Showing posts with label Standards. Show all posts
Showing posts with label Standards. Show all posts

Tuesday, October 31, 2017

100G Lambda MSA looks for new wavelength spec

A new 100G Lambda Multi-Source Agreement (MSA) Group is aiming to develop specifications based on 100 Gbps per wavelength optical technology.

Founding members of the group include Alibaba, Arista Networks, Broadcom, Ciena, Cisco, Finisar, Foxconn Interconnect Technology, Inphi, Intel, Juniper Networks, Lumentum, Luxtera, MACOM, MaxLinear, Microsoft, Molex, NeoPhotonics, Nokia, Oclaro, Semtech, Source Photonics, and Sumitomo Electric.

The new interfaces defined by the 100G Lambda MSA double the speed per wavelength for 100 Gbps and 400 Gbps applications.

The group said it aims to complement the 100 Gbps (100GBASE-DR) and 400 Gbps (400GBASE-DR4) 500 m reach interfaces currently being defined by IEEE P802.3.  Its work focuses on reaches of 2 km and 10 km over duplex single-mode fiber.

http://100glambda.com/

Monday, September 18, 2017

New double density SFP pluggable spec nears completion

The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group, which is backed by leading vendors, has released an initial hardware specification for an SFP-DD pluggable interface.

Founding members of the group include Alibaba, Broadcom, Brocade, Cisco, Dell EMC, Finisar, Hewlett Packard Enterprise, Huawei, Intel, Juniper Networks, Lumentum, Mellanox Technologies, Molex, and TE Connectivity.

The SFP-DD goal is to standardize a high-density, pluggable form factor interface that builds on the existing SFP pluggable form factor by leveraging an additional 2 rows of electrical contacts for double the lane density and data speed in next-generation networking equipment. The new spec will support up to 3.5 W optical modules in an enterprise environment.

SFP-DD key features include

  • A single port SMT connector and cage
  • Heat sink options for thermal management flexibility
  • Module mechanical definition
  • Support for optical and copper interfaces, with physical layer specifications to be determined outside the scope of the SFP-DD MSA
SFP-DD key benefits include

  • Support for up to 3.5 W for optical modules
  • Enables two channels of high-speed electrical interfaces connecting to host
  • Backward compatibility to all current SFP style interfaces
  • Developed by industry consortium to enable multi-vendor interoperability

http://sfp-dd.com/

Wednesday, August 23, 2017

IEEE P7130 to define Quantum Computing nomenclature

A new IEEE P7130—Standard for Quantum Computing Definitions project aims to establish a general nomenclature for Quantum Computing to standardize communication with related hardware and software projects.

Specifically, IEEE P7130 will define terms related to the physics of quantum computing including quantum tunneling, super position, quantum entanglement, as well as other related terms and terminology that will be updated as technological advances are made.

"While Quantum Computing is poised for significant growth and advancement, the emergent industry is currently fragmented and lacks a common communications framework,” said Whurley (William Hurley), chair, IEEE Quantum Computing Working Group. “IEEE P7130 marks an important milestone in the development of Quantum Computing by building consensus on a nomenclature that will bring the benefits of standardization, reduce confusion, and foster a more broadly accepted understanding for all stakeholders involved in advancing technology and solutions in the space.”

"IBM is part of quantum information's history, since its foundation more than 30 years ago. And we've been championing important terms, metrics, and scientific methods ever since," said Jerry Chow, manager, Experimental Quantum Computing, IBM Research and IEEE P7130 working group participant. "This standards project will help anyone from students to seasoned quantum scientists nucleate around a common language, while keeping up with the field's rapid pace of change, and further accelerate pioneering experiments and explorations in quantum computing."

"1QBit works with a variety of classical, quantum and otherwise non-standard processors, which necessitates communication between multiple external teams, across a wide range of industries, discussing many different types of computing systems,” said Andrew Fursman, CEO 1Qbit and IEEE P7130 working group participant. “IEEE P7130 "Standard for Quantum Computing Definitions" provides a valuable service to 1QBit, our partners in quantum computing, and the many industries with which we intersect."

“Confusions exist on what quantum computing or a quantum computer means,” added Professor Hidetoshi Nishimori of the Tokyo Institute of Technology and IEEE P7130 working group participant. “This partly originates in the existence of a few different models of quantum computing. It is urgently necessary to define each key word.”

https://standards.ieee.org/develop/wg/QCWG.html

Thursday, August 10, 2017

Nokia Bell Labs to lead 5G NGPaaS platform project

Nokia Bell Labs will lead a consortium of vendors, operators, IT companies, small and medium-sized enterprises and European academic institutions in the development over the next 2 years of the Next Generation Platform-as-a-Service (NGPaaS) for the 5G era.

