Tuesday, November 13, 2007

USB High Speed Inter-Chip Spec Hits 480 Mbps, Targets Mobile Devices

A new High Speed Inter-Chip (HSIC) 1.1 specification, which is a supplement to the USB 2.0 specification, supports faster chip-to-chip communication, at speeds up to 480 Mbps. The design target includes multiple high bandwidth operations on devices like 3G/4G handsets, smartphones, set-top boxes, mobile internet devices and connectivity within the PC.

The specification allows the integration of multiple high speed capabilities, such as 3G/4G modems, WiMAX, 802.11n and storage peripherals, as well as other USB based input devices like keypads and control panels. The HSIC permits the device to move data between the various components at higher bandwidth and with improved power efficiency. It also eliminates the need for analog PHYs by providing a digital signal interconnect between the SOCs and their IC peripherals.

"The Inter-Chip specification has been a pivotal building block for developers wanting to integrate the USB interface inside mobile applications," said Jeff Ravencraft, USB Implementers Forum (USB-IF) president.


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