Wednesday, December 2, 2020

OIF's 2020 Transport SDN API Interoperability Demo

OIF completed a multi-vendor 2020 Transport SDN Application Programming Interface (API) interoperability demonstration aimed at validating the benefits of transport SDN for the 5G era.

The ten-week long interoperability testing exercise, which was held in Telefonica’s Madrid lab, focused on SDN-based programmability, control and automation — testing Layer 1 and Layer 0 OTN control using ONF T-API 2.1.3, with additional testing of OpenConfig device APIs for transport equipment in network-operator-defined use cases.

Participating vendors included ADVA, Ciena, Cisco Systems, Infinera and Nokia. Network operator Telefonica hosted the demo. China Telecom, Telia and TELUS participated as consulting network operators.

“Operators have demanded more open optical networks to enable flexibility, lower costs, and best-of-breed options,” said Scott Wilkinson, Lead Analyst at Cignal AI. “Standard management interfaces and multi-vendor interoperability are critical to open optical networks. The interoperability demonstration recently performed under the guidance of the OIF is a major step towards achieving those operator goals.”

“The successful completion of the OIF 2020 Transport SDN API interoperability demonstration is a significant milestone toward widespread SDN deployment in production networks,” said Arturo Mayoral, Telefónica Transport Global CTIO Unit – Technology Expert and Lead of Optical SDN strategy. “By aligning vendors for a shared purpose – interoperability – and testing multiple use cases, we’re fostering manageability and flexibility in the network to allow deployment of cloud-based services, meet dynamic bandwidth demands and accelerate transport network transformation for the 5G era.”

The results of the multi-vendor demonstration will be revealed during a public read-out webinar event being held in partnership with Lightwave, Tuesday 12 January 2021, 6:00-7:30am PST. Register for free here

A private read-out event for demo participants and invited Network Operators is scheduled for Tuesday 19 January 2021.

OIF representatives will give presentations on the current status of the 2020 OIF Transport SDN API Interoperability Demonstration during the below events:

  • NGON & DCI World Digital Symposium – Friday 04 December 2020 – 20:00-20:15pm CET, OIF Speaker: Arturo Mayoral López de Lerma, Telefonica S.A
  • ECOC – Monday 07 December 2020 – 17:20-17:40pm CET, OIF Speaker: Arturo Mayoral López de Lerma, Telefonica S.A

https://www.oiforum.com/technical-work/2020-oif-transport-sdn-api-interoperability-demo/


2020 Transport SDN Application Programming Interface (API) Interoperability Demonstration PR Boilerplate:

Inphi debuts its next-gen 400G DR4 silicon photonics platform

Inphi has begun sampling its next-generation 400G DR4 silicon photonics platform solution, which includes a silicon photonics integrated circuit (PIC), a flip chip transimpedance amplifier (TIA), and an analog controller.

The new 400G DR silicon photonics platform is designed to work seamlessly with Inphi’s Porrima PAM4 Digital Signal Processor (DSP).

400G DR silicon photonics platform highlights:

  • Analog controller IC which replaces multiple discrete components for laser bias, configuration and monitoring of silicon photonics, and TIA control 
  • Inphi’s complete silicon photonics transceiver with four low-loss, transmit Mach-Zehnder modulators and four high-responsivity, receive photodiodes
  • Low-power, flip chip TIA with excellent sensitivity, overload, and error floor
  • Inphi’s Porrima Gen3 low-power, PAM4 DSP with integrated 56Gbaud laser driver 

Inphi said it is bringing its high volume silicon wafer scale manufacturing by offering the option to purchase Inphi-designed high-performance 400G DR4 PICs in full 200-mm wafer form. Customers receive silicon PIC wafers direct from an Inphi fab partner and will be able to continue with high-volume wafer scale manufacturing and 3-D heterogenous integration in their own factories. 


“Inphi has been the leading force to define and create a PAM4 ecosystem of optical modules for cloud and data center networks,” said Dr. Loi Nguyen, Founder and SVP, Optical Interconnect at Inphi. “I believe today’s announcement will mark the beginning of a new era of the ‘fabless optics’ industry. Optical transceiver manufacturers can leverage silicon high volume wafer scale in the manufacturing of transceivers without owning a fab.”

http://www.inphi.com

Ayar Labs hits key milestone for chip-to-chip optical connectivity

 Ayar Labs demonstrated its patented monolithic electronic/photonic solution on Globalfoundries' next-gen photonics solution based on its 45nm platform. 

The companies said this industry-first demonstration is a key milestone in providing chip-to-chip optical connectivity at scale. The two companies began working together in 2015 with a commitment to collaborate and commercialize differentiated silicon photonics solutions for greenfield applications that would require extreme bandwidth density (high data throughput in a small physical package) at low latency and high energy efficiency.

“Ayar Labs has been perfecting our micro-ring based monolithic electronic/photonic solution for nearly a decade. But the true commercial potential is realized when coupled with a 300mm semiconductor fabrication process that delivers the performance, reliability, and cost advantages that we and our customers require,” says Charles Wuischpard, CEO, Ayar Labs. “This is yet another industry-first result that solidifies our leadership for this market opportunity.”

