Thursday, September 20, 2018

Alibaba Cloud consolidates its no. 1 position in China

Presented this week at the Alibaba Group Investor Day conference.



Telia Carrier to offer Cloud Connect service in TierPoint's data centers

Telia Carrier will offer its Cloud Connect service across 25 TierPoint data centers in the U.S. across 14 metro areas, including Boston, Charlotte, Chicago, Connecticut, Dallas, Kansas City, Milwaukee,  Nashville, New York, Omaha, Philadelphia, Raleigh, St. Louis, and Seattle.

Telia Carrier’s Cloud Connect provides multiple, geographically diverse connections to the world’s largest cloud providers, including Microsoft, Amazon, Google and IBM.

Customers in TierPoint’s facilities will also benefit from access to Telia Carrier’s MEF 2.0 certified data center-to-data center Ethernet service, which connects to more than 150 Points-of-Presence worldwide.

“As enterprises continue to entrust their critical business processes to the cloud, direct and secure connectivity which bypasses the public internet becomes vital,” said Staffan Göjeryd, CEO, Telia Carrier. “In partnering with TierPoint, we’re able to bring enhanced global connectivity and our award winning customer care to many additional new locations, providing the quality of service and performance that enterprise customers expect. We’re really excited about expanding this relationship and in particular, the tangible benefits it will bring to TierPoint’s customers.”

“This new partnership with Telia Carrier is yet another key step in the process of expanding the connectivity options for clients using our data centers and cloud pods,” said TierPoint Chief Technology Officer Terry Morrison. “It further enhances our market-leading, edge-infrastructure solutions.”

  • Earlier this month, Telia Carrier announced the activation of a new PoP (Point-of-Presence) in Tokyo, Japan. Telia Carrier noted that recently there has been a significant increase in the amount of IP traffic moving through APAC, a region that loves its online gaming, rich Internet and video content. 

ECOC 2018: First COBO-compliant optical modules

The world’s first optical modules compliant with Consortium for On-Board Optics (COBO) will be shown at next week's ECOC Exhibition 2018 in Rome, Italy.

Specifically, COBO will present a showcase of solutions from Molex, Ciena and SENKO, TE Connectivity, Credo, and AOI.

A goal of COBO is to bring interoperable and interchangeable optical modules into the manufacturing of networking equipment to help address industry challenges, including continual traffic growth, the need for lower power consumption and the increasing speeds of networking technologies such as 400 Gigabit Ethernet.

“Next-generation technologies such as Artificial Intelligence, 5G, and the Internet of Things (IoT) are progressing at a rapid rate and all stand to benefit from equipment manufacturers’ adoption of on-board optics,” said Brad Booth, President of COBO. “The data produced by these applications needs to move efficiently and rapidly between devices and the demonstrations not only represent a significant step forward in achieving this through board-mounted optical modules but also a big step towards mass deployment of interoperable solutions.”

Some highlights:

  • Molex will display a COBO module-based reference layout board that includes high-density front panel Optical EMI shielding adapters, a blind-mate optical backplane interconnect and an on-card optical cabling featuring FlexPlane technology. The demo will highlight how system vendors can utilize Molex optical cable management technologies to integrate COBO on-board optical modules into next-generation system architectures.
  • Ciena and SENKO will show how low-profile face plate connector solutions can enhance the air flow capability and fiber management inside equipment, which will include the CS Connector, a new high-density solution, MPO PLUS Bayonet, and μ-LC that can create more space inside the equipment. In addition, two white papers will be available. The first looks at Data Center Interconnect traffic growth and how this drives the need for increased electrical high-speed signaling, best in-class layout and selection of printed circuit board laminate, where analysis is made of different material properties in the context of COBO applications and verification is made of the compliance to OIF CEI-56G-VSR-PAM4. The second study performs a thermal assessment including the coherent application in context to verify thermal capabilities of the COBO module for 14.4Tb/s capacity 1RU line card.
  • A 112Gbps demonstration will be performed jointly by TE Connectivity and Credo via a test set-up that provides a feasibility demonstration for future COBO applications using 100Gbps electrical lanes based on TE Connectivity’s channel and high-speed connector driven by Credo Semiconductor transceiver silicon.
  • AOI will exhibit a 400G 16 lane on-board optics device that can achieve 2km reach at 1310nm wavelength. It leverages the COBO form factor, electrical pin out and electrical connector specifications released earlier this year. AOI is taking advantage of the SiP technology for this compact device which has a highly integrated design for an on-board optics module.

