Monday, May 30, 2011

Vitesse's SimpliPHY 1G Devices Support 1588v2 and Ethernet/MPLS

Vitesse Semiconductor has expanded its Carrier Ethernet physical layer (PHY) portfolio with new Gigabit Ethernet (GE) devices offering an upgrade path for network equipment requiring IEEE 1588v2 timing synchronization and Ethernet/MPLS Operations Administration and Maintenance (OAM) features.

The new SimpliPHY 1G devices, the dual-port VSC8572 and quad-port VSC8574, support accurate timing distribution in wireless backhaul, data center, industrial automation, smart grid and other applications that leverage real-time services over newer packet-based networks. The two new devices complement the previously announced VSC8488-15 and VSC8494.

With the ability to handle encapsulations, such as Q-in-Q, IP/MPLS and MPLS Pseudowire, common in packet-based networks, the VSC8572 and VSC8574 deliver packet monitoring capabilities that enable service providers to reliably monitor services to Service Level Agreement contracts. Additionally, the devices offer full IEEE 1588v2 network synchronization support with one-step and two-step time stamping with accuracy better than 10ns in
1000BASE-T mode, sufficient for WiMAX and LTE backhaul and other timing critical applications.

"For businesses that need to deliver real-time services to customers over the Internet, such as the provision of cloud computing services, the customer experience can be improved by leveraging accurate key performance indicators and end-to-end service verification in the network equipment," said Brian Jaroszewski, senior product marketing manager at Vitesse. "Vitesse's goal is to provide a seamless upgrade path for equipment vendors and service providers to improve their networks with accurate OAM monitoring and precision timing features necessary for next-generation services over lower-cost packet networks."

Vitesse also offers a broad portfolio of Layer-2 and Layer-3 Switches with support for IEEE 1588v2 and Ethernet/MPLS OAM. The portfolio of physical layer devices offers timing accuracy improvements and cost savings at the system level by implementing these features in physical-layer silicon, thus allowing a simpler upgrade path to add these capabilities to existing equipments without changing switch, MAC, or processor silicon.

The devices will be available in 17-mm-square BGA packages. Sampling is underway.

See also