Wednesday, February 6, 2008

Qualcomm to Ship First Multi-mode LTE Chipsets in 2009

Qualcomm has expanded its device chipset roadmap to include Long Term Evolution (LTE). The company announced three multi-mode Mobile Data Modem (MDM) chipsets that will support LTE, as well as other 3GPP and 3GPP2 standards:

  • MDM9200 chipset designed to support UMTS, HSPA+ and LTE

  • MDM9800 chipset designed to support EV-DO Rev. B, UMB and LTE

  • MDM9600 chipset designed to support UMTS, HSPA+, EV-DO Rev. B, UMB and LTE

All three MDM9xxx-series chipsets will offer full backward compatibility. The chipsets will support FDD and TDD duplex modes, different carrier bandwidths and will be capable of supporting peak data rates of up to 50 Mbps on the downlink and 25 Mbps on the uplink.

Qualcomm said these new chipsets will allow UMTS and CDMA2000 operators to upgrade seamlessly to future LTE services while preserving backward compatibility to their existing 3G UMTS and CDMA2000 networks. The LTE solutions are scheduled to sample in the second quarter of 2009.