The NGPaaS consortium is part of the 5G Infrastructure Public-Private Partnership (5G-PPP), launched in 2014 as an initiative between the European Union and telecoms industry.

Nokia noted that the cloud is transforming many industries and services, leading to the need for innovations to be cloud-native in order to be successful, which necessitates the adoption of a model beyond the current telco Infrastructure-as-a-Service (IaaS): a Platform-as-a-service (PaaS) model.

Such a 5G cloud-native platform needs to offer two key features:

1.         To facilitate building, shipping and running of virtual network function (VNF) applications with telco-grade quality in terms of latency, reliability and capacity, in line with the requirements of 5G performance.
2.         The ability to combine all types of third-party applications with those VNFs to create more versatile and powerful cloud objects and break down silos between connectivity (for people, robots and sensors) and computing (machine learning, big data and video applications).

The NGPaaS consortium's goal is to enable adoption of the PaaS model to optimally support cloud-native 5G systems.

Industry and academic members of the consortium include: Nokia Bell Labs France; Nokia; ATOS (Spain); BT (UK); Orange (France); Virtual Open Systems (France); Vertical M2M (France); B-COM (France); ONAPP (UK); the University of Milano-Bicocca (Italy); Danmarks Tekniske Universitet (DTU); and IMEC (Belgium).

Nokia Bell Labs has been a key player in 5G research and industry collaboration, and views PaaS as an essential platform for service providers seeking to leverage the carrier cloud as they evolve their networks. In addition to leading the NGPaaS consortium, Nokia Bell Labs is also cooperating with academic partners and is participating in events such as ICC, MWC, OpenStack Summit and OPNFV to support efforts to achieve this goal.


New Automotive Edge Computing Consortium Gets Underway

A new Automotive Edge Computing Consortium is being organized with a mission to develop an ecosystem for connected cars to support emerging services such as intelligent driving, the creation of maps with real-time data and driving assistance based on cloud computing.

Founding members include DENSO, Ericsson, Intel, Nippon Telegraph and Telephone Corporation (NTT), NTT DOCOMO, Toyota InfoTechnology Center Co., and Toyota Motor Corp.

The organizers said thet plan focus on increasing network capacity to accommodate automotive big data in a reasonable fashion between vehicles and the cloud by means of edge computing and more efficient network design.

The consortium will define requirements and develop use cases for emerging mobile devices with a particular focus on the automotive industry, bringing them to standards bodies, industry consortiums and solution providers. The consortium will also encourage the development of best practices for the distributed and layered computing approach recommended by the members.

https://www.ericsson.com/en/news/2017/8/consortium-for-automotive-big-data


Thursday, July 13, 2017

SFP-DD MSA to define 2x 25/56 Gbit/s interface Spec

The SFP-DD Multi-Source Agreement (MSA) Group has announced plans to develop the specification for a high-speed, double-density small form-factor pluggable (SFP-DD) interface.

Under the MSA, participating companies will address the technical challenges of delivering a double-density SFP interface and ensuring mechanical interoperability for module components produced by different manufacturers. New SFP-DD-based networking equipment will be designed to support legacy SFP modules and cables, as well as the new double density products.

Specifically, the MSA group will develop operating parameters, signal transmission speed goals and protocols for the SFP-DD interface, which expands on the existing SFP pluggable form factor electrical interface as widely adopted in data centres and other networking platforms. It was noted that multi-vendor SFP modules and assemblies are available for a range of data rate speeds and reaches for data transmission applications such as hubs, switches, routers and servers.

The current SFP interface single electrical lane operates up to 25 Gbit/s NRZ or 56 Gbit/s PAM4; the new SFP-DD electrical interfaces will be designed to support 2 lanes operating at up to 25 Gbit/s NRZ or 56 Gbit/s PAM4 per lane, thereby enabling solutions with up to 50 or 112 Gbit/s PAM4 aggregate bandwidth.

By doubling the lane density and data speed of SFP transceivers, the SFP-DD specification will help address increased port density and scalability requirements in next-generation applications, with a focus on the server side interconnect. An SFP-DD server port, combined with QSFP-DD switch ports, can enable an overall doubling of the port density in network applications.


  • Founding members of the SFP-DD MSA group include Alibaba, Broadcom, Brocade, Cisco, Dell EMC, Finisar, Hewlett Packard Enterprise (HPE), Huawei, Intel, Juniper Networks, Lumentum, Mellanox Technologies, Molex and TE Connectivity.

Friday, March 31, 2017

IEEE 802.3bv amendment Addresses 1 GBE over Plastic

The IEEE has announced the publication of the new IEEE 802.3bv, Standard for Ethernet amendment: Physical layer specifications and management parameters for 1,000 Mbit/s operation over plastic optical fibre.