“Ayar Labs is an important partner of GLOBALFOUNDRIES,” says Anthony Yu, Vice President of Silicon Photonics at GF. “As collaborators, we’ve incorporated their requirements for PDK and process optimizations while providing early access to our next-generation process. Together, we will unlock a larger market opportunity and realize chip-to-chip optical I/O solutions that will enable higher bandwidth and faster connection for high performance compute applications.”

Over the last 18 months, Ayar Labs has been working with select semiconductor manufacturers, systems builders, and end users on co-design partnerships. The company is now announcing an expanded sampling program of its next-generation chiplet developed on GF’s latest silicon photonics manufacturing process that will be available to a broader group by request at ayarlabs.com/starterkit/

Dr. Mark Wade, President and CTO of Ayar Labs, will be sharing details of this industry first demonstration at ECOC 2020 as part of his presentation on ‘Silicon photonic chiplets for chip-to-chip communications’ on Tuesday, December 8, from 16:20 – 16:40 (CET). A video of the demonstration will also be made available at this time.

http://www.ayarlabs.com

Lockheed Martin Ventures invests in Ayar Labs

Lockheed Martin Ventures has made a strategic investment in Ayar Labs, a start-up that is developing  monolithic in-package optical I/O (MIPO) solution for applications that require high bandwidth, low latency and power efficient short reach interconnects. Financial terms were not disclosed.

Ayar Labs publicly demonstrated its monolithic electronic photonic TeraPHY chiplet at the Supercomputing 2019 conference and is now working with select semiconductor manufacturers, OEM systems builders, and end users on sampling and co-design partnerships in 2020. The company is based in Santa Clara, California.

“We are excited to welcome Lockheed Martin Ventures as a strategic investor,” said Charles Wuischpard, CEO of Ayar Labs. “Working with key system integrators like Lockheed Martin, who really understand the value of our solution and how to design it into future complex systems, is incredibly important. In that sense, we view this relationship as more than funding alone, but as an important long-term working relationship as well.”

Ayar Labs selected for Intel’s DARPA PIPES Project

Ayar Labs has been selected as Intel’s optical I/O solution partner for their recently awarded DARPA PIPES (Photonics in Package for Extreme Scalability) project.

The PIPES project aims to develop integrated optical I/O solutions co-packaged with next generation FPGA/CPU/GPU and accelerators in Multi-Chip Packages (MCP) to provide extreme data rates (input/output) at ultra-low power over much longer distances than supported by current technology. In the first phase of the project, the Ayar Labs TeraPHY chiplet will be co-packaged with an Intel FPGA using the AIB (Advanced Interconnect Bus) interface and Intel’s EMIB silicon-bridge packaging. “We’re seeing an explosion of Datacenter workloads that have an insatiable demand for bandwidth and the need to connect devices at rack-scale distances,” said Vince Hu, VP of Strategy and Innovation for Intel’s FPGA products. “The best way to do that is with optical interconnect and by using an Ayar Labs chiplet(s), we can achieve very high bandwidth at low latency and low power consumption.”

“Bringing optical connectivity all the way into the CPU/SOC package has long been one of the ‘Holy Grail’ projects in High Performance and Hyperscale Computing, as it unleashes the performance of ever more powerful computing and network processors and removes a major bottleneck and set of constraints in systems architecture and design,” said Charles Wuischpard, CEO of Ayar Labs, “Moreover, the energy consumed in moving data through a system is now very significant and growing, and the best way to manage that is to move the data optically from end to end. We are pleased to be selected by Intel as the optical solution for their DARPA PIPES project and look forward to a multi-year collaboration.”

The TeraPHY chiplet is manufactured on GLOBALFOUNDRIES' 45nm platform, which enabled Ayar Labs to build a monolithic, single-die solution that integrates both electrical and optical photonic circuits and devices on a single chip.

“We have worked in close collaboration with Ayar Labs to deliver a new class of integrated electronic, photonics solutions,” said Anthony Yu, vice president of Computing and Wired Infrastructure at GF. “Going forward, we’re excited to work with the pioneers at Ayar Labs to continue disrupting the market by combining our next generation 45nm platform, targeted to future CMOS-based photonics solutions, with their differentiated technology that will push the limits of chip communication bandwidth for high-performance computing, cloud and AI applications.”

NeoPhotonics' Class 60 coherent modulators/receivers for 100+ Gbaud

 NeoPhotonics announced the addition of Class 60 versions of its Coherent Driver-Modulator (CDM) and Intradyne Coherent Receiver (Micro-ICR) to its suite of High Bandwidth Coherent components, addressing the next generation of 100+ Gbaud systems to meet the ongoing growth in demand for bandwidth, especially between cloud data centers. 

These new Class 60 Coherent components extend the highest speed over distance performance of NeoPhotonics' existing Class 50 products by increasing the 3 dB bandwidth from 50 GHz to 60 GHz. The Class 60 suite improves on the currently shipping Class 40 components, and allows increasing symbol rates from the current 64+ Gbaud rate to the higher 100+ Gbaud rates. These NeoPhotonics components work together to enable customers to implement single wavelength data transmission near one Terabit per second over datacenter interconnect (DCI) distances, and long-haul 400~500Gbps transmission.

