Sunday, November 12, 2006

Conexant Debuts ADSL2plus Central Office Chipset

Conexant Systems introduced its ADSL2plus central office (CO) system-on-chip (SoC) solution featuring 16- and 24-port configurations.

The company said its two new devices support all recent amendments to the ADSL2plus standards and are optimized for IPTV, video on demand (VOD), and high-definition television (HDTV) programming.

Key features include:

  • Enhanced Impulse Noise Protection (INP): Additional memory has been integrated into the chip to support INP, which facilitates the delivery of better quality video.

  • Dual-latency with dual-interleaving: Allows carriers to simultaneously deliver error-free video and data content with the appropriate level of error protection for each service, while maximizing channel capacity.

  • Dynamic spectrum management (DSM) Levels 1 and 2: Improves rate/reach performance via optimum spectrum shaping and balancing. This enables telcos to significantly boost broadband access subscriber rates over their existing copper infrastructure, eliminating the need for a costly network upgrade.

  • Mask-on-Demand (MoD): A DSM Level 1 innovation developed by Conexant that improves performance improvement in medium and long range loops. This adaptive version of reach-extended ADSL (READSL) boosts loop reach, and upstream and downstream rates by optimizing the shape of the transmit power spectral density design. This allows carriers to increase their geographic coverage area and expand their customer base.

  • RemedyDSL: An extensive loop diagnostic capability that helps operators pre-qualify, diagnose and maintain loops for DSL operation.

Both new chipsets can be used in conjunction with Conexant's Columbia family of DSLAM processors for next-generation CO digital loop carriers, optical network units, and multiple dwelling/tenant unit (MDU/MTU) applications. In addition, a universal digital signal processor (DSP) ensures design compatibility across all of Conexant's ADSL and VDSL product lines, further maximizing design flexibility and reducing system and design-in costs.

Sampling is currently underway with production scheduled for early 2007.


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