COBO - Stand 608 at ECOC Exhibition 2018



Filmed at NetEvents 2018 in San Jose, California


A look at COBO and the drive for on-board optics


The Consortium for On-Board Optics (COBO) was formed three years ago to develop specifications to permit the use of board-mounted optical modules in the manufacturing of networking equipment, such as switches and even servers. The specifications will cover electrical interfaces, pin-outs, connectors, thermals, etc.  The idea is to drive the development of interchangeable and interoperable optical modules that can be mounted onto motherboards...



ECOC 2018: Acacia presents 600 Gbps per Wavelength Coherent Transmission

At the upcoming the European Conference on Optical Communications (ECOC) in Rome, Acacia Communications will demonstrate its AC1200 coherent module with dual-core design enabling 1.2 Tbps error-free transmission over fiber with 600 Gbps per wavelength.

The Acacia AC1200 module supports transmission capacity of up to 1.2 Tbps in a footprint that is 40 percent less than the size of the 5” x 7” modules that support transmission speeds of 400 Gbps today.

The module is based on Acacia’s Pico DSP ASIC, which utilizes two wavelengths that can be configured to support from 100 Gbps to 600 Gbps capacity each. The Acacia AC1200 supports a suite of advanced three-dimensional (3D) shaping features that may be optimized to enable performance approaching theoretical limits on a wide range of network configurations.

Acacia shipped its first AC1200 module customer samples in March 2018 and anticipates production to begin by the end of 2018.

Acacia said its high-capacity solution targets the requirements for connections between large data centers with reaches of 100km and above using standard single-mode fiber.

At ECOC, Acacia will also be leading various discussions on topics such as Digital Signal Processing (DSP), subsea communications and lab automation.

9:00 a.m. -12:30 p.m. – Christian Rasmussen, founder and vice president of digital signal processing and optics, will share his thoughts on the “Future scaling and capabilities of DSP algorithms” in the Coherent DSP in Optical Communications Workshop.

9:00 a.m. -12:30 p.m. – Timo Pfau, principal DSP engineer, will present on “What can DSP bring to optical access” in the DSP for Next Generation Optical Access Workshop.

9:00 a.m. -12:30 p.m. – Hongbin Zhang, principal DSP engineer, will present on the “Future of transponders for submarine transmission” in the Submarine Systems Workshop.

Tuesday, September 25

1:30 - 3:00 p.m. – BinBin Guan, optical engineer, will lead the Lab Automation Hackathon in which there will be eight demonstrations for various common lab automation tasks.

Wednesday, September 26

1:30 p.m. - Timo Pfau will present his invited paper titled, “High performance coherent ASIC” as part of the SC3 - Digital Signal Handling Techniques for Optical Communication Systems session.



ECOC 2018: Foxconn Interconnect Technology shows 400 Gbps interconnects

Foxconn Interconnect Technology (FIT) will showcase its latest 400 Gbps interconnect solutions in featured product and technology demonstrations at ECOC 2018.

Specifically, live traffic demonstrations will incorporate a selection of FIT's 400G QSFP-DD interconnect solutions that include various configurations of optics, cables, cages and connectors that combine to deliver 400 Gbps solutions.

"FIT is committed to the development of 400G PAM4 based products and technologies that will add to one of the broadest portfolios of transceivers, cages/connectors, and direct attach copper (DAC) on the market. The product and technology showcases that will take place at this year's ECOC demonstrate both our commitment to the QSFP-DD and OSFP MSA's, and our position as a market and technology leader," said Steve Shultis, Senior Director of Product Marketing at Foxconn Interconnect Technology.