Higher symbol rates increase data capacity while maintaining superior optical signal to noise ratio (OSNR) and reach performance, thereby enabling the highest speed over distance use. These new components are available in compact form factor packages suitable for use in pluggable modules and compact daughter cards. NeoPhotonics Class 60 CDM and Micro-ICR are mechanically compatible to their Class 40 counterparts, and are a natural upgrade path for achieving the higher symbol rates (100+ Gbaud) in order to support 800Gbps and above data rates per wavelength applications.

The Class 60 suite comprises:

  • Class 60 CDM: NeoPhotonics Class 60, polarization multiplexed, coherent driver modulator (CDM) features a co-packaged InP modulator with four linear, high bandwidth, differential drivers, and is designed for low V-Pi, low insertion loss and a high extinction ratio. The compact package is designed to be compliant with the form factor of the OIF Implementation Agreement #OIF-HB-CDM-01.0.
  • Class 60 Micro-ICR: NeoPhotonics Class 60 High Bandwidth Micro-Intradyne Coherent Receiver (Micro-ICR) is designed for 100+ Gbaud symbol rates, more than tripling the rate of standard 100G ICRs. The compact package is designed to be compliant with the OIF Implementation Agreement OIF-DPC-MRX-02.0.

These components are designed to work together with NeoPhotonics “Nano” ultra-narrow linewidth external cavity tunable laser, which cuts the size approximately in half compared to current Micro-ITLAs, while featuring industry leading linewidth and low phase noise with low electrical power consumption.

“NeoPhotonics has supported our customers by being first to volume production of our products at each new speed node. We are pleased to now offer Class 60 coherent modulators and receivers, which along with our ultra-narrow linewidth external cavity “nano” tunable laser, provide a complete suite of components enabling customers to increase the data rate per wavelength to one Terabit and beyond,” said Tim Jenks, Chairman and CEO of NeoPhotonics. “We are continuing to extend the bandwidth of our Indium Phosphide coherent integration platform to serve the highest speed over distance applications,” concluded Mr. Jenks.

https://www.neophotonics.com/press-releases/?newsId=12071

Advanced Material Solutions for Co-Packaged Optics - replay

The thermal properties of optical components become key considerations as power, processing, and utilization increase with faster data rates. For future optical components, several advanced materials are being considered. 

Our guests for this webinar are:

Dr. Peter Johnson, Staff Scientist at SABIC, who discusses thermoplastic optical integration in co-packaged applications. Dr. Johnson obtained his Ph.D in Chemistry at the University of Colorado, Boulder.

Dr. Jake Joo , who leads the  Optoelectronics group at Dupont. His presentation covers the high-speed data challenges for co-packaged optics, and the critical materials needed for next-gen data centers, including polymer waveguides, low-loss dialectic materials, index management materials, thermal management materials, etc. Dr. Joo obtained his PhD.D. in Materials Science and Engineering from MIT.

This is the third in a series of webinars sponsored by Dupont’s Silicon Valley Tech Center and the Consortium for On-board Optics (COBO).

https://youtu.be/f2-y6qnMbRA

Viavi introduces test tool for last mile fiber deployment

Viavi Solutions introduced a new type of network test tool to speed and simplify last mile optical fiber activation and maintenance. 

The versatile VIAVI Optimeter combines the functionality of a broadband or GPON/XG(S)-PON power meter with fiber certification and connector inspection in a simple, all-in-one solution for effortless FTTx certification and troubleshooting — regardless of field technicians' experience level. The Optimeter was designed to reduce truck rolls and trouble tickets by proving successful fiber install passes, or providing clear fault ownership information to stop unnecessary handoffs.

"Pressure to meet demand for new PON/FTTH service often leads to minimal testing or even no testing. As a result, technicians are not able to complete install and activation on the first visit between 20 to 50% of the time, leading to poor customer experiences and lost revenue," said Kevin Oliver, Vice President and General Manager, Converged Instruments and Virtual Test, VIAVI. "As service activation failure rates and maintenance costs continue to rise, the VIAVI Optimeter is a critical tool for premise and home techs to make sure that last mile fiber installation is done right the first time, improving deployment success rates and reducing the need for return visits."

Vodafone Business announces AWS Wavelength edge service in London

Vodafone Business is the first company in Europe to enable an AWS Wavelength service for distributed Multi-access Edge Computing (MEC).

In collaboration with AWS, Vodafone Business’ distributed MEC service will be rolled out from the spring of 2021, starting with the first commercial centre in London, and with other locations in the UK and Germany to follow. 

The commercial MEC centre in London will provide an ultra-low latency zone over a wide area and make use of Vodafone’s 5G network in the capital. In addition to areas within and around London, the low latency zone will extend to Cambridge, Oxford, Birmingham, Bristol, and Cardiff, as well as many towns home to tech firms along the M4 motorway corridor and parts of Wales and Cornwall.

