Showing posts with label Silicon+LTE. Show all posts
Showing posts with label Silicon+LTE. Show all posts

Tuesday, September 6, 2016

Sequans Demos LTE Cat M1 Chip

Sequans Communications is demonstrating its LTE Category M1/NB1 chip at this week's CTIA’s Super Mobility Week in Las Vegas.

Sequans’ Monarch chip will be shown in live communication with an LTE eNodeB (base station) emulator, the Amari OTS 100 from Amarisoft.

Monarch is an LTE Cat M1/NB1, LTE Release 13 solution. It is designed specifically for narrowband IoT applications, including sensors, wearables, and other low data, low power M2M and IoT devices. Monarch complies with the ultra-low-power and reduced complexity feature requirements of the 3GPP release 13 LTE Advanced Pro standard, defining narrowband, low data rate LTE technology for machine type communications.

“We are very proud to highlight the key capabilities of Monarch in this first-in-the-industry live demo of a Cat M1/NB1 chip,” said Georges Karam, Sequans CEO. "In designing Monarch, we worked from day one to make sure it would be fully optimized in both cost and power consumption to fully unleash the LTE for IoT market potential. I am very excited to say that Monarch is operating as designed and we expect to have it ready for network deployments in Q4.

http://www.sequans.com/

Thursday, August 25, 2016

ZTE Picks Sequans for LTE-Advanced CPE

ZTE has selected Sequans Communications' Cassiopeia LTE-Advanced chipset platform for a new line of high-performance CPE for LTE networks operating on LTE bands 42 and 43, primarily used in regions including southeast Asia, Latin America, Middle East, and Europe.

The ZTEWelink WF830 is an outdoor, fixed wireless router matched with an indoor multiservice gateway that supports advanced networking and WLAN AP functionalities.. It offer dual-carrier aggregation and category 6 throughput. The unit could be used for advanced residential or small business services delivered over the LTE network.

“We chose Sequans technology for the WF830 because of the robust LTE-Advanced capabilities of the Cassiopeia platform that has been well-proven in the marketplace,” said Sanqiang Liu, Product General Manager, ZTEWelink. “Cassiopeia’s carrier aggregation capability is flexible and robust, allowing for advanced MIMO operation and very high throughput. Sequans’ support was excellent throughout, especially during the operator certification process.”

“We are pleased to contribute our technology to the new LTE-Advanced ZTEWelink CPE,” said Craig Miller, Sequans VP of marketing. “It provides very high LTE performance enabling integrated access for data, voice, and Internet in one powerful unit.”

The LTE-Advanced chip inside the ZTEWelink WF830 is Sequans’ Cassiopeia LTE-Advanced platform, compliant with 3GPP Release 10 specifications. Cassiopeia supports highly flexible dual-carrier aggregation that allows the combination of any two carriers of any size up to 20 MHz each, contiguous or non-contiguous, inter-band or intra-band. Cassiopeia also supports other Release 10 enhancements such as new MIMO schemes, enhanced inter-cell interference coordination (eICIC) schemes for heterogeneous networks (HetNets), and improvements to eMBMS (evolved multimedia broadcast multicast service) or LTE broadcast. Cassiopeia features Sequans’ advanced receiver technology for improved performance. Cassiopeia can support additional optional features, including envelope tracking and secure boot, at customer request.

http://www.ztewelink.com/en

Thursday, February 4, 2016

Verizon, Sequans Collaborate on LTE CAT M Chipsets

Sequans Communications and Verizon are collaborating to accelerate development of CAT M-capable LTE chipsets.

Category M is based on the coming Release 13 of the 3GPP LTE standard, which defines new features such as extended coverage, lower data rate and lower power consumption.  Cat M LTE is aimed at a new class of LTE applications for machine-type-communications (MTC) devices, such as wearables, asset trackers, smart meters and industrial sensors.

Verizon and Sequans previously collaborated on CAT 1 LTE technology, which led to Verizon becoming the first in the world to deploy CAT 1 LTE devices commercially.