The new IEEE 802.3bv standard amendment is intended to address growing demand for high-speed Ethernet connectivity solutions for automotive, industrial and home networking, and leverages the ability of plastic optical fibre to meet the requirements of these applications where long link lengths are not involved.

The IEEE noted that automotive and industrial networks are increasingly migrating towards the use of Ethernet technology, with plastic optical fibre already being used in automobiles and other vehicles. The IEEE 802.3bv standard is designed to provide a reliable media option for Ethernet automotive networks, and also offers an alternative transmission medium applicable for harsh, electrically noisy environments such as industrial automation islands.

The non-conductive cable construction and simple installation properties enabled by plastic optical fibre are also being utilised by telecom providers to enhance Ethernet-based home networks for wireless network access based on IEEE 802.11 (WiFi) devices.

IEEE recently announced the approval of New Ethernet Applications, an IEEE-SA Industry Connections (IC) Program established to identify and address standards development requirements to support the broader utilisation of IEEE 802.3 standards across a range of industries.

The organisation noted that with emerging, non-traditional applications creating demand for new IEEE 802.3 standards, it ahs expanded the scope of the IEEE 802.3 Industry Connections Next Generation Enterprise, Data-Center, Campus (NG-ECDC) activity. Therefore the IEEE 802.3 New Ethernet Applications Industry Connections (NEA-IC) activity has been formed to cover applications outside data centre, campus and enterprise environments.

As part of this effort, study groups and standards development activities have been launched to address industrial and automotive applications, including the IEEE P802.3cg, Physical layer specifications and management parameters for 10 Mbit/s operation over single balanced twisted-pair cabling and IEEE P802.3 Multi-gig automotive Ethernet PHY study group, as well as application for networking management protocols such as the IEEE P802.3cf, Yang data model definitions task force.

http://www.ieee.org

Monday, March 13, 2017

New QSFP-DD MSA Targets 400G

The Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi Source Agreement (MSA) group has released a specification for the new QSFP-DD form factor, which is a next generation high-density, high-speed pluggable module with a QSFP28 compatible double-density interface. QSFP-DD pluggable modules can quadruple the bandwidth of networking equipment while remaining backwards compatible with existing QSFP form factors used across Ethernet, Fibre Channel and InfiniBand for 40 Gbps and 100 Gbps network applications.

Specifically, the new QSFP-DD form factor expands the standard QSFP four-lane interface by adding a row of contacts providing for an eight-lane electrical interface, each operating up to 25 Gbps with Non-Return-to-Zero (NRZ) modulation or 50 Gbps with Pulse Amplitude Modulation (PAM4). This adaptation allows the QSFP-DD form factor to address solutions up to 400 Gbps aggregate per QSFP-DD port, while providing backward compatibility to 40 Gbps and 100 Gbps. A single switch slot can support up to 36 QSFP-DD modules providing up to 14.4 Tbps aggregate capacity. With an advanced thermal design, the new QSFP-DD solution can support modules up to 12W, providing significant system design flexibility.

In total, 52 companies came together in support of the QSFP-DD MSA to address the industry need for high-density, high-speed networking solutions.

QSFP-DD MSA founder-promoters include Broadcom, Brocade, Cisco, Corning, Finisar, Foxconn Interconnect Technology, Huawei, Intel, Juniper Networks, Lumentum, Luxtera, Mellanox Technologies, Molex, Oclaro, and TE Connectivity.

Contributors include Amphenol, Applied Optoelectronics, APRESIA Systems, Celestica, Ciena, ColorChip, Dell EMC, Delta, Fujitsu Optical Components, Genesis, H3C, Innovium, Inphi, Ixia, Kaiam, LEONI, Lorom, Luxshare, MACOM, MaxLinear, MultiLane, NeoPhotonics, Nokia, Panduit, PHY-SI, Ranovus, Samtec, Senko, Semtech, Sicoya, Siemon, Skorpios Technologies, Source Photonics, Spirent, Sumitomo Electric, Xilinx, and Yamaichi Electronics.

http://www.qsfp-dd.com/

Thursday, February 2, 2017

OIF Approves Polarized Multiplexed Quadrature Modulator for 400G

The Optical Internetworking Forum (OIF) approved an Implementation Agreement (IA) for an optical integrated Polarization Multiplexed (PM) quadrature modulator for coherent applications with nominal symbol rates up to 64GBaud. The agreement supports the 16QAM modulation format for 400G applications.

“As we go to higher data rates, we need higher performing optical components that maintain a reasonable level of complexity,” said Karl Gass of Qorvo and the OIF’s PLL Working Group – Optical Vice Chair. “These components are targeted for 400G applications. RF bandwidth is the highest priority for this project.”

The forum members also started the CEI-112G in MCM project to support interconnect within Multi-Chip-Modules (MCMs). In addition to the CEI-112G-VSR specification that is being developed, there is a need to support high rate interconnect amongst large logic devices as well as to small driver devices within an MCM.