Vodafone Chief Technology Officer, Johan Wibergh, said: “Every millisecond matters in digitalising manufacturing, safeguarding citizens and workers, transporting medical supplies by drone or eliminating motion sickness when wearing a VR headset. Putting these services much closer to the customer with Vodafone’s Edge Computing service will significantly reduce any delay in transmitting critical services. By opening up new innovation hubs within our 5G network, which currently spans 127 cities and nine markets in Europe, we can help turn new business ideas into commercial successes.”

Tuesday, December 1, 2020

AWS pursues Local Zones strategy to cut latency

 AWS announced the availability of Local Zones in Boston, Houston, and Miami to serve latency-sensitive and throughput-sensitive workloads. The first AWS Local Zone was previously opened in Los Angeles. AWS has now announced plans to open an additional 12 Local Zones in 2021 in Atlanta, Chicago, Dallas, Denver, Kansas City, Las Vegas, Minneapolis, New York, Philadelphia, Phoenix, Portland, and Seattle.

Currently, AWS spans 77 Availability Zones within 24 geographic regions around the world, with announced plans for 15 more Availability Zones and five more AWS Regions in India, Indonesia, Japan, Spain, and Switzerland. AWS Regions are composed of Availability Zones, which each comprise of one or more data centers and are located in separate and distinct geographic locations with enough distance to significantly reduce the risk of a single event impacting business continuity, yet near enough to provide low latency for high-availability applications. Each Availability Zone has independent power, cooling, and physical security and is connected via redundant, ultra-low-latency networking. 


AWS Local Zones, which are managed and supported by AWS, are designed to support ultra-low latency applications. AWS Local Zones provide customers a high-bandwidth, secure connection between their local workloads and those running in the closest AWS Region. Customers can use the same AWS APIs and tools to run latency-sensitive workloads nearby to end-users, while seamlessly connecting to the full range of services in the AWS Region.

AWS says the vast majority of customers get the necessary performance for their applications in public AWS Regions, however, its Local Zone options will be better for applications such as remote real-time gaming, machine learning inference, and live video streaming. Previously, developers had to build and run these low latency application components with a different set of APIs and tools than the other parts of their applications running in AWS. 

In Southern California, AWS reports single-digit latency to end-users located in the Southern California area.

“Whether your organization has been all-in on the cloud since day one or is just beginning to move workloads to the cloud, all customers want to optimize for price performance,” said Dave Brown, Vice President, EC2, AWS. “As customers bring more and more workloads to the cloud, AWS continues to expand the industry’s leading compute portfolio to meet their increasingly diverse needs. With the new EC2 instance types, AWS Outposts and AWS Local Zones options we’re introducing today, we’re providing customers with an unmatched breadth and depth of capabilities to help them innovate more cost-effectively, with the right compute for the right job.”

https://aws.amazon.com/about-aws/global-infrastructure/localzones


Verizon 5G Edge with AWS Wavelength now available in eight cities

Verizon has activated its 5G Edge with AWS Wavelength service in Las Vegas, its eighth mobile edge computing location.  

Verizon and AWS announced their partnership at AWS re:Invent in 2019 and have since launched mobile edge computing (MEC) capabilities in Atlanta, the San Francisco Bay Area, Boston, Dallas, Las Vegas, Miami, New York and Washington, DC, with plans to add two additional cities by year end.


Verizon 5G Edge with AWS Wavelength is optimized for applications that require ultra-low latency and responsiveness enabled by 5G. 

“By leveraging the powerful combination of Verizon 5G Edge and AWS Wavelength, developers can deliver a wide range of transformative, latency-sensitive use cases like automated robotic systems in manufacturing facilities and smart cars and cities,” said Tami Erwin, CEO of Verizon Business. “We already have customers today creating exciting new applications in industries ranging from healthcare to sports and we can’t wait to see the next game-changing app that will be built on 5G and MEC.”

AWS also confirmed plans to launch AWS Wavelength with KDDI in Tokyo, SK Telecom in Daejeon (Korea), and Vodafone in London.

Measuring the latency of AWS Wavelength on Verizon 5G

AvidThink recently performed a series of basic throughput and latency tests on AWS Wavelength on Verizon’s network: 

In this video, Roy Chua, founder and principal of AvidThink, and Jim Carroll, Editor of Converge! Network Digest, discuss the test methodology and results. A key takeaway: application developers need to determine their workload placement strategy based on the location of nearby EC2 regions and available Wavelength sites.

https://youtu.be/09QHGHoMEjc


Aqua Comms activates AEC-2 transatlantic cable

Aqua Comms activated AEC-2 (America Europe Connect-2), the company’s second Trans-Atlantic subsea cable system and complementing its existing AEC-1 (America Europe Connect-1) cable, which went Ready for Service in 2016. 

AEC-2 connects New Jersey, U.S.A to Denmark, and is a wholly diverse and resilient new Trans-Atlantic subsea route, doubling fibre connectivity between North America and Denmark making it the first new subsea system directly linking North America to Denmark and the Nordic region in twenty years. AEC-2 leaves North America from NJFX, a carrier-neutral cable landing station and Tier 3 colocation facility in New Jersey, providing the option to bypass New York City and a route that offers complete diversity from existing Trans-Atlantic cables.