“We led the industry when we introduced our Calliope CAT 1 LTE chipset platform, tested it on Verizon’s network, and introduced it to the market where it is now being deployed broadly,” said Georges Karam, Sequans CEO. “And we are excited to extend our partnership with Verizon to address the CAT M space. Having the support of Verizon will ensure the new Sequans CAT M-capable chipsets currently in development will be ready as quickly as possible.”

http://www.sequans.com

Wednesday, October 28, 2015

LTE IoT Chipset Targets 10 years of Battery Life

Ericsson, in partnership with AT&T and Altair Semiconductor, plan to demonstrate ultralow power consumption for IoT devices with a target battery operational life of ten years.

The demonstration of LTE Power Saving Mode on a commercial LTE Internet of Things (IoT) chipset is showcased at this week's GSMA Mobile 360 Series - North America event in Atlanta, Georgia.

The IoT device Altair's FourGee-1160 Cat 1 chipset featuring ultra-low power consumption. Power Saving Mode is an Ericsson Evolved Packet Core feature based on 3GPP (Release 12) for both GSM and LTE networks. The feature is able to dramatically extend IoT device battery life up to ten years or more for common use cases and traffic profiles.

Cameron Coursey, Vice President, Product Development, AT&T's IoT Organization, says: "IoT connectivity is essential to helping businesses stay tethered to their assets around the world. Whether a trucking company hauls expensive cargo across the country or a restaurant transports fresh food overseas, a long battery life on their connected devices can help them provide continuous service.  Businesses can save money and become more efficient with battery replacements every few years rather than very few months.

"Power Saving Mode running on a Cat 1 device enables new use cases and services so far impractical for LTE based IoT networks. We are very pleased to cooperate with ecosystem partners such as Ericsson and AT&T to demonstrate how these use cases are made possible today, based on existing and commercial device and infrastructure technology," stated Eran Eshed, Co-Founder and VP of Marketing and Business Development, Altair.

http://www.ericsson.com/news/1962068

Tuesday, May 5, 2015

Marvell Introduces ARMADA Mobile PXA 1826 LTE Modem with Carrier Aggregation

Marvell Semiconductor's latest ARMADA Mobile PXA 1826 LTE modem supports the latest carrier aggregation features.  Marvell has been a leader in TDD LTE technology.

Several carriers now have licenses across TDD and FDD, creating a need for LTE modems supporting both. Presented by Allen Leibovitch, Senior Product Marketing Manager.

See video: https://youtu.be/OZ5_DdQu9kg


Enabling the Mobile Ecosystem with Leading-Edge Technology - Lu Chang

Mobile is a fast moving industry, both from the consumer point-of-view and the service provider point-of-view, says Lu Chang, Sr. Director, Mobile Products at Marvell. Here he discusses the mobile ecosystem.

Marvell has been in the mobile sector for some times, starting out building 3G products and later expanding into multi-mode 2/3/4G and LTE. The company works closely with service providers around the world to enable the next generation of smartphones and tablets.

See video: https://youtu.be/fO3vvS2I20k


Thursday, March 5, 2015

Qualcomm Adds LTE modes to Snapdragon Automotive Set

Qualcomm has added two LTE modems to its Snapdragon Automotive Solutions portfolio.

The Snapdragon X12 LTE modem (9x40) is designed to enable auto manufacturers to develop next-generation systems with advanced telematics and connected infotainment features while supporting greater coverage at download speeds up to Category 10 (up to 450 Mbps in the downlink and 100 Mbps in the uplink). The Snapdragon X5 LTE modem (9x28) is designed to enable automakers to broadly deploy LTE in all cars at download speeds up to Category 4 (up to 150 Mbps in the downlink and 50 Mbps in the uplink).

In addition to LTE, both modems support all major 3G/2G cellular standards and offer on-chip integration of global position (GNSS) support for all major constellation.  They also feature a 1 GHz processor with Linux and built-in software for key global regulatory mandates like EU eCall and ERA Glonass. They can be matched with a companion Qualcomm VIVE QCA65x4 chipset with Wi-Fi/BT to support consumer features like Wi-Fi 802.11ac hotspots and safety applications like vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) with a seamless combination of Wi-Fi, DSRC and LTE.

