them. Download here: https://www.mef.net/resources/technic...

To explore the latest on SD-WAN and LSO API innovations and engage with industry-leading service and technology experts such as Pascal Menezes, attend MEF19 (http://www.MEF19.com), held 18-22 November 2019 in Los Angeles, California.

Kuwait-based Qualitynet deploys ADVA's FSP 3000

Kuwait-based Qualitynet has deployed ADVA's FSP 3000 platform for nationwide data transport at speeds up to 400 Gbps.  This is achieved using ADVA’s QuadFlex line card to combine two 200 Gbps wavelengths operating at 8QAM within a single optical channel.

ADVA said its FSP 3000 also enables Qualitynet to make significant energy savings and, with its 1RU footprint, the solution consumes less rack space than competing technology. Managed by ADVA’s unique Ensemble Controller, the network brings programmatic SDN control, further improving efficiency by reducing troublesome and time-consuming manual processes while providing maintenance teams with full visibility.

“Qualitynet now has a highly flexible and efficient transport system that will provide access to world-class connectivity and the very latest optical services. It offers a major boost to Kuwait’s businesses and delivers an enormous increase in mobile backhaul bandwidth for Qualitynet’s parent company, VIVA,” commented Munther Jadallah, account manager, sales, Middle East, ADVA.

Datadog surges 39% in IPO

Shares in Datadog (Nasdaq: DDOG) surged 39% above the IPO price to close at $37.55 on the first day of trading.

DataDog is a monitoring service for cloud-scale applications, providing monitoring of servers, databases, tools, and services, through a SaaS-based data analytics platform.

In its S-1 filing, the company disclosed revenue of $153.4 million for the first half of 2019.

DataDog was founded in 2010 and is based in New York.


Ericsson to open 5G factory in Texas

Ericsson will open a US$100 million state-of-the-art factory in Lewisville, Texas, a suburb close to Dallas/Fort Worth International Airport and Ericsson’s North America headquarters in Plano.
 
The 28,000sq m facility will produce 5G and Advanced Antenna System radios to boost network capacity and coverage to meet the demand for rapid 5G deployments in North America. Commercial operations are expected in early 2020 and will be powered by Ericsson 5G solutions tailored for the industrial environment. Fast and secure 5G connectivity will enable agile operations and flexible production. Ericsson’s 5G industrial solutions include automated warehouses, connected logistics, automated assembly, packing and product handling, and the use of autonomous carts.

Texas Governor, Greg Abbott, says: “From manufacturing to technology, the Texas economy is firing on all cylinders thanks to investments of world class companies like Ericsson. I am proud that Ericsson has chosen Texas to expand its operations, and can assure them that as Governor, I will continue to promote pro-growth policies that reduce the heavy hand of government regulation and encourage expansion in the private sector.”

Niklas Heuveldop, President and Head of Ericsson North America, says: “As the commercial 5G network rollout continues to accelerate across North America, Ericsson is excited to lead the global technology evolution in close partnership with our North American customers, with a clear focus on value creation for consumers, enterprises and society at large. We continue to increase our investments in the U.S., so that we can more rapidly respond to customer demands, accelerating our pace of innovation and time to market for critical new products.”

Western Digital to exit storage systems business

Western Digital agreed to sell its IntelliFlash business to DDN, a global leader in artificial intelligence (AI) and multi-cloud data management. Under the deal, DDN also will increase its purchase of Western Digital’s HDD and SSD storage devices.Financial terms were not disclosed.

Western Digital said the sale reflects its strategic intention to exit Storage Systems, which consists of its IntelliFlash and ActiveScale businesses. The company is exploring strategic options for ActiveScale. These actions will allow Western Digital to optimize its Data Center Systems portfolio around its core Storage Platforms business, which includes the OpenFlex™ platform and fabric-attached storage technologies.

“As we look to the future, scaling and accelerating growth opportunities for IntelliFlash and ActiveScale will require additional management focus and investment to ensure long-term success,” said Mike Cordano, president and chief operating officer. “By refocusing our Data Center Systems resources on our Storage Platforms business, we are confident that the Western Digital portfolio will be better positioned to capture significant opportunities ahead and drive long-term value creation.”