AEC-2 offers wavelength services ranging from 10G, 100G and 400G. It was designed for complete redundancy and diversity to support key data centre connectivity routes across the North Atlantic. These include connecting key US locations such as Ashburn, VA and 165 Halsey Street in New Jersey to Copenhagen in Denmark and the wider Nordic region as well as critical existing locations throughout Europe including Amsterdam, Frankfurt and Hamburg.  

“As part of Aqua Comms’ expansion in the North Atlantic and across the globe, we are delighted to launch our second Trans-Atlantic cable, AEC-2, providing a new and diverse route that supports the critical data centre markets in the US and Northern Europe,” comments Nigel Bayliff, Chief Executive Officer of Aqua Comms. “Data traffic continues to grow exponentially and we are looking forward to delivering industry-leading services to our customers over this new cable system.” 

AEC-2 forms part of the North Atlantic Loop, that along with two new cables planned to go RFS in early 2021, will form a resilient, ring-based subsea infrastructure link between the East Coast of the United States, Ireland, the UK and the Nordics. 

http://www.aquacomms.com

Aqua Comm's AEC-2 subsea cable to tie into Interxion Copenhagen

Aqua Comms will interconnect its America Europe Connect-2 (AEC-2) subsea cable system at Interxion’s data center in Copenhagen.

AEC-2 is Aqua Comms’s portion of the Havfrue subsea cable project, connecting New Jersey, U.S.A., to Ireland, and Denmark. The America Europe Connect-2 cable is scheduled to land in Blaabjerg, near Esbjerg in September 2019 and will be the first new cable connecting Denmark to the U.S. in nearly two decades.

Aqua Comms supplies fiber pairs, spectrum and capacity networking solutions to the global media, content and carrier markets.

“The large number of networks and content platforms present at Interxion’s Copenhagen campus makes it an efficient location for AEC-2 to interconnect with our target customers,” said Nigel Bayliff, CEO of Aqua Comms. “The investment Interxion is making to develop its campus in Copenhagen aligns with the growth in demand we are seeing for highly resilient network capacity between northern Europe and the U.S”.

AEC-2 will complement Aqua Comms’ existing transatlantic cable, AEC-1, and deliver on its vision of creating a “North Atlantic Loop”, a resilient dual-path network across the Atlantic. This will be further enhanced by North Sea Connect (NSC) from Denmark to the UK and Celtix-Connect-2 (CC-2) as a second Irish Sea cable crossing from the UK to Ireland, both of which will follow shortly after AEC-2.

“The AEC-1 subsea cable already extends to the Interxion facility in Dublin, so we are pleased to expand our collaboration with Aqua Comms on this new cable into Denmark,” said Peder Bank, Managing Director of Interxion, Nordics. “Our community of customers greatly value international capacity on diverse, modern and resilient routes which is exactly what the ring topology of the North Atlantic Loop provides. The system further strengthens Interxion’s position as the main Gateway to the Nordic Region”.

AEC-2 is scheduled to go live in the fourth quarter of 2019 and will more than double fiber connectivity to Denmark from the US, increasing the diversity and reliability of the Internet to the region. Aqua Comms investment in subsea cables to northern Europe complements Interxion’s increased investments in its Nordic data centers in Copenhagen and Stockholm.

HAVFRUE subsea cable to link NJ and Denmark with 108 Tbps capacity

TE SubCom will serve as the system supplier for HAFVRUE, a new subsea cable that will link New Jersey to the Jutland Peninsula of Denmark with a branch landing in County Mayo, Ireland. Optional branch extensions to Northern and Southern Norway are also included in the design.

The HAVFRU system will be owned and operated by multiple parties, including Aqua Comms, Bulk Infrastructure, Facebook, and others. Aqua Comms, the Irish cable owner/operator and carriers’ carrier, will serve as the system operator and landing party in U.S.A., Ireland, and Denmark. Bulk Infrastructure of Norway will be the owner and landing party for the Norwegian branch options.

The HAFVRUE subsea cable system will be optimized for coherent transmission and will offer a cross-sectional cable capacity of 108Tbps, scalable to higher capacities utilizing future generation SLTE technology. SubCom will incorporate their Wavelength Selective Switching Reconfigurable Optical Add Drop Multiplexer (WSS-ROADM) for flexible wavelength allocation over the system design life. It is the first new cable system in almost two decades that will traverse the North Atlantic to connect mainland Northern Europe to the U.S.A.

HAVFRUE is the Danish word for mermaid.

Preparation work is underway and system ready-for-service (RFS) is expected in Q4 2019.

“The HAVFRUE cable will provide state-of-the-art connectivity for increasing needs of users, ranging from individual consumers to businesses and the research community. SubCom is proud to be selected as the supplier for this project,” said Sanjay Chowbey, president of TE SubCom.