In addition to contributing to the QSFP-DD and OSFP Multisource Agreements (MSAs), FIT is one of the founding promoters of both the 100G Lambda MSA supporting single-mode fiber optic links and the new 400G BiDi MSA supporting links over widely available and deployed parallel multimode links.

ECOC 2018: eSilicon to show 7nm 56G PAM4 long-reach SerDes

eSilicon plans to demonstrate the silicon performance of its 7nm 56G long-reach SerDes during ECOC 2018 (Anritsu booth #408).

eSilicon will show a periodic pattern generator (PPG)-to-chip live demo with different backplane reaches. Specifically, the demonstration will show 56G PAM4 data transfer running at 56Gb/s over two different BERTSCOPE channels with two different reaches, both driven by the Anritsu MP1900A Signal Quality Analyzer-R using a passive and an active PAM4 combiner. The demo with Anritsu is significant because it will show how it is possible to leverage TX finite impulse response (FIR) capabilities to increase performance and improve power figure of merit (FOM) and functionality. A key feature is high insertion loss tolerance with low bit-error rates to support increased bandwidth in legacy equipment.

“To obtain such reach and effectively stress the PAM4 SerDes receiver, it is very important to be able to generate an original extremely high-quality signal, and include equalization and stress tools for full control of the TX side. During the bring-up period, a flexible solution like Anritsu’s MP1900A is the best choice for an interoperability test,” said Anritsu EMEA Wireline Marketing Director Alessandro Messina.

ECOC 2018: Semtech exhibits CDR platform for 25G SFP28 SR modules and AOCs

At ECOC 2018, Semtech will highlight multiple products including its ClearEdge CDR platform for low-cost 25G SFP28 SR modules and Active Optical Cables.

Semtech will also feature its laser drivers, limiting amplifiers, ROSAs, signal conditioners, transceivers, and transimpedance amplifiers (TIAs).

Semtech supplies high-speed optical transceiver ICs and offers optical networking solutions that support multiple next-generation PAM4 and NRZ connectivity standards including Ethernet, PON, Optical Transport Network (OTN), Fibre Channel, and InfiniBand.

ECOC 2018: Go!Foton shows its latest fiber management hub

At ECOC 2018, Go!Foton will showcase the newest member of its line of "PEACOC" high-density fiber management solutions.

The new PEACOC Fiber Distribution Hub (FDH) is designed to be utilized beyond central offices and data centers.

“The PEACOC FDH reinvents the concept of OSP cable management, by providing open, front-side access to all of the operating assets including cabling, splices and optical components,” said Michael Zammit, VP and GM of Connectivity Solutions at Go!Foton.

It features Go!Foton's patented spreadable adapter technology, which improves technician access to small form factor connectors while providing superior fiber management and routing. By enabling this functional modularity, flexible cable management, and multiple mounting options, the Go!Foton FDH can be customized to meet the needs of any customer and deployment situation.

The high-density PEACOC FDH is available in both a hermetically sealed dome enclosure for underground use or a more traditional pole and wall mounted metallic enclosure. Providing options for either factory pre-stub cables or field fusion splicing of both the feeder and distribution cables, the PEACOC FDH leverages Go!Foton’s existing legacy in the manufacture of passive optical components. The solution can also be equipped with a wide assortment of PLC optical splitters without sacrificing easy access to both front and rear subscriber connections.

http://www.gofoton.com

ECOC 2018: InnoLight demos 400G QSFP-DD DR4

InnoLight Technology, which is based in Suzhou, China, will demonstrate a 400G QSFP-DD DR4 interoperating with 100G single lambda DR1 at ECOC 2018.

In addition, InnoLight will introduce its family of 400G optical transceivers, including 400G OSFP, 400G QSFP-DD and 100G QSFP28 single lambda optical products.