Members have also started a maintenance project to produce amendments to the User Network Interface (UNI) 2.0 and External Network to Network Interface (E-NNI) 2.0 specification documenting the extensions for support of OTN rates higher than 100G. Adding these extensions to UNI 2.0 and E-NNI 2.0 will facilitate vendor interoperability. The project seeks to assist the IETF as it develops the required routing and signaling extension by providing a description of the Byond100G data-plane and the operations to be controlled by GMPLS.

http://www.oiforum.com

Monday, January 30, 2017

25 Gigabit Ethernet Consortium Completes 25G/50G Plugfest

The 25 Gigabit Ethernet Consortium announced record participation in, and successful completion of, the first 25G and 50G Ethernet plugfest.

The plugfest, which was held at the University of New Hampshire InterOperability Laboratory (UNH-IOL) in Durham, New Hampshire, provided a forum where consortium members could collaborate and ensure interoperability of feature sets and configurability between their products. Sixteen companies attended the week-long event with a wide variety of test scenarios including auto-negotiation and stressed conditions. The testing demonstrated a high degree of multi-vendor interoperability and specification conformance.

The plugfest was highlighted by the following activities:

  • Interoperability between vendors including adapters, switches, test and measurement devices, and interconnects
  • Proving advanced infrastructure connectivity
  • Plug and play multi-vendor compatibility
  • Successful auto-negotiation
  • Support for both forward and backward compatibility

“In order to handle the increasing amount of data, server architectures all too often require multiple 10G ports. 25G Ethernet arrives just in time and has started its climb towards dominance as the leading server-to-ToR switch interconnect. As this transition occurs, plugfests assure users that 25G and greater speeds from different vendors will perform as advertised with solid plug-and-play interoperability,” said Vittal Balasubramanian, chair of the 25G/50G Ethernet Interop Committee and Principal Signal Integrity Engineer at Dell.

“Due to the success of this interoperability test event, the steering committee of the consortium has decided to make its specification available to the public,” stated Brad Booth, chair of the 25G Ethernet Consortium. “The consortium is looking forward to future events to evaluate interoperability between the consortium specification and IEEE Std. 802.3by™-2016.”

http://www.25gethernet.org

Wednesday, December 7, 2016

OIF Begins Work on Two FlexE Projects

The Optical Internetworking Forum has started work on two new FlexE projects.

“The datacenter and communications industries are demanding a solution for flexible deployment and provisioning of Ethernet bandwidth,” said Scott Irwin of MoSys and the OIF’s Physical and Link Layer (PLL) Working Group protocol vice chair. “Building on its first generation of FlexE, the OIF has started a new project to support the next generation of Ethernet PHY rates currently under development within the IEEE 802.3 Working Group. Because of the large industry interest in FlexE, the OIF is also hosting a workshop on the topic which allows non-members to learn about the work first hand.”

The FlexE 1.0 implementation agreement, completed in March of this year, provides a mechanism to map one or more FlexE clients over a group of 100 Gb/s Ethernet PHYs. The client rates supported are 10G, 40G, and n×25G. The new FlexE 2.0 project will add the ability to create FlexE groups of 200 Gb/s and 400 Gb/s Ethernet PHYs and to consider several other feature additions.

FlexE 1.0 and ongoing revision enable 802.1 LLDP over management channels for FlexE Connectivity Verification. However, FlexE capabilities discovery is still required to facilitate the setup of FlexE Group(s) and Clients. The new FlexE Neighbor Discovery project will introduce some OIF organizational specific FlexE Extension to LLDP for FlexE capabilities discovery.

The OIF will host a workshop titled, FlexE Today and Tomorrow, in San Jose on January 20th.

http://www.oiforum.com/oif-announces-new-flex-ethernet-projects-and-workshop/

Bluetooth 5 Ready for Action - More Speed, Range

The Bluetooth Special Interest Group (SIG) officially adopted Bluetooth 5 as the latest version of the Bluetooth core specification, bringing longer range, faster speed, and larger broadcast message capacity, as well as improved interoperability and coexistence with other wireless technologies.

Key feature updates include four times range while maintaining the same power requirements, two times speed (upto 2 Mbps), and eight times broadcast message capacity. Longer range powers whole home and building coverage, for more robust and reliable connections. Higher speed enables more responsive, high-performance devices. Increased broadcast message size increases the data sent for improved and more context relevant solutions.

Bluetooth 5 also includes updates that help reduce potential interference with other wireless technologies to ensure Bluetooth devices can coexist within the increasingly complex global IoT environment. Bluetooth 5 delivers all of this while maintaining its low-energy functionality and flexibility for developers to meet the needs of their device or application.