“The effect of LTE on connected telematics and infotainment inside the car is transformational, rivaling the one from feature phones to smartphones,” added Singh. “Ubiquitous connectivity to cars is enabling industries like automotive, wireless operators, and insurance to come together in unlocking value for consumers. In addition, the cars of tomorrow will not only inform and entertain the consumer, but also communicate with their environment to make driving safer, which is accomplished through system level integration across infotainment, telematics and connectivity subsystems of the vehicle. The X12 and X5 are designed with this integration as a requirement, so we can support the vision of getting these capabilities into all cars.”


http://www.qualcomm.com

Wednesday, March 4, 2015

Marvell Unveils 5-mode 4G LTE Release 10 Modem

Marvell unveiled a 5-mode 4G LTE Release 10 modem chipset supporting Carrier Aggregation.

The Marvell ARMADA Mobile PXA1826 extends the company's leadership in 64-bit quad-core and octa-core 4G LTE mobile processors for global markets.

Key features include:

  • Multi-mode LTE R10 CAT7 supporting TD-LTE, FDD-LTE, TD-SCDMA, WCDMA and GSM
  • Integrated Cortex A7, up to 1.2GHz
  • Support CSFB and VoLTE voice services
  • Includes Marvell’s LTE R10 RF transceiver

“I am very pleased to launch our industry-leading 5-mode 4G LTE Release 10 modem with carrier aggregation. Our leadership in 4G LTE technology and close collaboration with top global operators and tier-one OEMs have significantly accelerated the mass deployment of 4G LTE in China and around the world,” said Weili Dai, President and Co-Founder of Marvell. “Carrier aggregation is an important technology to increase capacity and enable new features in cellular communication.”

http://www.marvell.com/

Wednesday, February 18, 2015

Qualcomm Readies 4 Midrange Snapdragon Processors

Qualcomm introduced its Snapdragon 620, 618, 425, and 415 processors, supporting a wide range of mobile devices and a range of price points.  Both the 600 and 400 series processors feature Qualcomm Hexagon application DSP, which has the ability to process low-power tasks without waking up the CPU cores. The new designs offer an integrated X8 LTE modem (Category 7 with download speeds of up to 300Mbps and upload speeds of up to 100Mbps) and high-end multimedia features such as dual image signal processors (ISP) and FLAC support for high-quality audio.

Some details:

  • The Snapdragon 620 integrates a brand new ARM Cortex-A72 CPUs and next-gen Qualcomm Adreno GPU. It brings support for 4K Ultra HD video capture and playback and 2K display resolution. 

  • The Snapdragon 618 will be the hexa-core variant of the 620, loaded with the same core features.
  • The Snapdragon 425 processor has the same X8 LTE as the 620 and 618, complete with integrated Cat 7 modem. It supports a high quality camera with enhanced photo processing and dual ISP.
  • The Snapdragon 415 provides an affordable octa-core solution for manufacturing customers who are looking for a quick transition from Snapdragon 410, which has amassed over 80+ design wins since its inception became available late last year. The Snapdragon 415 features support for integrated Cat 4 LTE (speeds up to 150Mbps), 64-bit CPU architecture, and 720p display resolutions.


Commercial devices featuring the new Snapdragon 620, 618, 425, and 415 processors are expected to be available in the second half of 2015.

A further marketing note, Qualcomm is now using "Snapdragon" as the brand for its discrete LTE multimode modems (previously Gobi).

Tuesday, June 10, 2014

Sequans Targets Colibri LTE Platform at Internet of Things

Sequans Communications introduced its "Colibri" LTE chipset targeted at the Internet of Things (IoT) modules and M2M devices.

The Colibri LTE Platform comprises Sequans’ latest baseband and RF chips (SQN3221 and SQN3241), an integrated network and application CPU platform running Sequans’ carrier-proven LTE protocol stack, an IMS client, and a comprehensive software package for over-the-air device management and packet routing.

Key features:

  • 3GPP Release 10, software upgradable to Release 11
  • FDD and TDD, up to 20 MHz channels
  • Throughput up to category 4 (150 Mbps DL / 50 Mbps UL)
  • Integrated enhanced network and application CPU
  • Wafer-level packaging
  • Embedded IMS VoLTE client and digital voice interface
  • Supports Linux, Android, ChromeOS, Windows, and MAC OS
  • IoT friendly interfaces, including USB 2.0, SDIO 3.0 and high-speed UART
  • Includes Sequans AIR™ interference cancellation technology for superior cell-edge performance

“In developing Colibri, our goal was to pack it with great IoT features while making it so cost-effective that it would immediately solidify the business cases for adding LTE to numerous new M2M and IoT devices,” said Georges Karam, Sequans CEO. “I’m proud to say we’ve reached our goal and Colibri offers the best price/performance in the industry, enabling 4G LTE modules to approach 2G price points.”