Innolight's current and upcoming products include: OSFP SR8, QSFP-DD SR8, QSFP28 DR1, OSFP 2XFR4, QSFP-DD DR4/DR4+, QSFP28 FR1, OSFP DR4/DR4+,  QSFP-DD FR4, SFP-DD AOC, OSFP FR4, QSFP-DD LR4, OSFP LR4.

"New applications such as digital reality, artificial intelligence, machine learning, and 5G wireless are driving the network traffic to an unprecedented level. Cloud operators need continuing innovation in optical solutions to support bandwidth demand. InnoLight's comprehensive family of 400G solutions will enable cloud operators to rapidly upgrade its networks from 100G to 400G.  InnoLight, with its advanced R&D capability, strong technology partnerships, state-of the-art manufacturing capability will continue to provide better solutions for the industry," said Osa Mok, Chief Marketing Officer of InnoLight Technology.

ECOC 2018: II-VI to show twin flexband 1xN WSS, OTDR

II-VI, a vertically integrated manufacturing company based in Saxonburg, Pennsylvania and offering optoelectronic products, plans to showcase its products for ROADM line cards and highly compact optical amplifier solutions tailored to enable high bit rate DWDM transceivers.

These will include:

  • The twin flexband 1xN WSS powered by the Gen-2 LightFlow(TM) switch engine with 12.5 GHz bandwidth granularity for next-generation coherent long haul and metro networks. 
  • The dual port pluggable Optical Time Domain Reflectometer (OTDR) for embedded network monitoring applications in carrier and data center networks. 
  • The 3-pin micro-pump and 8-pin mini-DIL pump lasers now available at 400 mW and 500 mW respectively, to enable next-generation coherent transceivers.
  • II-VI's product showcase includes one of the industry's broadest and most vertically integrated portfolios of products for ROADM line cards and highly compact optical amplifier solutions tailored to enable high bit rate DWDM transceivers.



Wednesday, September 19, 2018

SENDATE completes multivendor SDN trial with Coriant and ADVA

SENDATE, the Celtic-Plus flagship project for secure networking of data centers in Europe, completed a multi-vendor SDN field trial featuring real-time planning of transparent high-speed services across a disaggregated, multi-domain optical network.

The SENDATE trial was conducted in the Telia Company R&D lab in Stockholm with live connectivity to production network fibers, the multi-vendor, multi-domain trial included participation from optical networking and SDN solution suppliers and research partners, including ADVA, Coriant, highstreet technologies, VPIphotonics, and the RISE Research Institutes of Sweden.

The trial demonstrated end-to-end wavelength service activation between disaggregated transponders spanning SDN-enabled ADVA and Coriant optical domains.



Use cases tested during the trial included dynamic optical reach planning using open APIs and SDN-enabled 100G and 200G alien wavelength provisioning across multi-vendor optical domains. The successful interworking leveraged an extension of the standardized ONF T-API interface significantly enhanced and extended with optical impairment capabilities for automated network planning. The SDN controller was based on OpenDaylight with an integrated photonic planning app running as a micro-service.

More information on the field trial will be presented at the ECOC exhibition on 24-26 September in Rome, Italy. Visit the VPIphotonics booth 302.

SENDATE participants said the trial showcased the critical role that standards-based SDN interworking and integrated planning play in simplifying operations and reducing end-to-end provisioning times in multi-domain, disaggregated optical networks.

“As new high-bandwidth end-user applications drive increased demand for photonic layer connectivity, service providers face the real-world challenge of provisioning across multi-vendor optical networks. Today these networks are operated as separate domains involving proprietary and mostly offline planning,” said Mauro Costa, Director Network and Infra Architecture, Telia Company. “An open and integrated approach to multi-domain service planning helps solve this challenge. In combination with SDN-based orchestration of multi-vendor transport elements, including open line systems, integrated and real-time service planning paves the way for a more agile and automated optical infrastructure capable of meeting stringent performance demands of new services, including 5G.”

