Sunday, August 31, 2008

Runcom Raises US$10M for OFDMA Silicon

Runcom Technologies, a start-up based in Israel, secured a US$10 million Series C investment for its OFDMA based silicon solutions for user terminals and base stations that comply with the IEEE802.16e-2005 standard for WiBro and Mobile WiMAX applications.

Runcom's products include PHY and MAC communication layer silicon. In April 2008 Runcom Technologies received the WiMAX Forum Certified Seal of Approval for its products. The company said it has sold more than 250,000 units of its RNA200 ASIC for user terminals.

The funding was raised by TLcom Capital LLP. This is only the second round of financing of Runcom. The previous investment round currently hold by SMAC Partners from Germany and Concord from Israel was executed in the year 2000.