Sequans expects modules based on the Colibri platform to be available from various module manufacturers beginning in Q3.

http://www.sequans.com

Wednesday, June 4, 2014

Lantiq and Intel Show LTE Cat6 Gateway Platform

Lantiq and Intel announced a joint reference platform for fixed LTE Broadband Router designs.

The co-developed reference platform combines the Intel XMM 7260 LTE communications platform with Lantiq’s GRX330 Communications Processor.

Key features:

  • An Intel designed M.2 module based on the Intel XMM 7260 platform delivers LTE-Advanced features  including flexible carrier aggregation - up to 40Mhz with support for up to 23 CA combinations in one SKU – and category 6 speeds (300 Mbps theoretical peak downlink speeds).
  • The 7260 supports more than 30 3GPP bands (21 bands simultaneous in a single SKU) and global network standards (LTE FDD/TDD, WCDMA/HSPA+, TD-SCDMA/TD-HSPA/EDGE).
  • The Lantiq GRX330 communications processor offers a full Gigabit Ethernet router design, using  a dedicated acceleration engine to maximize Wi-Fi throughput, while keeping the CPU available for other networking and application tasks.

http://www.lantiq.com
http://www.intel.com


Thursday, February 27, 2014

Sequans Showcases Cassiopeia LTE-Advanced

Sequans Communications showed off its Cassiopeia silicon compliant with 3GPP Release 10 specifications and is software upgradeable to Release 11.

Cassiopeia supports highly flexible dual carrier aggregation up to 40 MHz total bandwidth. In 30 MHz FDD, combining two channels of 10 MHz plus 20 MHz, which will be one of the most common configurations deployed by LTE operators, Cassiopeia can deliver maximum theoretical category 6 LTE throughput of up to 225 Mbps.

The company says its carrier aggregation capability allows any two carriers of any size up to 20 MHz each, contiguous or non-contiguous, inter-band or intra-band, to be combined.

http://www.sequans.com

Monday, February 10, 2014

Broadcom Releases 5th Generation LTE Platform

Broadcom has released a new LTE chipset aimed at the sub $300 smartphone market.

Broadcom's fifth generation turnkey platform supports Android KitKat and utilizes the company's pin-to-pin compatible dual-core M320 or upcoming quad-core M340 LTE SoC and connectivity and location technology.

Key features:

  • Cat 4 150 Mbps LTE speeds in FDD-LTE and TD-LTE modes and up to 42 Mbps with DC-HSPA+ 3G as well as GSM/EDGE
  • BCM2095 LTE RF transceiver enables FDD and TD LTE/3G/2G band support for worldwide roaming
  • VoLTE and HD voice support
  • HD display, imaging and graphics for an immersive consumer experience
  • Pre-integrated with the Android KitKat operating system
  • Reduces LTE modem power consumption by up to 30 percent for extended hours of use
  • "5G" WiFi, Bluetooth Smart, NFC and location technologies

Broadcom also noted complete design reuse between its dual-core and quad-core basebands, enabling OEMs to develop multiple devices with the same platform design while lowering engineering costs and accelerating time to market. Certification by leading carriers worldwide and Category 4 (Cat 4) speeds in FDD-LTE and TD-LTE modes enable OEMs to deliver high-performance smartphones with seamless worldwide roaming capabilities.

http://www.broadcom.com

Monday, December 9, 2013

Qualcomm's Low-Cost Snapdragon 410 Integrates 4G LTE World Mode

Qualcomm introduced Snapdragon 410 chipset featuring integrated 4G LTE World Mode.

The new Snapdragon 410 chipsets are manufactured using 28nm process technology. They feature processors that are 64-bit capable along with graphics driven by an Adreno 306 GPU, 1080p video playback and up to a 13 Megapixel camera.

