Monday, May 16, 2011

First Chipset Interoperability Plugfest Set for Next Week

The HomeGrid Forum and the Broadband Forum will host the first Chipset Interoperability Plugfest next week at the ITU facilities in Geneva, Switzerland. The Chipset Interoperability Plugfest is being facilitated by the University of New Hampshire InterOperability Laboratory (UNH-IOL).

The specific goals of this first plugfest are to perform initial tests for interoperability and compliance of chipsets from a number of vendors, validate the test suite and act as a prelude to the launch of HomeGrid's formal Compliance and Interoperability program. Multiple chipset vendors are expected to participate.

"As one of the world's leading organizations for broadband best practices and technology evolution, we are pleased to be able to co-host the first chipset open interoperability event. This is a very important step on the road to bringing products to the market and represents a significant milestone for service providers planning to deploy," said Robin Mersh, CEO of the Broadband Forum.

"The ITU supports this event and we believe this represents a significant milestone in the world's service providers aligning around," said Malcolm Johnson, Director of the ITU Telecommunication Standardization Bureau from ITU. "A multi-vendor silicon interoperability event furthers the technology, and with the support of the Broadband Forum and HomeGrid Forum members, we are working with important players that will be deploying this technology in the near future."http://www.broadband-forum.org

  • In June 2010, the International Telecommunication Union (ITU-T) formally approved the standard for next-generation wired home networks, including the Data Link Layer (G.9961), Physical Layer (G.9960) and coexistence protocol (G.9972). is expected to simplify the home networking market, which has until now been cluttered with many competing technologies and upgrade variations.