Wednesday, October 31, 2018

Netronome proposes open "chiplets" for domain specific workloads

Netronome unveiled its open architecture for domain-specific accelerators .

Netronome is collaborating with six leading silicon companies, Achronix, GLOBALFOUNDRIES, Kandou, NXP, Sarcina and SiFive, to develop this open architecture and related specifications for developing chiplets that promise to reduce silicon development and manufacturing costs.

The idea is fo chiplet-based silicon to be composed using best-of-breed components such as processors, accelerators, and memory and I/O peripherals using optimal process nodes. The open architecture will provide a complete stack of components (known good die, packaging, interconnect network, software integration stack) that lowers the hardware and software costs of developing and deploying domain-specific accelerator solutions. Implementing open specifications contributed by participating companies, any vendor’s silicon die can become a building block that can be utilized in a chiplet-based SoC design.

“The end of Moore’s Law will increase the use of domain-specific accelerators to meet power-performance requirements in cloud infrastructure, network infrastructure and IoT/wireless edge applications,” said Bob Wheeler, principal analyst, The Linley Group. “With its modular approach, the open domain-specific accelerator architecture could change the chiplet paradigm from single-vendor solutions to a world of choice, thereby enabling OEMs and operators to develop and deploy advanced SoC solutions.”

“Netronome’s domain-specific architecture as used in its Network Flow Processor (NFP) products has been designed from the ground up keeping modularity, and economies of silicon development and manufacturing costs as top of mind,” said Niel Viljoen, founder and CEO at Netronome. “We are extremely excited to collaborate with industry leaders and contribute significant intellectual property and related open specifications derived from the proven NFP products and apply that effectively to the open and composable chiplet-based architecture being developed in the ODSA Workgroup.”

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