“DDN has deep technical expertise and capabilities in high performance and at scale data environments, and is well positioned to build on and accelerate the success of the business,” said Phil Bullinger, senior vice president & general manager of the Data Center Systems business. “Importantly, both Western Digital and DDN are aligned in our commitment to executing a smooth transition for all stakeholders. Western Digital will remain one of the largest consumers of IntelliFlash products, and customers will continue to receive best-in-class service and support.”

Ericsson upgrades factory in Nanjing

Ericssson completed an 18-month upgrade of its existing factory in Nanjing, China. The SEK 500 million project has transformed the facility into one of the most advanced manufacturing facilities in the industry.

Ericsson produces 5G and 4G radio technology products at the factory, most of which support communication service providers in the Chinese market to increase network capacity, roll-out 5G, and make Industry 4.0 a reality.

The 18-month upgrade has seen Ericsson modernize every step of the production process in Nanjing, in preparation for the introduction and rapid deployments of 5G in China. This includes the first modular-designed automatic assembly line for 5G radios, which will enable Ericsson to produce the latest 5G radios in the capacity needed for the Chinese market.

An upgraded automatic packing line, which supports both 4G and 5G products, has been up running from the second quarter of 2019.

Delta Electronics picks MaxLinear’s 2nd Gen PAM4 DSPs

Delta Electronics, Inc., a global leader in power and thermal management solutions, has selected MaxLinear’s second-generation Telluride PAM4 DSPs to develop sub-3.5 watt 100G single lambda DR, FR, and LR optical modules.

The second-generation Telluride family (MxL93515 and MxL93516) extends MaxLinear’s PAM4 DSP offering, by enabling sub-3.5W QSFP28 and SFP-DD 100G optical modules. With support for extended operating temperature, the new Telluride DSPs are also ideally suited for the wireless fronthaul market transition to single lambda 100G optics with reaches up to 10km.

“Building upon the success of our first-generation Telluride PAM4 DSPs, our newest devices enable revolutionary 100 Gbps QSFP28 and SFP-DD modules with sub-3.5W power consumption,” said Will Torgerson, Vice President and General Manager of MaxLinear’s High-Speed Interconnect Group. "We are excited to see the adoption of our latest generation Telluride product family by Delta Electronics, Inc. for its industry leading low power optical modules.”

128 Technology raises $30M for smart session routing

128 Technology, a start-up based in Burlington, Massachusetts, closed $30 million in Series D financing for its "Session Smart" Routing technology.

“The latest round of funding comes at a pivotal time for 128 Technology, when we’re seeing higher than ever demand for our session-based, service-centric networking approach,” said Andy Ory, CEO of 128 Technology. “As virtualization and cloud are shaping our connected future, 128 Technology’s approach offers users a simple, agile solution and helps enterprises manage their networks efficiently and securely.”

“Andy Ory and his rapidly growing 128 Technology team have disrupted the multi-billion-dollar market for traditional networking by delivering proven, next generation network services that give customers freedom from increased risks, unnecessary costs and vendor lock-in,” said Sonja Hoel Perkins, Managing Director, The Perkins Fund. “As companies around the globe continue to invest in solutions that meet the demands for a new model of virtual networking, 128 Technology has created a large, untapped market opportunity.”

Existing investors all participated in the oversubscribed round, including executive management and current employees of 128 Technology, G20 Ventures, The Perkins Fund and individual investors. The company has raised $97.4 million to date.

Wednesday, September 18, 2019

DOCOMO commits to multivendor O-RAN for 4G/5G

NTT DOCOMO has commenced deployment of a 4G/5G multivendor radio access network conforming to O-RAN specifications.

Working in collaboration with Fujitsu, NEC, and Nokia, DOCOMO has demonstrated multi-vendor interoperability across a variety of 4G and 5G base station equipment compatible with O-RAN. The O-RAN standards include fronthaul specifications and X2 profile specifications.



O-RAN fronthaul specifications are used to establish the connections between centralized units hosting baseband processing and remote units hosting radio processing in 5G remote-installed base stations. O-RAN fronthaul interface specifications provide a foundation for interoperability between centralized units and remote units of 5G remote-installed base stations manufactured by diverse partners.

