Monday, January 16, 2006

TeleCIS Secures $10 Million for WiMAX Chipsets

TeleCIS Wireless, a start-up based in Santa Clara, California, secured $10 million in Series C funding for its WiMAX fixed, portable and mobile broadband wireless chipset technology.

The funding will support the upcoming launch of the company's performance leading WiMAX Fixed/Portable subscriber device chip as well as the development of the second TeleCIS chip, a multi-protocol chipset combining 802.16e WiMAX Mobile and 802.11 WiFi protocols in a single chip. This design will deliver WiMAX Mobile, WiFi, MIMO and smart antenna functionality in a single chip.

The company's first chip, TCW 1620, is compliant with the 802.16-2004 WiMAX Fixed standard. The chip is designed for both fixed indoor consumer premises equipment as well as portable subscriber devices such as PC Cards and small form factor portable access products for laptops and PDAs. The chip delivers full nomadic portability within a WiMAX service area and provides broadband wireless consumers freedom from tethered connections.

  • TeleCIS Wireless is headed by Dr. Sam Endy, who previously served as President and CEO of ArrayComm. He previously was VP, Operations at Sprint, where he was responsible for the activation and operation of Sprint's 20,000-mile U.S. fiber network, 42 switching centers, and initiation of international service.

  • The founder of TeleCIS Wireless is Dr. Je Woo Kim, previously a professor at Pusan National University in Korea.

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