Thursday, October 6, 2011

OIF Approves Micro Tunable Laser for High Density 100G

The Optical Internetworking Forum (OIF) approved a Micro Integrable Tunable Laser Assembly (uITLA) implementation agreement (IA) which addresses the form factor for 100G applications with a 60% reduction in area and a nearly 30% reduction in height. In addition, the power consumption was reduced by 25%. The uITLA is expected to help prevent market fragmentation in component mechanical form factors for new high-density modules or line card applications.

OIF members also approved two additional documents under the 100G framework umbrella this month.

The following IAs are maintenance updates to 100G technology areas that came about as vendors began building product. OIF working group members found there were clarifications needed to maintain commonality among these components.

The 100G Long Haul DWDM Transmission Module Multi-Source Agreement (MSA) is a follow-on to the successful 300-pin transponder used in 10G and 40G applications. The OIF worked with the CFP MSA to align the two MSAs to incorporate a common management interface that addresses module communication and commands, including interfacing to the laser and adjusting for changes in power. In addition, clarifications were made to several mechanical specifications.

The Integrated Intradyne Coherent Receiver IA provides definition for a highly integrated photonic component enabling reductions in the cost and size of 100G transceivers. This update clarified several operating and mechanical characteristics and resulted in a body length reduction of 80% from 60 mm to 50 mm.

“The OIF is continually refining our technology driven documents to fit the rapidly evolving market,�? said Karl Gass of TriQuint Semiconductor and the OIF's Physical and Link Layer Working Group vice-chair. “The OIF has completed several tunable laser projects that are commercially successful and will continue to update our 100G centric documents to support the needs of vendors and carriers and the emerging market.�?


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