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5G / 6G / Wi-Fi

Lockheed Martin integrates Intel’s FlexRAN in 5G.MIL Base Station

Lockheed Martin and Intel have integrated a 5G Core and Open Radio Access Network (O-RAN) into Lockheed Martin’s 5G.MIL Hybrid Base Station (HBS). The implementation brings Intel’s FlexRAN reference architecture and Intel Xeon Scalable processors into a rugged, 3U tactical chassis with open system communications gateway capabilities. Lockheed Martin has now demonstrated over-the-air 5G and […]

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Lockheed Martin and Microsoft expand classified cloud work

Lockheed Martin and Microsoft have expanded their strategic relationship to help power the next generation of technology for the Department of Defense (DOD) in four critical areas: Classified Cloud Innovations: Microsoft’s latest secure framework will make Lockheed Martin the first non-government entity to independently operate inside the Microsoft Azure Government Secret cloud ushering in a […]

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5G / 6G / Wi-Fi

Lockheed Martin and Verizon demo 5G.MIL drones

Lockheed Martin and Verizon demonstrated 5G-enabled drones for capturing and securely transfering real-time intelligence, surveillance and reconnaissance (ISR) data from aircraft in flight.  The demonstration, which occurred at Lockheed Martin’s 5G test range in Waterton, Colorado, used mmWave 5G to move data from aircraft in flight over Lockheed Martin’s multi-site, multi-vendor 5G.MIL pilot network. Lockheed […]

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Semiconductors

Intel secures foundry contract in Pentagon’s RAMP-C program

The U.S. Department of Defense awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) program.  The RAMP-C program was created to facilitate the use of a U.S.-based commercial semiconductor foundry ecosystem to fabricate the assured leading-edge custom and integrated circuits and […]

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Semiconductors

Intel to upgrade its New Mexico fab for 3D semiconductor packaging

Intel announced plans to $3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Foveros, its 3D packaging technology. Foveros advanced 3D packaging technology enables Intel to build processors with compute tiles stacked vertically, rather than side-by-side, providing greater performance in a smaller footprint. It also allows Intel […]

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AT&T Selected by Defense Information Systems Agency

AT&T confirmed that it has been awarded a position on the Defense Information Systems Agency’s (DISA) Global Networking Services (GNS) contract. AT&T will provide services like global and regional transport services, software-defined networking, Ethernet and network integration services. DISA provides enterprise network and IT infrastructure to support the requirements of the Department of Defense’s more […]

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