Sunday, July 22, 2007

Ericsson and TI Co-develop 3G Solutions for Handset Manufacturers

Ericsson and Texas Instruments (TI) will work together to develop custom solutions for new Open OS enabled 3G devices. The partnership combines 3G modems from Ericsson Mobile Platforms with high-performance OMAP applications processors from TI. Solutions from the joint engagement will include OMAP, custom basebands and connectivity technologies and will be capable of supporting the major Open OS. The result of this joint effort will enable all device manufacturers to offer advanced Open OS handsets for both the high-end and the rapidly growing mid-range market.

The companies said handsets based on these solutions are expected to be available on the market in the second half of 2008.