SENDATE, Secure Networking for a Data Centre Cloud in Europe, is a 70 million euro public-private partnership project comprising 83 companies, research organizations, and universities from Germany, France, Finland, and Sweden.

https://www.celticplus.eu/celtic-plus-project-sendate-simplifies-operations-of-open-optical-networks/

Multi-terabit INDIGO subsea cable lands in Perth

The new INDIGO cable system (previously known as APX West & Central) has landed in Perth, Australia.

The INDIGO cable system will span approximately 9,000 km between Singapore and Perth, Australia, and onwards to Sydney. The system will land at existing facilities in Singapore, Australia and Indonesia, providing connections between Singapore and Jakarta.

The consortium project is backed by  AARNet, Google, Indosat Ooredoo, Singtel, SubPartners and Telstra.

The system will feature a two-fibre pair 'open cable' design and spectrum- sharing technology. This design will allow consortium members to share ownership of spectrum resources provided by the cable and allow them to independently leverage technology advances and implement future upgrades as required.

Utilising coherent optical technology, each of the two fibre pairs will provide a minimum capacity of 18 Tbit/s, with the option to further increase this capacity in the future.

In April 2007, the consortium selected Alcatel Submarine Networks (ASN) for the construction of a new subsea cable system.



Nuage frames SD-WAN 2.0 around automation and security

Nokia's Nuage Networks said it is moving ahead to the next phase of software-defined wide are networking.

Nuage Networks' SD-WAN 2.0 offering is its architecture for delivering and orchestrating enterprise IT services across data centers, public cloud services, SaaS provider clouds and enterprise branch sites. The company says the latest release of its  Virtualized Network Services (VNS) platform embodies this architecture with new automation and security capabilities for helping enterprises to connect not only branch and regional sites, but also to their private data centers, SaaS providers and public clouds.

Sunil Khandekar, founder and CEO of Nuage Networks, says: "The industry is on the cusp of a big shift towards SD-WAN. Today, Nuage solidifies its SD-WAN 2.0 leadership, adding key features to improve the security and manageability of VNS, and further reinforces our founding vision to connect enterprise users to their applications without boundaries. Unlike other vendors that either have basic connectivity solutions, use proprietary hardware or need to cobble together multiple platforms to address enterprise IT needs, we purposefully developed our VNS offer on a single platform to give our customers a powerful, seamless and consistent set of capabilities across the entire network. By offering IT services over SD-WAN and combining them with Nuage's core strengths in large scale networking and operational capabilities, Nuage Networks VNS establishes itself as the industry's first and foremost SD-WAN 2.0 platform."

New security capabilities include end-to-end microsegmentation, as well as the ability to detect threats and respond in real-time. This protects against malicious unauthorized access. Administrators can monitor all network communication across and within a branch to identify anomalies and violations of policies. The system generates automated actions by creating security rules in real-time based on real-time events and patterns.

Nuage Networks SD-WAN 2.0 also provides enterprises flexible infrastructure to deploy value-added services, whether locally through hosting 3rd party VNFs on an x86 uCPE or service-chained in the data center or cloud, ending the complexity of installing and remotely managing dedicated purpose-built customer premises equipment or single-function appliances.

Talari debuts "Cloud Connect" SD-WAN

Talari Networks introduced its new "Cloud Connect" solution for hybrid multi-cloud enterprise networks. 

The company says its multi-tenant Cloud Connect platform ensures MPLS-class reliability and Quality of Experience (QoE) when accessing multiple SaaS and public cloud services. The cloud-first approach aims to deliver the same reliability benefits of Talari’s failsafe SD-WAN site-to-site connectivity while bringing cost savings and independence from proprietary carrier lock-in.

Talari’s solution enables cost-effective and efficient high QOE connectivity to Software as a Service (SaaS), Unified Communications as a Service (UCaaS), cloud service gateways, and managed Network as a Service (NaaS) offerings through a new high-availability connection called a Cloud Conduit.  Underlying the immediate commercial appeal of the Talari Cloud Connect solution, Talari is announcing the support of several leading UCaaS, NaaS and Cloud Service providers (CSPs).  Partners including RingCentral, Evolve IP, Pure IP, Meta Networks and Mode are the first to offer Cloud Connect support.