The O-RAN X2 profile specifications provide a foundation for interoperability between 4G base stations and 5G base stations manufactured by diverse partners in 5G non-standalone (5G NSA) networks by taking 3GPP X2 interface specifications and specifying detailed standards for their usage. 5G NSA networks connect devices using both 4G and 5G technologies.

DOCOMO believes this represents the world's first realization of this level of multi-vendor interoperability in 4G and 5G base station equipment conforming to O-RAN specifications. The ability to deploy and interconnect base station equipment from different vendors will make it possible to select the equipment most suitable for deployment in any given environment, such as base stations offering broad coverage in rural areas or small base stations that can be deployed in urban areas where space is limited.

DOCOMO will deploy the equipment in the pre-commercial 5G service it plans to launch on September 20, 2019 in Japan.
https://www.nttdocomo.co.jp/english/info/media_center/pr/2019/0918_00.html

Fujitsu delivers 5G base station products to NTT DOCOMO

Fujitsu Limited has begun delivery of 5G base station products, comprising of Central Unit (CU, 1) and Radio Unit (RU, 2), to NTT DOCOMO for its commercial 5G network.

The 5G CU products that Fujitsu has started delivering realize the 5G system through a proprietary software design from the company using software-defined radio technology, which can implement different wireless technologies on the same hardware.

The 5G RU products have built-in antennas (which had conventionally been installed externally) equipped with beam forming, enabling efficient network deployments. These RU products have a lineup consisting of 3 types of equipment that support 5G frequencies (the 3.7 GHz band, the 4.5 GHz band, and the 28 GHz band). he products are compliant with the O-RAN fronthaul interface specifications. Using this open interface, Fujitsu's products can connect to various vendors CU/RU products. The products also support 3GPP's (Release 15) specifications.

Fujitsu said it has been working with NTT DOCOMO to develop a CU and RUs that comply with the O-RAN fronthaul interface specifications

Equinix extends global reach of Oracle Cloud infrastructure

Equinix will provide global reach for Oracle Cloud Infrastructure.

Oracle's Generation 2 Cloud Infrastructure is designed to create an infrastructure that matches the performance, control and governance of enterprise data centers, while delivering the scale, elasticity and cost savings of public clouds.

Recent global market expansions by Equinix in São Paulo, Sydney, Tokyo, Toronto and Zurich now provide customers in these metros with private and highly secure connectivity to Oracle Cloud Infrastructure FastConnect via Equinix Cloud Exchange Fabric (ECX Fabric).

As a part of the expanded collaboration, Oracle customers using Oracle Cloud Infrastructure in the Phoenix data center region can also now directly connect to Oracle Cloud Infrastructure FastConnect from Equinix International Business Exchange data centers in Los Angeles via ECX Fabric.

Currently, Oracle FastConnect is deployed in six Equinix IBX data centers, including Amsterdam, Chicago, Frankfurt, London, Sydney and Washington, D.C./Northern Virginia. Additionally, Equinix offers more private onramps to Oracle Cloud Infrastructure FastConnect in 32 other metros globally, ncluding:

  • 7 Asia-Pacific metros: Hong Kong, Melbourne, Osaka, Perth, Singapore, Sydney and Tokyo.
  • 13 American metros: Atlanta, Boston, Culpeper, Dallas, Denver, Houston, Los Angeles, Miami, New York, São Paulo, Seattle, Silicon Valley and Toronto.
  • 12 European metros: Dublin, Dusseldorf, Geneva, Helsinki, Madrid, Manchester, Milan, Munich, Paris, Stockholm, Warsaw and Zurich.

Interxion backs IX-API

INTERXION, which is a leading provider of carrier and cloud-neutral colocation data centre services in Europe, announced its support for the new Internet Exchange Application Programming Interface (IX-API).

Interxion will use IX-API to deliver customers on-demand remote peering, providing access to peering services from all Interxion data centres across Europe.

AMS-IX, DE-CIX and LINX develop a universal IX-API

Three of the leading Internet exchange providers, AMS-IX, DE-CIX and LINX, announced a universal IX-API designed serve as a common technical communication protocol enabling communication between various software applications.

The idea is to create a common interface for provisioning key services at multiple exchanges, by creating a simpler platform for customers and offering an easier way to connect.

The three IX partners said their IX-API allows users to self-manage their existing and new interconnection services, such as peering, more effectively.

See also