“Bluetooth is revolutionizing how people experience the IoT. Bluetooth 5 continues to drive this revolution by delivering reliable IoT connections and mobilizing the adoption of beacons, which in turn will decrease connection barriers and enable a seamless IoT experience,” said Mark Powell, executive director of the Bluetooth SIG. “This means whole-home and building coverage, as well as new use cases for outdoor, industrial, and commercial applications will be a reality. With the launch of Bluetooth 5, we continue to evolve to meet the needs of IoT developers and consumers while staying true to what Bluetooth is at its core: the global wireless standard for simple, secure, connectivity.”

http://www.bluetooth.com/bluetooth5

Thursday, November 17, 2016

OIF Commences Work on Four New Project

Following its Q4 meeting this month in Auckland, New Zealand, The Optical Internetworking Forum announced four new projects:

  • 400ZR Interoperability Project -- will develop an implementation agreement for 400G ZR and short-reach DWDM multi-vendor interoperability.  It is relevant for router-to-router interconnect use cases and is targeted at (passive) single channel and amplified DWDM applications with distances up to 120 km. This project should ensure a cost-effective and long-term relevant implementation using single-carrier 400G, coherent detection and advanced DSP/FEC algorithms.  
  • Common ACO Electrical I/O Project -- will define the ACO electrical I/O independent of the choice of form factor and optical carrier count for 45 Gbaud and 64 Gbaud per-carrier applications. This project would build upon the success of the CFP2-ACO but is form factor agnostic so that it could be applied to multiple applications such as  CFP4, CFP8, QSFP, micro QSFP and OFSP.
  • Coherent Modem Management Interface Project -- members have requested that the industry combine the coherent modem management interface specifications [4"x5" LH MSA, CFP2-ACO, CFP2-DCO, Flex-Coherent, etc.] into a standalone document.  OIF leadership, working in conjunction with the CFP MSA group, is inviting companies to participate in creating a complementary Normative document.
  • High Baud Rate Coherent Modulation Function Project -- will define a small form factor component implementation agreement that combines the high baud-rate PMQ (HB-PMQ) modulator plus the RF drive functions into a single component. This new component will be used in conjunction with a high baud Integrated Coherent Receiver (ICR), a micro Integrable Tunable Laser Assembly (ITLA) and a coherent DSP, to implement a high performance coherent modem.

“The OIF continues to work with other standards bodies and the industry to identify a wide range of technology needs that cross the entire optical and electrical ecosystem,” said Karl Gass of Qorvo and the OIF’s Physical Link Layer working group optical vice-chair.  “The OIF remains committed to providing technology direction that provides a path to interoperability in a pre-competitive environment. The projects started during the Q4 meeting demonstrate the OIF’s  commitment to work with other standards bodies in the industry.”

In addition, OIF announced the following election results: Dave Brown of Nokia was re-elected to the Board for a two-year term and appointed as president.  Re-elected to one-year terms were Junjie Li of China Telecom and Dave Stauffer of Kandou Bus. Stauffer will continue to serve as secretary/treasurer. Jonathan Sadler of Coriant and Nathan Tracy of TE Connectivity were elected to the board for two-year terms.  Tracy was appointed as vice president of marketing. Tom Issenhuth of Microsoft was appointed as vice president and Ian Betty of Ciena continues to serve on the Board.

Newly elected were Klaus-Holger Otto of Nokia as Technical Committee chair, Ed Frlan of Semtech as Technical Committee vice chair and Jeffery Maki of Juniper Networks as chair of Physical Layer User Group Working Group.

Brian Holden of Kandou Bus, Market Awareness and Education Committee co-chair, Physical and Link Layer; and Lyndon Ong of Ciena, MA&E Committee co-chair, Networking were both re-elected.

http://www.oiforum.com/


Thursday, October 20, 2016

Momentum Builds for Citizens' Band LTE (3.5 GHz)

The Citizens Broadband Radio Service (CBRS) Alliance, which was formed in February 2016 with the goal of making LTE-based solutions in the 3.5 GHz CBRS band widely available, announced the addition of Accelleran, Airspan Networks, American Tower Corp., AT&T, Baicells, CableLabs, Ericsson, ExteNet Systems, Nsight, Ranzure Networks, Rise Broadband, and ZTE as members. Founding members of the alliance include Access Technologies (Alphabet), Federated Wireless, Intel, Nokia, Qualcomm and Ruckus Wireless (now part of Brocade).

“For LTE-based solutions in the shared CBRS band to be successful, we need a wide range of ecosystem partners, infrastructure, equipment and network providers, to work together closely,” said Michael Peeters, vice president Innovation Portfolio, Nokia and President of the CBRS Alliance. “We are thrilled to welcome all the new members to the CBRS Alliance and look forward to working together to provide solutions toward in-building and outdoor cellular coverage.”