“Prior to working with RingCentral and Talari, our firm’s cloud services were dependent on separate and expensive dedicated circuits for messaging, voice, video, meetings, and conferencing,” said Jason Kasch, CIO at Structural Group. “The addition of Talari’s new Cloud Connect solution within Ring Central’s Unified Communication offering helps boost service reliability while simplifying cloud management and network troubleshooting.”

“Talari’s customers are heavily invested in complex cloud business applications to securely power everyday operations reliably and at scale,” said Patrick Sweeney, CEO at Talari Networks. “Talari Cloud Connect ensures secure, reliable, predictable access to SaaS and cloud-based network services, without enterprises being forced to bear the burden and complexity of deploying and managing SD-WAN infrastructure in the cloud. Cloud Connect helps enterprises and their cloud services providers deliver full multi-link visibility, reliability and bi-directional QoS while accessing cloud/SaaS-based apps.”

https://www.talari.com/press_release/talari-cloud-connect-leapfrogs-sd-wan-competition/

OE Solutions expands 25Gbps portfolio with designs for 5G fronthaul

OE Solutions introduced two industrial-temperature rated 25Gbps SFP28 transceiver products for access applications, including for 5G fronthaul.

“OE Solutions specializes in carefully tailored transceiver solutions to meet the many and often challenging requirements of access networks. Fiber and spectrum scarcity have been constant drivers for bi-directional transceivers and we now see interest in alternative WDM solutions in the O-band, including LAN-WDM as well as custom wavelengths, as a way to increase fiber capacity,” said Per Hansen, VP Marketing & Sales of OE Solutions. “We have been a leading supplier of specialized transceiver solutions for wireless fronthaul since OE Solutions’ formation 15 years ago. Deployment of the next generation wireless, 5G will surely be as exciting for OE Solutions as the first one.”

The new 25Gbps transceivers joining OE Solutions’ extensive list of IT-rated transceivers for access applications are:
  • 25Gbps SFP28 LAN-WDM Duplex ER-lite IT for distances up to 30km
  • 25Gbps SFP28 1270nm/1330nm BIDI LR IT for distances up to 10km
These transceivers will be generally available in Q3 2018.

Other members of the industrial-temperature rated 25G portfolio include:
  • 25Gbps SFP28 CWDM Duplex LR IT for distances up to 10km
  • 25Gbps SFP28 1270nm/1310nm BIDI ER-lite IT for distances up to 30km
  • 25Gbps SFP28 1310nm Duplex LR IT for distances up to 10km
OE Solutions will be showing its portfolio at next week's ECOC in Rome, Italy. Booth #250.

OE Solutions introduces Packet over SONET Smart SFP

OE Solutions introduced a Smart SFP transceiver for 2.5 Gbps Packet over SONET/SDH.

The new SFP+ transceiver can be used to connect routers and switches across SONET/SDH networks, without the need for a dedicated interface card.

The company says that by inserting its plug-and-play Smart SFP in a free 10GbE port, any router or packet switch can be upgraded to support 2.5 Gbps Packet over SONET/SDH, saving power, space and cost. Additionally, it provides extra flexibility, as any number of SFP+ ports can be upgraded to provide a SONET/SDH network interface. The new Packet over SONET Smart SFP is currently in field trials and will be available during Q4 2018.

OE Solutions already has a rich portfolio of Smart SFP solutions for TDM over Packet, that allows customers, ranging from large network equipment manufacturers to small city carriers, to deploy new services on their network or to solve problems which could not be easily solved before, by using the Smart SFPs.

“Our innovative Smart SFPs are opening up new markets and applications. Our partnership with AimValley leverages our optical expertise and their network technology expertise to build unique products that solve real network problems for the operators”, said Y.K. Park, CEO of OE Solutions.

OE Solutions will be showing its Packet over SONET Smart SFP at next week's ECOC in Rome, Italy.Booth #250.

https://oesolutions.com

Oclaro to showcase laser portfolio at ECOC 2018

At next week's ECOC Exhibition in Rome, Italy, Oclaro will showcase its full suite of high-speed lasers for access and wireless networks.

