AMD intros first data center CPU using 3D die stacking
AMD announced the general availability of its 3rd Gen AMD EPYC data center processors with AMD 3D V-Cache technology, formerly codenamed “Milan-X.” The new processors feature the industry’s largest L3 cache,3 delivering the same socket, software compatibility and security capabilities as 3rd Gen EPYC CPUs. AMD said its 3D V-Cache technology solves physical layout challenges […]