“CBRS is creating opportunities to bring the benefits of LTE technology to a wider ecosystem,” said Neville Meijers, VP Business Development, Qualcomm Technologies Inc., and chairman of the board for the CBRS Alliance. “CBRS enables new kinds of deployments and business models, from LTE-based neutral hosts that can serve multiple service providers, to dedicated networks serving various entities such as enterprises or IoT verticals.”

http://www.cbrsalliance.org


  • In April 2015, the U.S. Federal Communications Commission (FCC) adopted rules for CBRS, which opens 150 MHz of spectrum (3550-3700 MHz) for commercial use — while providing necessary protection of incumbent users of the band. Spectrum access is actively coordinated based on priority and granular location, making previously allocated spectrum available to new entrants and services.



Sunday, October 16, 2016

OpenCAPI Looks to Redefine Server Architecture Beyond PCIe

Major industry vendors announced their support for OpenCAPI, a new standard that provides an open, high-speed pathway for different types of technology – advanced memory, accelerators, networking and storage – to more tightly integrate their functions within servers. The idea is to re-architect servers to remove system bottlenecks, putting the compute power closer to the data -- and to do so with an open (non-Intel) design.

Backers of the newly formed OpenCAPI Consortium include AMD, Dell EMC, Google, Hewlett Packard Enterprise, IBM, Mellanox Technologies, Micron, NVIDIA and Xilinx.

OpenCAPI said its high bandwidth, low latency open interface is capable of 25 Gbps, outperforming the current PCIe specification which offers a maximum data transfer rate of 16 Gbps.

Several companies announced plans to introduce and deploy OpenCAPI enabled products, including:

  • IBM plans to introduce POWER9-based servers that leverage the OpenCAPI specification in the second half of 2017. Additionally, IBM will enable members of OpenPOWER Foundation to introduce OpenCAPI enabled products in the second half 2017.
  • Google and Rackspace’s new server under development, codenamed Zaius and announced at the OpenPOWER Summit in San Jose, will leverage POWER9 processor technology and plans to provide the OpenCAPI interface in its design.
  • Mellanox plans to enable the new specification capabilities in its future products.
  • Xilinx plans to support OpenCAPI enabled FPGAs.


The OpenCAPI consortium said it intends to make the OpenCAPI specification fully available to the public at no charge before the end of the year.

IBM first introduced CAPI technology to the industry in 2014 with our POWER8 processor and made it available to our OpenPOWER partners. Since then, the industry has embraced and validated its potential as a game-changing technology for the most important modern workloads including artificial intelligence, advanced data analytics and deep learning,” said Brad McCredie, IBM Fellow and Vice President of POWER Development. “As a result of this initial success, IBM has decided to double down on our commitment to open standards and enablement of industry innovation by opening up access to our CAPI technology to the entire industry. With the support of our OpenCAPI co-founders, we have created a new OpenCAPI specification that tremendously improves performance over our prior specification and IBM will be among the first to implement it with our POWER9 products expected in 2017.”

http://www.opencapi.org

Thursday, October 6, 2016

OpenStack Hits its 14th Release - Newton

The OpenStack community released Newton, the 14th version of the most widely deployed open source software for building clouds.

Newton brings user experience improvements for container cluster management and networking. New features in the Ironic bare metal provisioning service, Magnum container orchestration cluster manager, and Kuryr container networking project more seamlessly integrate containers, virtual and physical infrastructure under one control plane.

Other areas of improvement include:

Improved Scalability --including the ability to scale up or down across platforms and geographies. This further cements OpenStack’s dominance as a solution for clouds of all sizes. Enhancements include improved scale-up/scale-down capabilities in Nova, Horizon and Swift; progress with Cells V2 for horizontal scale out of Nova compute environments; the addition of convergence by default in Heat; and multi-tenancy improvements in Ironic.

Enhanced Resiliency-- Cinder, Ironic, Neutron and Trove are among the projects that deliver improved high availability functionality. Security improvements are included in Newton as well; for example, Keystone offers upgrades that include PCI compliance and encrypted credentials. Cinder adds support for retyping encrypted to unencrypted volumes and vice versa. Additional enhancements in Cinder include micro-version support, the ability to delete volumes with snapshots using the cascading feature, and a backup service that can be scaled to multiple instances.

Better User Experience -- the Newton release significantly advances OpenStack as the one cloud platform for virtualization, bare metal and containers and enhances the ease of use for operators and app developers, making OpenStack easier to set up, operate, change and fix, with greater automation. Magnum offers provisioning for container orchestration tools, namely Swarm, Kubernetes and Mesos. Magnum’s new features include an operator-centric Install Guide, support for pluggable drivers, support for Kubernetes clusters on bare metal servers, and asynchronous cluster creation. For general bare metal provisioning, Ironic adds multi-tenant networking and tighter integration with Magnum, Kubernetes and Nova; also, Kolla now supports deploying to bare metal. Kuryr brings Neutron networking capabilities to containers, making Swarm integration and Kubernetes integration available for the first time. Another Kuryr highlight is the capability to nest VMs through integration with Magnum and Neutron (early release).