Snapdragon 410 chipsets integrate 4G LTE and 3G cellular connectivity for all major modes and frequency bands across the globe and include support for Dual and Triple SIM. Together with Qualcomm RF360 Front End Solution, Snapdragon 410 chipsets will have multiband and multimode support. Snapdragon 410 chipsets also feature Qualcomm's Wi-Fi, Bluetooth, FM and NFC functionality, and support all major navigation constellations: GPS, GLONASS, and China's new BeiDou, which helps deliver enhanced accuracy and speed of Location data to Snapdragon-enabled handsets.

The chipset also supports all major operating systems, including the Android, Windows Phone and Firefox operating systems.

Qualcomm Technologies also announced for the first time the intention to make 4G LTE available across all of the Snapdragon product tiers. The Snapdragon 410 processor gives the 400 product tier several 4G LTE options for high-volume mobile devices, as the third LTE-enabled solution in the product tier.

"We are excited to bring 4G LTE to highly affordable smartphones at a sub $150 ( ~ 1,000 RMB) price point with the introduction of the Qualcomm Snapdragon 410 processor," said Jeff Lorbeck, senior vice president and chief operating officer, Qualcomm Technologies, China. "The Snapdragon 410 chipset will also be the first of many 64-bit capable processors as Qualcomm Technologies helps lead the transition of the mobile ecosystem to 64-bit processing."

http://www.qualcomm.com/media/releases/2013/12/09/qualcomm-technologies-introduces-snapdragon-410-chipset-integrated-4g-lte

Wednesday, November 20, 2013

Qualcomm Intros 4th Gen Modem Chipset Supporting LTE-Advanced

Qualcomm introduced its fourth-generation 3G/LTE multimode modem chipset, the Qualcomm Gobi 9x35, and RF transceiver chip, the Qualcomm WTR3925.

The Qualcomm Gobi 9x35 is a cellular modem implemented in 20nm technology.  It offers support for global carrier aggregation with up to 40 MHz for both LTE TDD and FDD Category 6.  This enables download speeds of up to 300 Mbps. It is backwards compatible and supports all other major cellular technologies, including DC-HSPA, EVDO Rev. B, CDMA 1x, GSM and TD-SCDMA.

The Qualcomm WTR3925 is the first announced RF transceiver chip based on the 28 nm process, and is Qualcomm Technologies’ first single-chip, carrier aggregation RF solution that supports all carrier aggregation band combinations approved by 3GPP. The WTR3925 pairs with the Gobi 9x35 chipset and the Qualcomm RF360 Front End Solution, which enable the mobile industry’s premier global, single-SKU LTE platform. Sampling is expected to begin sampling early next year.

“We’re excited to be expanding our portfolio with a fourth generation of 3G/LTE multimode connectivity solutions,” said Cristiano Amon, executive vice president, Qualcomm Technologies, Inc., and co-president, QCT. “Not only do these products extend our industry-leading Gobi roadmap, they enable the creation of thinner and more efficient mobile devices capable of connecting to the fastest 4G LTE Advanced networks worldwide.”

http://www.qualcomm.com/media/releases/2013/11/20/qualcomm-technologies-announces-fourth-generation-3glte-multimode-modem

Freescale Demos Simultaneous LTE and WCDMA on a Single Base Station Processor

Freescale Semiconductor's QorIQ Qonverge BSC9132 SoC for small cell base station can now run simultaneous WCDMA and LTE thanks to the company's integrated VortiQa Layer 1 (L1) software.

“The addition of WCDMA multimode capability to our comprehensive portfolio of LTE L1 software underscores Freescale’s strong commitment to the small cell market,” said Stephen Turnbull, wireless marketing manager for Freescale’s Digital Networking business. “Freescale is helping accelerate the ability of small cell manufacturers to deliver multimode picocell solutions that work together seamlessly and meet the requirements of wireless network operators.”

http://www.freescale.com

Wednesday, September 4, 2013

Broadcom to Acquire LTE Modem Business from Renesas Electronics

Broadcom agreed to acquire LTE-related assets from affiliates of Renesas Electronics Corporation for approximately $164 million in cash.

