Tuesday, July 18, 2006

QUALCOMM Completes First HSUPA Test calls

QUALCOMM announced the successful completion of the industry's first HSUPA test calls delivering 2.0 Mbps on the uplink. QUALCOMM's Mobile Station Modem (MSM) MSM7200 chipset, the first HSUPA solution, was used for the test calls and interoperability testing. The company said ten leading device manufacturers are already designing handsets based on the chipset.


  • HSUPA (High-Speed Uplink Packet Access), which is analogous to HSDPA (downlink) technology, promises eventual peak rates up to 5.76 Mbps and QoS capabilities.


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