To support popular telecom network configurations,VLAN-aware VMs allow companies to run their existing VNFs in an OpenStack cloud and use per-tenant VLANs to get traffic to them. Nova adds mutable configuration settings, allowing operators to reload certain configuration parameters without restarting the node. Also, Nova’s get-me-a-network feature simplifies network configuration.

“The OpenStack community is focused on making clouds work better for users. This is clearly evident in the Newton release, which tackles users’ biggest needs, giving cloud operators and app developers greater security, resiliency and choice,” said Jonathan Bryce, executive director of the OpenStack Foundation. “The new features and enhancements in Newton underscore the power of OpenStack: it handles more workloads in more ways across more industries worldwide. OpenStack is a cloud platform that ties everything together—compute, network, storage, and innovative cloud technologies.”

http://www.openstack.com

Tuesday, October 4, 2016

ETSI’s Open Source MANO (OSM) Hits Release 1

ETSI’s Open Source MANO (OSM) group announced the first release of its open source Management and Orchestration (MANO) software stack.

OSM Release ONE, which closely aligned with ETSI NFV, comes less than six months since the inaugural meeting of the OSM community.

The OSM group said Release ONE could be installed in operator labs to create a scalable and interoperable open source MANO environment. Release ONE substantially enhances interoperability with other components (VNFs, VIMs, SDN controllers) and creates a plugin framework to make platform maintenance and extensions significantly easier to provide and support.

Highlights of the list of technical features in Release ONE include:

  • Natively supported VIMs: VMwareTM, OpenStack and OpenVIM
  • Support for reference SDN Controllers, such as OpenDayLight (ODL) and FloodLight
  • A plugin model to facilitate the addition of new types of VIMs and SDN Controllers, thus minimizing developer effort
  • Multi-site Network Services, to respond to operator requirements, allowing deployments that span across multiple datacenters
  • A one-step installer, based on containers and Juju modelling, to simplify testing, customization and deployment of OSM
  • Extended virtualized network functions (VNF) and network service models, allowing Day-Zero VNF configuration
  • OpenVIM code, included as part of the OSM install, providing a reference VIM for all-in-one installations with full support of Enhanced Platform Awareness. Uniquely, users are not required to have a pre-existing VIM installation in their premises before installing OSM

“The pace of the group’s work has been amazing, and as one of the fastest growing NFV and SDN open source projects, OSM now proudly counts 46 members including many of the leading global operators” says Francisco-Javier Ramón, ETSI OSM Chair and Head of Network Virtualisation Initiative at Telefónica, Global CTO.

http://www.etsi.org/news-events/news/1132-2016-10-news-etsi-open-source-mano-release-one-now-available

#MWC16: Open Source MANO Initiative Gets Underway

A new industry initiative is underway for the development of Open Source software for Management and Orchestration (MANO) of Network Functions Virtualization (NFV). The group is sponsored by ETSI and its founders include BT, Canonical, Intel, Mirantis, RIFT.io Inc, Telefonica, Telekom Austria Group and Telenor.

Two of the key components of the ETSI NFV architectural framework are the NFV Orchestrator and VNF (Virtualized Network Function) Manager, known as NFV MANO. Additional layers, such as service orchestration are also required for operators to enable true NFV services. Open Source software can facilitate the implementation of an ETSI aligned NFV architecture, provide practical and essential feedback to the ETSI NFV ISG and increase the likelihood of interoperability among NFV implementations.

The new group, ETSI OSM, will deliver an open source MANO stack using accepted open source tools and working procedures. The activity will be closely aligned with the evolution of ETSI NFV and will provide a regularly updated reference implementation of NFV MANO. OSM will enable an eco-system of NFV solution vendors to rapidly and cost-effectively deliver solutions to their users.