Broadcom is gaining a dual-core LTE SoC that is ready for volume production and is carrier-validated by leading global operators in North America, Japan and Europe. Broadcom also receives high-quality multimode, multiband, LTE-A/HSPA+/EDGE modem IP that includes support for leading-edge features such as Carrier Aggregation and VoLTE. The acquisition adds quality patents and applications to Broadcom's IP portfolio and brings some of the world's most experienced cellular engineers to Broadcom.

Broadcom said the deal will accelerate the launch of its first multimode, carrier-validated LTE SoC platform, which is now expected in early 2014.

"Today's transaction firmly establishes Broadcom's presence in the rapidly growing LTE market with a production-ready, carrier-validated SoC," said Scott McGregor, President and CEO of Broadcom. "Our LTE platform will leverage Broadcom's rich connectivity portfolio and will deliver an optimized feature set for this fast growing market."

Broadcom also updated its business outlook for the three months ending September 30, 2013. The company now expects revenue between $2.075 billion and $2.175 billion; GAAP and non-GAAP product gross margins to be up roughly 50 to 100 basis points; and GAAP and non-GAAP research and development, and selling, general and administrative expenses to be somewhat above the high-end of the previously guided range of down ~$5 million to up ~$15 million and flat to up ~$20 million, respectively.

http://www.broadcom.com/investors

Thursday, August 15, 2013

Ericsson appoints Head of Business Unit Modems

Ericsson has appointed Mats Norin as Vice President and Head of Business Unit Modems.  He will also take a seat on Ericsson’s Global Leadership Team, reporting to Chairman of Business Unit Modems and Head of Group Function Strategy, Douglas Gilstrap.


Business Unit Modems includes the design, development, supply and sales of the LTE multimode thin modem solutions, including 2G, 3G and 4G interoperability. On August 2, 2013, this activity was transferred to Ericsson from ST-Ericsson where Norin served as Executive Vice President and Chief Technology Officer since 2012.

Hans Vestberg, President and CEO said: “The LTE multimode thin modems is an important enabler for our vision of 50 billion connected devices in a Networked Society. I am pleased that Mats Norin, with his extensive industry experience, will lead the work to realize the potential in this business. Our focus is on bringing the best modems to market, and to work closely with customers to integrate these modems into their products.”


Tuesday, May 21, 2013

CTIA: NVIDIA Showcases Tegra 4i with LTE-Advanced Modem


At this week's CTIA in Las Vegas, NVIDIA is showcasing its Tegra 4i mobile processor for mainstream smartphones with an integrated NVIDIA i500 LTE modem performing at 150 Mbps in the downlink.

Earlier this year at Mobile World Congress in February, the same demo was operating at 100 Mbps.  The performance boost is achieved with a software update for NVIDIA’s software-defined radio technology.

Tegra 4i’s modem is also multi-mode -- it delivers 4G LTE Advanced and is backward compatible with LTE Cat 3, 3G, and 2G.

http://www.nvidia.com

Monday, May 20, 2013

Sequans Offers LTE Modules


Sequans Communications introduced a new line of "EZLinkLTE" LTE modules based on its own LTE baseband chip.  The modules include a complete RF front end and key interfaces in a single, compact package.

The first EZLinkLTE module, sampling now, is the VZ20Q, which is one of the first modules in the industry to support both LTE bands 4 and 13. 

The baseband chip at the heart of the new module is Sequans’ SQN3120 Mont Blanc chip that was certified by Verizon Wireless in 2012. The chip is compliant with 3GPP release 9 and it delivers category 4 throughput of up to 150 Mbps in the downlink. Starting with the SQN3120 chip, the VZ20Q integrates all other elements necessary for a complete LTE modem system. These include an LTE-optimized RF transceiver provided by Sequans’ RF partner, Fujitsu Semiconductor, a complete dual-band RF front-end for bands 4 and 13, LP-DDR SDRAM, embedded boot Flash, and VC-TCXO, all in a single, surface-mountable package with a very compact footprint, 17 x 24 x 2 mm.

“Our EZLinkLTE modules provide great value to device designers in terms of cost savings and reduction of development risk and time,” said Georges Karam, Sequans CEO. “The EZLinkLTE modules are pre-integrated, pre-tested, and pre-certified by carriers, meaning that we’ve done most of the heavy lifting in advance and can offer device makers a very quick and easy solution for adding LTE connectivity to many types of devices.”

See also