Thursday, October 2, 2014

Lantiq’s VDSL2 Chipset Supports 300 Mbps at up to 200m

Lantiq began shipping its new VINAX dp chipset optimized for Fiber To The distribution point (FTTdp) applications.

The Lantiq VINAX dp chipset enables aggregated 300 Mbps over VDSL2 at distances up to 200m between a customer premise gateway and the fiber network distribution point.

Lantiq said uts new chip set operates in industrial temperature ranges and with low power consumption, enabling installation in outdoor boxes with passive cooling. Since it can be line-powered from the customer premise, the FTTdp unit can be placed conveniently in carrier managed locations, while on the subscriber end, the standard VDSL CPE and power feeder is self-installed.

Key features:

  • Tightly integrated Lantiq carrier-class VDSL2 and GPON (FALC ON) solution
  • 300 Mbps aggregated data rate with G.INP (retransmission) downstream and upstream
  • Based on mature, future proof (VINAX CO platform) technology with demonstrated interoperability on both ends for GPON and VDSL links. 
  • Typical power consumption is 2.7 Watt for the VINAX dp chipset. 
  • The entire system consumes less than 6 Watts – including VDSL, GPON, DC/DC converter and all other active and passive components.  

Lantiq said it has partnered with several leading equipment manufacturers including Alcatel Lucent, ZTE, T&W, Aethra Telecommunications and others for successful field trials of its FTTdp solution.

See also