Qualcomm's Snapdragon 888 brings 3rd gen 5G modem, 6th gen processor

Qualcomm previewed its new flagship - the Snapdragon 888 - featuring its 3rd generation X60 5G Modem-RF System with global band coverage and a 6th generation AI Engine operating at an astonishing 26 tera operations per second (TOPS).

The 5G modem operates in mmWave and sub-6 across all major bands worldwide, and it brings support for 5G carrier aggregation, global multi-SIM, stand alone, non-stand alone, and Dynamic Spectrum Sharing.

The new 6th generation Qualcomm AI Engine features completely re-engineered Qualcomm Hexagon processor that improves performance and power efficiency.

“Creating premium experiences takes a relentless focus on innovation. It takes long term commitment, even in the face of immense uncertainty,” said Cristiano Amon, president, Qualcomm Incorporated. “It takes an organization that’s focused on tomorrow, to continue to deliver the technologies that redefine premium experiences.”



https://www.qualcomm.com/news/releases/2020/12/01/qualcomm-redefines-premium-snapdragon-tech-summit-digital-2020


Salesforce's $27.7B acquisition of Slack brings enterprise communications tools


Salesforce agreed to acquire Slack in a deal valued at approximately $27.7 billion ($26.79 in cash and 0.0776 shares of Salesforce common stock for each Slack share).

Slack’s enterprise communications platform integrates with more than 2,400 apps that people use to collaborate, communicate and get work done. 

The companies plan to integrate Slack's enterprise communication tools into every Salesforce Cloud. This will make Slack into the new interface for Salesforce Customer 360.

"Stewart and his team have built one of the most beloved platforms in enterprise software history, with an incredible ecosystem around it,” said Marc Benioff, Chair and CEO, Salesforce. “This is a match made in heaven. Together, Salesforce and Slack will shape the future of enterprise software and transform the way everyone works in the all-digital, work-from-anywhere world. I’m thrilled to welcome Slack to the Salesforce Ohana once the transaction closes.”

“Salesforce started the cloud revolution, and two decades later, we are still tapping into all the possibilities it offers to transform the way we work. The opportunity we see together is massive,” said Stewart Butterfield, Slack CEO and Co-Founder. “As software plays a more and more critical role in the performance of every organization, we share a vision of reduced complexity, increased power and flexibility, and ultimately a greater degree of alignment and organizational agility. Personally, I believe this is the most strategic combination in the history of software, and I can’t wait to get going.”


SSE Enterprise Telecoms selects Infinera’s XTM for UK expansion

SSE Enterprise Telecoms, one of the UK’s leading connectivity providers, has selected Infinera’s XTM Series for the second phase of its UK-wide network expansion. 

SSE Enterprise Telecoms operates a 20,000km private telecoms network and 15 data centres that span the UK and offers a range of connectivity solutions including leading edge SD-WAN, Ethernet, Optical and dark fibre services.


With Infinera’s XTM Series, SSE Enterprise Telecoms leverages an industry-leading optical solution optimized for 5G transport with high-performance synchronization capabilities and low latency. The network’s Layer 2 packet optical aggregation features also provide enterprise customers with high-bandwidth connectivity services over the same network. These benefits extend across SSE Enterprise Telecoms’ network, which upon completion will span over 30,000 km. 

“This network expansion with Infinera’s XTM Series is key to our UK initiative as it enables new technologies including the IIoT and autonomous vehicles, as well as opening the door to new business technologies such as seamless, instant video streaming and immersive virtual and augmented reality,” said Dave Eddy, COO, SSE Enterprise Telecoms. “Infinera’s XTM solution provided the high performance, scalability, and flexibility required to meet our network needs.”

“The UK market’s bandwidth is growing exponentially, and SSE Enterprise Telecoms is poised to meet this growing demand as it more than doubles its number of connected exchanges,” said Nick Walden, Senior Vice President, Sales at Infinera. “We are proud to be a part of SSE Enterprise Telecoms’ network expansion as it ushers the era of 5G with the unique capabilities of Infinera’s XTM.”

AWS to deploy Intel's Gaudi AI accelerators in EC2 instances

AWS will begin offering EC2 instances with up to eight of Intel's Habana Gaudi accelerators for machine learning workloads.

Gaudi accelerators are specifically designed for training deep learning models for workloads that include natural language processing, object detection and machine learning training, classification, recommendation and personalization.

“We are proud that AWS has chosen Habana Gaudi processors for its forthcoming EC2 training instances. The Habana team looks forward to our continued collaboration with AWS to deliver on a roadmap that will provide customers with continuity and advances over time,” states David Dahan, chief executive officer at Habana Labs, an Intel Company.

ntel acquires Habana Labs for $2 billion - AI chipset

Intel has acquired Habana Labs, an Israel-based developer of programmable deep learning accelerators for the data center, for approximately $2 billion.

Habana’s Gaudi AI Training Processor is currently sampling with select hyperscale customers. Large-node training systems based on Gaudi are expected to deliver up to a 4x increase in throughput versus systems built with the equivalent number of GPUs. Gaudi is designed for efficient and flexible system scale-up and scale-out.