Designed to meet the high-performance and rigorous environmental conditions of access deployments, these

The line-up includes:

  • A 25 Gbps uncooled Industrial-temperature (I-temp) rated Direct Modulated DFB laser (DML) chip. The 25 Gbps uncooled DML chip is capable of operating at high temperature up to 95C, which means that transceiver suppliers will not have to mount an expensive, power-hungry thermoelectric cooler inside. In addition, the high bandwidth of the Oclaro DML chip enables 50 Gbps PAM4 waveforms to be obtained with 5 dB Extinction Ratio and TDECQ values of less than 2.0dB. These features enable the laser to operate in 50GbE transceivers such as SFP56 or QSFP28.
  • A 10 Gbps high-power I-temp DML laser chip. that is designed for carriers currently upgrading the data rate to 10 Gbps as per the new XGS-PON/10GE-PON standards. By enhancing its DML waveguide design, Oclaro has been able to deliver a 10 Gbps high-power 1270nm DML chip for ONU equipment for XGS-PON/10GE-PON. Key differentiators of this laser chip are its high optical output power (15mW at 95C) and high bandwidth (more than 15GHz).
  • New electro-absorption modulated (EML) lasers that also service data center applications. Oclaro's EML designs are capable of high-speed operation for 100 Gbps PAM4 using an extremely high-bandwidth modulator. Oclaro EMLs have passed the rigorous damp heat operating and storage requirements of GR-468, making them an attractive option for coolerless operation over typical data center temperature ranges. 
Oclaro said it has recently expanded its production capacity by investing in new wafer fab equipment in its Japan and UK production facilities. The expansion will meet growing customer demand for these lasers and in anticipation of the future ramp of 5G optical links.

"Network upgrades to the current access infrastructure will require a new generation of low-cost, robust, and high-speed lasers that can withstand the rigorous requirements demanded by deployments in outdoor enclosures and uncontrolled temperature nodes," said Walter Jankovic, President of Oclaro's Optical Connectivity Business Unit. "Oclaro has designed its lasers specifically to deliver a higher level of performance over wide operating temperature ranges and support critical features such as PAM4 modulation. These lasers are expected to be critical components to support the introduction of 5G wireless networks by enabling customers to upgrade their wireless fronthaul links from 10 Gbps to 25 Gbps to 50 Gbps."

Oclaro's 25 Gbps uncooled DML chip I-temp, 10 Gbps high power DML LD chip I-temp, and EMLs are all currently in mass production.

Cadence intros deep neural-network accelerator AI processor IP

Cadence Design Systems introduced its deep neural-network accelerator (DNA) AI processor intellectual property for developers of articial intelligence semiconductors for use in applications spanning autonomous vehicles (AVs), ADAS, surveillance, robotics, drones, augmented reality (AR)/virtual reality (VR), smartphones, smart home and IoT.

The Cadence Tensilica DNA 100 Processor IP targets high performance and power efficiency across a full range of compute from 0.5 TeraMAC (TMAC) to 100s of TMACs. The company said processors based on this IP could deliver up to 4.7X better performance and up to 2.3X more performance per watt compared to other solutions with similar multiplier-accumulator (MAC) array sizes. Compatibility with the latest version of the Tensilica Neural Network Compiler enables support for advanced AI frameworks including Caffe, TensorFlow, TensorFlow Lite, and a broad spectrum of neural networks including convolution and recurrent networks. This makes the DNA 100 processor an ideal candidate for on-device inferencing for vision, speech, radar, lidar and co

“The applications for AI processors are growing rapidly, but running the latest neural network models can strain available power budgets,” said Mike Demler, senior analyst at the Linley Group. “Meeting the demands for AI capabilities in devices ranging from small, battery-operated IoT sensors to self-driving cars will require more efficient architectures. The innovative sparse compute engine in Cadence’s new Tensilica DNA 100 processor addresses these limitations and packs a lot of performance for any power budget.”


See also