Tuesday, November 8, 2011

Deca Technologies Targets Wafer Level Chip Packaging

Deca Technologies, a start based in Tempe, Arizona, announced its entrance into the market for wafer level chip scale packaging (WLCSP) services for the semiconductor industry.

The company will leverage the solar wafer manufacturing methods of SunPower Corp. and the financial, operational and manufacturing support from Cypress Semiconductor.

Deca's initial products include a series of WLCSP (Wafer Level Chip Scale Packaging) derivatives targeted at the current $1 billion-plus WLP (Wafer Level Packaging) market. Growth in WLPs continues to be driven primarily by the desire of handset OEMs to integrate more features and functionality into less space. Miniaturization, cost and performance benefits increasingly lead to a preference for WLP solutions. However, as traditional strip-based package technologies give way to advanced wafer-based methods, significant capital strain and cycle time challenges have burdened the supply chain.

Deca's investors include Cypress and SunPower. The new company is part of Cypress's Emerging Technology Division.


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