“ETSI OSM complements the work of the ETSI NFV ISG and vice versa. It will provide an opportunity to capitalize on the synergy between standardization and open source approaches by accessing a greater and more diverse set of contributors and developers than would normally be possible”, says Luis Jorge Romero, ETSI Director General. “This maximizes innovation, efficiency and time to market and ensures a continuing series of conformant reference implementations.”

http://osm.etsi.org/welcome/

Wednesday, September 28, 2016

OIF Begis Work on IC-TROSA and CFP2-Digital Coherent Optics Project

The Optical Internetworking Forum’s (OIF) has begun work on two optical interface projects:

the IC-TROSA project would enable manufacturers to have a higher level of integration for transmit and receive optical components. Integrated Coherent Transmitter-Receiver Optical Subassembly (IC-TROSA) is the evolutionary step that combines Polarization Multiplexed Quadrature (PMQ) Transmitter (Tx) and Integrated Coherent Receiver (ICR) components to create a single integrated optics package.  The optical sub-assembly that supports high-bandwidth and high-order QAM operations is suited for data center interconnect, metro and long-haul applications. As module sizes decrease, current coherent optics components need similar size reductions to enable next generation multi-terabit switches, line cards, and transport. Density requirements for next-gen line cards, front-pluggable and future on-board 400G+ optical modules are driving the need for further integration and miniaturization.

the CFP2-Digital Coherent Optics (DCO) project will work with other standards bodies to implement coherent modulations formats in CFP modules. The OIF’s CFP2-DCO project includes a way to build address management interface and identify registers necessary to talk to the DSP located in the module, specific to coherent modulation techniques. The CFP2-DCO is intended to be used for 100G, 200G or 400G applications for metro, long-haul and data center interconnections and it can support different formats such as DP-QPSK and DP-xQAM.

“The IC-TROSA project tackles much more than just a simple size reduction,” said Karl Gass of Qorvo and the OIF’s Physical and Link Layer (PLL) Working Group – Optical vice chair.  “It addresses optical packaging in a way that isn’t done in high volumes today. We want to come to industry consensus in this pre-competitive environment.”

http://www.oiforum.com.

Tuesday, September 27, 2016

ETSI Announces NFV Release 2

ETSI’s Network Functions Virtualisation  (NFV) Industry Specification Group (ISG) announced the publication of NFV Release 2 specifications covering a wide set of functional areas, such as the management of virtualized resources, lifecycle management of both network services and virtualized network functions, network service fault/performance management, virtualized resource capacity management, etc.

NFV Release 2 incorporates 11 new group specifications, in addition to the many NFV specifications already published. These detail the various requirements, interface descriptions and information models enabling interoperability of solutions based on the ETSI NFV Architectural Framework.


“This represents another major step towards our objective of defining a comprehensive set of specifications that will facilitate the deployment of NFV throughout the telecommunication industry, with significant benefits being subsequently derived in many interrelated sectors,” states Telefonica’s Diego Lopez, the newly appointed Chairman of ETSI NFV ISG. “Through the collaborative efforts of all parties involved in the ETSI NFV ISG, we have been able to identify and define the required capabilities, following a practical approach that leverages proofs of concept to explore and demonstrate what was proposed. The combination of wide consensus and experimental evidence has led to NFV being recognized as a completely viable and highly valuable technology. This has allowed us to make progresses at a fast pace.”

“By drawing upon the combined merits of a well-defined standards structure and the support of the open source community, we have been able to accelerate the development process and ensure widespread interoperability,” Lopez continues. “I am therefore confident that the ETSI NFV Architectural Framework will be the foundation upon which future virtualization of the network is established - enabling cost effective allocation of resources and the rapid addition of new services, while still ensuring the highest degrees of security and reliability, as well as painless and seamless integration with existing infrastructure.”

http://www.etsi.org/deliver/etsi_gs/NFV/001_099/002/01.02.01_60/gs_NFV002v010201p.pdf

ETSI’s NFV Group Publishes Phase 1 Specs


ETSI’s Network Functions Virtualisation  (NFV) Industry Specification Group (ISG) announced the publication of eleven specifications under phase 1 of its activity. The work includes an infrastructure overview, an updated architectural framework, and descriptions of the compute, hypervisor and network domains of the infrastructure. The new specifications also cover management and orchestration, security and trust, resilience and service quality...

New Spec for Audio over USB Type-C

The USB Implementers Forum (USB-IF) announced a new USB Audio Device Class 3.0 specification to establish USB Audio over USB Type-C as the primary solution for all digital audio applications, including headsets, mobile devices, docking stations, gaming set-ups and VR solutions.

“USB is the simplest and most pervasive connector available today, making USB Type-C the logical choice for the future of digital audio,” said Jeff Ravencraft, USB-IF President and COO. “We encourage companies interested in adopting USB specifications to take advantage of USB-IF resources to reduce time-to-market and deliver reliable USB products.”

The USB Audio Device Class 3.0 specification makes it easier to support digital audio over USB, add capabilities to reduce power consumption and add support for new features such as hotword detection. It defines minimum interoperability requirements across analog and digital solutions to minimize user confusion when not all hosts or devices support audio consistently. USB Audio over USB Type-C™ allows OEMs to remove the 3.5mm analog audio jack, shaving up to a millimeter off product designs and reducing the number of connectors on a device. Fewer connectors will open the door for innovation in countless ways and make it easier to design waterproof or water-resistant devices.

http://www.usb.org

See also