Additionally, Habana’s Goya AI Inference Processor, which is commercially available, has demonstrated excellent inference performance including throughput and real-time latency in a highly competitive power envelope. Gaudi for training and Goya for inference offer a rich, easy-to-program development environment to help customers deploy and differentiate their solutions as AI workloads continue to evolve with growing demands on compute, memory and connectivity.

Habana will remain an independent business unit and will continue to be led by its current management team. Habana will report to Intel’s Data Platforms Group, home to Intel’s broad portfolio of data center class AI technologies.

“This acquisition advances our AI strategy, which is to provide customers with solutions to fit every performance need – from the intelligent edge to the data center,” said Navin Shenoy, executive vice president and general manager of the Data Platforms Group at Intel. “More specifically, Habana turbo-charges our AI offerings for the data center with a high-performance training processor family and a standards-based programming environment to address evolving AI workloads.”

Habana Labs chairman Avigdor Willenz will serve as a senior adviser to the business unit as well as to Intel Corporation after Intel’s purchase of Habana.

“We have been fortunate to get to know and collaborate with Intel given its investment in Habana, and we’re thrilled to be officially joining the team,” said David Dahan, CEO of Habana. “Intel has created a world-class AI team and capability. We are excited to partner with Intel to accelerate and scale our business. Together, we will deliver our customers more AI innovation, faster.”


Interview: Habana Labs targets AI processors



Habana Labs, a start-up based in Israel with offices in Silicon Valley, emerged from stealth to unveil its first AI processor. Habana's deep learning inference processor, named Goya, is >2 orders of magnitude better in throughput & power than commonly deployed CPUs, according to the company. The company will offer a PCIe 4.0 card that incorporates a single Goya HL-1000 processor and designed to accelerate various AI inferencing workloads,...



HPE returns to pre-pandemic levels of $7.2 billion, relocates to Texas

 Hewlett Packard Enterprise Co. (HPE) reported revenue of $7.2 billion for the 4th quarter of its fiscal year, up 6% from the prior quarter and flat from the prior-year period. GAAP was $0.12, above the previously provided outlook of $0.02 to $0.06 per share. Non-GAAP was $0.37, above the previously provided outlook of $0.32 to $0.36 per share.

“Hewlett Packard Enterprise finished the year with a very strong performance,” said Antonio Neri, president and CEO of Hewlett Packard Enterprise. “In Q4 we saw a notable rebound in our overall revenue, with particular acceleration in key growth areas of our business.”

“The global pandemic has forced businesses to rethink everything from remote work and collaboration to business continuity and data insight,” he continued. “Over the last several months, customers have increasingly turned to HPE for our unique capabilities from edge to cloud that help them empower their workforces, deploy resilient new IT solutions and extract insights from critical data, while consuming these solutions more flexibly as a service.”


HPE also announced plans to relocate its headquarters from San Jose, California, to Houston, Texas. 

Highlights:

  • Intelligent Edge revenue was $786 million, up 6% year over year or 5% when adjusted for currency, with 10.1% operating profit margin, compared to 6.2% from the prior-year period. Revenue grew 15% sequentially or 14% when adjusted for currency. Intelligent Edge best-in-class portfolio was recognized as a leader for the 15th year in the Gartner Magic Quadrant for wired and WLAN access infrastructure. The Company also expects to take share in both campus switching and WLAN.
  • High Performance Compute & Mission Critical Systems (HPC & MCS) revenue was $975 million, up 25% year over year, with 12.2% operating profit margin, compared to 10.2% from the prior-year period. Revenue grew 50% sequentially driven by strong performance in Cray, HPC-Apollo and MCS.
  • Compute revenue was $3.2 billion, down 5% year over year or down 4% when adjusted for currency, with 6.1% operating profit margin, compared to 13.9% from the prior-year period. Revenue was down 6% sequentially or 7% when adjusted for currency but was up low single-digits when adjusted for backlog conversion.
  • Storage revenue was $1.2 billion, down 3% year over year, with 16.7% operating profit margin, compared to 17.4% from the prior-year period. Revenue grew 8% sequentially or 7% when adjusted for currency driven by strong operational execution, reduction of backlog and momentum in key areas of the portfolio.
  • Advisory & Professional Services (A&PS) revenue was $245 million, down 9% year over year or 10% when adjusted for currency, with (0.4%) operating profit margin, compared to 0.4% from the prior-year period. Revenue was up 8% sequentially or 6% when adjusted for currency even as COVID-19 impacted consulting activities and chargeability levels of our team members. A&PS is a strategic business that pulls through significant infrastructure and operational services sales.
  • Financial Services revenue was $849 million, down 3% year over year or 4% when adjusted for currency. 

ADTRAN expands its access routing portfolio

ADTRAN introduced two access routers for fiber-based IP connectivity to the enterprise.

The NetVanta 3148 and 4148 expand on ADTRAN’s suite of NetVanta access routers by combining routing and switching capabilities for both copper and fiber into VoIP-ready platforms. Routing performance and eSBC capacity vary among the new routers, providing flexible and scalable options for managed service providers and their customers. The NetVanta 3148 supports up to 500Mbps of routing performance and up to 300 eSBC calls, while the NetVanta 4148 supports a full Gigabit and up to 1,000 eSBC calls.

