Tuesday, September 24, 2013

RANOVUS Raises $11 Million for Multi-Terabit Interconnects

RANOVUS, a start-up based in Ottawa, Ontario, announced $11 million in venture funding for its multi-terabit interconnect solutions for data center and communications networks.

RANOVUS’ platform is enabled by the company’s iQuantum Dot Multi-Wavelength Laser technology combined with advanced digital and photonics integrated circuit technologies. The company says its technology delivers significant reduction in power dissipation, size and cost of interconnects, enabling a much higher degree of distortion tolerance compared to traditional solutions. The company has not yet announced any products.

Investors include Azure Capital Partners, T-Venture, BDC Venture Capital, OMERS Ventures and MaRS Investment Accelerator Fund.

”We started RANOVUS with a world-class team of technologists and marketers to address the ever increasing challenge of cost-effectively scaling Data Center networks. Our platform technology enables Data Center operators to achieve cost-effective, power efficient and low latency connectivity from 100Gbps to multi Tbps,” said Hamid Arabzadeh, RANOVUS’ Chairman, President and CEO. “We are delighted to have such reputable global investors as Azure Capital Partners, T-Venture, BDC Venture Capital, and OMERS Ventures sharing our vision and investing in RANOVUS as we enter the market validation phase of our disruptive product portfolio.”


  • RANOVUS was founded in February 2012

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