“ADTRAN’s enterprise and SMB solutions have a long heritage and highly-diversified customer base, which built a solid foundation for our latest expansion to the NetVanta portfolio,” said Brian Lenahan, Product Line Manager of Enterprise Subscriber Solutions at ADTRAN. “The new options we developed address the growing bandwidth demands on the enterprise network and help managed service providers apply the right solution to build the best network for each of their customers.”

http://www.adtran.com

Monday, November 30, 2020

2020 Next-Gen SD-WAN and SASE Series Overview

In this SD-WAN and SASE overview video, we present the concise thoughts of the industry's thought leaders including Sunil Khandekar, General Manager/Founder of Nuage Networks from Nokia; Rupesh Chokshi, Vice President of AT&T Cybersecurity; Jeff Aaron, VP of Enterprise Marketing at Juniper Networks; Mick Higgins, SVP of Product at Asavie, now part of Akamai; Marc Halbfinger, CEO of PCCW Global; and Craig Connors, VP and CTO of SD-WAN at VMware.

https://youtu.be/D3n_vIYDFSA

Our new showcase site also features a complimentary 2020 Next-Gen SD-WAN and SASE Report from AvidThink examining current enterprise viewpoints and service provider trends. We look at the rapidly changing vendor ecosystem and provide observations of the market to help enterprises chart a safe SD-WAN and SASE course in 2021. 

Ericsson: Mobile network data traffic up 50% from 3Q19 to 3Q20

Mobile network data traffic grew 50 percent between Q3 2019 and Q3 2020, according to the newly updated Ericsson Mobility Report.

A second key finding is that current 5G uptake in subscriptions and population coverage confirms 5G as deploying the fastest of any generation of mobile connectivity. Ericsson estimates that by the end of this year, more than 1 billion people – 15 percent of the world’s population – will live in an area that has 5G coverage rolled out. The company has raised its year-end 2020 estimate for global 5G subscriptions to 220 million, thanks largely to rapid uptake in China, reaching 11 percent of its mobile subscription base. 

Fredrik Jejdling, Executive Vice President and Head of Networks, Ericsson, says: “This year has seen society take a big leap towards digitalization. The pandemic has highlighted the impact connectivity has on our lives and has acted as a catalyst for rapid change, which is also clearly visible in this latest edition of the Ericsson Mobility Report.

Additional highlights:

  • In 2026, 60 percent of the world’s population will have access to 5G coverage, with 5G subscriptions forecast to reach 3.5 billion.
  • North America is expected to end the year with about 4 percent of its mobile subscriptions being 5G. Commercialization is now moving at a rapid pace and by 2026, Ericsson forecasts that 80 percent of North American mobile subscriptions will be 5G, the highest level of any region in the world.
  • Europe will end the year with about 1 percent 5G subscriptions in the region. During the year, some countries delayed auctions of the radio spectrum needed to support 5G deployment.
  • The rate of introducing 5G New Radio (NR) functionality is increasing, with more than 150 5G device models launched commercially. Many devices support 5G Frequency Division Duplex (FDD) and dynamic spectrum sharing (DSS). The first 5G standalone (SA) networks have been launched in Asia and North America, as well as the first devices capable of NR carrier aggregation.
  • The number of service providers offering fixed wireless access (FWA) is on the rise. Almost two-thirds of service providers now have an FWA offering. FWA connections are forecast to grow more than threefold and reach more than 180 million by the end of 2026, accounting for about a quarter of total mobile network data traffic.

https://www.ericsson.com/4adc87/assets/local/mobility-report/documents/2020/november-2020-ericsson-mobility-report.pdf

SK Telecom designs its own AI chip

SK Telecom unveiled its own artificial intelligence (AI) chip and announced plans to enter the AI semiconductor business.

The South Korean telecoms operator said its new "SAPEON X220" chip is optimized for processing large amounts of data in parallel. Its deep learning computation speed is 6.7 kilo-_frames per second, which is 1.5 times faster than that of Graphics Processing Units (GPUs) for inference that are being widely used by AI-service companies. At the same time, it uses 20% less power than GPU by consuming 60 watts of energy and is about half the price of a GPU.

SKT plans to use the chip for its own AI-powered services, including for voice recognition. The aim is to generate synergies by combining AI semiconductor chips and 5G edge cloud. 

SAPEON X220 will also be utilized by SKT’s affiliate companies. For instance, ADT Caps will apply the chip to enhance the performance of its AI-based video monitoring service named T View. In addition, SAPEON X220 will be applied to the cloud server of the next-generation media platform of Cast.era, a joint venture of SKT and Sinclair Broadcast Group.

SKT also announced a plan to enter the AI as a Service (AIaaS) business. It will offer a complete solution package as a service by combining its AI chip and AI software, including diverse AI algorithms for features like content recommendation, voice recognition, video recognition and media upscaling, along with Application Programming Interfaces (APIs).

https://www.sktelecom.com/en/press/press_detail.do?page.page=1&idx=1492&page.type=all&page.keyword=